CN111128802A

CN111128802A - Microelectronic die packaging system

Info

Publication number: CN111128802A
Application number: CN201911296062.0A
Authority: CN
Inventors: 汤忠武
Original assignee: Individual
Current assignee: Shenzhen Friendcom Technology Co Ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2020-05-08
Anticipated expiration: 2039-12-16
Also published as: CN111128802B

Abstract

The invention relates to a packaging system for a microelectronic die. The packaging system of the microelectronic die includes an electrical box, an electrical cover, a packaging component and a toggle, the electrical cover is detachably mounted on the top of the electrical box, and the packaging component is mounted in the electrical box, The encapsulation assembly includes an encapsulation box body, a resisting spring and an encapsulation plate, the bottom of the encapsulation box body is rotatably installed in the electrical box, and a narrow and long resisting groove is opened on one side of the encapsulation box body. The packaging system of the microelectronic die facilitates the replacement of the microelectronic die.

Description

Microelectronic die packaging system

Technical Field

The present invention relates to a packaging system for microelectronic die.

Background

In the field of aviation and machinery, electronic devices have been developed in an intensive direction. In order to ensure the stable operation of the microelectronic die, glue is generally used to fix the microelectronic die device, and the rationality and scientificity of the microelectronic die package structure will directly affect the operational stability of the microelectronic die. However, microelectronic die devices secured by glue are not easily removable and need to be replaced along with the packaging device when the microelectronic die needs to be replaced due to damage.

Disclosure of Invention

In view of the foregoing, there is a need for a microelectronic die packaging system that facilitates replacement of microelectronic dies.

A packaging system of a microelectronic tube core comprises an electrical box, an electrical cover, a packaging assembly and a poking member, wherein the electrical cover is detachably mounted at the top of the electrical box, the packaging assembly is mounted in the electrical box and comprises a packaging box body, a propping spring and a packaging plate, the bottom of the packaging box body is rotatably mounted in the electrical box, one side of the packaging box body is provided with a long and narrow propping groove, the interior of the packaging box body is accommodated with the microelectronic tube core, the propping spring is used for propping the packaging box body to rotate, the bottom of the packaging plate is rotatably connected with the bottom of the side wall of the packaging box body, a propping strip block is convexly arranged on the packaging plate and is used for being clamped in the long and narrow propping groove to tightly prop the microelectronic tube core, the poking member is inserted in the side wall of the electrical box and is used for detachably clamping the packaging plate, thereby the packaging box body is positioned in a horizontal position.

In one embodiment, a toggle groove is formed in a side wall of the electrical box, and an access through groove is formed in a side of the toggle groove facing the package box in a penetrating manner.

In one embodiment, the toggle groove and the through-entering groove are both rectangular grooves, and the size of the through-entering groove is smaller than that of the toggle groove.

In one embodiment, the toggle member includes a closing plate and a rectangular convex column, the rectangular convex column is convexly disposed on the closing plate, the closing plate is clamped in the toggle groove, and the rectangular convex column is inserted in the through-entering groove.

In one embodiment, a sealed cavity is formed in the electrical box, and the access through slot communicates with the sealed cavity.

In one embodiment, a connecting rod is arranged on one side of the bottom of the packaging box body, and the connecting rod is rotatably connected into the electrical box.

In one embodiment, a mounting rod is disposed in the electrical box, one end of the holding spring is connected to the mounting rod, and the other end of the holding spring is connected to a middle portion of a side wall of the electrical box.

In one embodiment, the package assembly further includes a rectangular support rod, the rectangular support rod is located in the electrical box, and two opposite ends of the rectangular support rod are respectively fixed on two opposite side walls of the electrical box.

In one embodiment, the rectangular supporting rod is arranged adjacent to the toggle groove, the cross section of the rectangular supporting rod is rectangular, a supporting groove is concavely arranged in the middle of the rectangular supporting rod, and the supporting groove is used for accommodating and supporting the packaging box body so as to realize the horizontal positioning of the packaging box body.

In one embodiment, the supporting spring is a compression spring, and the extending direction of the supporting spring is perpendicular to the connecting rod.

When the packaging system of the microelectronic tube core packages the microelectronic tube core, the microelectronic tube core is inserted into the packaging box body, and then the packaging plate is rotated to enable the abutting strip block to be clamped into the long and narrow abutting groove so as to abut against the microelectronic tube core. And continuing to rotate and push the packaging plate to push the packaging box body to rotate to a horizontal position by overcoming the elastic force of the abutting spring, inserting the poking part into the side wall of the electrical box, and detachably clamping the packaging plate so as to position the packaging box body at the horizontal position. The microelectronic die can then be packaged by removably mounting the electrical cover on top of the electrical enclosure. When the microelectronic tube core is damaged and needs to be replaced with a new microelectronic tube core, the poking piece is pulled out to release the electrical box, the electrical box rotates under the propping of the propping spring, the microelectronic tube core can be released by poking the packaging plate, and the microelectronic tube core can be taken out, so that the microelectronic tube core is replaced easily.

Drawings

Fig. 1 is a perspective view of a packaging system for a microelectronic die of an embodiment.

Fig. 2 is a perspective view of a package assembly according to an embodiment.

Fig. 3 is a schematic perspective view of a toggle member according to an embodiment.

Fig. 4 is a partially enlarged view of a portion a in fig. 1.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The present invention relates to a packaging system for microelectronic die. For example, the packaging system for the microelectronic die includes an electrical box, an electrical cover detachably mounted on a top of the electrical box, a package assembly mounted in the electrical box, and a toggle member. For example, the package assembly includes a package box, a supporting spring and a package plate, the bottom of the package box is rotatably installed in the electrical box, and a long and narrow supporting groove is formed in one side of the package box. For example, the microelectronic die is accommodated in the package box, the abutting spring is used for abutting the package box to rotate, and the bottom of the package plate is rotatably connected to the bottom of the side wall of the package box. For example, the package board is provided with a holding strip block protruding thereon, and the holding strip block is used for being clamped into the long and narrow holding groove to hold the microelectronic die tightly. For example, the poking part is inserted into a side wall of the electrical box and used for detachably clamping the packaging plate, so that the packaging box body is positioned in a horizontal position.

Referring to fig. 1 to 4, a microelectronic die packaging system includes an electrical box 10, an electrical cover (not shown), a packaging assembly 30 and a toggle member 40, the electrical cover is detachably mounted on a top of the electrical box 10, the packaging assembly 30 is mounted in the electrical box 10, the packaging assembly 30 includes a packaging box 31, a holding spring 32 and a packaging plate 33, a bottom of the packaging box 31 is rotatably mounted in the electrical box 10, one side of the packaging box 31 is provided with a long and narrow holding groove 315, a microelectronic die (not shown) is accommodated in the packaging box 31, the holding spring 32 is used for holding the packaging box 31 to rotate, the bottom of the packaging plate 33 is rotatably connected to a bottom of a side wall of the packaging box 31, the packaging plate 33 is convexly provided with a holding strip block 331, the holding strip block 331 is used for being clamped in the long and narrow holding groove 315, the poking member 40 is inserted into the sidewall of the electrical box 10 to detachably hold the package board 33, so that the package box 31 is positioned in a horizontal position.

For example, the microelectronic die packaging system can be used to package the microelectronic die by inserting the microelectronic die into the package housing 31, and then rotating the package plate 33 to allow the retaining bar blocks 331 to engage the elongated retaining grooves 315 to retain the microelectronic die. The package plate 33 is continuously rotated to push the package box 31 to rotate to a horizontal position against the elastic force of the supporting spring 32, and then the toggle member 40 is inserted into the sidewall of the electrical box 10 and detachably clamps the package plate 33, so that the package box 31 is positioned at the horizontal position. The microelectronic die can then be completed by removably mounting the electrical cover on top of the electrical enclosure 10. When the microelectronic die is damaged and needs to be replaced with a new microelectronic die, the electrical box 10 is released by pulling out the toggle element 40, the electrical box 10 rotates under the support of the support spring 32, the microelectronic die can be released by pulling out the packaging plate 33, and the microelectronic die can be taken out, so that the microelectronic die can be replaced easily.

For example, a circuit structure is disposed within the package housing 31 to electrically connect the microelectronic die.

For example, in order to facilitate the insertion of the toggle element 40 into the side wall of the electrical box 10, a toggle groove 11 is formed on the side wall of the electrical box 10, and an access groove 12 is formed through the side of the toggle groove 11 facing the package housing 31. The toggle groove 11 and the through inlet groove 12 are both rectangular grooves, and the size of the through inlet groove 12 is smaller than that of the toggle groove 11. The toggle member 40 includes a closing plate 41 and a rectangular protruding column 42, the rectangular protruding column 42 is protruded on the closing plate 41, the closing plate 41 is clamped in the toggle slot 11, and the rectangular protruding column 42 is inserted in the through entering slot 12. A sealed cavity 15 is formed in the electrical box 10, and the through inlet slot 12 is communicated with the sealed cavity 15. By arranging the through access groove 12, the toggle element 40 can be conveniently inserted into the toggle groove 11.

For example, in order to facilitate the rotation of the package body 31, a connection rod 311 is provided at one side of the bottom of the package body 31, and the connection rod 311 is rotatably connected to the inside of the electrical box 10. An installation rod is arranged in the electrical box 10, one end of the abutting spring 32 is connected to the installation rod, and the other end of the abutting spring is connected to the middle of the side wall of the electrical box 10. The package assembly 30 further includes a rectangular support rod (not shown) located in the electrical box 10, and opposite ends of the rectangular support rod are fixed to two opposite side walls of the electrical box 10 respectively. The rectangular supporting rod is arranged close to the toggle groove 11, the cross section of the rectangular supporting rod is rectangular, a supporting groove is concavely arranged in the middle of the rectangular supporting rod, and the supporting groove is used for accommodating and supporting the packaging box body 31 so as to horizontally position the packaging box body 31. The supporting spring 32 is a compression spring, and the extending direction of the supporting spring 32 is perpendicular to the connecting rod 311. The coupling bar 311 is provided to facilitate the rotation of the packing case 31, and the support groove is provided to facilitate the support and accommodation of the packing case 31 when the packing case 31 falls down.

For example, it is particularly important that the electrical box 10 is recessed with a strip groove 13 for easy pulling out the toggle element 40, and the strip groove 13 is vertically communicated with the toggle groove 11. The toggle member 40 further includes a connecting plate 43 and a toggle plate 44, the connecting plate 43 is vertically connected to the closing plate 41, the connecting plate 43 is vertical to the closing plate 41, the connecting plate 43 is clamped in the strip groove 13, the toggle plate 44 is stacked on the connecting plate 43, one end of the toggle plate 44 is rotatably connected to one end of the toggle plate 44 far away from the closing plate 41, and the other end of the toggle plate 44 is adjacent to the closing plate 41. The toggle plate 44 is housed in the slat groove 13. The toggle plate 44 is configured to turn around the connecting plate 43 and abut against the bottom edge of the strip groove 13 after being stressed, so as to apply a force to toggle the toggle member 40 out of the through slot 12. Through setting up the setting aside board 44, on the one hand be convenient for fold in the slat groove 13, another convenience needs the dismouting to can stir and support the tip in slat groove 13 to utilize to dial power with stir 40 and dial out the logical groove 12 of entering.

For example, to facilitate clamping the microelectronic die, a clamping cavity 314 is formed in the package housing 31, and the clamping cavity 314 penetrates through an end of the package housing 31 away from the connecting bar 311. The clamping cavity 314 is provided with a clamping plate 316 in a sliding manner, the abutting strip block 331 abuts against the clamping plate 316, one end, far away from the connecting rod 311, of the packaging plate 33 is vertically provided with a sealing cover 338, the sealing cover 338 is used for sealing the top of the clamping cavity 314 of the packaging box 31, a rectangular opening 339 is formed in the middle of the sealing cover 338, and the rectangular convex column 42 of the toggle piece 40 is used for being clamped into the rectangular opening 339 of the sealing cover 338, so that the packaging box 31 is positioned. For example, to facilitate removal of the microelectronic die, the retaining spring 32 is used to retain the package housing 31 to rotate to a first angle (i.e., has returned to the original length of the retaining spring 32) to enable hovering of the package housing 31, wherein the first angle is 75 degrees. For example, in order to facilitate the package plate 33 to be opened when taking out, two pressure springs are disposed on the package plate 33, ends of the two pressure springs are connected to the package box 31, and the two pressure springs are respectively located at two opposite sides of the holding bar block 331. When the ic chip is taken out, the two pressure springs can be released, so that the package plate 33 rotates and pops open relative to the package box 31 to drive the holding bar block 331 to be separated from the long and narrow holding groove 315, thereby preventing the sealing cover 338 from blocking the clamping cavity 314. For example, in order to improve the elastic force of the holding spring 32, an auxiliary rod 18 is further disposed in the electrical box 10, the auxiliary rod 18 is parallel to the rectangular supporting rod, and the auxiliary rod 18 is located between the rectangular supporting rod and the holding spring 32 and is located obliquely above the mounting rod. When the packaging box 31 is turned over toward the rectangular supporting rod, the auxiliary rod 18 is used for abutting against the abutting spring 32, so that the abutting spring 32 is bent from the middle part to form a bottom vertical spring section and a top bent spring section, the elastic abutting force of the spring on the packaging box 31 is further improved, and the abutting stability is improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A packaging system for a microelectronic die, characterized in that it comprises an electrical box, an electrical cover, a packaging component and a toggle, the electrical cover is detachably mounted on the top of the electrical box, and the package component is installed In the electrical box, the encapsulation assembly includes an encapsulation box, a resisting spring and an encapsulation plate, the bottom of the encapsulation box is rotatably installed in the electrical box, and one side of the encapsulation box is provided with A narrow and long abutting groove, the packaging box accommodates a microelectronic die, the abutting spring is used to rotate against the packaging box, and the bottom of the packaging board is rotatably connected to the side wall of the packaging box At the bottom, a resisting block is protruded on the package board, and the resisting block is used to snap into the narrow and long resisting groove to press against the microelectronic die, and the toggle element is inserted into the The side wall of the electrical box is used for detachably holding the packaging board, so that the packaging box is positioned in a horizontal position.

2 . The packaging system of the microelectronic die according to claim 1 , wherein a toggle groove is formed on the side wall of the electrical box, and the toggle groove is opened through the side of the packaging box. 3 . There are access slots.

3 . The packaging system for a microelectronic die according to claim 2 , wherein the toggle slot and the entry through slot are both rectangular slots, and the size of the entry through slot is smaller than the size of the toggle slot. 4 . size.

4 . The packaging system of the microelectronic die according to claim 3 , wherein the toggle element comprises a closing plate and a rectangular convex column, the rectangular convex column is protruded on the closing plate, and the closed The board is clamped in the toggle slot, and the rectangular protruding post is inserted into the entry through slot.

5 . The packaging system of the microelectronic die according to claim 4 , wherein a sealing cavity is formed in the electrical box, and the inlet through groove communicates with the sealing cavity. 6 .

6 . The packaging system for microelectronic dies according to claim 5 , wherein a connecting rod is provided on one side of the bottom of the packaging box, and the connecting rod is rotatably connected to the electrical box. 7 .

7 . The packaging system of the microelectronic die according to claim 6 , wherein a mounting rod is provided in the electrical box, one end of the resisting spring is connected to the mounting rod, and the other end is connected to the mounting rod. 8 . the middle of the side wall of the electrical box.

8 . The packaging system of the microelectronic die according to claim 7 , wherein the packaging assembly further comprises a rectangular support rod, the rectangular support rod is located in the electrical box, and two opposite sides of the rectangular support rod are located in the electrical box. 9 . The ends are respectively fixed on two opposite side walls of the electrical box.

9 . The packaging system of the microelectronic die according to claim 8 , wherein the rectangular support rod is disposed adjacent to the toggle slot, the cross section of the rectangular support rod is rectangular, and the rectangular support rod has a rectangular shape. 10 . A support groove is recessed in the middle, and the support groove is used to accommodate and support the packaging box body, so as to realize the horizontal positioning of the packaging box body.

10 . The packaging system for a microelectronic die according to claim 9 , wherein the resisting spring is a compression spring, and an extension direction of the resisting spring is perpendicular to the connecting rod. 11 .