CN111158519A - Touch control assembly, display module, electronic equipment and preparation method of touch control assembly - Google Patents
Touch control assembly, display module, electronic equipment and preparation method of touch control assembly Download PDFInfo
- Publication number
- CN111158519A CN111158519A CN201911350130.7A CN201911350130A CN111158519A CN 111158519 A CN111158519 A CN 111158519A CN 201911350130 A CN201911350130 A CN 201911350130A CN 111158519 A CN111158519 A CN 111158519A
- Authority
- CN
- China
- Prior art keywords
- layer
- display area
- routing
- wiring layer
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
本发明实施例公开了一种触控组件、显示模组、电子设备和触控组件的制备方法，所述触控组件包括衬底基板，所述衬底基板包括显示区和围绕所述显示区的非显示区；所述衬底基板的非显示区上层叠设置有第一走线层、第一保护层、第二走线层和第二保护层；且所述第二走线层通过贯穿所述第一保护层的过孔与所述第一走线层连接。本发明实施例在触控组件的非显示区域设置了第一走线层和第二走形层，并且所述第一走线层和所述第二走线层相连接，在第一走线层或第二走线层划伤时，另外的走线层仍能导通，本发明实施例在面板切割过程产生的玻璃屑导致走线划伤时，走线层仍能导通，进而提高了触控组件的可靠性。
Embodiments of the present invention disclose a touch control component, a display module, an electronic device, and a method for preparing a touch control component. The touch control component includes a base substrate, and the base substrate includes a display area and a surrounding area of the display area. a non-display area; a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the base substrate; The via hole of the first protective layer is connected to the first wiring layer. In the embodiment of the present invention, a first wiring layer and a second wiring layer are arranged in the non-display area of the touch component, and the first wiring layer and the second wiring layer are connected, and the first wiring layer is connected to the second wiring layer. When the wiring layer or the second wiring layer is scratched, the other wiring layers can still be turned on. In the embodiment of the present invention, when the glass dust generated during the panel cutting process causes the wiring to be scratched, the wiring layer can still be turned on, thereby improving the reliability of touch components.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a touch control assembly, a display module, electronic equipment and a preparation method of the touch control assembly.
Background
At present, with the pursuit of users for the screen occupation ratio of electronic equipment, a full screen becomes an industrial hotspot, and the realization of the design of narrower frames and high screen occupation ratio becomes a technical difficulty for various terminal manufacturers to strive for breakthrough. The design of the ultra-narrow frame naturally brings the design of ultra-narrow line width and line distance, and the problem of circuit breaking caused by line scratching and corrosion is easy to occur. Therefore, in order to improve the reliability of the display touch module, the circuit design of the product needs to be continuously optimized.
At present, the line width/line distance design of product circuit has reduced to 3um, and the glass bits that panel cutting process produced lead to walking the line fish tail very easily, if the fish tail, can lead to walking open a way and function harmfully, influence production yield and cost, or lead to later stage user use, and the circuit is corroded by aqueous vapor, sweat etc. and the line that finally appears is opened a way and reliability function is bad.
Disclosure of Invention
The embodiment of the invention provides a touch control assembly, a display module, electronic equipment and a preparation method of the touch control assembly, and aims to solve the technical problems that in the prior art, due to glass dust generated in the panel cutting process, wiring is scratched, further wiring open circuit is generated, and the reliability function is poor.
According to a first aspect of embodiments of the present invention, a touch assembly is disclosed, the touch assembly comprising a substrate base plate, the substrate base plate comprising a display area and a non-display area surrounding the display area;
a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the substrate base plate; and the second routing layer is connected with the first routing layer through a via hole penetrating through the first protective layer.
According to a second aspect of the present invention, the present invention discloses a display module, which includes the above-mentioned touch component, display component, driving chip, electronic component and circuit board;
the touch control assembly is arranged opposite to the display assembly;
the touch control assembly is connected with the driving chip, and the driving chip and the electronic element are arranged on the circuit board.
According to a third aspect of the present invention, the present invention discloses an electronic device, which includes the above display module.
According to a fourth aspect of the present invention, the present invention discloses a method for manufacturing a touch assembly, the method comprising:
providing a substrate base plate, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area;
sequentially forming a first wiring layer and a first protective layer on a non-display area of the substrate base plate;
forming a via hole penetrating through the first protective layer;
forming a second routing layer on the first protective layer; the second routing layer is connected with the first routing layer through a through hole penetrating through the first protective layer;
and forming a second protective layer covering the second wiring layer.
The embodiment of the invention discloses a touch control assembly, which comprises a substrate base plate, a touch control module and a display module, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area; a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the substrate base plate; and the second routing layer is connected with the first routing layer through a via hole penetrating through the first protective layer. According to the embodiment of the invention, the first routing layer and the second routing layer are arranged in the non-display area of the touch control assembly and are connected, when the first routing layer or the second routing layer is scratched, the other routing layers can still be conducted, and when the routing is scratched due to glass chips generated in the panel cutting process, the routing layers can still be conducted, so that the reliability of the touch control assembly is improved.
Drawings
FIG. 1 is a schematic diagram of a touch device in the prior art;
fig. 2 is a schematic diagram of a touch device according to an embodiment of the invention;
fig. 3 is a schematic view of a display module according to an embodiment of the invention;
fig. 4 is a flowchart illustrating a method for manufacturing a touch device according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Structure diagram of touch control assembly in prior art referring to fig. 1, molybdenum circuit 21 is arranged on non-display area 2 of upper glass substrate 11 of display module, protective layer is arranged on molybdenum circuit, molybdenum circuit 21 and ito layer 12 are arranged on display area, however, in this design, when the protective layer is scratched, the problem of corrosion and open circuit easily occurs to the bottom molybdenum circuit.
Based on this, in order to improve the corrosion resistance and scratch resistance of the touch control component circuit, a common method at present is to use a high-hardness material or increase the thickness and width of the wire, but due to the limitation requirements of the industry vacuum sputtering technology and the product space design, the wire can be selected from metal materials such as Mo, Nb, AL and the like. In order to break through the limitation of materials and design space, according to the structural characteristics of a product, on the premise of not additionally increasing the cost, the embodiment of the invention improves the scratch resistance and corrosion resistance of the circuit by optimizing the stacking design of the peripheral circuit structures, and enhances the reliability of module routing.
Specifically, the embodiment of the invention provides a touch assembly, which comprises a substrate base plate, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area;
a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the substrate base plate; and the second routing layer is connected with the first routing layer through a via hole penetrating through the first protective layer.
In the embodiment of the present invention, referring to fig. 2, a specific structure diagram of a touch device is shown, where the touch device includes a substrate 105, the substrate includes a display area 20 and a non-display area 10 surrounding the display area, and a first routing layer 101, a first protection layer 102, a second routing layer 103, and a second protection layer 104 are stacked on the non-display area of the substrate; the first protection layer 102 is provided with a via hole, the second routing layer 103 is connected with the first routing layer 101 through the via hole, and the second routing layer 103 is connected with the first routing layer 101, so that when the second routing layer 103 is scratched or corroded, the touch assembly can realize functions through the first routing layer 101, and the influence on the touch assembly is reduced.
Optionally, a third wiring layer, a third protective layer, a fourth wiring layer and a fourth protective layer are stacked on the display area of the substrate base plate;
the third routing layer and the first routing layer are arranged on the same layer, the third protection layer and the first protection layer are integrally formed, the fourth routing layer and the second routing layer are arranged on the same layer, and the fourth protection layer and the second protection layer are integrally formed.
In the embodiment of the present invention, referring to fig. 2, the third routing layer 201 and the first routing layer 101 are disposed on the same layer, and when the materials of the third routing layer 201 and the first routing layer 101 are the same, the third routing layer 201 and the first routing layer 101 can be synchronously manufactured, so that the process flow is reduced. The third protection layer is integrally formed with the first protection layer 102, so that the process flow and the process cost can be reduced. The fourth wiring layer 202 and the second wiring layer 103 are disposed on the same layer, and similarly, when the materials of the fourth wiring layer 202 and the second wiring layer 103 are the same, the process flow can be reduced. The fourth passivation layer is integrally formed with the second passivation layer 104 to reduce the process flow and the process cost. It is understood that the third routing layer 201 and the first routing layer 101 may not be disposed on the same layer, the third protection layer may not be integrally formed with the first protection layer 102, the fourth routing layer 202 may not be disposed on the same layer as the second routing layer 103, or the fourth protection layer may not be integrally formed with the second protection layer 104, as long as the functions required by the embodiment of the present invention can be achieved, and the embodiment of the present invention does not specifically limit the specific structure and process.
Optionally, the third routing layer and the first routing layer are made of the same material, and the fourth routing layer and the second routing layer are made of the same material.
In the embodiment of the invention, the third routing layer and the first routing layer are made of the same material, or the fourth routing layer and the second routing layer are made of the same material, so that synchronous preparation can be realized during preparation. The process flow is reduced, and the technical problem of cost increase caused by the design of the embodiment of the invention is avoided.
Optionally, the first routing layer is made of indium tin oxide, and the second routing layer is made of molybdenum.
In the embodiment of the invention, the first wiring layer is arranged as the indium tin oxide layer in the non-display area of the touch control component, so that the circuit non-conduction caused by the scratch of molybdenum on the second wiring layer can be prevented, the corrosion resistance of the indium tin oxide layer is strong, the overall corrosion resistance of the wiring layer of the touch control component can be increased, and the reliability and the safety of the touch control component can be enhanced by arranging the first wiring layer as the indium tin oxide layer.
Optionally, the first routing layer is made of molybdenum, and the second routing layer is made of indium tin oxide.
In the embodiment of the invention, the second wiring layer is arranged as the indium tin oxide layer in the non-display area of the touch control component, and the indium tin oxide has strong scratch resistance and corrosion resistance, so that when the second protective layer is scratched, the second wiring layer is not easy to scratch and corrode relative to the molybdenum wiring layer, and the reliability and the safety of the touch control component can be improved. Furthermore, when the second routing layer is scratched, the first routing layer at the bottom layer can still enable the whole circuit to be conducted, and the reliability and the safety of the touch control assembly are further improved.
Optionally, the material of the first protection layer includes silicon oxide or silicon nitride, and the material of the second protection layer includes silicon oxide or silicon nitride.
In the embodiment of the invention, the first protective layer is used for protecting the first wiring layer and isolating the first wiring layer from the second wiring layer, so that an insulating material is required to be selected for preparation, and in the field of display screens, silicon oxide or silicon nitride is generally used for preparing the protective layer. The second protective layer is used for protecting the second wiring layer and isolating the second wiring layer from the external environment, so that an insulating material needs to be selected for preparation, and the protective layer is generally prepared from silicon oxide or silicon nitride in the field of display screens.
In the embodiment of the invention, the third passivation layer and the first passivation layer are integrally formed, so the material of the third passivation layer also includes silicon oxide or silicon nitride. Similarly, the material of the fourth passivation layer also includes silicon oxide or silicon nitride. It is understood that, if there are other requirements, the third protection layer and the first protection layer may be formed separately, and the fourth protection layer and the second protection layer may be formed separately, which is not limited in this respect.
It can be understood that the invention is suitable for stacking other functional modules of display modules of electronic equipment such as watches, televisions and the like through similar ways by innovative structural stacking design, so as to achieve the anti-scratch capability of the wiring, and the invention also belongs to the protection scope of the invention.
The embodiment of the invention discloses a touch control assembly, which comprises a substrate base plate, a touch control module and a display module, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area; a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the substrate base plate; and the second routing layer is connected with the first routing layer through a via hole penetrating through the first protective layer. According to the embodiment of the invention, the first routing layer and the second routing layer are arranged in the non-display area of the touch control assembly and are connected, and when the first routing layer or the second routing layer is scratched, the other routing layers can still be conducted.
The embodiment of the invention also discloses a display module, which comprises a touch component 301, a display component 302, a driving chip 303, an electronic element 305 and a circuit board 304; the touch component 301 is arranged opposite to the display component 302; the touch component is connected to the driving chip 303, and the driving chip 303 and the electronic component 305 are disposed on the circuit board 304.
In the embodiment of the present invention, the driving chip 303 is connected to the touch device for driving the touch device to complete the related touch function, and the driving chip 303 is disposed on the circuit board 304 and performs data transmission with the circuit board 304 to ensure the functionality of the touch device. Optionally, the circuit board is a multilayer flexible circuit board, the multilayer flexible circuit board is formed by laminating three or more layers of single-sided flexible circuit boards or double-sided flexible circuit boards together, a metalized hole is formed by drilling and electroplating, and a conductive path is formed between different layers, so that the multilayer flexible circuit board has more functions compared with a single-sided parallel circuit board or a double-sided flexible circuit board. The circuit board 304 is also provided with electronic components 305, which are soldered to the circuit board as peripheral components on the circuit board.
Optionally, the display module further includes a chip on film, and the driving chip is disposed on the circuit board through the chip on film.
In the embodiment of the invention, the chip on film is a soft film packaging technology of a crystal grain for fixing the driving chip on the circuit board, and is a technology for jointing the chip and the flexible substrate circuit by using a flexible additional circuit board as a packaging chip carrier. The chip on film has the following characteristics: the size is reduced, and the device is thinner and lighter; the chip is arranged with the front side facing downwards, and the line distance is miniaturized (pitch of 35 mu m), so that the reliability can be improved; regional reflow soldering can be carried out on the substrate; the bending strength is high; passive components may be added. Therefore, the driving chip is arranged on the circuit board through the chip on film, so that the reliability can be improved, and the chip on film has the characteristics that regional reflow soldering can be performed on the circuit board, the bending strength is high, and the passive component can be increased.
The display module comprises a touch control assembly, wherein the touch control assembly comprises a substrate base plate, and the substrate base plate comprises a display area and a non-display area surrounding the display area; a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the substrate base plate; and the second routing layer is connected with the first routing layer through a via hole penetrating through the first protective layer. According to the embodiment of the invention, the first routing layer and the second routing layer are arranged in the non-display area of the touch control assembly and are connected, and when the first routing layer or the second routing layer is scratched, the other routing layers can still be conducted.
The embodiment of the invention also discloses electronic equipment which comprises the display module.
In the embodiment of the present invention, the electronic device includes, but is not limited to, a mobile phone, a television, a wearable electronic device, and the like.
The embodiment of the invention also discloses a preparation method of the touch control assembly, and with reference to fig. 4, the preparation method comprises the following steps:
In an embodiment of the present invention, the display area and the non-display area on the substrate are determined according to a specific position structure of the touch device, which is not specifically limited in the embodiment of the present invention, the first routing layer may be an ITO layer or a molybdenum layer, the second routing layer may also be an ITO layer or a molybdenum layer, and the first protective layer and the second protective layer are a silicon dioxide layer or a silicon nitride layer. The size of the via hole penetrating through the first protective layer is set according to requirements, and the first routing layer can be connected with the second routing layer through the via hole.
As a specific example, the first wiring layer is ITO, and the first protective layer is SiO2(silicon oxide), molybdenum as the second wiring layer, and SiO as the second protective layer2When the second routing layer is scratched and corroded, the second routing layer is usedThe first wiring layer is connected with the first wiring layer through the via holes, so that the ITO on the first wiring layer can still be conducted, and the influence on the functions of the product is small.
As a specific example, the main process flow of the ITO wiring layer in the display area is as follows: cleaning a glass substrate, ITO sputtering (whole surface), coating protective photoresist, exposing, removing the photoresist in a non-wiring area, etching a non-ITO circuit area in a display area, and removing the photoresist in a wiring area.
The main process flow of the molybdenum wiring layer in the non-display area comprises the steps of cleaning a glass substrate, sputtering (whole surface) molybdenum material, coating protective photoresist, exposing, removing the photoresist in the non-wiring area, etching the non-wiring area and removing the photoresist in the non-wiring area.
According to the circuit manufacturing process, no matter the ITO circuit or the molybdenum (Mo) circuit is manufactured, the whole surface of the glass substrate is coated with the conductive material, and then the corresponding wiring is etched according to the design pattern. Ito (indium tin oxide) is a transparent semiconductor, i.e., indium tin oxide, and in practical applications, it is often characterized by a bulk resistance, and the sheet resistivity of the ito (indium tin oxide) is generally about 100 Ω, and it has good conductivity, and is one of the essential important materials for display and touch panels. In addition, the chemical properties of ITO are relatively stable. Alkali resistance: and after the mixture enters 600 ℃ and is added into a 10% sodium hydroxide solution for 5 minutes, the square resistance change value of the ITO layer is not more than 10%. Acid resistance: after the ITO layer is immersed in a hydrochloric acid solution with the concentration of 6% at 250C for 5 minutes, the square resistance change rate of the ITO layer is not more than 10%. Solvent resistance: 250C, after 5 minutes in acetone and absolute ethyl alcohol, the square resistance change rate of the ITO layer is not more than 10%. Adhesion force: the film layer is attached to the surface of the film layer by using an adhesive tape and is quickly torn off, so that the film layer is not damaged; or after the ITO layer is continuously torn for three times, the square resistance change rate of the ITO layer is not more than 10%. Thermal stability: and heating in 300C air for 30 minutes, wherein the resistance value of the ITO conductive square resistor is not more than 300% of the original square resistor.
Synthesize above circuit manufacture craft and ITO characteristic and learn, when preparation display area ITO circuit, can be in advance at the regional ITO wiring of non-display around making, let molybdenum walk the ITO circuit that increases a layer of high conductivity in line bottom, this design has two benefits: firstly, when a Touch Sensor (Touch Sensor) routing is scratched and exposed, the bottom layer ITO circuit can still be conducted; and secondly, the ITO has stronger corrosion resistance than the molybdenum circuit, and when the molybdenum circuit is corroded and exposed, the ITO can still be conducted. Therefore, after the design scheme is optimized, the scratch resistance and the corrosion resistance of the circuit can be effectively improved, and the reliability of the display touch module is enhanced.
On the premise of not increasing the process flow and the process cost, the stack design of the Touch Sensor wiring in the module frame glue area is optimized, the original single-layer molybdenum wiring is optimized into the ITO wiring and Mo wiring design, when the molybdenum wiring is scratched or corroded, the bottom ITO can still be conducted, and the scratch resistance and the corrosion resistance of the module line can be effectively increased. Therefore, the design requirement of high screen ratio can be met, the product reliability can be improved, and finally the product competitiveness and the customer satisfaction can be improved.
In an embodiment of the present invention, a method for manufacturing a touch module includes: providing a substrate base plate, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area; sequentially forming a first wiring layer and a first protective layer on a non-display area of the substrate base plate; forming a via hole penetrating through the first protective layer; forming a second routing layer on the first protective layer; the second routing layer is connected with the first routing layer through a through hole penetrating through the first protective layer; and forming a second protective layer covering the second wiring layer. According to the embodiment of the invention, the first routing layer and the second routing layer are arranged in the non-display area of the touch control assembly and are connected, and when the first routing layer or the second routing layer is scratched, the other routing layers can still be conducted.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A touch control assembly is characterized by comprising a substrate base plate, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area;
a first wiring layer, a first protective layer, a second wiring layer and a second protective layer are stacked on the non-display area of the substrate base plate; and the second routing layer is connected with the first routing layer through a via hole penetrating through the first protective layer.
2. The touch-control assembly of claim 1, wherein a third wiring layer, a third protective layer, a fourth wiring layer and a fourth protective layer are stacked on the display area of the substrate;
the third routing layer and the first routing layer are arranged on the same layer, the third protection layer and the first protection layer are integrally formed, the fourth routing layer and the second routing layer are arranged on the same layer, and the fourth protection layer and the second protection layer are integrally formed.
3. The touch assembly of claim 2, wherein the third routing layer and the first routing layer are made of the same material, and the fourth routing layer and the second routing layer are made of the same material.
4. The touch-sensitive assembly of any one of claims 1 to 3, wherein the first wiring layer is ITO and the second wiring layer is Mo.
5. The touch-sensitive assembly of any one of claims 1 to 3, wherein the first wiring layer is made of Mo, and the second wiring layer is made of ITO.
6. The touch-sensing assembly of claim 2, wherein the first passivation layer comprises silicon oxide or silicon nitride, and the second passivation layer comprises silicon oxide or silicon nitride.
7. A display module is characterized by comprising a display component, a driving chip, an electronic element, a circuit board and the touch component of any one of claims 1 to 6;
the touch control assembly is arranged opposite to the display assembly;
the touch control assembly is connected with the driving chip, and the driving chip and the electronic element are arranged on the circuit board.
8. The display module according to claim 7, wherein the display module further comprises a flip-chip film;
the driving chip is arranged on the circuit board through the chip on film.
9. An electronic device, characterized in that the electronic device comprises the display module according to claim 8 or 9.
10. A preparation method of a touch control assembly is characterized by comprising the following steps:
providing a substrate base plate, wherein the substrate base plate comprises a display area and a non-display area surrounding the display area;
sequentially forming a first wiring layer and a first protective layer on a non-display area of the substrate base plate;
forming a via hole penetrating through the first protective layer;
forming a second routing layer on the first protective layer; the second routing layer is connected with the first routing layer through a through hole penetrating through the first protective layer;
and forming a second protective layer covering the second wiring layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911350130.7A CN111158519A (en) | 2019-12-24 | 2019-12-24 | Touch control assembly, display module, electronic equipment and preparation method of touch control assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911350130.7A CN111158519A (en) | 2019-12-24 | 2019-12-24 | Touch control assembly, display module, electronic equipment and preparation method of touch control assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111158519A true CN111158519A (en) | 2020-05-15 |
Family
ID=70557926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911350130.7A Pending CN111158519A (en) | 2019-12-24 | 2019-12-24 | Touch control assembly, display module, electronic equipment and preparation method of touch control assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111158519A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111999950A (en) * | 2020-08-03 | 2020-11-27 | 京东方科技集团股份有限公司 | Array substrate, preparation method of array substrate and liquid crystal panel |
| CN113434057A (en) * | 2021-07-19 | 2021-09-24 | 联想(北京)有限公司 | Method for manufacturing sensor assembly |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040252165A1 (en) * | 1997-07-15 | 2004-12-16 | Silverbrook Research Pty Ltd | Method of fabricating an ink jet printhead chip with differential expansion actuators |
| CN104317445A (en) * | 2014-10-15 | 2015-01-28 | 重庆京东方光电科技有限公司 | Touch substrate and preparation method thereof, and touch display panel |
| CN104598074A (en) * | 2014-12-31 | 2015-05-06 | 上海天马有机发光显示技术有限公司 | Touch panel, touch display device and manufacture method of touch panel |
| CN104699349A (en) * | 2015-04-01 | 2015-06-10 | 上海天马微电子有限公司 | Array substrate, manufacturing method thereof and display panel |
| CN106168876A (en) * | 2015-04-20 | 2016-11-30 | 三星电子株式会社 | For providing method and the electronic equipment of user interface |
| CN107249056A (en) * | 2017-06-06 | 2017-10-13 | 上海传英信息技术有限公司 | Mobile terminal and the method for realizing one-handed performance mobile terminal |
| CN206807504U (en) * | 2017-06-06 | 2017-12-26 | 上海传英信息技术有限公司 | Mobile terminal |
| CN109448570A (en) * | 2018-12-17 | 2019-03-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and display module |
| CN112698756A (en) * | 2019-10-23 | 2021-04-23 | 华为终端有限公司 | Display method of user interface and electronic equipment |
-
2019
- 2019-12-24 CN CN201911350130.7A patent/CN111158519A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040252165A1 (en) * | 1997-07-15 | 2004-12-16 | Silverbrook Research Pty Ltd | Method of fabricating an ink jet printhead chip with differential expansion actuators |
| CN104317445A (en) * | 2014-10-15 | 2015-01-28 | 重庆京东方光电科技有限公司 | Touch substrate and preparation method thereof, and touch display panel |
| CN104598074A (en) * | 2014-12-31 | 2015-05-06 | 上海天马有机发光显示技术有限公司 | Touch panel, touch display device and manufacture method of touch panel |
| CN104699349A (en) * | 2015-04-01 | 2015-06-10 | 上海天马微电子有限公司 | Array substrate, manufacturing method thereof and display panel |
| CN106168876A (en) * | 2015-04-20 | 2016-11-30 | 三星电子株式会社 | For providing method and the electronic equipment of user interface |
| CN107249056A (en) * | 2017-06-06 | 2017-10-13 | 上海传英信息技术有限公司 | Mobile terminal and the method for realizing one-handed performance mobile terminal |
| CN206807504U (en) * | 2017-06-06 | 2017-12-26 | 上海传英信息技术有限公司 | Mobile terminal |
| CN109448570A (en) * | 2018-12-17 | 2019-03-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and display module |
| CN112698756A (en) * | 2019-10-23 | 2021-04-23 | 华为终端有限公司 | Display method of user interface and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111999950A (en) * | 2020-08-03 | 2020-11-27 | 京东方科技集团股份有限公司 | Array substrate, preparation method of array substrate and liquid crystal panel |
| CN111999950B (en) * | 2020-08-03 | 2023-07-28 | 京东方科技集团股份有限公司 | Array substrate, preparation method of array substrate and liquid crystal panel |
| CN113434057A (en) * | 2021-07-19 | 2021-09-24 | 联想(北京)有限公司 | Method for manufacturing sensor assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101029490B1 (en) | Window panel integrated capacitive touch sensor and manufacturing method thereof | |
| CN102548758B (en) | Thin-sheet glass substrate laminate and method of manufacturing the same | |
| JP5746619B2 (en) | Window panel integrated electrostatic capacitance type touch sensor and manufacturing method | |
| US8686965B2 (en) | Single-layer projected capacitive touch panel and method of manufacturing the same | |
| TWI526890B (en) | Touch panels and fabrication methods thereof | |
| CN108446045B (en) | Touch sensor and method for manufacturing the same | |
| KR101683373B1 (en) | Conductive structure body and method for manufacturing the same | |
| WO2014029184A1 (en) | Thin-film sensor, capacitive touchscreen containing the sensor, method of fabricating same, and terminal product thereof | |
| WO2014029183A1 (en) | Thin-film sensor, capacitive touchscreen containing the sensor, method of fabricating same, and terminal product thereof | |
| CN118550425B (en) | High-reliability touch display directional sounding device and preparation process thereof | |
| US11526241B2 (en) | Flexible substrate, touch display substrate, manufacturing methods thereof, and touch display device | |
| CN107450784A (en) | A kind of flexible projecting type capacitor touch screen and preparation method thereof | |
| TWI472977B (en) | Touch panel and manufacturing method | |
| CN111158519A (en) | Touch control assembly, display module, electronic equipment and preparation method of touch control assembly | |
| CN118567517B (en) | High-reliability touch display directional sounding device and preparation process thereof | |
| KR20140052510A (en) | Manufacturing method of touch screen panel | |
| CN107957815A (en) | Touch-control display panel | |
| US10104770B2 (en) | Touch panel, preparing method thereof, and Ag—Pd—Nd alloy for touch panel | |
| EP3037930A1 (en) | Capacitive touch panel | |
| JP5860837B2 (en) | Capacitive touch panel | |
| KR20110119122A (en) | Window integrated capacitive touch screen panel and manufacturing method thereof | |
| CN106293243A (en) | A kind of touch-control display module and preparation method thereof | |
| KR20120032962A (en) | Touch window and manufacturing mathod | |
| CN110782789A (en) | A display module and electronic equipment | |
| CN203038254U (en) | A narrow frame touch screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200515 |
|
| RJ01 | Rejection of invention patent application after publication |