CN111162004B - Method and device for adjusting internal environment of semiconductor equipment and electronic equipment - Google Patents
Method and device for adjusting internal environment of semiconductor equipment and electronic equipment Download PDFInfo
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- CN111162004B CN111162004B CN201911374147.6A CN201911374147A CN111162004B CN 111162004 B CN111162004 B CN 111162004B CN 201911374147 A CN201911374147 A CN 201911374147A CN 111162004 B CN111162004 B CN 111162004B
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Abstract
本发明提供了一种半导体设备内部环境的调整方法、装置和电子设备，根据所接收到的用户发出的模型调整指令，调整预设的半导体设备的结构模型，并对调整后的该结构模型进行内部环境分析，当判断所得到的分析结果符合预设结果时，根据调整后的该结构模型，对半导体设备的设备结构进行调整，以控制该半导体设备的内部环境。该方法首先通过调整分析半导体设备的结构模型，使其满足预期效果，然后按照调整后的结构模型调整实际半导体设备的结构，即可满足半导体加工器件对半导体设备内部环境的要求，从而提高半导体器件生产良率。
The invention provides a method, device and electronic device for adjusting the internal environment of a semiconductor device. According to a received model adjustment instruction issued by a user, the preset structural model of the semiconductor device is adjusted, and the adjusted structural model is adjusted. In the internal environment analysis, when it is judged that the obtained analysis result conforms to the preset result, the device structure of the semiconductor device is adjusted according to the adjusted structure model to control the internal environment of the semiconductor device. The method firstly adjusts and analyzes the structural model of the semiconductor device to make it meet the expected effect, and then adjusts the structure of the actual semiconductor device according to the adjusted structural model, so as to meet the requirements of the semiconductor processing device for the internal environment of the semiconductor device, thereby improving the semiconductor device. Production yield.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a method and an apparatus for adjusting an internal environment of a semiconductor device, and an electronic device.
Background
Integrated Circuit (IC) fabrication is the core of the electronic information industry, and is one of the most important high and new technologies that promote the development of national economy and social informatization. The microenvironment inside the semiconductor equipment has an important influence on the production yield of the semiconductor device. In the process of processing semiconductor devices, most semiconductor equipment requires the internal environment of the equipment to maintain a relatively positive pressure to the external environment, and turbulence usually exists in the semiconductor equipment while the positive pressure is formed, so that if the turbulence is in a position with a large influence on the processing technology of the semiconductor devices, the production yield of the semiconductor devices is adversely affected.
Disclosure of Invention
The invention aims to provide a method for adjusting the internal environment of semiconductor equipment so as to improve the production yield of semiconductor devices.
The invention provides a method for adjusting the internal environment of semiconductor equipment, which comprises the following steps: receiving a model adjusting instruction sent by a user; adjusting a preset structure model of the semiconductor equipment according to the model adjusting instruction; performing internal environment analysis on the adjusted structure model to obtain an analysis result; judging whether the analysis result meets a preset result or not; and if so, adjusting the equipment structure of the semiconductor equipment according to the adjusted structure model so as to control the internal environment of the semiconductor equipment.
Further, the semiconductor device includes a plurality of partitions; according to the model adjusting instruction, adjusting a preset structural model of the semiconductor equipment, wherein the step comprises the following steps: according to the model adjusting instruction, adjusting the air inlet position, the air outlet position and a passage between the plurality of subareas in the preset structural model of the semiconductor equipment, wherein the passage comprises: via size, via location, and via configuration.
Further, the method further comprises: and if not, continuing to execute the step of receiving the model adjusting instruction sent by the user until the analysis result meets the preset result.
Further, if the at least one subarea of the semiconductor equipment contains liquid to be discharged and gas to be discharged at the same time, the at least one subarea of the semiconductor equipment also comprises a liquid discharge port, an air discharge port and a separation module; the separation module is used for separating the liquid to be discharged and the flow direction of the gas to be discharged so as to enable the liquid to be discharged through the liquid discharge port, and the gas to be discharged is discharged through the air exhaust port.
Further, the semiconductor device has a periodical opening and closing window, and the method further comprises: collecting air pressure data of each subarea of the semiconductor equipment in the process of each opening and closing period; comparing the air pressure data of the subareas with preset air pressure data of the subareas, and outputting a difference value; adjusting the air intake of the subareas according to the difference value; wherein the number of the difference values is one or more.
Further, according to the difference value, adjusting the intake of the partition, including: judging whether the difference value exceeds a preset range or not; if the difference value does not exceed the preset range, selecting the maximum difference value; judging whether the maximum difference value has periodicity or not; if the maximum difference value has periodicity, calculating the corresponding relation between the period of the maximum difference value and the period of the opening and closing window of the subarea; and adjusting the air intake of the subareas according to the corresponding relation.
Further, after the step of adjusting the intake air volume of the partition according to the corresponding relationship, the method further includes: and if the difference value exceeds the preset range, sending an alarm instruction or stopping running the semiconductor equipment so as to maintain the semiconductor equipment.
Further, the method further comprises: and if the maximum difference value does not have periodicity, adjusting the intake air volume of the subareas according to the maximum difference value.
Further, according to the corresponding relationship, adjusting the intake of the subareas comprises: establishing a regression model based on the corresponding relation; performing regression analysis on the regression model based on a historical optimal solution set, and outputting an optimal solution for adjusting the intake air amount; updating the optimal solution into the historical optimal solution set; and adjusting the intake of the subareas according to the optimal solution.
The invention provides a device for adjusting the internal environment of semiconductor equipment, which comprises: the receiving module is used for receiving a model adjusting instruction sent by a user; the first adjusting module is used for adjusting a preset structure model of the semiconductor equipment according to the model adjusting instruction; the analysis module is used for carrying out internal environment analysis on the adjusted structure model to obtain an analysis result; the judging module is used for judging whether the analysis result meets a preset result or not; and the second adjusting module is used for adjusting the equipment structure of the semiconductor equipment according to the adjusted structure model if the analysis result accords with the preset result so as to control the internal environment of the semiconductor equipment.
The invention provides an electronic device, which comprises a processor and a memory, wherein the memory stores machine executable instructions capable of being executed by the processor, and the processor executes the machine executable instructions to realize the method for adjusting the internal environment of the semiconductor device.
According to the method and the device for adjusting the internal environment of the semiconductor equipment and the electronic equipment, the preset structure model of the semiconductor equipment is adjusted according to the received model adjusting instruction sent by the user, the internal environment of the adjusted structure model is analyzed, and when the analysis result obtained is judged to accord with the preset result, the equipment structure of the semiconductor equipment is adjusted according to the adjusted structure model so as to control the internal environment of the semiconductor equipment. The method comprises the steps of firstly adjusting and analyzing a structure model of the semiconductor equipment to enable the structure model to meet the expected effect, and then adjusting the structure of the actual semiconductor equipment according to the adjusted structure model, so that the requirement of a semiconductor processing device on the internal environment of the semiconductor equipment can be met, and the production yield of the semiconductor device is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor device according to an embodiment of the present invention;
fig. 2 is a flowchart illustrating a method for adjusting an internal environment of a semiconductor device according to an embodiment of the present invention;
fig. 3 is a flowchart of another method for adjusting an internal environment of a semiconductor device according to an embodiment of the present invention;
FIG. 4 is a schematic top view of a modified semiconductor device structure according to an embodiment of the present invention;
FIG. 5 is a flowchart of another method for adjusting an internal environment of a semiconductor device according to an embodiment of the present invention;
FIG. 6 is a schematic view of a gas and liquid flow direction using a separation module according to an embodiment of the present invention;
fig. 7 is a flowchart illustrating another method for adjusting an internal environment of a semiconductor device according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an apparatus for adjusting an internal environment of a semiconductor device according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The fabrication of Integrated Circuits (ICs) is the core of the electronic information industry, and is one of the most important high and new technologies that promote the informatization development of the national economy and society. With the explosive growth of artificial intelligence, 5G communication, internet of things, automobile application and the like on chip requirements, the semiconductor industry encounters a huge development opportunity. The size of the devices and the width of the wiring processed by the semiconductor equipment are also continuously reduced along with the development of moore's law. Meanwhile, the upgrading of the technical nodes increases the procedures in the wafer manufacturing process, for example, a CPU chip needs 400 channels for 90nm nodes, and more than 1200 channels for 5nm nodes, so that the yield is reduced due to the increase of the procedures; some industry leaders still have the problem of unstable technology or low yield, and one important factor causing the low yield is micro-pollution in the manufacturing process. Measurements show that for every 1% yield increase, the net revenue for a pilot plant producing 6 million pieces a year increases by two to nine million. Based on this, the design concept of semiconductor devices has begun to be inclined from "meeting the use requirements of various processes and improving the processing efficiency" to "improving the yield of the products produced by the devices". Therefore, it is increasingly important to control the microenvironment inside the semiconductor device to reduce micro-contamination during wafer processing.
In the existing wafer manufacturing equipment, an air filter generally generates clean air flow, and the clean air flow enters from the upper part of the equipment, flows through a process area and is exhausted from an air outlet at the lower part, so that the aims of purifying the microenvironment in the equipment and preventing the deposition of polluted gas in the process area are fulfilled. The method has certain defects and shortcomings in the control of the microenvironment.
In accordance with the state of the art, the problems that are typically encountered in semiconductor equipment are described below in terms of a CMP (Chemical Mechanical Polishing) apparatus for Chemical Mechanical Polishing of wafers.
1. The CMP apparatus described above has two inherent partitions: the polishing device comprises a polishing area and a cleaning area, wherein the cleaning area is required to keep a relative positive pressure to the external environment so as to prevent the inside from being polluted by water vapor in the polishing area and external environment gas; when positive pressure is formed, the inevitable turbulence exists in the cleaning closed area, the formation of the turbulence can cause the cleaning gas and the chemical steam to be condensed, and the cleaning effect is influenced after condensed particles are generated.
2. The polishing area needs to keep relative negative pressure to the environment so as to prevent polishing liquid from forming gas flowing out of equipment after being volatilized, and the gas is volatilized into the environment to cause physical damage to engineers in the environment; by the preceding equipment situation, form the negative pressure and need increase the air exit in equipment, the air exit is located the process zone lower part usually, but simultaneously has the chemical liquid spill when polishing district processing wafer, and the spill liquid probably falls into this air exit to cause unpredictable influence to exhaust system.
3. The equipment is provided with a periodic opening and closing window between each cleaning process cavity, the mechanical arm cavity and the polishing area cavity, and the periodic opening and closing window can influence the air pressure and the air path inside a certain cavity, destroy the relative pressure value and the turbulent flow position and cause unpredictable air flow or a new pollution source.
Based on this, the embodiments of the present invention provide a method and an apparatus for adjusting an internal environment of a semiconductor device, and an electronic device.
To facilitate understanding of the present embodiment, first, a schematic structural diagram of a semiconductor device is provided to describe a process of adjusting an internal environment of the semiconductor device, and as shown in fig. 1, a top view of the structure of the semiconductor device includes three partitions, namely, a partition one, a partition two, and a partition three; according to the requirement of the semiconductor device processing technology on cleanliness, the requirement of a partition on cleanliness is the highest, and the requirement of the partition three and the right on cleanliness is the lowest; the air flow in the semiconductor equipment is required to flow through the second partition from the upper right part of the first partition to the left, then flow to the third partition from the right part of the third partition and then flow out from the lower right part of the third partition; wherein, the liquid in the environment of the partition II splashes downwards, and the lower right part of the partition III has a periodical opening and closing window according to the function requirement of the equipment; it should be noted that the above schematic structural diagram is only used for illustration to illustrate the technical problem to be solved by the present solution, and the actual device may not be limited to three partitions; considering that semiconductor equipment generally needs a clean environment, the scheme is not only directed to CMP equipment, but also can be extended to other semiconductor equipment; if dangerous chemicals are required to be used in the semiconductor equipment process, the internal air pressure of the equipment is required to be lower than the external air pressure so as to avoid the dangerous chemicals from volatilizing into the external environment to cause harm to human bodies; since most semiconductor devices require a higher internal pressure than the external pressure to prevent the internal environment from being polluted by the external environment, the schematic diagram requires a higher internal pressure than the external environment for three zones to solve the internal environmental problems of most semiconductor devices.
Based on the above schematic structural diagram of the semiconductor device, the following describes in detail a method for adjusting an internal environment of the semiconductor device according to an embodiment of the present invention, as shown in fig. 2, the method includes the following steps:
step S202, receiving a model adjusting instruction sent by a user.
The model adjusting instruction may be understood as an instruction issued by a user to add, modify or adjust a structural component to the semiconductor structure model, for example, an instruction to adjust a position or a size of the structural component; in practical implementation, before issuing a model adjustment instruction, a user generally needs to refer to a difference between a current internal environment of the semiconductor device and an ideal internal environment, for example, in the current internal environment of the semiconductor device, a turbulent flow position is not located in a region with a low requirement on cleanliness, or a turbulent flow is not concentrated, or a relative air pressure value inside each current process partition of the semiconductor device is unstable and has a difference with an ideal air pressure value; model adjustment instructions sent by a user are received through analysis software, wherein the analysis software can adopt flow simulation based on solidworks or other analysis software.
Step S204, adjusting a preset structural model of the semiconductor device according to the model adjustment command.
Pre-storing the established structure model of the semiconductor equipment to be adjusted into the analysis software, and adjusting the structure model of the semiconductor equipment by the analysis software according to the received model adjustment instruction; as an example, if the model adjustment instruction instructs to adjust a specified structural component in the structural model to a specified position, the analysis software adjusts the specified structural component to the specified position according to the instruction.
And step S206, carrying out internal environment analysis on the adjusted structure model to obtain an analysis result.
The analysis result can be understood as the air pressure data, turbulence position, etc. of each region in the structure model of the semiconductor device; and analyzing the adjusted structure model through the analysis software to obtain an analysis result of the structure model of the semiconductor equipment.
Step S208, judging whether the analysis result meets the preset result.
The preset result can be understood as that the turbulent flow position in the structural model is positioned in the area with lower requirement on cleanliness and the turbulent flow is concentrated, or the air pressure in each subarea of the equipment is relatively stable, and the like; for different semiconductor devices, the preset results are usually different, and the preset results can be set according to the requirements of users; and judging whether the analysis result of the structural model meets the preset result set by the user.
Step S210, if the device structure of the semiconductor device is matched with the adjusted structure model, adjusting the device structure of the semiconductor device to control the internal environment of the semiconductor device.
If the analysis result of the structure model conforms to the preset result, the actual device structure of the semiconductor device is adjusted according to the adjusted structure model, and as an example, if the specified structural component is adjusted to the specified position in the adjusted structure model, the corresponding component is adjusted to the specified corresponding position in the actual semiconductor device, so that the internal environment of the actual semiconductor device conforms to the expected effect.
According to the method for adjusting the internal environment of the semiconductor device, the preset structure model of the semiconductor device is adjusted according to the received model adjusting instruction sent by the user, the internal environment of the adjusted structure model is analyzed, and when the analysis result obtained is judged to accord with the preset result, the device structure of the semiconductor device is adjusted according to the adjusted structure model so as to control the internal environment of the semiconductor device. The method comprises the steps of firstly adjusting and analyzing the structure model of the semiconductor equipment to enable the structure model to meet the expected effect, and then adjusting the structure of the actual semiconductor equipment according to the adjusted structure model, so that the requirement of a semiconductor processing device on the internal environment of the semiconductor equipment can be met, and the production yield of the semiconductor device is improved.
The embodiment of the invention also provides another method for adjusting the internal environment of the semiconductor equipment, which is realized on the basis of the method of the embodiment; the embodiment mainly describes a specific implementation process for adjusting a preset structural model of a semiconductor device according to a model adjustment instruction, wherein the semiconductor device comprises a plurality of partitions; as shown in fig. 3, the method comprises the steps of:
step S302, receiving a model adjusting instruction sent by a user.
Step S304, adjusting the air inlet position, the air outlet position, and the path between the plurality of partitions in the preset structure model of the semiconductor device according to the model adjustment instruction, wherein the path includes: via size, via location, and via configuration.
In practical implementation, based on the schematic diagram of the semiconductor device shown in fig. 1, as one implementation manner, firstly, air filters may be respectively disposed at the tops of three partitions and air outlets may be disposed at the lower portions of the three partitions in the structural model of the semiconductor device, so as to control the total air outlet volume of the air outlets of the device to be smaller than the total air inlet volume of the air filters, so as to ensure that the internal ambient air pressure of the device is higher than the external ambient air pressure; if the semiconductor device is provided with a plurality of subareas, and each subarea is provided with an air filter and an air outlet, the air outlet volume of the air outlet of each subarea is usually smaller than the air inlet volume of the air filter; the positions of the air filter and the air outlet are selected by software analysis, wherein the best effect position can be understood as that the turbulent position in the equipment is positioned in a region with low cleanliness requirement and the turbulent flow is concentrated. It should be noted that, if the semiconductor device has a plurality of partitions, it is not necessary to provide an air filter and an air outlet in each partition, for example, there is a device having an air outlet in a first partition and an air inlet in an adjacent second partition, and then the air inlet in the second partition flows into the first partition having the air outlet through a window between the first partition and the second partition along the device, in which case, the air outlet may not be provided in the second partition.
Before the structural model is adjusted, the validity of a software analysis result needs to be verified; after the positions of an air filter and an air outlet are set in a structural model of the semiconductor equipment through software analysis, firstly, the air filter and the air outlet are also set at corresponding positions in the actual semiconductor equipment, then, a wind pressure stable position is selected and a micro differential pressure sensor is installed, whether the internal environmental pressure of the selected position is consistent with the software analysis effect is measured through examples, and if the internal environmental pressure is inconsistent with the software analysis effect, the wind volume of an air outlet of the air filter, the negative pressure of the air outlet and the respective tightness of three partitions are measured and corrected; if the results are consistent, the actual effect is consistent with the software effect, and the software analysis result is proved to be effective. After the software analysis result is proved to be effective, the size, the position or the structure of the passage between the partitions are adjusted through the software, for example, the software is adjusted by adding a plurality of operable wind shields or adding openings, so that the turbulent flow position is controlled in a required area, and the problems of generating condensed particles and the like due to turbulent flow are avoided, thereby influencing the production yield of the semiconductor device.
And S306, carrying out internal environment analysis on the adjusted structure model to obtain an analysis result.
Step S308, judging whether the analysis result meets the preset result.
Specifically, whether the turbulent position is driven to the third and right parts of the partition with the lowest requirement on cleanliness is judged in the analysis result.
Step S310, if the device structure of the semiconductor device is matched with the adjusted structure model, adjusting the device structure of the semiconductor device to control the internal environment of the semiconductor device.
And after confirming that the turbulent flow position in the structure model is driven to the third right part and the right part of the partition with the lowest requirement on cleanliness, adjusting the actual structure, the actual position and the like of each component in the actual semiconductor equipment according to the finally adjusted structure model, and perfecting and processing hardware to specifically execute. Specifically, referring to the schematic top view of the adjusted semiconductor device structure shown in fig. 4, a solid line square frame is an air filter disposed at the top of the device, a circle is an air outlet disposed at the lower portion of the device, a solid line arrow is a normally open window at the middle of the device, and a dotted line arrow is a periodically open and closed window at the middle of the device. In the embodiment, the installation position and the air inlet volume of an air filter on the upper part of the equipment are adjusted through software analysis and example verification; the position of an air outlet at the lower part of the equipment and the size of negative pressure; and a cavity wind path structure, etc., and driving the turbulent position to a space region with the least influence on the wafer processing technology.
The method for adjusting the internal environment of the semiconductor device describes in detail a specific implementation process for adjusting a preset structural model of the semiconductor device according to a model adjustment instruction, and positions, structures and the like of structural components of the structural model are adjusted through software so as to control the turbulent flow position in a required area. The method comprises the steps of firstly adjusting and analyzing a structure model of the semiconductor equipment to enable the structure model to meet the expected effect, and then adjusting the structure of the actual semiconductor equipment according to the adjusted structure model, so that the requirement of a semiconductor processing device on the internal environment of the semiconductor equipment can be met, and the production yield of the semiconductor device is improved.
The embodiment of the invention also provides another method for adjusting the internal environment of the semiconductor equipment, which is realized on the basis of the method of the embodiment; this embodiment focuses on describing a specific implementation process of continuing to execute the step of receiving a model adjustment instruction sent by a user until an analysis result conforms to a preset result if the analysis result does not conform to the preset result, as shown in fig. 5, the method includes the following steps:
step S502, receiving a model adjusting instruction sent by a user.
Step S504, adjusting a preset structure model of the semiconductor device according to the model adjustment command.
Step S506, performing internal environment analysis on the adjusted structure model to obtain an analysis result.
Step S508, judging whether the analysis result meets a preset result; if yes, go to step S510, and if not, go to step S512.
Step S510, adjusting the device structure of the semiconductor device according to the adjusted structure model, so as to control the internal environment of the semiconductor device.
If the semiconductor equipment simultaneously contains liquid to be discharged and gas to be discharged in at least one subarea, in order to prevent the liquid to be discharged from falling into an air outlet at the lower part of the semiconductor equipment and further influencing an air draft system, the subarea also comprises a liquid discharge port, an air outlet and a separation module; the separation module is used for separating the liquid to be discharged and the flow direction of the gas to be discharged so as to discharge the liquid to be discharged through the liquid discharge port and discharge the gas to be discharged through the air exhaust port. For easy understanding, a schematic flow diagram of gas and liquid using a separation module is provided, as shown in fig. 6, the separation module uses an air exhaust structure with a loop, through which gas is exhausted through the loop, and liquid flows out from top to bottom without mutual interference, thereby realizing water-gas separation inside the semiconductor device, wherein, the dotted arrow represents the flow direction of liquid, and the liquid itself is basically not affected by the air pressure in the subarea, flows to a lower liquid discharge port by gravity, and is exhausted through the liquid discharge port; the solid arrow represents the gas flow direction, the gas is influenced by the positive pressure in the subarea and the negative pressure of the lower exhaust outlet of the structure, and flows out of the equipment external exhaust system along the loop, so that the exhaust system is prevented from being influenced by waste liquid through the structure; the air exhaust structure with the loop can be suitable for any air exhaust space without water pressure and only wind pressure.
Step S512, the step of receiving the model adjustment instruction sent by the user is continuously executed until the analysis result meets the preset result.
And if the analysis result shows that the turbulent flow position is not driven to the third and right parts of the partition with the lowest requirement on the cleanliness, continuously executing the step of receiving a model adjusting instruction sent by a user to continuously adjust the structural model until the analysis result shows that the turbulent flow position is driven to the third and right parts of the partition with the lowest requirement on the cleanliness.
According to the method for adjusting the internal environment of the semiconductor equipment, when the software analysis result does not accord with the preset result, the structural model is continuously adjusted until the analysis result meets the preset result; meanwhile, the separation module capable of realizing water-gas separation is provided, so that liquid is prevented from falling into an air outlet in the lower part of the semiconductor equipment, and further, the influence on an air exhaust system is avoided. The method comprises the steps of firstly adjusting and analyzing a structure model of the semiconductor equipment to enable the structure model to meet the expected effect, and then adjusting the structure of the actual semiconductor equipment according to the adjusted structure model, so that the requirement of a semiconductor processing device on the internal environment of the semiconductor equipment can be met, and the production yield of the semiconductor device is improved.
The embodiment of the invention also provides another method for adjusting the internal environment of the semiconductor equipment, which is realized on the basis of the method of the embodiment; the semiconductor device has a periodically opening and closing window, as shown in fig. 7, the method includes the steps of:
step S702, receiving a model adjusting instruction sent by a user.
Step S704, adjusting a preset structure model of the semiconductor device according to the model adjustment command.
Step S706, performing internal environment analysis on the adjusted structure model to obtain an analysis result.
Step S708, determining whether the analysis result matches a preset result.
Step S710, if yes, adjusting the device structure of the semiconductor device according to the adjusted structure model to control the internal environment of the semiconductor device.
Step S712, during each on/off cycle, collecting the air pressure data of each partition of the semiconductor device.
The method comprises the steps that a sensor is arranged in the semiconductor equipment, and air pressure data in the equipment are collected; if the semiconductor device has a plurality of subareas, a sensor can be respectively arranged in each subarea, the sensor can adopt the micro differential pressure sensor or other sensors, and the actual air pressure data of each subarea is collected through the sensor; the period of acquiring the actual air pressure data can be set by a technician of the relevant equipment according to actual requirements.
Step S714, comparing the air pressure data of the sub-area with the preset air pressure data of the sub-area, and outputting a difference value.
The preset air pressure data can be understood as air pressure data which is obtained by software analysis and meets different process requirements; the difference value can be understood as the difference value between the collected actual air pressure data and the corresponding preset air pressure data; aiming at each subarea of the semiconductor equipment, comparing the acquired actual air pressure data of each subarea with corresponding preset air pressure data, and outputting a difference value of each subarea; it should be noted that, each partition of the semiconductor device is adjusted independently, and the period of the periodic open/close window of one partition and the period of the periodic open/close window of another partition may be different, so each partition is usually controlled by independent software; for each partition, the preset air pressure data set will usually be different according to the process requirement of the partition.
Step S716, adjusting the intake of the subareas according to the difference value; wherein, the number of the difference value is one or more.
Acquiring actual air pressure data once for each partition of the semiconductor equipment, and comparing the actual air pressure data with preset air pressure data to obtain a difference value; the automatic adjustment period after calculation can be set by a craftsman according to requirements, namely in one period of adjusting the air intake, the times of acquiring actual air pressure data can be manually set according to requirements, and the number of the obtained difference values can be correspondingly adjusted according to the difference of the acquisition times; the number of acquisitions set and the number of difference values obtained for different sectors will usually also be different. According to the obtained difference value, the air intake of the corresponding subarea is adjusted, in actual implementation, a reference value of initial adjustment quantity is usually set manually, for example, the air quantity of the air filter can be adjusted up or down, during initial adjustment, an initially increased or decreased reference quantity can be set by a craftsman, and then automatic adjustment is carried out through a computer based on the reference quantity. In practical implementation, this step can be implemented by:
and step 70, judging whether the difference value exceeds a preset range.
The preset range can be understood as an acceptable range of a difference value between the collected actual air pressure data of the partition and the preset air pressure data of the partition for each partition of the semiconductor equipment; the preset range can be set by a craftsman according to the technological requirements; due to the differences in the process requirements of different zones, the preset ranges set for different zones are usually different.
Step 71, if the difference value does not exceed the preset range, selecting the largest difference value.
For each partition of the semiconductor equipment, if the difference value of the partition does not exceed the preset range, it can be understood that the actual air pressure in the partition can meet the process requirement corresponding to the partition, and if the number of the obtained difference values is multiple, the difference value with the largest value is selected from the multiple difference values.
Step 72, determine whether the maximum difference value is periodic.
And judging whether the time with the maximum difference value is periodic or not according to the historical difference value data of the subareas.
And 73, if the maximum difference value has periodicity, calculating the corresponding relation between the period of the maximum difference value and the period of the opening and closing windows of the partitions.
For each partition, the period of the opening and closing window of the partition is usually a fixed value, and if it is determined that the maximum difference value appearing in the partition has periodicity, the corresponding relationship between the period of the opening and closing window and the period of the maximum difference value appearing in the partition can be calculated, wherein the corresponding relationship may be directly related, or a certain functional relationship may be formed after several times of regression algorithm operation, and the algorithm needs to be fitted by itself.
And step 74, adjusting the air intake of the subareas according to the corresponding relation.
During initial adjustment, an initial time range is usually set by equipment personnel according to the size of each air filter of different subareas and the space size of the subarea before the maximum difference value appears, and an optimal solution is automatically obtained through a regression algorithm based on the initial time range; in practical implementation, this step is realized by the following steps:
step 740, establishing a regression model based on the above correspondence.
The regression model may be understood as a model that can output an adjustment policy, and through the regression model, an association between the adjustment policy and the correspondence may be established.
And 741, performing regression analysis on the regression model based on the historical optimal solution set, and outputting an optimal solution for adjusting the air intake.
The historical optimal solution set may be understood as a set of adjustment strategies obtained in each switching cycle for each partition, where the adjustment strategies may include adjustment timing, adjustment modes, and the like; the optimal solution is not usually a fixed value, for example, if the period of the periodic opening and closing window of the designated partition is opened every 5 minutes, in the one-time opening and closing period, the obtained optimal solution may be that the intake air volume of the air filter is increased a little at the 3 rd minute, and the intake air volume of the air filter is decreased a little at the 4 th minute; in the next period, the set value and the result value of the previous period can be collected as experience values to be used as reference for outputting the regulation strategy of the next period, and regression analysis is an infinite approach to an ideal value and is a continuous optimization process.
As another implementation manner, if the period of opening and closing the window is 5 minutes, the number of times of adjusting the intake air volume of the air filter in 5 minutes may be one or more, for example, when the regression analysis algorithm is a first-order algorithm, there may be one adjustment in 5 minutes; if the regression analysis algorithm is a second order algorithm, then there may be two adjustments in 5 minutes, and so on.
When regression analysis is carried out, a set value or a result value of a previous period may be taken as an empirical value and input into a regression model so as to output an optimal solution of a next period; or a plurality of historical data are taken as empirical values and input into the regression model to output the optimal solution of the next period; namely, according to the adopted regression algorithm, adjusting points can be automatically added in the period of opening and closing the window of one subarea, and one or more historical data can be collected to be used as experience value reference, so that the period of obtaining the optimal solution is shortened.
And step 742, updating the optimal solution into the historical optimal solution set.
And (4) storing the optimal solution obtained in each switching period into the historical optimal solution set, namely continuously updating the historical optimal solution along with the adjustment process.
Step 743, adjusting the intake air volume of the subarea according to the optimal solution.
And adjusting the air intake of the air filter of the corresponding subarea according to the obtained optimal solution.
And step S75, if the difference value exceeds the preset range, sending an alarm instruction or stopping operating the semiconductor device to maintain the semiconductor device.
For each subarea of the semiconductor equipment, if the difference value of the subareas exceeds a preset range, the actual air pressure in the subarea can be understood as not meeting the process requirement corresponding to the subarea; at this time, an alarm instruction needs to be sent out or the operation of the semiconductor equipment needs to be stopped so as to remind equipment maintenance personnel of maintaining the semiconductor equipment in time.
Step S76, if the maximum difference value does not have periodicity, adjusting the intake air volume of the partition according to the maximum difference value.
For each subarea, if the maximum difference value does not have periodicity, increasing or decreasing the intake of the air filter of the subarea according to the maximum difference value; as an example, if the maximum difference value shows that the actual air pressure data is higher than the preset air pressure data, the intake air amount of the air filter of the partition needs to be reduced; if the maximum difference value shows that the actual air pressure data is lower than the preset air pressure data, the air intake of the air filter of the subarea needs to be increased. In the embodiment, the air pressure data is collected by combining the sensor, a regression algorithm is designed, the air inlet quantity of the air filter is controlled in real time, a periodic air inlet mode is fitted, and the air pressure in each cavity of the equipment tends to be stable.
According to the method for adjusting the internal environment of the semiconductor equipment, if the semiconductor equipment is provided with the periodical opening and closing windows, in the process of each opening and closing period, the actual air pressure data of each subarea can be collected aiming at each subarea of the semiconductor equipment, the actual air pressure data is compared with the corresponding preset air pressure data, and the air intake of each subarea is adjusted according to the difference value obtained by comparison. The method comprises the steps of firstly adjusting and analyzing the structure model of the semiconductor equipment to enable the structure model to meet the expected effect, and then adjusting the structure of the actual semiconductor equipment according to the adjusted structure model, so that the requirement of a semiconductor processing device on the internal environment of the semiconductor equipment can be met, and the production yield of the semiconductor device is improved.
Referring to fig. 8, a schematic structural diagram of an apparatus for adjusting an internal environment of a semiconductor device is shown, the apparatus including: a receiving module 80, configured to receive a model adjustment instruction sent by a user; a first adjusting module 81, configured to adjust a preset structural model of the semiconductor device according to the model adjusting instruction; the analysis module 82 is used for carrying out internal environment analysis on the adjusted structure model to obtain an analysis result; the judging module 83 is configured to judge whether the analysis result meets a preset result; and a second adjusting module 84, configured to adjust the device structure of the semiconductor device according to the adjusted structure model if the analysis result meets the preset result, so as to control the internal environment of the semiconductor device.
The adjusting apparatus for an internal environment of a semiconductor device according to an embodiment of the present invention adjusts a preset structural model of the semiconductor device according to a received model adjustment instruction sent by a user, performs internal environment analysis on the adjusted structural model, and adjusts a device structure of the semiconductor device according to the adjusted structural model when it is determined that an obtained analysis result matches a preset result, so as to control the internal environment of the semiconductor device. The device firstly adjusts and analyzes the structure model of the semiconductor equipment to enable the structure model to meet the expected effect, and then adjusts the structure of the actual semiconductor equipment according to the adjusted structure model, so that the requirement of a semiconductor processing device on the internal environment of the semiconductor equipment can be met, and the production yield of the semiconductor device is improved.
An embodiment of the present invention further provides an electronic device, as shown in fig. 9, where the electronic device includes a processor 90 and a memory 91, the memory 91 stores machine executable instructions that can be executed by the processor 90, and the processor 90 executes the machine executable instructions to implement the method for adjusting the internal environment of the semiconductor device.
Further, the electronic device shown in fig. 9 further includes a bus 92 and a communication interface 93, and the processor 90, the communication interface 93, and the memory 91 are connected by the bus 92.
The Memory 91 may include a high-speed Random Access Memory (RAM) and may further include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The communication connection between the network element of the system and at least one other network element is implemented through at least one communication interface 93 (which may be wired or wireless), and the internet, a wide area network, a local network, a metropolitan area network, and the like may be used. The bus 92 may be an ISA bus, a PCI bus, an EISA bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one double-headed arrow is shown in FIG. 9, but this does not indicate only one bus or one type of bus.
The processor 90 may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware or instructions in the form of software in the processor 90. The Processor 90 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the Integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, or discrete hardware components. The various methods, steps, and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of the method disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in the memory 91, and the processor 90 reads the information in the memory 91 and completes the steps of the method of the foregoing embodiment in combination with the hardware thereof.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
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| US6333272B1 (en) * | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| CN105489526A (en) * | 2014-09-17 | 2016-04-13 | 沈阳芯源微电子设备有限公司 | Shunt supercharging device for semiconductor equipment and control method for shunt supercharging device |
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