CN111162021B - Test probe apparatus for testing semiconductor dies and related systems and methods - Google Patents

Abstract

The present invention provides a test probe device for testing semiconductor bare chips, comprising a device support base, a support foot rod, a main support rod, a CCD detection camera, a side support rod, a probe holding seat structure, an air guide connecting pipe, a connection Data cable, adjustable computer support base structure, integrated control computer, adjustment base, adjustment screw, semiconductor bare chip support base structure, test probes and adjustment holes. Under the action of CCD detection camera, signal memory, analog-to-digital converter, photodiode and sensor, the present invention conducts the detailed in-out test of the semiconductor bare chip, and displays it on the integrated control computer to increase the convenience of observation; meanwhile, it is convenient for probes It is easy to operate and has obvious intelligent test function. It can generate the relationship between the output voltage of the CCD device and the input exposure amount and display it on the PC display, and can obtain the test results of the main photoelectric parameters. Easy to adjust and high efficiency.

Description

A test probe apparatus and related system and method for testing semiconductor die

technical field

The invention belongs to the technical field of testing equipment for semiconductor bare chips, and in particular relates to a testing probe device for testing semiconductor bare chips and a related system and method.

Background technique

Semiconductor dies are routinely fabricated in large area wafers such that hundreds or thousands of identical individual dies are fabricated simultaneously. This die may include diodes, transistors, metal oxide semiconductor field effect transistors, insulated gate bipolar transistors, and the like. After formation, the die of the wafer may be tested for certain characteristics via testing equipment (commonly referred to as "wafer probe" or "probe" testing). Typical die testing includes optical testing or electrical testing by bringing the die into contact with probe pins. Dies that fail the probe test for any reason are usually marked for removal.

When electrical testing is performed, the dies in the wafer that pass the probe test are often damaged, especially the bond pads contacted by the probe pins and the dies on the under bump metallization (UBM). Also, from time to time, dies with only minor skin damage are marked for removal via optical testing. During wafer probing, due to testing limitations and inaccuracies discussed above, some dies pass wafer probing and are considered "good dies" when they are actually defective. Conversely, when the dies are actually "good dies", some dies fail the wafer probe test and are considered bad dies.

In addition, the Chinese Patent Publication No. CN110031744A, the invention-creation title is a test probe system for testing a bare chip of a wafer, which includes: a first probe interface positioned on at least one of the wafers including the 3DI structure On the first side of the die, the first probe interface includes: a voltage source; and at least one first inductor operably coupled to the voltage source. The system further includes a carrier for supporting the wafer on a side of the carrier opposite the first probe interface; and a second probe interface on the carrier from the first probe On opposite sides of the interface: a voltage sensor; and at least one second inductor operably coupled to the voltage sensor. the voltage source of the first probe interface is configured to induce a voltage inductively within at least one 3DI structure of the die via the at least one first inductor, and wherein the voltage of the carrier A sensor is configured to detect a voltage within the at least one 3DI structure via the at least one second inductor. However, the existing semiconductor bare chip test probe equipment still has the problems that the semiconductor bare chip cannot be displayed in detail, the operation control is inconvenient and the test efficiency is low.

In view of this, it is very necessary to invent a test probe apparatus and related systems and methods for testing semiconductor die.

SUMMARY OF THE INVENTION

In order to solve the above-mentioned technical problems, the present invention provides a test probe device for testing semiconductor bare chips and a related system and method, so as to solve the problem that the existing semiconductor bare chip test probe devices still cannot perform detailed testing of semiconductor bare chips. Display, inconvenient operation control and low test efficiency.

A test probe device for testing semiconductor bare chips, including a device support base, a support foot rod, a main support rod, a CCD detection camera, a side support rod, a probe holder structure, an air-conducting connecting pipe, and a connecting data line, Adjustable computer support base structure, integrated control computer, adjustment base, adjustment screw, semiconductor bare chip support base structure, test probes and adjustment holes, the support legs are screwed on the four corners of the lower surface of the equipment support base The main support rod is threadedly connected to the middle position of the rear of the upper surface of the equipment support base; the CCD detection camera is bolted to the upper end of the main support rod; the side support rods are respectively threaded on the equipment support base the middle position of the left and right sides of the upper surface; the probe clamping seat structure is screwed on the upper end of the side support rod; the air guide connecting pipe is embedded in the outer side of the probe clamping seat structure; the connection data line One end is plugged into the output end of the CCD detection camera, and the other end is plugged into the input end of the integrated control computer; the adjustable computer support base structure is threadedly connected to the upper right side of the upper surface of the equipment support base; the integrated control computer It is installed at the front of the adjustable computer support base structure; the adjustment base is bolted to the middle position of the upper front side of the equipment support base; the adjustment screw thread is connected to the inner upper right position of the adjustment base; the semiconductor The die support base structure is arranged on the upper part of the adjustment base and is engaged with the adjustment screw rod; the test probe is clamped on the upper end of the probe clamping base structure; the adjustment hole is opened inside the equipment support base.

Preferably, the probe clamping seat structure includes a support seat plate, a cylinder regulating valve, an air pipe, a sealing valve, a fixing ring and a locking screw, and the cylinder regulating valve is threadedly connected to the upper middle position of the supporting seat plate ; the air guide pipe is embedded in the middle position of the right side of the cylinder regulating valve; the sealing valve is sleeved on the right end of the air guide pipe; the fixing ring screw is connected to the right side of the sealing valve; the locking screw The screw connection is in the middle position on the right side of the fixing ring.

Preferably, the adjustable computer support base structure includes a support column, a connecting screw, a U-shaped seat, a horizontal suspension rod and a connecting plate, and the connecting screw is integrally arranged at the lower middle position of the support column; The type seat is bolted to the upper end of the support column; one end of the horizontal hanger is axially connected to the inner right position of the U-shaped seat, and the other end is screwed to the rear middle position of the connecting plate.

Preferably, the semiconductor die support base structure includes a support base, an outer groove, an inner placement groove and a pick-up groove, and the outer groove is opened at the inner and outer positions of the support bracket; the inner The placing slot is set at the upper middle position of the support bracket; the said picking groove is set at the upper right position of the support bracket.

Preferably, an arc-shaped silicone pad is glued to the top of the locking screw; the test probe is inserted into the fixing ring and clamped and fixed with the locking screw.

Preferably, the air guide connecting pipe is embedded on the left side of the cylinder regulating valve and communicates with the air guide pipe and the sealing valve.

Preferably, the connecting plate is a rectangular stainless steel plate; the inner wall of the connecting plate is provided with a circular through hole; the integrated control computer is installed on the front surface of the connecting plate.

A related system for testing semiconductor bare chips, comprising a workbench, a device support base, a CCD detection camera, a self-balancing adjustment module and an integrated control computer, the device support base is placed on the upper part of the workbench; the The CCD detection camera, the self-balancing adjustment module and the integrated control computer are electrically connected to each other and installed on the upper part of the equipment support base.

Preferably, the inside of the CCD detection camera includes a signal memory, an analog-to-digital converter, a photodiode and a sensor, and the signal memory, the analog-to-digital converter, the photodiode and the sensor are electrically connected to each other.

Preferably, the integrated control computer further includes an external control output module, an image processing module and a display screen, and the external control output module and the image processing module are respectively electrically connected to the display screen.

Preferably, the signal memory, the analog-to-digital converter, the photodiode and the sensor are respectively electrically connected to the image processing module.

An operation method for testing a semiconductor bare chip test probe device, which specifically includes the following steps:

Step 1: Clamp and fix the test probe;

Step 2: Fix the semiconductor die;

Step 3: Marking of the first landing pad;

Step 4: Implementation of interconnects;

Step 5: Start the CCD detection camera for testing;

Step 6: Output of test data;

Step 7: Mark replacement of semiconductor die.

Preferably, in step 1, the probe for testing is inserted into the fixing ring, and the locking screw is tightened for fixing, and the airway is rotated to adjust the probe to an appropriate angle.

Preferably, in the second step, the semiconductor die is placed in the inner placement groove.

Preferably, in step 3, a first landing pad is implemented on the scribe line of the semiconductor die for marking.

Preferably, in step four, a first interconnect is implemented on the scribe line and between the landing pad and the cluster of dies on the wafer.

Preferably, in step 5, start the CCD inspection camera and the integrated control computer; use automated test equipment to test the die cluster in the One or more die-to-die links are implemented on the scribe lines.

Preferably, in step 6, the data displayed on the integrated control computer is output, which can be output in Word or Excel format.

Preferably, in the seventh step, the access tool is inserted through the access groove to increase the convenience of replacing the semiconductor die.

Compared with the prior art, the beneficial effect of the present invention is: under the action of the CCD detection camera, the signal memory, the analog-to-digital converter, the photodiode and the sensor, the detailed in-out test of the semiconductor bare chip is carried out, and the test is displayed on the integrated control computer. It increases the convenience of inspection; at the same time, when the probe and the semiconductor die are fixed, the fixing ring and the locking screw, as well as the support bracket, the outer groove, the adjustment seat and the adjustment screw are controlled to increase the convenience of adjustment; easy operation, With obvious intelligent test function, it can generate the relationship between the output voltage of the CCD device and the input exposure amount and display it on the PC monitor, and can obtain the test results of the main photoelectric parameters, which is easy to adjust and has high efficiency.

Description of drawings

Fig. 1 is the structural schematic diagram of the front view of the test probe device for testing semiconductor die according to the present invention;

2 is a schematic structural diagram of a side view of a test probe device for testing semiconductor die according to the present invention;

Fig. 3 is the top view structure schematic diagram of the equipment support base of the present invention;

Fig. 4 is the structural schematic diagram of the probe holding seat structure of the present invention;

5 is a schematic structural diagram of the adjustable computer support base structure of the present invention;

6 is a schematic structural diagram of the semiconductor die support base structure of the present invention;

7 is a schematic diagram of a related system for testing a semiconductor die test probe device of the present invention;

8 is a schematic structural diagram of a CCD detection camera system of the present invention;

Fig. 9 is the structural representation of the integrated control computer system of the present invention;

10 is a flow chart of a method of use of the present invention;

In the picture:

1. Equipment support base; 2. Support foot rod; 3. Main support rod; 4. CCD detection camera; 5. Side support rod; ; 63, air guide tube; 64, sealing valve; 65, fixing ring; 66, locking screw; 7, air guide connecting pipe; 8, connecting data cable; 9, adjustable computer support base structure; 91, support column; 92 , connecting screw; 93, U-shaped seat; 94, horizontal boom; 95, connecting plate; 10, integrated control computer; 11, adjustment seat; 12, adjustment screw; 13, semiconductor die support seat structure; 131, support bracket seat; 132, outer groove; 133, internal placement groove; 134, extraction groove; 14, test probe; 15, adjustment hole.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments.

The components of the embodiments of the invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings are not intended to limit the scope of the invention as claimed, but are merely representative of selected embodiments of the invention.

Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

As shown in Figures 1 to 2, the present invention provides a test probe device for testing semiconductor bare chips, including a device support base 1, a support leg rod 2, a main support rod 3, a CCD detection camera 4, and a side support Rod 5, probe holding seat structure 6, air guide connection pipe 7, connecting data line 8, adjustable computer support seat structure 9, integrated control computer 10, adjustment seat 11, adjustment screw 12, semiconductor die support seat structure 13 , the test probe 14 and the adjustment hole 15, the described support legs 2 are screwed to the four corner positions of the lower surface of the equipment support base 1; The said CCD detection camera 4 is bolted to the upper end of the main support rod 3; The clamping seat structure 6 is screwed on the upper end of the side support rod 5; the air guide connecting pipe 7 is embedded in the outer side of the probe clamping seat structure 6; one end of the connecting data line 8 is plugged into the CCD detection camera 4 The output end of the device, and the other end is plugged into the input end of the integrated control computer 10; the adjustable computer support base structure 9 is threadedly connected to the upper right side of the upper surface of the equipment support base 1; the integrated control computer 10 is installed in an adjustable Adjust the front part of the computer support base structure 9; the adjustment base 11 is bolted to the middle position of the upper front side of the equipment support base 1; the adjustment screw 12 is threadedly connected to the inner upper right position of the adjustment base 11; the The semiconductor die support base structure 13 is arranged on the upper part of the adjustment base 11 and is engaged with the adjustment screw 12; the test probe 14 is clamped on the upper end of the probe clamping base structure 6; the adjustment hole 15 is opened Inside the equipment support base 1.

In this embodiment, specifically, the probe clamping seat structure 6 includes a support seat plate 61, a cylinder regulating valve 62, an air conduit 63, a sealing valve 64, a fixing ring 65 and a locking screw 66. The cylinder The regulating valve 62 is threadedly connected to the upper middle position of the support seat plate 61; the air duct 63 is embedded in the right middle position of the cylinder regulating valve 62; the sealing valve 64 is sleeved on the right end of the air duct 63; the The fixing ring 65 is screwed to the right side of the sealing valve 64 ; the locking screw 66 is screwed to the middle position of the right side of the fixing ring 65 .

In this embodiment, specifically, the adjustable computer support base structure 9 includes a support column 91, a connecting screw 92, a U-shaped seat 93, a horizontal suspension rod 94 and a connecting plate 95, and the connecting screw 92 is integrally arranged At the lower middle position of the support column 91; the U-shaped seat 93 is bolted to the upper end of the support column 91; one end of the horizontal suspension rod 94 is axially connected to the inner right position of the U-shaped seat 93, and the other end is screwed At the rear middle position of the connecting plate 95 .

In this embodiment, specifically, the semiconductor die support base structure 13 includes a support bracket 131 , an outer groove 132 , an inner placement groove 133 and an extraction groove 134 , and the outer groove 132 is opened in the support The inner and outer positions of the bracket 131 ; the inner placement groove 133 is opened at the upper middle position of the support bracket 131 ; the extraction groove 134 is opened at the upper right position of the support bracket 131 .

In this embodiment, specifically, the top of the locking screw 66 is glued with an arc-shaped silicone pad; the test probe 14 is inserted into the fixing ring 65 and clamped and fixed with the locking screw 66 .

In this embodiment, specifically, the air guide connecting pipe 7 is embedded on the left side of the cylinder regulating valve 62 and communicates with the air guide pipe 63 and the sealing valve 64 .

In this embodiment, specifically, the connecting plate 95 is a rectangular stainless steel plate; the inner wall of the connecting plate 95 is provided with a circular through hole; the integrated control computer 10 is installed on the connecting plate 95 positive surface.

A related system for testing semiconductor bare chips, comprising a workbench, a device support base, a CCD detection camera, a self-balancing adjustment module and an integrated control computer, the device support base is placed on the upper part of the workbench; the The CCD detection camera, the self-balancing adjustment module and the integrated control computer are electrically connected to each other and installed on the upper part of the equipment support base.

In this embodiment, specifically, the inside of the CCD detection camera includes a signal memory, an analog-to-digital converter, a photodiode and a sensor, and the signal memory, the analog-to-digital converter, the photodiode and the sensor are electrically connected to each other. Connection settings.

In this embodiment, specifically, the integrated control computer further includes an external control output module, an image processing module and a display screen, and the external control output module and the image processing module are respectively electrically connected to the display screen.

In this embodiment, specifically, the signal memory, the analog-to-digital converter, the photodiode and the sensor are respectively electrically connected to the image processing module.

An operation method for testing a semiconductor bare chip test probe device, which specifically includes the following steps:

Step 1: Clamp and fix the test probe;

Step 2: Fix the semiconductor die;

Step 3: Marking of the first landing pad;

Step 4: Implementation of interconnects;

Step 5: Start the CCD detection camera for testing;

Step 6: Output of test data;

Step 7: Mark replacement of semiconductor die.

In this embodiment, specifically, in step 1, the probe for testing is inserted into the fixing ring 65, and the locking screw 66 is tightened for fixing, and the air guide tube 63 is rotated to adjust the probe to an appropriate angle.

In this embodiment, specifically, in step 2, the semiconductor die is placed in the inner placement groove 133 .

In this embodiment, specifically, in step 3, a first landing pad is implemented on the scribe line of the semiconductor die for marking.

In this embodiment, specifically, in step four, a first interconnect is implemented on the scribe line and between the landing pad and the cluster of dies on the wafer.

In this embodiment, specifically, in step 5, the CCD inspection camera and the integrated control computer are activated; the automated test equipment is used to make the landing pad contact the probe tip and apply the automated test equipment resources to the die cluster through the probe tip. The test die cluster implements one or more die-to-die links on the scribe lines.

In this embodiment, specifically, in step 6, the data displayed on the integrated control computer is output, which can be output in Word or Excel format.

In this embodiment, specifically, in step 7, the access tool is inserted through the access groove 134 to increase the convenience of replacing the semiconductor die.

The invention provides a test probe device for testing semiconductor bare chips and a related system and method, which can carry out detailed in-out testing of semiconductor bare chips under the action of a CCD detection camera, a signal memory, an analog-to-digital converter, a photodiode and a sensor. , and displayed on the integrated control computer to increase the convenience of viewing; at the same time, when the probe and the semiconductor die are fixed, the fixing ring 65 and the locking screw 66, as well as the support bracket 131, the outer groove, the adjustment seat and the adjustment The screw increases the convenience of adjustment; it is easy to operate, has obvious intelligent test function, can generate the relationship between the output voltage of the CCD device and the input exposure amount and display it on the PC display, and can obtain the test results of the main photoelectric parameters, The adjustment is convenient and the efficiency is high.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the design concept of the present invention shall be included in the protection scope of the present invention. within.

Claims (10)

1. The device for testing the semiconductor bare chip comprises a device supporting base (1), supporting leg rods (2), a main support rod (3), a CCD detection camera (4), side support rods (5), a probe clamping seat structure (6), an air guide connecting pipe (7), a connecting data line (8), an adjustable computer supporting seat structure (9), an integrated control computer (10), an adjusting seat (11), an adjusting screw rod (12), a semiconductor bare chip supporting seat structure (13), a testing probe (14) and an adjusting hole (15), wherein the supporting leg rods (2) are respectively connected to four corners of the lower surface of the device supporting base (1) through screws; the main support rod (3) is in threaded connection with the middle position of the rear part of the upper surface of the equipment support base (1); the CCD detection camera (4) is connected to the upper end of the main support rod (3) through a bolt; the side supporting rods (5) are respectively in threaded connection with the middle positions of the left side and the right side of the upper surface of the equipment supporting base (1); the probe clamping seat structure (6) is connected to the upper end of the side supporting rod (5) through a screw; the air guide connecting pipe (7) is embedded outside the probe clamping seat structure (6); one end of the connecting data wire (8) is inserted at the output end of the CCD detection camera (4), and the other end is inserted at the input end of the integrated control computer (10); the adjustable computer supporting seat structure (9) is in threaded connection with the right upper side of the upper surface of the equipment supporting base (1); the integrated control computer (10) is arranged at the front part of the adjustable computer supporting seat structure (9); the adjusting seat (11) is connected to the middle position of the front side of the upper part of the equipment supporting base (1) through a bolt; the adjusting screw rod (12) is in threaded connection with the right upper side position inside the adjusting seat (11); the semiconductor bare chip supporting seat structure (13) is arranged at the upper part of the adjusting seat (11) and is meshed with the adjusting screw rod (12); the test probe (14) is clamped at the upper end of the probe clamping seat structure (6); the adjusting hole (15) is formed in the equipment supporting base (1).

2. The test probe apparatus for testing semiconductor dies according to claim 1, wherein the probe holder structure (6) comprises a support holder plate (61), a cylinder regulating valve (62), a gas guiding tube (63), a sealing valve (64), a fixing ring (65) and a locking screw (66), the cylinder regulating valve (62) is screwed at an upper middle position of the support holder plate (61); the air guide pipe (63) is embedded in the middle position of the right side of the air cylinder regulating valve (62); the sealing valve (64) is sleeved at the right end of the air duct (63); the fixing ring (65) is screwed on the right side of the sealing valve (64); the locking screw (66) is in threaded connection with the middle position of the right side of the fixing ring (65).

3. The test probe apparatus for testing semiconductor dies according to claim 2, wherein the adjustable computer support structure (9) comprises a support pillar (91), a connection screw (92), a U-shaped seat (93), a cross-bar (94) and a connection plate (95), the connection screw (92) is integrally disposed at a lower middle position of the support pillar (91); the U-shaped seat (93) is connected to the upper end of the supporting column (91) through a bolt; one end of the transverse suspender (94) is connected to the right side of the inside of the U-shaped seat (93) in a shaft mode, and the other end of the transverse suspender is connected to the middle position of the rear portion of the connecting plate (95) in a screw mode.

4. The test probe device for testing semiconductor dies according to claim 3, wherein the semiconductor die supporting base structure (13) comprises a supporting bracket (131), an outer recess (132), an inner placing groove (133) and an extraction recess (134), the outer recess (132) being opened at an inner outer position of the supporting bracket (131); the inner placing groove (133) is arranged at the middle position of the upper part of the supporting bracket (131); the fetching groove (134) is arranged at the right side position of the upper part of the supporting bracket (131).

5. The apparatus according to claim 4, wherein the locking screw (66) has an arc-shaped silicone pad glued to its tip; the test probe (14) is inserted into the fixing ring (65) and clamped and fixed by a locking screw (66).

6. Test probe device for testing semiconductor dies according to claim 5, characterized in that the connection plate (95) is embodied as a rectangular stainless steel plate; the inner wall of the connecting plate (95) is provided with a circular through hole; the integrated control computer (10) is arranged on the front surface of the connecting plate (95).

7. A related system for testing semiconductor die test probe devices as recited in claim 1, including a table, a device support base, a CCD detection camera, a self-balancing adjustment module and an integrated control computer, said device support base being disposed above said table; the CCD detection camera, the self-balancing adjusting module and the integrated control computer are electrically connected with each other and are arranged on the upper part of the equipment supporting base.

8. The system of claim 7, wherein the CCD inspection camera includes a signal memory, an analog-to-digital converter, a photodiode, and a sensor, the signal memory, the analog-to-digital converter, the photodiode, and the sensor being electrically connected to each other.

9. The system of claim 7, wherein the integrated control computer further comprises an external control output module, an image processing module and a display, and the external control output module and the image processing module are electrically connected to the display respectively.

10. The method of claim 1, further comprising the steps of:

the method comprises the following steps: clamping and fixing the test probe;

step two: fixing the semiconductor bare chip;

step three: marking of the first landing pad;

step four: implementation of an interconnect;

step five: starting a CCD detection camera for testing;

step six: outputting test data;

step seven: the marking of the semiconductor die is replaced.

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