CN111192736A

CN111192736A - Coil and coil packaging module

Info

Publication number: CN111192736A
Application number: CN201811356532.3A
Authority: CN
Inventors: 潘咏民; 范仲成
Original assignee: Guangzhou Chenghan Electronic Technology Co ltd
Current assignee: Guangzhou Chenghan Electronic Technology Co ltd
Priority date: 2018-11-15
Filing date: 2018-11-15
Publication date: 2020-05-22

Abstract

A coil and a coil packaging module provided with the coil, the coil packaging module comprises a box seat unit, a terminal unit and at least one circuit unit, the box base unit comprises a base, the terminal unit comprises a plurality of terminals inserted in the base, each circuit unit is arranged on the base, and comprises a substrate and at least one coil group which is arranged on the substrate and is electrically conducted with the terminal unit, the coil group is provided with at least one coil, each coil is provided with a bobbin, two first supporting plates and two second supporting plates which are respectively arranged at two ends of the bobbin, and a plurality of wires wound on the bobbin, the first supporting plate and the second supporting plate are respectively provided with a plurality of first pins and second pins which are exposed out of the respective bottom surfaces, the first pins and the second pins are arranged in a staggered mode, and interference caused by the fact that the conducting wires are fixed on the pins is reduced.

Description

Coil and coil packaging module

Technical Field

The present invention relates to an electronic module, and more particularly, to a coil having a wound wire connected to a lead and a coil package module having the same.

Background

The existing coil packaging module comprises a box seat defining a containing space, a circuit board arranged in the containing space, a plurality of coils arranged on the circuit board and a plurality of terminals inserted in the box seat and electrically connected with the circuit board, wherein each coil comprises a support shaft, two support plates arranged at two ends of the support shaft respectively and a plurality of wires wound on the support shaft, the bottom end of each support plate is provided with a group of pins, each pin group is provided with a plurality of pins arranged at intervals, and two ends of each wire are connected with the pins of the support plates.

When one end of the wire is fixed to the corresponding pin, because each pin group is arranged at the bottom end of the supporting plate at the same interval, the pins on the other corresponding side not only affect the construction of electrically connecting the tail end of the wire to the pin, but also may cause the risk of connecting the wrong pin by the wire, thereby reducing the assembly efficiency.

Disclosure of Invention

It is an object of the present invention to provide a coil that overcomes at least one of the disadvantages of the background art.

It is another object of the present invention to provide a coil encapsulation module that overcomes at least one of the disadvantages of the background art.

The coil of the invention comprises a bobbin, a first supporting plate, a second supporting plate and a plurality of leads. The first support plate is connected to one end of the bobbin and comprises a plurality of first pins exposed out of the bottom surface of the bobbin. The second support plate is connected to the other end of the bobbin and comprises a plurality of second pins exposed on the bottom surface of the bobbin, the first pins do not have the second pins at positions corresponding to the second support plate along the axial direction of the bobbin, and the first pins and the second pins are arranged in a staggered mode. The wire is wound on the bobbin. Each wire has two ends. The end part can be connected with the corresponding first pin and the second pin.

The coil packaging module comprises a box seat unit, a terminal unit and at least one circuit unit. The cartridge receptacle unit includes a base. The terminal unit comprises a plurality of terminals inserted in the base. The circuit unit is arranged on the base and comprises a substrate and at least one coil group which is arranged on the substrate and is conductive to the terminal unit, wherein the coil group is provided with at least one coil, and each coil is provided with a bobbin, a first supporting plate connected to one end of the bobbin, a second supporting plate connected to the other end of the bobbin and a plurality of wires wound on the bobbin. The first support plate is provided with a plurality of first pins exposed out of the bottom surface of the first support plate, and the second support plate is provided with a plurality of second pins exposed out of the bottom surface of the second support plate. The first pins are not provided with the second pins at the positions corresponding to the second support plate along the axial direction of the bobbin, so that the first pins and the second pins are arranged in a staggered manner, each wire is provided with two end parts, and the end parts can be connected to the corresponding first pins and the corresponding second pins.

The coil of the invention also comprises an adsorption plate which is connected with the support plate and has a flat outer surface.

In the coil packaging module, each coil is also provided with an adsorption plate which is connected with the support plate and has a flat outer surface.

In the coil packaging module of the present invention, the box base unit further includes an upper cover detachably combined with the base, and the upper cover and the base cooperate to define an accommodating space for accommodating the circuit unit and the terminal unit.

In the coil packaging module of the invention, each terminal has a first end portion protruding from the base and a second end portion opposite to the first end portion and exposed out of the box base unit.

In the coil package module of the present invention, the substrate has a plurality of through holes, and the first end portions of the terminals pass through the through holes.

In the coil package module of the present invention, the substrate has two conductive connection surfaces respectively located on two opposite sides, and each conductive connection surface can be electrically connected to the coil assembly.

In the coil packaging module, the coil group is also provided with an integrated board which is electrically connected with the corresponding conducting surface of the substrate, the integrated board is provided with two mounting surfaces which are respectively positioned on two opposite sides, and each mounting surface can be used for fixedly connecting the supporting plate of the coil.

In the coil packaging module, the integrated board is also provided with a connecting surface connected with the mounting surface, and the connecting surface is connected with the guide connecting surface of the substrate.

The invention has the beneficial effects that: through the design that the first pins and the second pins are arranged in a staggered mode, when the end portions of the wires are respectively assembled on the corresponding first pins and the second pins, the wires are not easily interfered by the pins on the opposite side during construction wire pulling, and the assembling efficiency is improved.

Drawings

Other features and effects of the present invention will be clearly apparent from the embodiments with reference to the drawings:

fig. 1 is an exploded perspective view illustrating a first embodiment of a coil encapsulation module according to the present invention;

FIG. 2 is a cross-sectional side view of the first embodiment;

FIG. 3 is a fragmentary perspective view illustrating the construction of a coil of the first embodiment;

FIG. 4 is a schematic bottom view illustrating the arrangement of the plurality of pins of the coil according to the first embodiment;

FIG. 5 is a view similar to FIG. 4 illustrating the arrangement of the pins in other variations of the coil;

FIG. 6 is a view similar to FIG. 2 illustrating the arrangement of a plurality of coils in another variation of the first embodiment;

FIG. 7 is a cross-sectional side view of a second embodiment of the present invention; and

fig. 8 is a cross-sectional side view of a third embodiment of the present invention.

Detailed Description

Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.

Referring to fig. 1, 2 and 3, the first embodiment of the coil and coil package module of the present invention includes a housing unit 1, a terminal unit 2 and a circuit unit 3.

The box base unit 1 is made of an electrical insulating material and includes a base 11 and an upper cover 12 detachably combined with the base 11, and the upper cover 12 and the base 11 cooperate to define an accommodating space 13 for accommodating the circuit unit 3 and the terminal unit 2.

The terminal unit 2 includes a plurality of terminals 21 inserted in the base 11, each terminal 21 is made of a conductive metal material and has a first end 211 penetrating the base 11 and a second end 212 opposite to the first end 211 and exposed outside the housing unit 1.

The circuit unit 3 is disposed in the accommodating space 13 and includes a substrate 31 and a plurality of coil sets 32 disposed on the substrate 31 and electrically connected to the terminal unit 2. The substrate 31 is a single-sided printed circuit board having a plurality of through holes 311 for the first end portions 211 of the terminals 21 to pass through and a conductive surface 312, wherein the conductive surface 312 is electrically connected to the coil assembly 32. In practice, the number of the conductive contact surfaces 312 of the substrate 31 is not limited to the first embodiment. Referring to fig. 6, in a variation of the first embodiment, the substrate 31 is a double-sided printed circuit board having two opposite conductive surfaces 312.

Each coil set 32 has two coils 321, each coil 321 has a bobbin 322, a first supporting plate 323 connected to one end of the bobbin 322, a second supporting plate 324 connected to the other end of the bobbin 322, an absorbing plate 325 connected to the first supporting plate 323 and the second supporting plate 324 and having a flat outer surface 326, and a plurality of wires 327 wound around the bobbin 322, the first supporting plate 323 has a plurality of first pins 33 exposed on the bottom surface thereof, and the second supporting plate 324 has a plurality of second pins 34 exposed on the bottom surface thereof. Referring to fig. 4, the first pins 33 do not have the second pins 34 at positions corresponding to the positions of the second supporting plate 324 along the axial direction of the wire 327 wound on the bobbin 322, so that the first pins 33 and the second pins 34 are arranged in a staggered manner. Each wire 327 has two ends 328, one end 328 of the wire 327 is electrically connected to the corresponding first pin 33, and the other end 328 of the wire 327 is electrically connected to the corresponding second pin 34.

It should be particularly noted that, in implementation, the number of the coils 321 of the coil group 32 is not limited to two, and in other variations of the present embodiment, the number of the coils 321 of the coil group 32 may be one, or three or more. The end 328 of each wire 327 is not limited to be electrically connected to the first pin 33 and the second pin 34, but in other variations of the present embodiment, the end 328 of one wire 327 may be electrically connected to the first pin 33 or the second pin 34. The arrangement of the first pins 33 and the second pins 34 is not limited to the embodiment, referring to fig. 5, in another variation of the first embodiment, some of the second pins 34 can be guided and connected by matching with two end portions 328, so that the shape of the second pins is slightly larger than that of the other second pins 34, the arrangement interval of the corresponding first pins 33 is increased, and the first pins 33 and the second pins 34 are still maintained in a staggered arrangement.

After the wire 327 is wound around the bobbin 322, the end portions 328 are electrically connected to the first pins 33 and the second pins 34 by a robot or a manual operation, because the first pins 33 and the second pins 34 are arranged in a staggered manner, when one end portion 328 is fixed to the corresponding first pin 33, no pin protrusion is formed on the second supporting plate 324 on the other side, and the phenomenon of misconnection due to staggered arrangement of two sides of the pin is avoided.

During assembly, a negative pressure is generated by an access end (not shown) of an automated robot arm to attract the outer surface 326 of the attraction plate 325, the coil assembly 32 is arranged on the conductive connection surface 312, and the coil assembly 32 is fixed to the conductive connection surface 312 by welding, thereby forming the circuit unit 3. Then, the first end portions 211 of the terminals 21 are respectively inserted through the through holes 311 of the substrate 31, and the substrate 31 and the terminal unit 2 are soldered. Finally, the upper cover 12 is combined with the base 11 to be packaged and combined into a coil packaging module. The automated robot and the welding are not the focus of the present invention and therefore will not be described in detail herein. In addition, the manner of taking and placing the coil 321 is not limited to using an automated robot, and the fixing of the coil assembly 32 on the guiding surface 312 and the connection between the coil assembly and the terminal unit 2 and the substrate 11 is not limited to soldering, and can be changed according to actual requirements.

Referring to fig. 7, the second embodiment of the present invention is different from the first embodiment in that: the second embodiment includes two circuit units 3 arranged at intervals up and down, and the inner side of the base 11 is in a radial surrounding step shape and is provided with a first abutting section 111 for one circuit unit 3 to be arranged and a second abutting section 112 for the other circuit unit 3 to be arranged. The terminal 21 of the terminal unit 2 is disposed through the first abutting section 111 and the second abutting section 112 for electrically connecting the substrate 31 of the circuit unit 3. It should be noted that the number of the circuit units 3 is not limited to two, and in other variations of the second embodiment, the number of the circuit units 3 may also be three or four …, and the corresponding base 11 is designed to have a relative number of abutting sections.

Referring to fig. 8, the third embodiment of the present invention is different from the first embodiment in that: in the third embodiment, each coil set 32 has an integrated board 35 and a plurality of coils 321. The board 35 is a double-sided printed circuit board and has two mounting surfaces 351 located on opposite sides, respectively, and a connecting surface 352 connected to the mounting surfaces 351. The connection surface 352 may be electrically connected to the conductive connection surface 312. Each mounting surface 351 can be used for fixing and electrically connecting the first support plate 323 and the second support plate 324 of the coil 321.

During assembly, a negative pressure is generated by an access terminal (not shown) of an automated robot arm to attract the outer surface 326 of the attraction plate 325, the coils 321 are respectively arranged on the mounting surface 351 of the integrated board 35, the coils 321 are electrically and fixedly connected to the mounting surface 351 by welding to form the coil group 32, the coil group 32 is arranged on one of the conductive connection surfaces 312 of the substrate 31 at intervals, and the connection surface 352 of each integrated board 35 is electrically and fixedly connected to one of the conductive connection surfaces 312 of the substrate 31 to form the circuit unit 3. It should be noted that the integrated board 35 may be a single-sided printed circuit board having only one mounting surface 351, so the arrangement is not limited to this embodiment, and in the implementation, the manner of taking and placing the coil 321 is not limited to the use of an automated robot, and the fixing of the coil 321 to the corresponding mounting surface 351 is not limited to soldering, and can be changed according to actual requirements.

In summary, the coil and the coil packaging module of the present invention have the following effects: by arranging the first pins 33 and the second pins 34 of each coil 321 in a staggered manner, when one end 328 is fixed to the corresponding first pin 33, no pin protrusion is formed on the second supporting plate 324 on the other side, and the phenomenon of mis-connection due to staggered two sides of the pin is avoided. Therefore, the object of the present invention can be achieved.

The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and all simple equivalent changes and modifications made in the claims and the specification of the present invention are also within the scope of the present invention.

Claims

1. A coil, comprising a bobbin, a first support plate, a second support plate and several wires, the first support plate is connected to one end of the bobbin, and includes a number of first pins exposed on its bottom surface, The second support plate is connected to the other end of the spool, and includes a plurality of second pins exposed on the bottom surface of the second support plate, the wires are wound around the spool, and each wire has two ends. The part can be connected to the corresponding first pin and the second pin, and it is characterized in that: there is no position on the first pin corresponding to the second support plate along the axis direction of the spool. For the second pins, the first pins and the second pins are arranged in a staggered manner.

2 . The coil of claim 1 , further comprising a suction plate connected to the support plate and having a flat outer surface. 3 .

3. A coil package module, comprising a box base unit, a terminal unit and at least one circuit unit, the box base unit comprising a base, the terminal unit comprising several terminals inserted into the base, the circuit The unit is arranged on the base, and includes a base plate and at least one coil assembly disposed on the base plate and conducting electricity with the terminal unit, characterized in that the coil assembly has at least one coil according to claim 1 .

4 . The coil package module according to claim 3 , wherein the coil further has a suction plate connected to the support plate and having a flat outer surface. 5 .

5 . The coil packaging module according to claim 4 , wherein the box base unit further comprises an upper cover that can be detachably combined with the base, and the upper cover is matched with the base. 6 . An accommodating space for accommodating the circuit unit and the terminal unit is defined.

6 . The coil package module of claim 5 , wherein each terminal has a first end protruding from the base and opposite to the first end and exposed to the box base unit. 7 . of the second end.

7 . The coil package module of claim 6 , wherein the substrate has a plurality of through holes through which the first ends of the terminals pass through. 8 .

8. The coil package module according to any one of claims 3 to 7, wherein the substrate has two conductive surfaces respectively located on opposite sides, and each conductive surface can supply the coil assembly Conductive connection.

9 . The coil package module according to claim 8 , wherein the coil assembly further has an integrated board conductively connected to the corresponding conductive surfaces of the substrate, the integrated board has two oppositely located side mounting surfaces, each mounting surface can be fixedly connected to the support plate of the coil.

10 . The coil package module according to claim 9 , wherein the integrated board further has a connection surface connected to the mounting surface, and the connection surface is connected to the conductive surface of the substrate. 11 .