CN111128526A - Integrally molded inductor structure with terminal electrode led out from bottom and manufacturing process thereof - Google Patents
Integrally molded inductor structure with terminal electrode led out from bottom and manufacturing process thereof Download PDFInfo
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- CN111128526A CN111128526A CN202010057134.2A CN202010057134A CN111128526A CN 111128526 A CN111128526 A CN 111128526A CN 202010057134 A CN202010057134 A CN 202010057134A CN 111128526 A CN111128526 A CN 111128526A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
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Abstract
本发明公开了一种端电极底部引出之一体成型模铸电感结构，包括漆包线卷，所述漆包线卷通过绕线治具缠绕定型，定型后的漆包线卷的起始端和结束端呈锐角，所述漆包线卷的底端填充设置有第一磁性粉末层和第二磁性粉末层，所述第一磁性粉末层和所述第二磁性粉末层的外表面设置有涂布层和两侧设置的空缺区，所述漆包线卷的起始端和结束端分别裸露于对应空缺区处，所述空缺区的表面设置有电镀铜层、电镀镍层和电镀锡层，本发明还提供了一种端电极底部引出之一体成型模铸电感结构的制造工艺，通过上述结构和制造工艺，本发明制备的底部电极一体成型模铸电感组件四周皆无导体，线路布局时外围组件可以更进一步靠近，有效节约了PCB尺寸。
The invention discloses an integral molding die-cast inductor structure led out from the bottom of a terminal electrode, comprising an enameled wire coil, the enameled wire coil is wound and shaped by a winding jig, and the starting end and the ending end of the shaped enameled wire coil are at an acute angle. The bottom end of the enameled wire roll is filled with a first magnetic powder layer and a second magnetic powder layer, and the outer surfaces of the first magnetic powder layer and the second magnetic powder layer are provided with a coating layer and vacancies arranged on both sides , the starting end and the ending end of the enameled wire roll are exposed at the corresponding vacant area respectively, and the surface of the vacant area is provided with an electroplated copper layer, an electroplated nickel layer and an electroplated tin layer, and the present invention also provides a terminal electrode bottom lead out One is the manufacturing process of the integral molding die-cast inductor structure. Through the above structure and manufacturing process, the bottom electrode integral molding die-cast inductor component prepared by the present invention has no conductors around it, and the peripheral components can be further approached during the circuit layout, which effectively saves the PCB size. .
Description
Technical Field
The invention relates to the technical field of die casting inductor preparation, in particular to an integrally formed die casting inductor structure with a terminal electrode led out from the bottom and a manufacturing process thereof.
Background
The inductor is applied to most of electronic products, and equipment damage caused by current problems can not easily occur when the electronic products are used after the inductor is installed; with the development of the inductor industry, the improvement of the manufacturing technology and the research and development technology, the inductor products are continuously upgraded and updated, and the integrally molded die casting inductor is a new product after the updating and updating, so that the application range is wider.
Fig. 1 shows an integrally molded inductor structure formed by die casting, which includes an inductor body, the inductor body is mainly formed by pressing metal powder in a die casting manner, the specific manufacturing method is well known to those skilled in the art, and will not be described herein, a coil is wound inside the inductor body, the end edges of the two ends of the coil are exposed on the surface of the inductor body, then external end electrodes are respectively formed on the outer surfaces of the two end edges, the end electrodes are led out from the inductor body from the side edges, and then the bottom of the end electrodes is bent to facilitate the subsequent SMT surface mounting technology.
The integrally molded inductor with the above structure is generally only suitable for the situation that the length and width of the PCB are not limited, and the size of the PCB is gradually reduced along with the trend of gradually reducing the size of the electronic product, so the mold inductor, which is indispensable in the circuit application, also faces the challenge of gradually reducing the size. The integrally molded die casting inductor structure is mainly characterized in that the end electrode is led out from the inductor body from the side edge, and then the end electrode is bent at the bottom to facilitate the subsequent SMT surface mounting technology; because the terminal electrode is made of conductive materials, a certain space needs to be reserved beside the inductance terminal electrode during circuit layout, and the phenomenon that other components contact the inductance terminal electrode in the SMT process to cause short circuit and influence circuit operation is avoided; taking the power-on design of a mobile phone and a notebook computer as an example, the usage amount of inductors is several to tens of inductors, and each inductor needs to reserve a certain space, so that the sum of the inductors and the reserved space on the circuit layout cannot be ignored, and further miniaturization of the PCB can be restrained.
Disclosure of Invention
The invention mainly solves the technical problem of providing an integrally formed die casting inductance structure with a terminal electrode led out from the bottom and a manufacturing process thereof, wherein the periphery of a bottom electrode integrally formed die casting inductance component is not provided with conductors, and peripheral components can be further close to each other during circuit layout, so that the size of a PCB is effectively saved, a substantial step is promoted for a PCB miniaturization technology, and the integrally formed die casting inductance structure has good practical value.
In order to solve the technical problems, the invention adopts a technical scheme that: the utility model provides an one-piece shaping die casting inductance structure that termination electrode bottom was drawn forth, includes the enameled wire book, the enameled wire book is stereotyped through the winding tool winding, and the initiating terminal and the ending terminal of the enameled wire book after the design are acute angle contained angle, the bottom of enameled wire book is filled and is provided with first magnetism powder layer, the top of first magnetism powder layer is provided with second magnetism powder layer, first magnetism powder layer and second magnetism powder layer are rectangle an organic whole and set up, the initiating terminal and the ending terminal of enameled wire book extend to the upper surface both ends of second magnetism powder layer, the surface of first magnetism powder layer and second magnetism powder layer is provided with the coating layer, the both sides of coating layer upper surface are provided with the vacancy district respectively, the initiating terminal and the ending terminal of enameled wire book expose respectively in corresponding vacancy district department, the surface in vacancy district is provided with the copper layer, and the surface of the electroplated copper layer is sequentially provided with an electroplated nickel layer and an electroplated tin layer.
Preferably, the first magnetic powder layer is composed of metal powder, a binder and an additive, the metal powder is soft magnetic powder, the binder is any one of epoxy resin, acryl resin, phenolic resin and silicone resin, the additive is stearic acid, and the first magnetic powder layer and the second magnetic powder layer have the same composition structure.
Preferably, the soft magnetic powder is at least one of carbon-based iron powder, reduced iron powder, iron nickel powder, iron silicon aluminum powder, iron silicon chromium powder and iron silicon powder, and the stearic acid is any one of fatty acid or graphite fluoride.
Preferably, the addition ratio of the binder is 0.5 wt% to 10 wt%.
Preferably, the cross-sectional shape of the enameled wire coil is any one of a circle, a rectangle, a square and a polygon.
Preferably, the coating layer is any one of an epoxy resin layer, an acryl resin layer, a phenol resin layer and a silicon resin layer.
Preferably, the thickness range of the coating layer is 1-100 um.
Preferably, the thickness of the electroplated copper layer is 0.5-20 um, the thickness of the electroplated nickel layer is 0.5-20 um, and the thickness of the electroplated tin layer is 0.5-20 um.
The invention also provides a manufacturing process of the integrally molded die casting inductor structure with the bottom of the terminal electrode led out, which comprises the following steps,
(A) winding the enameled wire coil on a winding jig, wherein the starting end and the ending end of the wound enameled wire coil form an acute included angle;
(B) filling a first magnetic powder layer into a forming die of a die-casting forming machine, turning the formed enameled wire coil for 180 degrees, and implanting the enameled wire coil into the first magnetic powder layer in the forming die;
(C) filling a second magnetic powder layer into the forming die, and then pressing and forming under the pressure of 1-10 ton/cm2The starting end and the ending end of the enameled wire coil are arranged at two ends of the upper surface of the second magnetic powder layer in an extending mode;
(D) putting the semi-finished product after the compression molding into an oven for baking to cure the binder, wherein the baking temperature is between 60 and 260 ℃, and the baking time is between 0.5 and 24 hours;
(E) arranging a coating layer on the surface of the product obtained in the step (D), and then putting the product into an oven for baking at the baking temperature of 60-260 ℃ for 0.5-24 h;
(F) grinding the two sides of the upper surface of the coating layer of the product obtained in the step (E) in a grinding mode, wherein the positions after grinding are vacant areas, and the starting end and the ending end of the enameled wire coil are respectively exposed at the corresponding vacant areas;
(G) applying an electroplated copper layer on the vacant areas obtained in the step (F), wherein the electroplated copper layer is deposited on the vacant areas without the coating layer;
(H) and (G) continuously applying the product obtained in the step (G) as an electroplated nickel layer and an electroplated tin layer, thereby obtaining the integrally formed die casting inductance structure product with the bottom of the terminal electrode led out.
Preferably, the coating layer in the step (E) is provided by any one of dipping, rolling spraying and arranging spraying.
The invention has the beneficial effects that: according to the integrally-formed die-casting inductance structure with the end electrode led out from the bottom and the manufacturing process thereof, the integrally-formed die-casting inductance component with the bottom electrode is obtained through a plurality of structural procedures such as winding, die-casting forming, grinding and electroplating of an enameled wire coil, no conductor exists around the integrally-formed die-casting inductance component, and peripheral components can be further close to each other during circuit layout, so that the size of a PCB is effectively saved, a substantial step is promoted for a PCB miniaturization technology, and the integrally-formed die-casting inductance structure with the end electrode led out from the bottom has good practical value and.
Drawings
Fig. 1 is a diagram of an integrally molded inductor structure of the prior art related to the background of the invention;
FIG. 2 is a schematic side view of the enameled wire coil wound and shaped on the winding jig of the present invention;
FIG. 3 is a top view of the enameled wire coil wound and shaped on the winding fixture in the present invention;
fig. 4 is a schematic structural view of the forming die of the present invention filled with a first magnetic powder layer;
FIG. 5 is a schematic structural view of the shaped enameled wire coil turned 180 degrees and then placed in the first magnetic powder layer of the forming mold;
fig. 6 is a schematic view of the structure after the filling of the second magnetic powder layer is continued on the basis of fig. 5;
FIG. 7 is a schematic view of the product shaping structure after the forming mold is removed from the base of FIG. 4;
FIG. 8 is a schematic view of the structure of FIG. 7 after a coating layer is disposed thereon;
FIG. 9 is a schematic structural view of a region with two sides of the upper surface ground to obtain voids on the basis of FIG. 8;
FIG. 10 is a schematic view of a structure of applying an electroplated copper layer at the vacant areas on the basis of FIG. 9;
FIG. 11 is a schematic structural view of the nickel electroplating layer and the tin electroplating layer which are continuously applied on the basis of FIG. 10;
FIG. 12 is the schematic view of FIG. 11 after being turned over to embody the final product structure;
the parts in the drawings are numbered as follows:
1. enamelling the wire coil; 2. winding a wire tool; 3. a first magnetic powder layer; 4. a second magnetic powder layer; 5. a coating layer; 6. an empty area; 7. electroplating a copper layer; 8. electroplating a nickel layer; 9. electroplating a tin layer; 10. and (5) forming a die.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example (b):
as shown in fig. 2 and 3, an integrally molded die casting inductance structure with a terminal electrode led out from the bottom comprises an enameled wire coil 1, wherein the enameled wire coil 1 is wound and shaped by a winding jig 2, the starting end and the finishing end of the shaped enameled wire coil 1 form an acute included angle, the cross section of the enameled wire coil 1 is in a shape of any one of a circle, a rectangle, a square or a polygon, and the cross section of the enameled wire coil 1 embodied in the embodiment is in a shape of a circle.
As shown in fig. 4, 5 and 6, a first magnetic powder layer 3 is filled at the bottom end of the enameled wire roll 1, a second magnetic powder layer 4 is arranged above the first magnetic powder layer 3, the first magnetic powder layer 3 and the second magnetic powder layer 4 are integrally arranged in a rectangular shape, the starting end and the ending end of the enameled wire roll 1 are arranged at two ends of the upper surface of the second magnetic powder layer 4 in an extending manner, and the first magnetic powder layer 3 and the second magnetic powder layer 4 have the same composition structure.
As shown in fig. 4, 5 and 6, the first magnetic powder layer 3 is composed of metal powder, a binder and an additive, wherein the metal powder is soft magnetic powder, and the soft magnetic powder is at least one of carbon-based iron powder, reduced iron powder, iron nickel powder, iron silicon aluminum powder, iron silicon chromium powder and iron silicon powder. The adhesive is any one of epoxy resin, acrylic resin, phenolic resin and silicon resin, and the addition proportion of the adhesive is 0.5-10 wt%, so that better molding density and magnetic property can be achieved. The additive is stearic acid, and the stearic acid is any one of fatty acid or graphite fluoride.
As shown in fig. 7, 8 and 9, a coating layer 5 is disposed on the outer surfaces of the first magnetic powder layer 3 and the second magnetic powder layer 4, the coating layer 5 is any one of an epoxy resin layer, an acryl resin layer, a phenolic resin layer and a silicone resin layer, the thickness of the coating layer 5 is preferably in a range of 1 to 100um, the thickness range provides enough thickness to protect the magnetic powder, and then the two sides of the upper surface of the coating layer 5 are respectively provided with a vacant area 6 by grinding, so that the start end and the end of the enameled wire coil 1 are respectively exposed at the corresponding vacant areas 6.
As shown in fig. 10, 11 and 12, an electroplated copper layer 7 is formed on the surface of the obtained void region 6, and an electroplated nickel layer 8 and an electroplated tin layer 9 are sequentially arranged on the surface of the electroplated copper layer 7, wherein the thickness of the electroplated copper layer 7 is 0.5 to 20um, and the copper layer has better bonding property and conductivity with the magnetic core, in addition, the preferred thickness of the electroplated nickel layer 8 is 0.5 to 20um, and the preferred thickness of the electroplated tin layer 9 is 0.5 to 20um, so that each electroplated layer has better bonding property and better conductivity.
The invention also provides a manufacturing process of the integrally formed die casting inductance structure with the end electrode led out from the bottom, which comprises the following steps,
(A) winding the enameled wire coil 1 on a winding jig 2, wherein the starting end and the ending end of the wound enameled wire coil 1 form an acute included angle;
(B) filling a first magnetic powder layer 3 into a forming die 10 of a die-casting forming machine, turning the formed enameled wire coil 1 by 180 degrees, and implanting the enameled wire coil into the first magnetic powder layer 3 in the forming die 10;
(C) filling a second magnetic powder layer 4 into a forming die 10, and then performing compression forming under the pressure of 1-10 ton/cm2The starting end and the ending end of the enameled wire coil 1 are arranged at two ends of the upper surface of the second magnetic powder layer 4 in an extending manner;
(D) putting the semi-finished product after the compression molding into an oven for baking to cure the binder, wherein the baking temperature is between 60 and 260 ℃, and the baking time is between 0.5 and 24 hours;
(E) arranging a coating layer 5 on the surface of the product obtained in the step (D), wherein the coating layer 5 is arranged in any one of impregnation, rolling spraying and arrangement spraying, and then placing the product into an oven for baking at the baking temperature of 60-260 ℃ for 0.5-24 h;
(F) grinding the two sides of the upper surface of the coating layer 5 of the product obtained in the step (E) in a grinding mode, wherein the positions after grinding are vacant areas 6, and the starting end and the ending end of the enameled wire coil 1 are respectively exposed at the corresponding vacant areas 6;
(G) applying an electroplated copper layer 7 on the vacant areas 6 obtained in the step (F), and depositing the electroplated copper layer 7 on the vacant areas 6 without the coating layer;
(H) and (G) continuously applying the product obtained in the step (G) as an electroplated nickel layer 8 and an electroplated tin layer 9, thereby obtaining the integrally formed die casting inductance structure product with the bottom of the terminal electrode led out.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An integrated molding die casting inductance structure that end electrode bottom is drawn forth which characterized in that: the enameled wire coil comprises an enameled wire coil (1), wherein the enameled wire coil (1) is wound and shaped through a winding jig (2), the starting end and the ending end of the enameled wire coil (1) after shaping are acute included angles, a first magnetic powder layer (3) is filled at the bottom end of the enameled wire coil (1), a second magnetic powder layer (4) is arranged above the first magnetic powder layer (3), the first magnetic powder layer (3) and the second magnetic powder layer (4) are arranged in a rectangular integral manner, the starting end and the ending end of the enameled wire coil (1) extend to the two ends of the upper surface of the second magnetic powder layer (4), coating layers (5) are arranged on the outer surfaces of the first magnetic powder layer (3) and the second magnetic powder layer (4), empty areas (6) are respectively arranged on the two sides of the upper surface of each coating layer (5), and the starting end and the ending end of the enameled wire coil (1) are respectively exposed at the corresponding empty areas (6), the surface of the vacancy area (6) is provided with an electroplated copper layer (7), and the surface of the electroplated copper layer (7) is sequentially provided with an electroplated nickel layer (8) and an electroplated tin layer (9).
2. The structure of claim 1, wherein said bottom terminal lead-out integrally molded inductor comprises: the first magnetic powder layer (3) is composed of metal powder, a binder and an additive, the metal powder is soft magnetic powder, the binder is any one of epoxy resin, acrylic resin, phenolic resin and silicon resin, the additive is stearic acid, and the first magnetic powder layer (3) and the second magnetic powder layer (4) are identical in composition structure.
3. The structure of claim 2, wherein said bottom terminal lead-out integrally molded inductor comprises: the soft magnetic powder is at least one of carbon-based iron powder, reduced iron powder, iron nickel powder, iron silicon aluminum powder, iron silicon chromium powder and iron silicon powder, and the stearic acid is any one of fatty acid or graphite fluoride.
4. The structure of claim 2, wherein said bottom terminal lead-out integrally molded inductor comprises: the addition proportion of the binder is 0.5-10 wt%.
5. The structure of claim 1, wherein said bottom terminal lead-out integrally molded inductor comprises: the cross section of the enameled wire coil (1) is in any one shape of a circle, a rectangle, a square or a polygon.
6. The structure of claim 1, wherein said bottom terminal lead-out integrally molded inductor comprises: the coating layer (5) is any one of an epoxy resin layer, an acryl resin layer, a phenolic resin layer and a silicon resin layer.
7. The structure of claim 6, wherein said bottom terminal lead-out integrally molded inductor comprises: the thickness range of the coating layer (5) is 1-100 um.
8. The structure of claim 1, wherein said bottom terminal lead-out integrally molded inductor comprises: the thickness of copper electroplating layer (7) is 0.5 ~ 20um, the thickness of nickel electroplating layer (8) is 0.5 ~ 20um, the thickness of tin electroplating layer (9) is 0.5 ~ 20 um.
9. The manufacturing process of the integrally formed die casting inductance structure with the end electrode led out from the bottom is characterized in that: comprises the following steps of (a) carrying out,
(A) winding the enameled wire coil (1) on the winding jig (2), wherein the starting end and the finishing end of the wound enameled wire coil (1) form an acute included angle;
(B) filling a first magnetic powder layer (3) into a forming die (10) of a die-casting forming machine, turning the formed enameled wire coil (1) by 180 degrees, and implanting the enameled wire coil into the first magnetic powder layer (3) in the forming die (10);
(C) filling a second magnetic powder layer (4) into a forming die (10), and then pressing and forming, wherein the pressure of the pressing and forming is 1-10 ton/cm2The starting end and the ending end of the enameled wire coil (1) are arranged at two ends of the upper surface of the second magnetic powder layer (4) in an extending mode;
(D) putting the semi-finished product after the compression molding into an oven for baking to cure the binder, wherein the baking temperature is between 60 and 260 ℃, and the baking time is between 0.5 and 24 hours;
(E) arranging a coating layer (5) on the surface of the product obtained in the step (D), and then putting the product into an oven for baking at the baking temperature of 60-260 ℃ for 0.5-24 h;
(F) grinding the two sides of the upper surface of the coating layer (5) of the product obtained in the step (E) in a grinding mode, wherein the positions after grinding are vacant areas (6), and the starting end and the ending end of the enameled wire coil (1) are respectively exposed at the corresponding vacant areas (6);
(G) applying an electroplated copper layer (7) on the vacant areas (6) obtained in the step (F), and depositing the electroplated copper layer (7) on the vacant areas (6) without the coating layer;
(H) and (G) continuously applying the product obtained in the step (G) as an electroplated nickel layer (8) and an electroplated tin layer (9), thereby obtaining the integrally-formed die casting inductance structure product with the bottom of the terminal electrode led out.
10. The process of claim 9, wherein the step of forming the bottom-lead end electrode of the molded inductor comprises: the coating layer (5) in the step (E) is arranged in any one of dipping, rolling spraying and arraying spraying.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010057134.2A CN111128526A (en) | 2020-01-19 | 2020-01-19 | Integrally molded inductor structure with terminal electrode led out from bottom and manufacturing process thereof |
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| CN202010057134.2A CN111128526A (en) | 2020-01-19 | 2020-01-19 | Integrally molded inductor structure with terminal electrode led out from bottom and manufacturing process thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200086536A1 (en) * | 2018-09-13 | 2020-03-19 | Shenzhen Sunlord Electronics Co., Ltd. | Transfer-molded inductor and manufacturing method thereof |
| CN111548759A (en) * | 2020-05-18 | 2020-08-18 | 文登卡尔马斯特电子有限公司 | Thermo-reversible adhesive material |
| CN112435844A (en) * | 2020-12-04 | 2021-03-02 | 横店集团东磁股份有限公司 | Integrated co-fired inductor and preparation method thereof |
| CN112435845A (en) * | 2020-12-04 | 2021-03-02 | 横店集团东磁股份有限公司 | Integrated co-fired inductor and preparation method thereof |
| CN113178316A (en) * | 2021-04-12 | 2021-07-27 | 创一科技(长沙)有限公司 | High-power large-current integrally-formed inductor with electrodes metallized by electroplating |
| CN113345702A (en) * | 2021-04-12 | 2021-09-03 | 创一科技(长沙)有限公司 | Preparation method of low-cost integrated chip inductor |
| JP2022067029A (en) * | 2020-10-19 | 2022-05-02 | 湖南▲創▼一▲電▼子科技股▲ふん▼有限公司 | Manufacturing method of integrated chip inductor consisting of metal magnetic powder core |
| CN119170396A (en) * | 2024-11-21 | 2024-12-20 | 汕头市信技电子科技有限公司 | A method for manufacturing a miniaturized surface mount inductor |
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| CN112435844A (en) * | 2020-12-04 | 2021-03-02 | 横店集团东磁股份有限公司 | Integrated co-fired inductor and preparation method thereof |
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