CN111162066A

CN111162066A - Backlight light source

Info

Publication number: CN111162066A
Application number: CN202010077180.9A
Authority: CN
Inventors: 方成应; 孙媛媛
Original assignee: Kunshan Hongguan Photoelectric Technology Co Ltd
Current assignee: Kunshan Hongguan Photoelectric Technology Co Ltd
Priority date: 2020-01-24
Filing date: 2020-01-24
Publication date: 2020-05-15

Abstract

The present invention provides a backlight light source, comprising: the LED chip comprises a substrate and a light emitting chip arranged on the substrate; the one side of base plate has been seted up heavy groove, and luminous chip installs in heavy groove, and accept in the heavy groove at place at least partially, and luminous chip passes through the bonding region of wire connection to base plate one side on, and the peak of wire sets up near the base plate, and the one side of base plate still is provided with first anti-welding coating, and first anti-welding coating distributes in the four corners region of place face, and the another side of base plate still is provided with the second anti-welding coating, and the second anti-welding coating is set up to the cross, and still is provided with polarity on the second anti-welding coating and judges the sign. The backlight source of the invention realizes the thinning design of the backlight source by arranging the sinking groove on the substrate and fixing the light emitting chip in the sinking groove. Meanwhile, the backlight source adopts a reverse routing mode to connect the substrate and the light-emitting chip, so that the increase of the overall height of the backlight source due to the line type of the metal wire is avoided.

Description

Backlight light source

Technical Field

The invention relates to the technical field of backlight, in particular to a backlight light source with an ultrathin design.

Background

For a backlight light source in a notebook computer, the thickness of the existing backlight light source is 0.6mm, the thinnest is 0.45mm, and the thickness is thick, so that the ultrathin design cannot be realized. This is because the light emitting chip of the backlight source in the notebook is fixed on a substrate, and the influence of the metal wires causes the backlight source to be thicker as a whole. Meanwhile, the key space of the notebook keyboard is small, the thick backlight source is not beneficial to the installation of the notebook keyboard, and the thick backlight source has certain influence on the optimized design of the notebook both structurally and attractively. Therefore, it is necessary to provide a further solution to the above problems.

Disclosure of Invention

The present invention is directed to a backlight source to overcome the shortcomings of the prior art.

To achieve the above object, the present invention provides a backlight source, comprising: the LED chip comprises a substrate and a light emitting chip arranged on the substrate;

the one side of base plate has been seted up heavy groove, luminous chip install in heavy groove, and accept in the heavy groove at place at least partially, luminous chip passes through the wire and is connected to on the welding region of base plate one side, just wire's peak is close to the base plate sets up, the one side of base plate still is provided with first anti-welding coating, first anti-welding coating distributes in the four corners region of place face, the another side of base plate still is provided with second anti-welding coating, second anti-welding coating is set up to the cross, just still be provided with polarity judgement sign on the second anti-welding coating.

As an improvement of the backlight source of the present invention, the light emitting chips are three chips for realizing RGB light emission, and each chip is connected to the soldering area on one side of the substrate through a respective metal wire.

As an improvement of the backlight source, the chips are arranged in the sinking groove side by side, and a gap is formed between the adjacent chips.

As an improvement of the backlight source, the first welding-proof coating and the second welding-proof coating are both a green paint coating.

As the improvement of the backlight source, the substrate and the light-emitting chip are both provided with metal solder balls, the end parts of the metal wires are connected to the corresponding metal solder balls, and the highest point of the metal wires is arranged close to the metal solder balls on the substrate.

As an improvement of the backlight source, the polarity judgment mark is a triangular mark arranged in the middle of the cross-shaped second solder mask.

Compared with the prior art, the invention has the beneficial effects that: the backlight source of the invention realizes the thinning design of the backlight source by arranging the sinking groove on the substrate and fixing the light emitting chip in the sinking groove. Meanwhile, the backlight source adopts a reverse routing mode to connect the substrate and the light-emitting chip, so that the increase of the overall height of the backlight source due to the line type of the metal wire is avoided.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a top view of a backlight source according to an embodiment of the present invention;

FIG. 2 is a bottom view of an embodiment of a backlight source of the present invention;

FIG. 3 is a cross-sectional view of an embodiment of a backlight source of the present invention;

fig. 4 is a circuit diagram corresponding to an embodiment of the backlight source of the invention.

Detailed Description

The present invention is described in detail below with reference to various embodiments, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should be able to make modifications and substitutions on the functions, methods, or structures of these embodiments without departing from the scope of the present invention.

The present invention provides a backlight light source, comprising: the LED chip comprises a substrate and a light emitting chip arranged on the substrate;

The technical solution of the backlight source of the present invention is illustrated below with reference to an embodiment.

As shown in fig. 1 to 4, the backlight source of the present embodiment includes: the LED chip comprises a substrate 1 and a light emitting chip 2 arranged on the substrate 1.

One surface of the substrate 1 is provided with a sinking groove 11, the light emitting chip 2 is installed in the sinking groove 11 and at least partially accommodated in the sinking groove 11, so that the light emitting chip 2 at least partially sinks into the substrate 1, and the overall height of the backlight source is further reduced.

Meanwhile, in order to achieve the light mixing effect of the backlight source, in one embodiment, the light emitting chips 2 are three chips for achieving RGB light emission, and each chip is connected to the bonding area on one surface of the substrate 1 through a respective metal wire 21. Wherein, each chip is arranged in the sinking groove 11 side by side, and a gap is arranged between adjacent chips. So set up, be close to the setting relatively with a plurality of chips, be favorable to ensureing the effect of mixing the light.

The light-emitting chip 2 is connected to the welding area on one surface of the substrate 1 through a metal wire 21, and the highest point of the metal wire 21 is arranged close to the substrate 1. The purpose of this design is to consider that the height difference exists between the light emitting chip 2 and the substrate 1, and if the highest point of the metal wire 21 is close to the light emitting chip 2, the overall height of the backlight source will be increased, which is not favorable for the ultra-thin design of the backlight source.

In one embodiment, metal solder balls are disposed on the substrate 1 and the light emitting chip 2, ends of the metal wires 21 are connected to the corresponding metal solder balls, and the highest point of the metal wire 21 is disposed close to the metal solder balls on the substrate 1.

One side of the substrate 1 is also provided with a first solder mask layer 12, and the first solder mask layer 12 is distributed in the four corners of the side where the solder mask layer is arranged, so that the phenomenon that tin permeates into a product due to thermal expansion of the product after reflow soldering to affect the stability of the product performance can be prevented. In one embodiment, the first solder mask coating 12 is a green paint coating.

The other side of the substrate 1 is also provided with a second welding-proof coating 13, and the second welding-proof coating 13 is in a cross shape. With this arrangement, short circuit failure after reflow soldering can be prevented. In one embodiment, the first and second

solder mask layers

12 and 13 are both a green paint layer.

In addition, a polarity judgment mark 14 is further provided on the second solder resist 13 to identify the polarity during the production and use. In one embodiment, the polarity judgment mark 14 is a triangular mark disposed in the middle of the cross-shaped second solder mask layer 13.

In summary, the backlight source of the present invention realizes the thinning design of the backlight source by forming the sinking groove on the substrate and fixing the light emitting chip in the sinking groove. Meanwhile, the backlight source adopts a reverse routing mode to connect the substrate and the light-emitting chip, so that the increase of the overall height of the backlight source due to the line type of the metal wire is avoided.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A backlight source, characterized in that the backlight source comprises: a substrate and a light-emitting chip arranged on the substrate;

One side of the substrate is provided with a sinking groove, the light-emitting chip is installed in the sinking groove, and at least partially accommodated in the sinking groove where it is located, and the light-emitting chip is connected to the welding area on one side of the substrate through metal wires and the highest point of the metal wire is set close to the substrate, one side of the substrate is also provided with a first solder resist coating, the first solder resist coating is distributed in the four corners of the surface, the substrate The other side is also provided with a second anti-soldering coating, the second anti-soldering coating is arranged in a cross shape, and the second anti-soldering coating is also provided with a polarity judgment mark.

2 . The backlight source according to claim 1 , wherein the light-emitting chips are three chips that realize RGB light emission, and each chip is connected to the welding area on one side of the substrate through respective metal wires. 3 .

3 . The backlight source according to claim 2 , wherein each of the chips is arranged side by side in the corresponding sink, and there is a gap between adjacent chips. 4 .

4 . The backlight source of claim 1 , wherein the first solder resist coating and the second solder resist coating are both a green paint coating. 5 .

5 . The backlight source according to claim 1 , wherein metal solder balls are arranged on both the substrate and the light-emitting chip, the ends of the metal wires are connected to the corresponding metal solder balls, and the The highest point is placed close to the metal solder balls on the substrate.

6 . The backlight source according to claim 1 , wherein the polarity determination mark is a triangular mark arranged in the middle of the cross-shaped second solder resist coating. 7 .