CN111191407B - Simulation automation method - Google Patents

Abstract

A simulated automation method for laying out blueprints. The simulation automation method includes: obtaining a plurality of parameters from the stackup table and the layout design diagram of the printed circuit board through the syntax conversion module; converting each parameter into an automatic syntax that conforms to the simulation software recognizable through the syntax conversion module; and converting the converted The automation syntax is embedded in the simulation software, and the simulation is performed by the simulation software.

Description

Simulate an automated method

technical field

The invention relates to a signal simulation method, and in particular to a simulation automation method.

Background technique

Printed circuit boards are often used in electronic products, and signal simulation is one of the tools used for troubleshooting and verification in electronic product development. Generally speaking, when an engineer wants to use simulation software to analyze the signal quality of this type of electronic product, the engineer needs to manually set the parameters such as the thickness of each layer of the printed circuit board, material properties, metal etching angle, and manually set the via hole The material, the thickness of the hole wall plating and other parameters.

Since the signal simulation takes a long time, it needs to be operated by a signal simulation engineer with simulation experience. However, since the number of licenses of the simulation software is limited, if the operation time is too long, the time of the next simulation will be delayed. Therefore, if the operation setting time can be shortened, the use efficiency of the simulation software can be improved and the simulation time can be shortened.

Contents of the invention

The invention provides a simulation automation method, which can effectively reduce the signal simulation time required for product development.

The simulation automation method of the present invention is used for computer-executable simulation software. The simulation automation method includes: obtaining multiple parameters from the stacking table and layout design diagram of the printed circuit board through the syntax conversion module; Converting to an automatic grammar recognizable by the simulation software; and embedding the converted automatic grammar into the simulation software, so as to perform simulation by the simulation software.

In an embodiment of the present invention, the simulation automation method further includes: reading the layout design drawing by the layout drawing reading module, and inputting the parameters obtained from the layout design drawing to the syntax conversion module.

In an embodiment of the invention, the parameters include a plurality of stacking parameters and a plurality of layout parameters. The step of obtaining the parameters from the stack table and the layout design diagram through the syntax conversion module includes: obtaining the stacking parameters from the stack table; and obtaining the layout parameters from the layout design diagram.

In an embodiment of the present invention, the stacking parameters at least include: the number of layers of the circuit board, the type of the circuit board, the thickness of each dielectric layer, the dielectric constant of each dielectric layer, and the dissipation factor of each dielectric layer. factor and the thickness of each metal layer. The layout parameters at least include multiple layer names, multiple via hole names, and multiple via hole types.

In an embodiment of the present invention, the step of obtaining the parameters from the stack table and the layout design diagram through the syntax conversion module further includes: calculating the respective dielectric constants of multiple metal layers according to the stacking relationship recorded in the stack table , dissipation factor, and etch angle.

In an embodiment of the present invention, the simulation automation method further includes: using a syntax conversion module to convert the unit of the thickness to conform to the format of the simulation software.

In an embodiment of the present invention, the step of converting each parameter into an automation syntax that conforms to the simulation software through the syntax conversion module includes: converting the stacking parameters into conforming to the automation syntax that the simulation software recognizes with the layer name .

In an embodiment of the present invention, the simulation automation method further includes: a syntax conversion module setting a plurality of via hole parameters according to the via hole name and the via hole type.

Based on the above, the present invention proposes an automatic solution for stack setting, hoping to solve the problem that manual setting is required for stack setting, and lay the foundation for fully automatic signal simulation.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a system architecture diagram according to an embodiment of the present invention.

Fig. 2 is a flowchart of a simulation automation method according to an embodiment of the present invention.

3A-3F are schematic diagrams of partial program codes of the automation syntax according to an embodiment of the present invention.

Explanation of reference signs:

110: Overlap table

120: Layout design drawing

130: Syntax Transformation Module

140: Layout drawing reading module

150: Simulation software

310～360: program code

S205～S215: Simulate each step of the automation method

Detailed ways

FIG. 1 is a system architecture diagram according to an embodiment of the present invention. Referring to FIG. 1 , the system architecture for implementing the simulation automation method includes a stackup table 110 , a board file 120 , a syntax conversion module 130 , a layout reading module 140 and a simulation software 150 .

This embodiment is implemented by using an electronic device with computing capability. The electronic device includes processors, storage devices and other equipment. A plurality of modules are stored in the memory device, and the processor drives the modules to implement the simulation automation method.

The processor can be a central processing unit (Central Processing Unit, CPU), an image processing unit (Graphic Processing Unit, GPU), a physical processing unit (Physics Processing Unit, PPU), a programmable microprocessor (Microprocessor), Embedded control chip, digital signal processor (Digital Signal Processor, DSP), application specific integrated circuit (Application Specific Integrated Circuits, ASIC) or other similar devices. The storage device is any form of fixed or removable random access memory (Random Access Memory, RAM), read-only memory (Read-Only Memory, ROM), flash memory (Flash memory), secure digital card ( Secure Digital Memory Card, SD), hard disk or other similar devices or a combination of these devices.

The stackup table 110 is designed based on the difference between the layout design diagram 120 and the simulation software 150 . The stacking table 110 describes stacking parameters of printed circuit boards. The stacking parameters at least include: the number of layers of the circuit board, the type of the circuit board, the respective thicknesses of multiple dielectric layers, the dielectric constant (Dielectric Constant, DK) of each dielectric layer, and the dissipation factor (Dissipation Factor, DF) of each dielectric layer. ) and the respective thicknesses of multiple metal layers.

In this embodiment, the stacking table 110 is designed in a commonly used file format, so it is not limited to the signal simulation engineer to fill in the stacking parameters, but it is convenient for general engineers to fill in the stacking parameters. For example, the overlay table 110 is designed with an electronic spreadsheet such as Excel. Accordingly, general users can input the stacking parameters of the printed circuit boards in the stacking table 110 . The user fills in the stacking table 110 with the stacking parameters that need to be manually set in the simulation software 150 . Here, some of the stacking parameters can be automatically calculated using the functions in the stack table 110, or calculated by an external program.

The layout design drawing 120 describes a plurality of layout parameters. These layout parameters at least include a plurality of layer names, a plurality of via hole names and a plurality of via hole types. The layout drawing reading module 140 can read the information of the layout design drawing 120, check whether the layer number information is correct, and read the names of each layer.

Fig. 2 is a flowchart of a simulation automation method according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 2 , in step S205 , a plurality of parameters are obtained from the stack table 110 and the layout design diagram 120 through the syntax conversion module 130 . Here, the parameters include multiple stacking parameters and multiple layout parameters. The layout design drawing 120 is read by the layout drawing reading module 140 , and the layout parameters obtained from the layout design drawing 120 are input to the syntax conversion module 130 .

In step S210 , each parameter is converted into an automatic grammar recognizable by the simulation software 150 through the grammar conversion module 130 . Afterwards, in step S215 , the converted automation grammar is embedded into the simulation software 150 , so that the simulation is performed by the simulation software 150 .

Specifically, the syntax conversion module 130 includes the corresponding relationship of the automation syntax supported by the simulation software. After the syntax conversion module 130 reads the stacking parameters in the stacking table 110 and obtains a plurality of layout parameters from the layout drawing reading module 140, it converts the parameters (stacking parameters and layout parameters) into analog The automation syntax of the software 150 is to insert the converted automation syntax into the simulation software 150 to automatically set various parameters.

For example, the stackup table 110 provides a user interface for the user to select or directly input the appropriate number of layers of the circuit board. Moreover, the user interface of the stackup table 110 further provides a plurality of types of circuit boards (such as Type 1-Type 4) for the user to choose. Afterwards, the stackup table 110 can automatically generate a table with the names and types of each layer based on the selected number of layers of the circuit board and the type of the circuit board, so that the user can start to fill in the thickness of each layer (including the dielectric layer and the metal layer) , the dielectric constant of the dielectric layer, the dissipation factor of the dielectric layer, and other stack parameters.

In the following, the simulation of a printed circuit board with 4 layers and a type 3 circuit board is used for illustration.

Table 1

In this embodiment, it is assumed that the stackup table 110 records that the number of layers of the circuit board is 4, the type of the circuit board is Type 3, and records the thickness of each layer, the dielectric constant (DK), and the dissipation factor (DF) as shown in Table 1. ) and other stacking parameters.

After selecting the number of circuit board layers (4 layers) and the type of circuit board (Type 3), referring to Table 1, the stackup table 110 automatically generates layer names and types based on the selected number of circuit board layers and the type of circuit board. the content of the field. In the layer name column, L1-L4 are metal layers, and "Solder Mask1", "Solder Mask 2" and "Medium 1"-"Medium 3" are medium layers. In the category column, "DIELECTRIC" stands for dielectric, and "CONDUCTOR" stands for conductor. The contents of the three columns of thickness, dielectric constant, and dissipation factor are input by the user.

Generally, when inputting the parameters of each layer, the dielectric constant and dissipation factor of the medium of the metal layers L1-L4 are not inputted. Here, other stacking parameters can be automatically calculated by the stacking table 110 or external software using known stacking parameters. For example, according to the stacking relationship recorded in the stacking table 110 , the dielectric constants, dissipation factors, and etching angles of the respective media of the plurality of metal layers L1 - L4 are calculated.

The calculation formulas of dielectric constants, dissipation factors and etching angles of the respective media of the metal layers L1 - L4 are illustrated below with examples.

In the case that the printed circuit board is stacked symmetrically, the number of layers is N (N is a multiple of 2), and the type of the circuit board is Type 3, assuming that the etching angle is 75 degrees or 105 degrees, the i-th layer of the metal layer (1≤i ≤N) The judgment formula of the etching angle A(i) is as follows:

A(i)=75, i≤1;

A(i)=75, 1<i<N&mod(N/2-i,2)=0;

A(i)=105, 1<i<N&mod(N/2-i,2)=1;

A(i)=105, i≥N.

In the case that the printed circuit board is stacked symmetrically, the number of layers is N (N is a multiple of 2), and the type of the circuit board is Type 3, DK (i-0.5) and DF (i-0.5) represent the metal layer i -The dielectric constant and dissipation factor of the dielectric layer between the 1st layer and the i-th layer (1≤i≤N); DK(i+0.5) and DF(i+0.5) respectively represent the i-th layer to the metal layer The dielectric constant and dissipation factor of the dielectric layer of the i+1 layer are respectively represented by DK(i) and DF(i) as the dielectric constant and dissipation factor of the i-th layer of the metal layer, and the judgment formula is as follows:

DK(i)=DK(i-0.5), i≤1;

DF(i)=DF(i-0.5), i≤1;

DK(i)=DK(i-0.5), 1<i<N&mod(N/2-i,2)=0;

DF(i)=DF(i-0.5), 1<i<N&mod(N/2-i,2)=0;

DK(i)=DK(i+0.5), 1<i<N&mod(N/2-i,2)=1;

DF(i)=DF(i+0.5), 1<i<N&mod(N/2-i,2)=1;

DK(i)=DK(i+0.5), i≥N;

DF(i)=DF(i+0.5), i≧N.

In the case that the printed circuit board is stacked symmetrically, the number of layers is N (N is a multiple of 2), the type of circuit board is Type 4, and the stacking method is m-n-m (for example, 1-n-1), assuming the etching angle of the metal layer is 75 degrees or 105 degrees, then the judgment formula of the etching angle A(i) of the i-th layer of the metal layer (1≤i≤N) is as follows:

A(i)=75, i≤(1+m);

A(i)=75, (1+m)<i<(N-m)&mod(N/2-i,2)=0;

A(i)=105, (1+m)<i<(N-m)&mod(N/2-i,2)=1;

A(i)=105, i≥(N-m).

As above, the judgment formulas of the dielectric constant DK(i) and the dissipation factor DF(i) of the i-th layer of the metal layer are as follows:

DK(i)=DK(i-0.5), i≤(1+m);

DF(i)=DF(i-0.5), i≤(1+m);

DK(i)=DK(i-0.5), (1+m)<i<(N-m)&mod(N/2-i,2)=0;

DF(i)=DF(i-0.5), (1+m)<i<(N-m)&mod(N/2-i,2)=0;

DK(i)=DK(i+0.5), (1+m)<i<(N-m)&mod(N/2-i,2)=1;

DF(i)=DF(i+0.5), (1+m)<i<(N-m)&mod(N/2-i,2)=1;

DK(i)=DK(i+0.5), i≥(N-m);

DF(i)=DF(i+0.5), i≥(N-m).

In the case that the printed circuit board is stacked symmetrically, the number of layers is N (N is a multiple of 2) and any type of circuit board, assuming that the metal etching angle is 75 degrees or 105 degrees, the i-th layer of the metal layer (1≤i≤ The judgment formula of the etching angle A(i) of N) is as follows:

A(i)=75, i≤(N/2);

A(i)=105, i≥(N/2+1).

As above, the judgment formulas of the dielectric constant DK(i) and the dissipation factor DF(i) of the i-th layer of the metal layer are as follows:

DK(i)=DK(i-0.5), i≤(N/2);

DF(i)=DF(i-0.5), i≤(N/2);

DK(i)=DK(i+0.5), i≥(N/2+1);

DF(i)=DF(i+0.5), i≧(N/2+1).

Taking Table 1 as an example, the dielectric constants, dissipation factors, and etching angles of the four metal layers L1-L4 shown in Table 2 can be calculated through formulas. Referring to Table 1, L1 to L4 represent the first to fourth layers of the metal layer, respectively. For example, the material column in Table 2 can be automatically generated by the stackup table 110 according to the type of circuit board.

Table 2

The names of each layer of the layout design diagram 120 have a certain corresponding relationship with the names of each layer of the layout design diagram converted by the simulation software 150 , but they are not completely consistent. In order to be able to automatically set various parameters in the simulation software 150, the syntax conversion module 130 must first understand the corresponding relationship, and accordingly, the layer names provided by the layout design drawing reading module 140 can be read. , which is converted into the name actually set in the simulation software 150 , and with the corresponding relationship between the parameters of each layer and the automation syntax, the automatic parameter setting of each layer can be performed.

3A-3F are schematic diagrams of partial program codes of the automation syntax according to an embodiment of the present invention. This embodiment is only one implementation manner, and is not limited thereto. The program code 310 is used to set the layer name of each layer. The name attached after the symbol "$" is the layer name. The layer names "TOP", "VCC", "IN1" and "BOTTOM" of the metal layer are obtained from the layout design drawing 120 by the syntax conversion module 130, while the layer names of the medium layer "medium40", "medium42", " medium44", "medium46", and "medium48" are names automatically generated by the simulation software 150 . Here, the metal layers "TOP", "VCC", "IN1" and "BOTTOM" respectively correspond to L1-L4 in Table 2, and the dielectric layers "medium40", "medium42", "medium44", "medium46", "medium48" " respectively correspond to "Solder Mask 1", "Medium 1" ~ "Medium 3", and "Solder Mask 2" in Table 2.

The program code 320 is used to set the dielectric constant (DK) and dissipation factor (DF) of each layer. Taking the first line of the program code 320 as an example, it is used to set the dielectric constant of the medium layer "medium40" to be 4.5, and the dissipation factor to be 0.017. And so on for others.

The program code 330 is used to set the material of the metal layer. In this embodiment, the simulation software 150 directly sets the material of the metal layers "TOP", "VCC", "IN1" and "BOTTOM" as copper (copper). to change the material of the metal layer.

Program code 340 is used to set the thickness of each layer. Here, it is assumed that the thickness unit used by the simulation software 150 is meter. Since the thickness unit used in the stack table 110 (as shown in Table 1) is mil, the syntax conversion module 130 can be used to convert the thickness unit to conform to the format of the simulation software 150 . That is, the following conversion formula can be used for unit conversion: h mil=(h*2.54*10 ⁻⁵ ) meter.

The program code 350 is used to set the etching angles of the metal layers “TOP”, “VCC”, “IN1” and “BOTTOM”. Here, the etching angles 75 and 105 are only one implementation example, and the etching angles can also be set to 70, 110 or other angles in other embodiments.

The program code 360 is used to set the relevant information of the via hole. From the layout design drawing 120 , the name of the via hole (such as “VIA20D10A28”), the type of the via hole (such as THOUGH), and the information of whether the via hole is connected or not can be obtained. The simulation software 150 will set the material of the via hole and the metallization thickness of the via hole according to the information.

In this embodiment, the layout drawing reading module 140 is used to read the information of the layout design drawing 120, and the syntax conversion module 130 is used to read the information in the stacking table 110 and the layout design drawing 120, and convert it into the information of the simulation software 150 according to the corresponding relationship. An automation program is used to automatically set various parameters of the stack structure and via holes in the simulation software 150 .

To sum up, the present invention can effectively reduce the signal simulation time required for product development, and can also prevent simulation software manufacturers or chip manufacturers from launching some tools to simplify the simulation process of competitors.

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and modifications without departing from the concept and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined by the claims.

Claims (6)

1. A simulation automation method for a simulation software executable by a computer, the simulation automation method comprising:

obtaining a plurality of parameters from an overlay table and a layout design drawing of a printed circuit board through a syntax conversion module, wherein the plurality of parameters comprise a plurality of stacking parameters and a plurality of layout parameters, and the step of obtaining the plurality of parameters from the overlay table and the layout design drawing through the syntax conversion module comprises:

obtaining the stacking parameters from the stacking table;

obtaining the layout parameters from the layout design drawing; and

calculating the dielectric constant, dissipation factor and etching angle of each of the plurality of metal layers according to the stacking relationship recorded in the stacking table;

converting each of the plurality of parameters into an automatic grammar which can be identified by the simulation software through the grammar conversion module; and

and sleeving the converted automatic grammar into the simulation software so as to perform simulation through the simulation software.

2. The simulation automation method of claim 1 further comprising:

reading the layout by a layout reading module, and inputting the parameters obtained from the layout to the grammar conversion module.

3. A simulation automation method according to claim 1,

the plurality of stacking parameters includes at least: a number of circuit board layers, a type of circuit board, a thickness of each of the plurality of dielectric layers, a dielectric constant of each of the plurality of dielectric layers, a dissipation factor of each of the plurality of dielectric layers, and a thickness of each of the plurality of metal layers;

the layout parameters at least include layer names, via hole names and via hole types.

4. The simulation automation method of claim 3 further comprising:

converting the units of the plurality of thicknesses by the syntax conversion module to conform to a format of the simulation software.

5. The simulation automation method of claim 3 wherein the step of converting each of the plurality of parameters into an automation grammar conforming to the recognition of the simulation software by the grammar conversion module comprises:

matching the layer names to convert the stacking parameters into automatic grammars which can be identified by the simulation software.

6. The simulation automation method of claim 3 further comprising:

the syntax transformation module sets a plurality of via parameters according to the plurality of via names and the plurality of via types.

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