CN111160507A

CN111160507A - Anti-dismantling electronic tag material and manufacturing method and using method thereof

Info

Publication number: CN111160507A
Application number: CN201911401270.2A
Authority: CN
Inventors: 任高林
Original assignee: Chongqing Peenerg Electronic Materials Co Ltd
Current assignee: Chongqing Peenerg Electronic Materials Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-05-15

Abstract

The invention discloses an anti-dismantling electronic tag material, a manufacturing method thereof and an anti-dismantling electronic tag, wherein the anti-dismantling electronic tag material comprises a carrier substrate, an anti-dismantling release layer is covered on the carrier substrate, a release pattern is arranged on the anti-dismantling release layer, a conductive metal layer is covered on the surface of the anti-dismantling release layer, when the carrier substrate is lifted, the anti-dismantling release layer and the conductive metal layer are disconnected in the shape of the release pattern, the width of a line in the release pattern is 1.5mm, and the distance between two adjacent lines is 2-3 mm. The remarkable effects are as follows: the anti-dismantling type layer with the type pattern between the carrier substrate and the antenna layer is used for forming force difference, so that the conductive metal layer is disconnected in the shape of the type pattern, the tag antenna is damaged, and the anti-dismantling effect is achieved.

Description

Anti-dismantling electronic tag material and manufacturing method and using method thereof

Technical Field

The invention relates to the technical field of electronic tag materials, in particular to an anti-dismantling electronic tag material, a manufacturing method and a using method thereof, which are particularly suitable for various RFID application occasions needing anti-counterfeiting and anti-dismantling.

Background

Currently, the RFID antenna mainly includes two processes of etching a PET composite aluminum foil and printing a circuit on a substrate with conductive silver paste. The two antennas are used for bonding the chip and processing the chip into an electronic tag material to realize the non-contact automatic identification of the product. The electronic tags have uniqueness, each RFID tag is unique, and circulation management and anti-counterfeiting sources of the products can be carried out through the one-to-one correspondence relationship between the RFID tags and the products.

However, in the actual product circulation process, if the electronic tag is reused, the product management object will be confused, and even brought by lawless persons to make fake, fall out of package, etc., which brings hidden troubles to the safety and management of the assets. The electronic tag is required to be unique in use, the tag cannot be taken off for secondary use after being pasted, and the core is that the antenna cannot be reused. The traditional anti-dismantling electronic label is only processed on the rear end processing technology of the label, such as a die cutting destructive knife, or some anti-dismantling label plane materials are adopted, but the technologies have unstable factors and cannot ensure 100% of antenna destruction rate. If the unique type of the electronic tag is required to be ensured, the antenna needs to be ensured to be 100% disposable.

Disclosure of Invention

Aiming at the defects of the prior art, the invention aims to provide a disassembly-proof electronic tag material, a manufacturing method and a using method thereof, and the uniqueness and the disassembly-proof function of the electronic tag material are realized.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

an electronic label material, which is characterized in that: including carrier substrate goes up to drape and has the anti-tear from the type layer, should have from the type pattern on the anti-tear from the type layer the surface of anti-tear from the type layer is draped and is had the conductive metal layer, works as when carrier substrate is uncovered, the anti-tear from type layer with the conductive metal layer from the shape disconnection of type pattern.

Further, the width of the lines in the release pattern is 1.5mm, and the distance between two adjacent lines is 2-3 mm.

Further, the release pattern is a regular or irregular pattern.

Furthermore, the release pattern is formed by at least one of a straight line, a curve line or a broken line through regular or irregular arrangement.

Furthermore, the thickness of the anti-detaching release layer is 2-3 mu m, and the thickness of the conductive metal layer is 200 nm.

Further, the conductive metal layer is an aluminum foil or a copper foil.

The invention also provides a manufacturing method of the anti-dismantling electronic tag material, which comprises the following steps:

step 1: coating a carrier substrate with a removal-proof release layer with a release pattern by adopting a precise coating technology, wherein the thickness of the removal-proof release layer is 2-3 mu m, and when the carrier substrate is lifted, the removal-proof release layer is broken in the shape of the release pattern;

step 2: and forming a conductive metal layer with the thickness of 200nm on the surface of the anti-stripping release layer by adopting a vacuum sputtering process, wherein the conductive metal layer is used for being processed into an antenna circuit by adopting a chemical etching or laser etching process.

Further, the release pattern is a regular or irregular pattern.

The invention also provides a use method of the anti-dismantling electronic tag, which is characterized in that: the anti-disassembly type electronic tag material is used for manufacturing the anti-disassembly type RFID electronic tag.

The invention has the following remarkable effects: the material is processed into the finished RFID electronic tag through chip bonding, gluing, material compounding and die cutting, when the tag is attached to an attached object, if the tag is lifted, a force difference is formed due to the anti-detaching release layer with the release pattern between the carrier substrate and the antenna layer, so that the conductive metal layer is broken in the shape of the release pattern, the tag antenna is damaged, and the anti-detaching effect is achieved. Meanwhile, the existing RFID production equipment and similar processes are adopted, so that the batch production of the anti-disassembly electronic tag material is more convenient, the cost is lower, and the anti-counterfeiting application of the batch RFID is directly promoted.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the release layer;

FIG. 3 is a schematic structural diagram of the anti-detachment RFID electronic tag;

fig. 4 is a schematic diagram of the detachment-proof RFID electronic tag after being detached.

Detailed Description

The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.

As shown in fig. 1, an anti-dismantling type electronic label material comprises a carrier substrate 1, wherein an anti-dismantling release layer 2 is covered on the carrier substrate 1, a release pattern 21 is arranged on the anti-dismantling release layer 2, the release pattern 21 is a regular or irregular pattern, the width of lines in the release pattern 21 is 1.5mm, the distance between two adjacent lines is 2-3 mm, a conductive metal layer 3 is covered on the surface of the anti-dismantling release layer 2, and when the carrier substrate 1 is uncovered, the anti-dismantling release layer 2 and the conductive metal layer 3 are disconnected with the shape of the release pattern 21.

After the electronic tag material is manufactured into an electronic tag, if the tag is torn off, because the anti-tearing release layer 2 is arranged between the carrier substrate 1 and the antenna layer (namely the etched conductive metal layer 3), the force difference is formed between the carrier substrate 1 and the antenna layer, when the carrier substrate 1 is torn off, the conductive metal layer 3 is broken in the shape of the release pattern 21, the antenna circuit of the anti-tearing electronic tag is broken, the damage of an antenna is realized, and the anti-tearing effect of the electronic tag is achieved.

As shown in fig. 2, the release pattern 21 in this embodiment is formed by at least one of a straight line, a curved line or a broken line arranged regularly or irregularly.

In the specific implementation process of the invention, the thickness of the anti-stripping release layer 2 is 2-3 μm, the thickness of the conductive metal layer 3 is 200nm, and the conductive metal layer 3 is an aluminum foil or a copper foil.

The embodiment also provides a manufacturing method of the anti-dismantling electronic tag material, which comprises the following specific steps:

step 1: coating a carrier substrate 1 by adopting a precise coating technology to form an anti-stripping release layer 2 with a release pattern 21, wherein the thickness of the anti-stripping release layer 2 is 2-3 mu m, and when the carrier substrate 1 is stripped, the anti-stripping release layer 2 is broken in the shape of the release pattern 21;

The invention also provides a use method of the anti-disassembly type electronic tag, the anti-disassembly type electronic tag material is used for manufacturing the anti-disassembly type RFID electronic tag, the anti-disassembly type RFID electronic tag is shown in figure 3, the anti-disassembly type electronic tag comprises an RFID chip 4, an adhesive layer 5 and a release film layer 6 besides the anti-disassembly type electronic material, firstly, the RFID chip 4 and an antenna circuit formed after etching are bonded, then, the adhesive layer 5 is formed by coating on the conductive metal layer 3, the RFID chip 4 is coated in the adhesive layer 5, and the release film layer 6 is coated on the adhesive layer 5.

As can be seen from the above description, the release film layer 6 can protect the adhesive layer 5, the RFID chip 4, etc. covered by the release film layer, so as to ensure that the adhesive layer 5 remains adhesive when being adhered to other goods. When the RFID electronic tag is used, the release film layer 6 is firstly peeled off due to its low adhesiveness with the adhesive layer 5, and then the other layer portion is adhered to the surface of the adherend 7.

When the anti-tamper RFID tag is attached to the object 7, if the tag is torn off, the anti-tamper release layer 2 is disposed between the conductive metal layer 3 and the carrier film, so that a force difference is formed, the release layer is broken in a shape of the pre-designed release pattern 21, and the conductive metal layer 3 and the adhesive layer 5 are broken together in the shape of the release pattern 21, as shown in fig. 4, the antenna circuit of the tag is not connected, and the antenna of the tag is damaged, thereby achieving the anti-tamper effect.

The technical solution provided by the present invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims

1. The utility model provides a prevent tearing open type electronic tags material which characterized in that: including carrier substrate goes up to drape and has the anti-tear from the type layer, should have from the type pattern on the anti-tear from the type layer the surface of anti-tear from the type layer is draped and is had the conductive metal layer, works as when carrier substrate is uncovered, the anti-tear from type layer with the conductive metal layer from the shape disconnection of type pattern.

2. The tamper-evident electronic label material as claimed in claim 1, wherein: the width of the lines in the release pattern is 1.5mm, and the distance between every two adjacent lines is 2-3 mm.

3. The tamper-evident electronic label material as claimed in claim 1, wherein: the release pattern is regular or irregular.

4. The tamper-evident electronic label material as claimed in claim 3, wherein: the release pattern is formed by at least one of a straight line, a curve line or a broken line through regular or irregular arrangement.

5. The tamper-evident electronic label material as claimed in claim 1, wherein: the thickness of the anti-detaching release layer is 2-3 mu m, and the thickness of the conductive metal layer is 200 nm.

6. The tamper-evident electronic label material as claimed in claim 5, wherein: the conductive metal layer is an aluminum foil or a copper foil.

7. A manufacturing method of a disassembly-proof electronic label material is characterized by comprising the following steps:

8. The method for manufacturing a tamper-evident electronic label material as claimed in claim 7, wherein: the release pattern is regular or irregular.

9. The method for manufacturing a tamper-evident electronic label material as claimed in claim 7, wherein: the width of the lines in the release pattern is 1.5mm, and the distance between every two adjacent lines is 2-3 mm.

10. A use method of an anti-disassembly electronic tag is characterized in that: the anti-detachment type electronic tag material as claimed in any one of claims 1 to 6 is used for manufacturing an anti-detachment type RFID electronic tag.