CN111162061A - A kind of LED package structure and its manufacturing method - Google Patents
A kind of LED package structure and its manufacturing method Download PDFInfo
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- CN111162061A CN111162061A CN201811325884.2A CN201811325884A CN111162061A CN 111162061 A CN111162061 A CN 111162061A CN 201811325884 A CN201811325884 A CN 201811325884A CN 111162061 A CN111162061 A CN 111162061A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
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Abstract
本发明提供的一种LED封装结构及其制造方法，其中，该结构包括：透光基板、封装胶层和多个芯片；各个芯片固定于透光基板上，且被封装胶层覆盖；在每个芯片中，芯片靠近透光基板的面为出光面，出光面相背的面为电极面，电极面上设置有至少两个电极，电极之间相距预置距离，且电极通过焊线连接至透光基板上的线路层。本发明通过将多个芯片设置于透光基板上，并用封装胶层将各个芯片覆盖起来，使得芯片的出光面朝向基板，且由于芯片两个隔开的电极在与出光面相对的面上，可以利用较大的电极面积将电极通过焊线连接至线路层上，便于芯片的贴装，且焊接难度大大降低，对基板的精度、应力适配问题的要求不高，能够降低LED封装结构的成本和生产难度。
The present invention provides an LED packaging structure and a manufacturing method thereof, wherein the structure comprises: a light-transmitting substrate, an encapsulation adhesive layer and a plurality of chips; each chip is fixed on the light-transmitting substrate and covered by the encapsulating adhesive layer; Among the chips, the surface of the chip close to the light-transmitting substrate is the light-emitting surface, and the surface opposite to the light-emitting surface is the electrode surface. The circuit layer on the optical substrate. In the present invention, a plurality of chips are arranged on the light-transmitting substrate, and each chip is covered with an encapsulation adhesive layer, so that the light-emitting surface of the chip faces the substrate, and since the two separated electrodes of the chip are on the surface opposite to the light-emitting surface, The large electrode area can be used to connect the electrodes to the circuit layer through bonding wires, which is convenient for chip mounting, and the welding difficulty is greatly reduced. cost and difficulty of production.
Description
Technical Field
The invention relates to the technical field of LED backlight, in particular to an LED packaging structure and a manufacturing method thereof.
Background
As a new solid light source, the LED has significant advantages of energy saving and life span, and has been widely used in the fields of illumination and display.
The LED technique of being shaded mainly is divided into two kinds of types of side income formula and straight following formula, present straight following formula backlight has the LED packaging structure who adopts and use flip chip as the basis, because flip chip's electrode is less in bottom and size, if electrode size designs's is little, after the installation, the faying face of chip and base plate is little, lead to chip welding harmfully etc. through collision etc. easily in transporting the process, electrode area designs big, then the interval between the electrode just becomes little, the welding degree of difficulty of chip on the base plate will be bigger and bigger, to the machining precision of base plate, the requirement of stress adaptation problem is all higher, the cost that leads to whole packaging structure improves greatly, the production degree of difficulty is great.
Disclosure of Invention
The embodiment of the invention provides an LED packaging structure and a manufacturing method thereof, which can reduce the cost and the production difficulty of the LED packaging structure.
According to an aspect of the present invention, there is provided an LED package structure, including: the packaging structure comprises a light-transmitting substrate, a packaging adhesive layer and a plurality of chips;
each chip is fixed on the light-transmitting substrate and covered by the packaging adhesive layer;
in each chip, the surface of the chip close to the light-transmitting substrate is a light-emitting surface, the surface of the light-emitting surface opposite to the light-emitting surface is an electrode surface, at least two electrodes are arranged on the electrode surface, the electrodes are separated by a preset distance, and the electrodes are connected to the circuit layer on the light-transmitting substrate through bonding wires.
Preferably, each chip is correspondingly covered with one packaging adhesive layer;
or
The packaging adhesive layer covers all the chips and the bonding pad area of the circuit layer.
Preferably, the plurality of chips are fixed on the light-transmitting substrate in parallel rows.
Preferably, two sides of each chip in each row of chips on the light-transmitting substrate are respectively provided with one circuit layer.
Preferably, in each chip, the two electrodes are respectively connected with the two circuit layers on two sides of the chip through the bonding wires.
Preferably, in each of the chips, 70% or more of the area of the electrode face is opaque.
Preferably, a coating layer is arranged between each chip and the light-transmitting substrate and/or on the bottom surface of the light-transmitting substrate, and the coating layer is a light-transmitting layer or a fluorescent layer.
Preferably, the light-transmitting substrate contains phosphor therein.
Preferably, the coating layer and the light-transmitting substrate contain a diffusion material therein.
Preferably, the encapsulation adhesive layer is a non-light-transmitting layer.
Preferably, the non-transparent layer is an integrally opaque adhesive layer or a packaging adhesive layer formed by covering a reflective material on the surface of the transparent adhesive layer.
Preferably, the preset distance between the electrodes on the chip is in the range of 10-250 um.
According to another aspect of the present invention, there is provided a method for manufacturing the LED package structure, including:
determining a light-emitting surface of each chip, and mounting each chip on a light-transmitting substrate in a manner that the light-emitting surface of each chip faces the light-transmitting substrate, wherein electrodes of the chip are arranged on the surface opposite to the light-emitting surface, and after the chip is mounted, the electrode surface of the chip faces away from the light-transmitting substrate;
connecting the electrodes of the chips to the circuit layer of the light-transmitting substrate by bonding wires;
and coating a non-light-transmitting material on the surface of each chip to form a packaging adhesive layer, or coating a light-transmitting material on the surface of each chip, and arranging a light-reflecting material on the surface of the light-transmitting material to form a packaging adhesive layer, so that each chip is covered by the packaging adhesive layer.
According to the technical scheme, the embodiment of the invention has the following advantages:
the invention provides an LED packaging structure and a manufacturing method thereof, wherein the structure comprises: the packaging structure comprises a light-transmitting substrate, a packaging adhesive layer and a plurality of chips; each chip is fixed on the light-transmitting substrate and covered by the packaging adhesive layer; in each chip, the surface of the chip close to the light-transmitting substrate is a light-emitting surface, the surface opposite to the light-emitting surface is an electrode surface, at least two electrodes are arranged on the electrode surface, the electrodes are separated by a preset distance, and the electrodes are connected to the circuit layer on the light-transmitting substrate through bonding wires. According to the LED packaging structure, the plurality of chips are arranged on the light-transmitting substrate, and the packaging adhesive layer covers each chip, so that the light-emitting surface of each chip faces the substrate, and because the two separated electrodes of each chip are arranged on the surface opposite to the light-emitting surface, the electrodes can be connected to the circuit layer through the bonding wires by utilizing a larger electrode area, the chip can be conveniently mounted, the welding difficulty is greatly reduced, the requirements on the accuracy and stress adaptation problem of the substrate are not high, and the cost and the production difficulty of the LED packaging structure can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a top view of an embodiment of an LED package structure provided in the present invention;
FIG. 2 is a front view of one embodiment of an LED package structure provided by the present invention;
FIG. 3 is a side view of one embodiment of an LED package structure provided by the present invention;
FIG. 4 is a front view of yet another embodiment of an LED package structure provided by the present invention;
FIG. 5 is a side view of yet another embodiment of an LED package structure provided by the present invention;
FIG. 6 is a schematic diagram of a first circuit layer of another embodiment of an LED package structure provided in the present invention;
fig. 7 is a schematic diagram of a second circuit layer of another embodiment of an LED package structure provided in the present invention;
fig. 8 is a schematic flowchart of a method for manufacturing an LED package structure according to an embodiment of the present invention.
Wherein the symbols in the figures are as follows:
1. light-transmitting substrate 2, packaging adhesive layer 3, chip 4, bonding wire 5, circuit layer 6, bonding pad area 7, high-reflection light-proof material
Detailed Description
The embodiment of the invention provides an LED packaging structure and a manufacturing method thereof, which can reduce the cost and the production difficulty of the LED packaging structure.
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to fig. 3, an embodiment of an LED package structure provided in the present invention includes: the packaging structure comprises a light-transmitting substrate 1, a packaging adhesive layer 2 and a plurality of chips 3.
Each chip 3 is fixed on the transparent substrate 1 and covered by the packaging adhesive layer 2. In each chip 3, the surface of the chip 3 close to the light-transmitting substrate 1 is a light-emitting surface, the surface opposite to the light-emitting surface is an electrode surface, at least two electrodes are arranged on the electrode surface, the electrodes are separated by a preset distance, and the electrodes are connected to the circuit layer 5 on the light-transmitting substrate 1 through bonding wires 4.
In the embodiment, the encapsulation adhesive layer 2 is usually a non-transparent layer, and may be a high-reflection opaque adhesive (or a non-transparent layer may be formed by covering a reflective material on the surface of the transparent adhesive), and in order to make each chip 3 only have a light emitting surface facing the substrate, the encapsulation adhesive layer 2 needs to completely cover other surfaces of the chip.
It should be noted that, the chip 3 usually has a plurality of light emitting surfaces, and in the embodiment of the present invention, each chip 3 is disposed on the transparent substrate 1, and each chip 3 is covered by the packaging adhesive layer 2, that is, the rest surfaces of the chip 3 except the contact surface with the transparent substrate 1 are covered by the packaging adhesive layer, so that the light emitting surface of the chip 3 faces the substrate, and the chip 3 can emit light through the substrate.
Because the electrodes of the chips 3 are disposed on the surface opposite to the light-emitting surface (hereinafter referred to as an electrode surface), the light-emitting surface is disposed at the bottom and the electrode surface is disposed at the top with respect to each chip 3, and on the electrode surface (which has at least two electrodes, hereinafter described as an example of two electrodes), since the two electrodes are spaced apart from each other, the preset distance between the two electrodes can be set in advance according to actual requirements, such as reducing the preset distance between the two electrodes, and appropriately increasing the electrode bonding wire area of the chip 3, in the embodiment of the present invention, the preset distance between the two electrodes can be set within a range of 10-250 μm, the electrodes can be connected to the circuit layer 5 of the substrate through the bonding wires 4 by using a larger electrode area, which is beneficial to the mounting of the chips 3 and can meet the special requirements of customers for the chip spacing, the welding difficulty is reduced, the requirements on the precision of the substrate and the stress adaptation problem are not high, and the cost and the production difficulty of the whole LED packaging structure can be reduced.
To illustrate the embodiment of the LED package structure more specifically, another embodiment of the LED package structure is provided below, and referring to fig. 1 to 3, another embodiment of the LED package structure provided by the present invention includes: the packaging structure comprises a light-transmitting substrate 1, a packaging adhesive layer 2 and a plurality of chips 3.
Each chip 3 is fixed on the transparent substrate 1 and covered by the packaging adhesive layer 2. In each chip 3, the contact surface of the chip 3 and the light-transmitting substrate 1 is a light-emitting surface, the surface opposite to the light-emitting surface is an electrode surface, at least two electrodes are arranged on the electrode surface, a preset distance is kept between the electrodes, and the electrodes are connected to the circuit layer 5 on the light-transmitting substrate 1 through bonding wires 4.
In this embodiment, the encapsulation adhesive layer 2 is usually a non-transparent layer, and may be a high-reflection opaque adhesive (or a non-transparent layer may be formed by covering a reflective material on the surface of the transparent adhesive), in order to make each chip 3 only have a light emitting surface facing the substrate, the encapsulation adhesive layer 2 needs to completely cover the other surfaces of the chip, and further, in order to improve the reliability of the product, the specific covering manner of the encapsulation adhesive layer 2 may be one of the following two types:
(1) each chip 3 is correspondingly covered with a packaging adhesive layer 2. In this way, the region where each chip is located is individually coated with the high-reflection opaque adhesive, so that the outer surface of each chip 3 may correspond to one package adhesive layer.
(2) The packaging adhesive layer 2 covers all the chip 3 and the bonding pad area of the circuit layer 5. In this way, all the chip 3 and the pad regions of the circuit layer 5 can be coated in the same package glue layer 2 (for convenience of description, fig. 1 to 3 are described in this way), so that the processing procedure can be further simplified, and the whole package structure is simpler and more compact.
In this embodiment, in order to make the whole LED package structure more consolidated and easy to package, a plurality of chips 3 can be fixed on the transparent substrate 1 in parallel rows, and a circuit layer 5 is correspondingly disposed on both sides of the transparent substrate 1 and at a position between two adjacent rows of chips 3. And for each chip 3, two electrodes of the chip 3 are correspondingly connected with two circuit layers 5 adjacent to the chip through bonding wires 4 respectively. It can be understood that, in the above encapsulation coverage, the encapsulation 2 covers the chip 3 and also covers the bonding wires 4.
In order to improve the light-emitting uniformity of the whole LED package structure, another embodiment of the LED package structure is provided below, with reference to fig. 4 to 5, which includes: the packaging structure comprises a light-transmitting substrate 1, a packaging adhesive layer 2 and a plurality of chips 3.
Each chip 3 is fixed on the transparent substrate 1 and covered by the packaging adhesive layer 2. In each chip 3, the contact surface of the chip 3 and the light-transmitting substrate 1 is a light-emitting surface, the surface opposite to the light-emitting surface is an electrode surface, at least two electrodes are arranged on the electrode surface, a preset distance is kept between the electrodes, and the electrodes are connected to the circuit layer 5 on the light-transmitting substrate 1 through bonding wires 4.
Furthermore, each chip 3 is correspondingly covered with a packaging adhesive layer 2;
or
The packaging adhesive layer 2 covers all the chip 3 and the bonding pad area of the circuit layer 5.
Furthermore, a plurality of chips 3 are fixed on the transparent substrate 1 in parallel rows, two circuit layers 5 are disposed on two sides of each chip in each row of chips on the transparent substrate 1, and in each chip 3, two electrodes are respectively connected with two circuit layers 5 on two sides of the chip through bonding wires 4.
Furthermore, the circuit layer 5 needs to be made of a conductive material, and the conductive material on the circuit layer can be made in one of the following two ways:
(1) as shown in fig. 6, the circuit layer 5 is divided into two layers, the bottom layer can be made of a transparent or opaque conductive material, and then the entire bottom layer can be plated with a conductive material suitable for soldering (i.e. the two layers are identical in size and are overlapped together), and the specific materials of the two layers can be selected according to actual needs, which is common knowledge of those skilled in the art and will not be described in detail herein.
(2) As shown in fig. 7, the circuit layer 5 is divided into two layers, the bottom layer of which may be made of a transparent or opaque conductive material, and then a certain pad region 6 is pre-selected on the bottom layer, and then plated with a conductive material suitable for soldering, and the specific materials of the two layers may be selected according to actual requirements, which is common knowledge of those skilled in the art and will not be described in detail herein.
Furthermore, in each chip 3 adopted by the invention, the surface opposite to the light-emitting surface is a non-light-transmitting surface, namely the electrode surface is non-light-transmitting, for example, more than 70% of the area of the electrode surface can be set to be light-proof, and the rest side surfaces and the bottom surface are not limited, so that the problem that the light-emitting of the chip is influenced by the bonding wire electrode is solved. In the present embodiment, the two electrodes of the chip 3 are located on the same plane, and a certain distance needs to be kept between the two electrodes in order to keep a sufficient electrode bonding area, such chip may be a flip chip, and the like. Still further, the chip may be a monochrome chip.
Furthermore, the packaging adhesive layer 2 is a non-transparent layer, and the non-transparent layer is an opaque adhesive layer as a whole or a non-transparent layer formed by covering a reflective material on the surface of the transparent adhesive layer.
Further, the preset distance between the electrodes on the chip 3 ranges from 10 to 250 um.
Further, in order to improve the performance of the whole product, the improvement can be made by the following two ways:
(a) a coating layer, which may be a light-transmitting layer or a fluorescent layer, may be disposed between each chip 3 and the light-transmitting substrate 1 and/or on the bottom surface of the light-transmitting substrate 1. It should be noted that the coating layer may be chip adhesive, and the mounting process may be dispensing, printing, spraying, or making a film first. When the coating layer is a light-transmitting layer, the refraction effect of light in the substrate can be changed, and when the coating layer is a fluorescent layer (such as fluorescent powder added in the chip mounting adhesive), the color of light can be changed. It should be noted that, in each chip 3, if a coating layer is disposed between the chip 3 and the light-transmitting substrate 1, the area of the coating layer is usually larger than the light-emitting surface of the chip 3, so as to achieve a better light-emitting effect and light-emitting uniformity.
(b) The inside of the light-transmitting substrate 1 is doped with phosphor.
Further, in order to improve the uniformity of light emission, a diffusing material, preferably a highly heat-resistant and highly light-transmissive material such as phenol formaldehyde resin or the like, may be added to the coating layer and the light-transmissive substrate 1 on the basis of the above mode (a).
Further, as shown in fig. 4 and 5, a high reflective opaque material 7 may be coated on the predetermined surface area of the transparent substrate 1 according to the actual light output requirement. It can be understood that, in the LED package structure shown in fig. 1 to 3, the light-transmitting substrate 1 is not coated with the high-reflective opaque material 7, i.e. the light-emitting requirement of the LED package structure is each side surface and bottom surface of the entire substrate, whereas on the basis of fig. 1 to 3, all four side surfaces of the substrate may be coated with the high-reflective opaque material 7, and a part of the bottom surface is coated with the material, and only a part of the bottom surface is remained as the light-emitting surface (or only four side surfaces may be coated with the material, or only one side surface may be coated with the material, and the embodiment is not limited specifically). Therefore, different light emitting requirements of users can be met by coating the high-reflection opaque material 7 on the surface of the light-transmitting substrate.
According to the LED packaging structure, the plurality of chips are arranged on the light-transmitting substrate, and the packaging adhesive layer covers each chip, so that the light-emitting surface of each chip faces the substrate, and because the two separated electrodes of each chip are arranged on the surface opposite to the light-emitting surface, the electrodes can be connected to the circuit layer through the bonding wires by utilizing a larger electrode area, the chip can be conveniently mounted, the welding difficulty is greatly reduced, the requirements on the accuracy and stress adaptation problem of the substrate are not high, and the cost and the production difficulty of the LED packaging structure can be reduced.
The above is a description of a specific structure and a connection relationship of the LED package structure provided by the present invention, and a manufacturing method provided by the present invention is described below, referring to fig. 8, an embodiment of the manufacturing method of the LED package structure provided by the present invention includes:
801. determining the light emitting surface of each chip, mounting each chip on the light-transmitting substrate in a manner that the light emitting surface of the chip faces the light-transmitting substrate, arranging the electrodes of the chip on the surface opposite to the light emitting surface, and enabling the electrode surface of the chip to face away from the light-transmitting substrate after the chip is mounted;
802. connecting the electrodes of the chips to the circuit layer of the light-transmitting substrate through bonding wires;
803. and coating a non-light-transmitting material on the surface of each chip to form a packaging adhesive layer, or coating a light-transmitting material on the surface of each chip, and arranging a light-reflecting material on the surface of the light-transmitting material to form a packaging adhesive layer, so that each chip is covered by the packaging adhesive layer.
The LED packaging structure manufactured by the manufacturing method provided by the invention adopts the chip with one surface being the separated positive and negative electrodes and the opposite surface being the light emitting surface, the bonding wire connection is carried out by utilizing the larger electrode area of the chip, the chip mounting is convenient, the welding difficulty is greatly reduced, the requirements on the accuracy and stress adaptation problems of the substrate are not high, the production cost is greatly reduced, the thickness of the whole backlight module is reduced, the light mixing distance is reduced, and the light emitting uniformity is improved.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (13)
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| CN201811325884.2A CN111162061A (en) | 2018-11-08 | 2018-11-08 | A kind of LED package structure and its manufacturing method |
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| CN201811325884.2A CN111162061A (en) | 2018-11-08 | 2018-11-08 | A kind of LED package structure and its manufacturing method |
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| CN115706102A (en) * | 2022-09-06 | 2023-02-17 | 深圳瑞沃微半导体科技有限公司 | Backlight module manufacturing method and backlight module |
| CN116543655A (en) * | 2023-06-21 | 2023-08-04 | 深圳市艾比森光电股份有限公司 | How to make an LED display |
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