CN111208409A - Method and device for automatically detecting backflow ground hole near differential signal via hole - Google Patents
Method and device for automatically detecting backflow ground hole near differential signal via hole Download PDFInfo
- Publication number
- CN111208409A CN111208409A CN202010025717.7A CN202010025717A CN111208409A CN 111208409 A CN111208409 A CN 111208409A CN 202010025717 A CN202010025717 A CN 202010025717A CN 111208409 A CN111208409 A CN 111208409A
- Authority
- CN
- China
- Prior art keywords
- differential signal
- detected
- pcb
- signal via
- differential
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/16—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
Abstract
The embodiment of the invention discloses a method and a device for automatically detecting backflow ground holes near differential signal via holes, wherein the method comprises the following steps: calling a preset distance parameter of the differential signal on the PCB, screening out the differential signal to be detected, detecting and judging the distance between the via hole of the differential signal to be detected and the nearby backflow ground hole, and displaying the detection result of the distance between the via hole of the differential signal and the backflow ground hole. The invention realizes the function of detecting whether reflow ground holes are added around all differential signals on the PCB by one key, can also detect single group or multiple groups of differential signals, solves the problem that a method for a PCB engineer to manually check the reflow ground holes of high-speed signals one by one in the prior art, saves time and labor, and greatly improves the working efficiency of the PCB engineer.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a method and a device for automatically detecting backflow ground holes near differential signal via holes.
Background
With the development of internet technology, big data covers various fields in life, and with the continuous expansion of data scale, higher requirements are put on the processing capacity and the processing efficiency of data, so that higher requirements are put on hardware equipment for processing and analyzing data. Servers and switches, which are the most important hardware devices for processing data, undertake most of the data processing. The reliability of a Printed Circuit Board (PCB) board as a main component of a server and a switch directly determines the performance and stability of the server and the switch, and along with the continuous improvement of signal rate, the requirement on the design quality of the PCB board is more and more strict, which requires a PCB engineer to pay more attention to details and a processing method for high-speed and high-frequency signals in the design process.
In the PCB design process, backflow ground holes are added near layer-changing via holes of high-speed differential signals above giga, so that good signal integrity is guaranteed, and signal quality is improved. All the backflow holes are manually added by a PCB engineer, thousands of pairs of high-speed differential signals may exist on a mainboard of one server, the number of the high-speed differential signals of the switch board card is more, thousands of pairs of the high-speed differential signals may be reached, thousands of the corresponding backflow holes also need to be added, and the backflow holes are huge data.
The existing PCB engineer manually checks whether the backflow holes are omitted or not for high-speed signals one by one, through searching the via holes and the backflow holes of each group of differential signals and measuring the distance between the two holes, whether the design requirements are met or not is judged, the existing detection method is time-consuming and labor-consuming, the situation that omission or insufficient checking is easily caused is also easily caused, and therefore the signal quality cannot meet the design requirements of products.
Disclosure of Invention
The embodiment of the invention provides a method and a device for automatically detecting backflow ground holes near differential signal via holes, which are used for solving the problems that in the prior art, a PCB engineer manually checks high-speed signal backflow ground holes one by one, time and labor are saved, the working efficiency of the PCB engineer is greatly improved, the condition that manual detection is easy to omit can be effectively avoided, the quality of a PCB (printed circuit board) is improved, and the reliability of a product is improved.
The embodiment of the invention discloses the following technical scheme:
the invention provides a method for automatically detecting a backflow ground hole near a differential signal via hole in a first aspect, which comprises the following steps:
calling a preset spacing parameter of a differential signal on the PCB;
screening out differential signals to be detected;
detecting and judging the distance between the differential signal via hole to be detected and the nearby backflow ground hole;
and displaying the detection result of the distance between the differential signal via hole and the backflow ground hole.
Further, the invoking of the preset pitch parameter of the differential signal on the PCB specifically includes:
and automatically reading the number of layers of the PCB or manually inputting the number of layers of the PCB, and calling the corresponding preset distance parameter according to the number of layers.
Further, the preset distance parameter specifically includes:
if the number of layers of the PCB is less than 8, the preset distance parameter is 50 mil;
if the number of layers of the PCB is greater than 14, the preset spacing parameter is 32 mil;
and if the number of the PCB layers is more than or equal to 8 and less than or equal to 14, the preset spacing parameter is 40 mil.
Further, the screening of the differential signals to be detected specifically includes:
if all the differential signals are detected, calling all the differential signals on the PCB as differential signals to be detected;
if the single group or the plurality of groups of differential signals are detected, keywords of the differential signals are manually input, the single group or the plurality of groups of differential signals are searched from the preset differential signals on the PCB according to the keywords, and the single group or the plurality of groups of differential signals are used as the differential signals to be detected.
Further, the detecting and judging the distance between the differential signal via hole to be detected and the nearby backflow ground hole specifically comprises:
if the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole is smaller than or equal to a preset distance parameter, judging that the backflow ground hole meeting the preset distance parameter is arranged nearby the to-be-detected differential signal via hole;
and if the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole is larger than the preset distance parameter, judging that no backflow ground hole which meets the preset distance parameter is nearby the to-be-detected differential signal via hole.
The invention provides a device for automatically detecting backflow holes near differential signal via holes, which comprises a distance parameter calling module, a differential signal screening module, a differential signal detection module and a result display module, wherein the distance parameter calling module is used for calling preset distance parameters of differential signals on a PCB, the differential signal screening module is used for screening out differential signals to be detected, the differential signal detection module is used for detecting and judging the distance between the differential signal via holes to be detected and the backflow holes near the differential signal via holes, and the result display module is used for displaying the detection results of the distance between the differential signal via holes and the backflow holes.
Further, the distance parameter calling module comprises a first input unit, a first automatic reading unit and a first calling unit, wherein the first input unit is used for manually inputting the number of layers of the PCB, the first automatic reading unit is used for automatically reading the number of layers of the PCB, and the first calling unit is used for calling the corresponding preset distance parameter according to the number of layers.
Further, the preset distance parameter specifically includes:
if the number of layers of the PCB is less than 8, the preset distance parameter is 50 mil;
if the number of layers of the PCB is greater than 14, the preset spacing parameter is 32 mil;
and if the number of the PCB layers is more than or equal to 8 and less than or equal to 14, the preset spacing parameter is 40 mil.
Further, the differential signal screening module comprises a second input unit, a second automatic reading unit and a second calling unit,
if all the differential signals are detected, the second calling unit calls all the differential signals on the PCB to be the differential signals to be detected;
if the single group or the multiple groups of differential signals are detected, the second input unit is used for manually inputting keywords of the differential signals, the second automatic reading unit reads out the single group or the multiple groups of differential signals from the preset differential signals on the PCB according to the keywords, and the second calling unit calls the single group or the multiple groups of differential signals to be used as the differential signals to be detected.
Further, the differential signal detection module comprises a comparison unit and a judgment unit,
if the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole compared by the comparison unit is smaller than or equal to the preset distance parameter, the judgment unit judges that the backflow ground hole meeting the preset distance parameter is arranged nearby the to-be-detected differential signal via hole;
if the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole compared by the comparison unit is larger than the preset distance parameter, the judgment unit judges that no backflow ground hole meeting the preset distance parameter exists nearby the to-be-detected differential signal via hole.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
the method and the device for automatically detecting the backflow holes near the differential signal via holes provided by the invention use the AXLSkill language which is opened to the outside by the Cadence company to realize one-key detection on whether the backflow hole function is added around all the differential signals on the PCB, replace the method that a PCB engineer manually checks the backflow holes of high-speed signals one by one, and also can detect single or multiple groups of differential signals; the invention can save time and labor, greatly improve the working efficiency of PCB engineers, effectively avoid the condition of easy omission in manual detection, improve the quality of PCB boards and improve the reliability of products.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a flow chart of the method of the present invention;
fig. 2 is a schematic structural diagram of a differential signal via and a return ground via according to an embodiment of the present invention;
FIG. 3 is a block diagram of the apparatus according to the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
The method is realized by using the AXL Skill language opened to the outside by the Cadence company.
As shown in fig. 1, which is a flow chart of the method of the present invention, the method includes:
calling a preset spacing parameter of a differential signal on the PCB;
screening out differential signals to be detected;
detecting and judging the distance between the differential signal via hole to be detected and the nearby backflow ground hole;
and displaying the detection result of the distance between the differential signal via hole and the backflow ground hole.
The specific calling of the preset interval parameters of the differential signals on the PCB is as follows: and automatically reading the layer number of the PCB or manually inputting the layer number of the PCB, and calling the corresponding preset distance parameter according to the layer number.
The preset spacing parameters are specifically as follows:
if the number of layers of the PCB is less than 8, the preset spacing parameter is 50 mil;
if the number of layers of the PCB is greater than 14, the preset spacing parameter is 32 mil;
if the number of layers of the PCB is more than or equal to 8 and less than or equal to 14, the preset spacing parameter is 40 mil.
The distance between the differential signal via hole and the nearby backflow ground hole is influenced by more factors, such as the number of layers of a PCB, the grade of a plate, the signal rate, signal crosstalk and the like, in practical application, the distance between the differential signal via hole and the nearby backflow ground hole needs to be determined by comprehensively considering the factors, the number of layers of the PCB is only used as a reference for presetting distance parameters, and other situations are not repeated.
The specific steps for screening out the differential signals to be detected are as follows:
if all the differential signals are detected, calling all the differential signals on the PCB as differential signals to be detected;
if the single group or the plurality of groups of differential signals are detected, keywords of the differential signals are manually input, the single group or the plurality of groups of differential signals are searched from the preset differential signals on the PCB according to the keywords, and the single group or the plurality of groups of differential signals are used as the differential signals to be detected.
The detection and judgment of the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole are specifically as follows:
if the distance between the differential signal via hole to be detected and the nearby backflow ground hole is smaller than or equal to the preset distance parameter, judging that the backflow ground hole which meets the preset distance parameter is arranged nearby the differential signal via hole to be detected;
and if the distance between the differential signal via hole to be detected and the nearby backflow ground hole is larger than the preset distance parameter, judging that no backflow ground hole which meets the preset distance parameter is nearby the differential signal via hole to be detected.
As shown in fig. 2, which is a schematic structural diagram of a differential signal via and a return ground according to an embodiment of the present invention, P and N refer to a pair of high-speed differential signals, and GND refers to a return ground. The pitch detected by the invention is the distance between the center point of P and the center point of the left GND, or the distance between the center point of N and the center point of the right GND.
The detection result for displaying the distance between the differential signal via hole and the backflow ground hole is specifically as follows: if the differential signal is provided with the backflow holes, the differential signal is displayed as OK, if the backflow holes are not added to the differential signal, the coordinates of the differential signal with the missing backflow holes are displayed, the coordinates are double clicked, and the position of the coordinates on the PCB is automatically jumped to.
As shown in fig. 3, a structural block diagram of the device of the present invention is shown, and the device includes a pitch parameter calling module, a differential signal screening module, a differential signal detecting module and a result displaying module, where the pitch parameter calling module is used to call a preset pitch parameter of a differential signal on a PCB, the differential signal screening module is used to screen out a differential signal to be detected, the differential signal detecting module is used to detect and judge a distance between a via hole of the differential signal to be detected and a nearby return ground hole, and the result displaying module is used to display a detection result of the distance between the via hole of the differential signal and the return ground hole.
The distance parameter calling module comprises a first input unit, a first automatic reading unit and a first calling unit, wherein the first input unit is used for manually inputting the number of layers of the PCB, the first automatic reading unit is used for automatically reading the number of layers of the PCB, and the first calling unit is used for calling the corresponding preset distance parameter according to the number of layers.
The first input unit is implemented by using an axlSpace _ Begin () function, which creates a data input dialog with axlprot ("diffvia with out gated check" nil) in an axspace _ Begin () function window, and the user inputs the number of layers of the PCB.
The preset spacing parameters are specifically as follows:
if the number of layers of the PCB is less than 8, the preset spacing parameter is 50 mil;
if the number of layers of the PCB is greater than 14, the preset spacing parameter is 32 mil;
if the number of layers of the PCB is more than or equal to 8 and less than or equal to 14, the preset spacing parameter is 40 mil.
The differential signal screening module comprises a second input unit, a second automatic reading unit and a second calling unit,
if all the differential signals are detected, the second calling unit calls all the differential signals on the PCB to be the differential signals to be detected;
if the single group or the multiple groups of differential signals are detected, the second input unit is used for manually inputting keywords of the differential signals, the second automatic reading unit reads out the single group or the multiple groups of differential signals from the preset differential signals on the PCB according to the keywords, and the second calling unit calls the single group or the multiple groups of differential signals to be used as the differential signals to be detected.
The second input unit is realized through an axlSingleFile () function and an axlReceivItem () function, a user manually inputs keywords of the differential signal, and the second calling unit outputs the differential signal to be detected through the axlSinglePoint () function.
The differential signal detection module comprises a comparison unit and a judgment unit,
if the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole compared by the comparison unit is smaller than or equal to the preset distance parameter, the judgment unit judges that the backflow ground hole meeting the preset distance parameter is arranged nearby the to-be-detected differential signal via hole;
if the distance between the to-be-detected differential signal via hole and the nearby backflow ground hole compared by the comparison unit is larger than the preset distance parameter, the judgment unit judges that no backflow ground hole meeting the preset distance parameter exists nearby the to-be-detected differential signal via hole.
The foregoing is only a preferred embodiment of the present invention, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the invention, and such modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010025717.7A CN111208409B (en) | 2020-01-10 | 2020-01-10 | Method and device for automatically detecting backflow ground hole near differential signal via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010025717.7A CN111208409B (en) | 2020-01-10 | 2020-01-10 | Method and device for automatically detecting backflow ground hole near differential signal via hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111208409A true CN111208409A (en) | 2020-05-29 |
| CN111208409B CN111208409B (en) | 2022-06-21 |
Family
ID=70787419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010025717.7A Active CN111208409B (en) | 2020-01-10 | 2020-01-10 | Method and device for automatically detecting backflow ground hole near differential signal via hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111208409B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114184933A (en) * | 2021-11-26 | 2022-03-15 | 浪潮(北京)电子信息产业有限公司 | Backflow ground hole detection method, system, device and computer readable storage medium |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110920A (en) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | High-Speed Connector Packaging and Packaging Methods |
| US20130158925A1 (en) * | 2011-12-14 | 2013-06-20 | Hon Hai Precision Industry Co., Ltd. | Computing device and method for checking differential pair |
| CN103577615A (en) * | 2012-07-18 | 2014-02-12 | 鸿富锦精密工业（深圳）有限公司 | Automatic checking system and method for high-speed differential signal line via holes |
| CN206759805U (en) * | 2017-05-18 | 2017-12-15 | 郑州云海信息技术有限公司 | Tin is bad in a kind of improvement and the PCB construction of high speed signal return flow path |
| CN110324962A (en) * | 2019-07-18 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The method for reducing PCB differential lines insertion loss |
-
2020
- 2020-01-10 CN CN202010025717.7A patent/CN111208409B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110920A (en) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | High-Speed Connector Packaging and Packaging Methods |
| US20130158925A1 (en) * | 2011-12-14 | 2013-06-20 | Hon Hai Precision Industry Co., Ltd. | Computing device and method for checking differential pair |
| CN103577615A (en) * | 2012-07-18 | 2014-02-12 | 鸿富锦精密工业（深圳）有限公司 | Automatic checking system and method for high-speed differential signal line via holes |
| CN206759805U (en) * | 2017-05-18 | 2017-12-15 | 郑州云海信息技术有限公司 | Tin is bad in a kind of improvement and the PCB construction of high speed signal return flow path |
| CN110324962A (en) * | 2019-07-18 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The method for reducing PCB differential lines insertion loss |
Non-Patent Citations (1)
| Title |
|---|
| 丁志廉: "混合PCB的微带线的性能", 《印制电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114184933A (en) * | 2021-11-26 | 2022-03-15 | 浪潮(北京)电子信息产业有限公司 | Backflow ground hole detection method, system, device and computer readable storage medium |
| CN114184933B (en) * | 2021-11-26 | 2024-04-05 | 浪潮(北京)电子信息产业有限公司 | Method, system, device and computer readable storage medium for detecting backflow ground hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111208409B (en) | 2022-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111784663B (en) | Method and device for detecting parts, electronic equipment and storage medium | |
| CN106487462B (en) | A kind of insertion loss test method and system | |
| CN105510348A (en) | Flaw detection method and device of printed circuit board and detection equipment | |
| CN108919083A (en) | A method of improving Serdes IP wafer test efficiency | |
| CN102819126A (en) | Testing device and testing method | |
| CN112202638A (en) | Data processing method, apparatus, equipment and computer storage medium | |
| CN111208409B (en) | Method and device for automatically detecting backflow ground hole near differential signal via hole | |
| CN101592620A (en) | Circuit substrate detection device and method | |
| CN106604550B (en) | A kind of line impedance adjusting method and system | |
| TWI732296B (en) | System for generating detection model according to standard data to confirm soldering state and method thereof | |
| CN109933931B (en) | A method to detect whether the backdrilling target layer is set correctly | |
| Lin et al. | A visual inspection system for surface mounted devices on printed circuit board | |
| CN114138581B (en) | Mainboard test method and system | |
| CN107391854A (en) | The method and device of crosstalk between a kind of inspection difference through hole | |
| CN103778266A (en) | Signal line arrangement checking system and method | |
| CN104182555A (en) | Circuit board wire distribution detection device and circuit board wire distribution detection method | |
| US12007377B2 (en) | System and method for building detection model based on standard value to confirm soldering status | |
| TW201426366A (en) | Signal line check system and signal line check method | |
| CN118332439A (en) | Circuit board reliability analysis method and system based on fusion features | |
| CN114638186B (en) | A method and device for simulating a printed circuit board | |
| WO2021197231A1 (en) | Image annotation method, device and system | |
| CN103258062A (en) | Wiring checking system and method | |
| CN102118920A (en) | Patching and assessing system of circuit boards and method | |
| CN115314424B (en) | Method and device for rapidly detecting network signals | |
| CN112651964A (en) | Target detection method based on deep learning |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Building 9, No.1, guanpu Road, Guoxiang street, Wuzhong Economic Development Zone, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Yuannao Intelligent Technology Co.,Ltd. Country or region after: China Address before: Building 9, No.1, guanpu Road, Guoxiang street, Wuzhong Economic Development Zone, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU LANGCHAO INTELLIGENT TECHNOLOGY Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |