CN111106044A

CN111106044A - High-precision Fan-out bonding machine

Info

Publication number: CN111106044A
Application number: CN201911394965.2A
Authority: CN
Inventors: 王钰锞
Original assignee: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY CO LTD
Current assignee: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY CO LTD
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-05-05

Abstract

The invention relates to the technical field of chip packaging, and the technical solution of the invention is: a high-precision Fan-out bonding machine, comprising an upper frame base, the upper frame base has four functional areas, and the lowermost layer is wafer material transmission The middle layer is the chip material transfer area, the upper layer is the chip bonding area, and the right side is the substrate material transfer area. The overall layout scheme of the bonding machine of the present invention can perfectly adapt to various process requirements involved in advanced packaging processes such as FO and FC, and at the same time, the performance indicators of high precision and high yield can be achieved at low cost. The structure is compact, and the overall size of the whole machine is smaller than that of similar equipment, which saves the user's clean room area. Under the condition of not reducing the yield, the position detection and periodic temperature drift compensation of the bonded chips can be realized, which provides a guarantee for the stability and reliability of the whole equipment.

Description

High-precision Fan-out bonding machine

Technical Field

The invention relates to the technical field of chip packaging, in particular to a high-precision Fan-out bonding machine.

Background

The chip bonding machine is a device which peels and picks up a chip from a blue film, and attaches the chip to a carrier plate according to certain precision requirements through a series of motion processes of transferring, overturning, gluing, detecting and the like. The final capacity, precision and reliability of material transfer of the equipment are directly influenced by the action flow and the matching mode among all the modules, namely the layout of the whole machine.

In recent years, advanced packaging technology has been rapidly developed in the chip packaging market, and the market proportion relative to the traditional packaging technology is also increased year by year. As a core technology for realizing an advanced packaging process: the advanced packaging equipment has wide market prospect.

Typical advanced packaging processes are the Flip-Chip process and the Fan-Out process. FC processes have been developed to date, with the most advanced being the C2 process and the TCB process. The ball grid array pitch of the back side of the chip of the C2 process is 60 microns, the bonding precision requirement error is less than 6 microns, and the yield requirement reaches 10+ kUPH. The TCB process requires that the soldering process be completed on-line, the pitch of the leads of the chip is less than 40 microns, the bonding accuracy of the device is required to reach 3 microns, the required bonding force is up to 250N, and the yield generally requires 1500 UPH. The FO process realizes high-density chip internal circuit interconnection through a ReDistribution Layer technology (ReDistribution Layer), so that a plurality of passive components are embedded in one package, and the overall cost of the chip is reduced. The FO process can be divided into the combination of different process modes such as RDL first/RDLlast/face-up/face-down and the like. These processes require that the chips be removed from the incoming wafer and attached to a temporary carrier (wafer or panel). Because the temporary carrier is not provided with local positioning marks, the FO process is different from the FC process, the overall positioning precision in the working range of the carrier is required, and the positioning precision can reach 3um due to higher-density electrical connection and smaller electrical connection distance. The FO process equipment also meets the high output yield requirement (10+ kUPH) while meeting the high bonding accuracy.

Against the background above, mainstream semiconductor equipment suppliers such as ASM, BESI, and KNS have introduced various types of high precision bonders to meet the requirements of advanced packaging processes for die attach precision and yield.

In the die bonding equipment, the main function of the bonding head is to pick up a chip from a prepared buffer table, and then move the chip to a carrier plate for bonding after visual positioning and detection. The bond head then has an XY motion relative to the carrier. There are currently two layouts for achieving such XY motion: the first is a moving gantry scheme; the second is a fixed gantry scheme.

The dynamic gantry method is that the bonding head is arranged on a gantry motion platform, and the bonding head is driven to realize XY motion by utilizing the XY motion of the gantry motion platform. This way the carrier plate is stationary during the whole process. A typical semiconductor packaging apparatus using this layout method is the 8800FC by BESI which uses a left and right mirror double gantry structure, each with a bonding head, capable of picking up the movement of the die in the XY plane. Each movable gantry structure is provided with a bonding upper-view camera and a bonding lower-view camera, and the Face-up bonding process and the Face-down bonding process can be compatible. The gantry positioning method is to distribute motions in two directions of XY to a bond head motion stage and a motion stage of a carrier. An example of a layout approach that may be used is the K & S APAMA device. The equipment is also in a layout of a left-right double gantry structure and a double-head structure, each side is provided with a fixed gantry structure which drives a bonding head to move along the Y direction, a substrate moving table drives a substrate to move along the X direction, and a double-light-path bonding camera realizes double-side visual alignment.

The traditional movable gantry and fixed gantry layout structures are widely adopted in the bonding modules of foreign brand equipment. The bonding module with the movable gantry layout is a preferred scheme for realizing the XY motion of the large-stroke high-precision bonding head. To realize the layout, a gantry motion driving and controlling algorithm is needed to control the motors at two ends of the X-axis span of the bottom layer to cooperatively output force so as to drive the X-axis load to rapidly and stably move. The disadvantages of this arrangement are: the development difficulty and the cost of the movable gantry structure capable of realizing high precision are very high due to the complexity of algorithms such as a gantry motion control algorithm, a compensation algorithm for generating heat to generate mechanical module distortion, and multi-dimensional Table Mapping of a motion Table. And the bottom layer X axis of the movable gantry structure is inevitably loaded greatly, high-acceleration movement cannot be realized, and the yield is reduced.

And the fixed gantry layout scheme adopts an upper shaft and a lower shaft to move independently to complete the lamination in an XY working plane on the carrier plate. The fixed gantry movement table with the layout mode can only move along the Y axis, so that the technological processes (hand changing, picking, gluing and positioning) required before bonding and bonding of the chips are necessarily arranged on a straight line, and the chips are sequentially attached along a line on the carrier plate. And when one row is finished, the X motion table of the carrier plate switches to a new row to continue working. The layout scheme is inevitably long in stroke of the bond head motion platform, and can become a bottleneck of high yield, and two common methods are used for improving the yield of the bond head motion platform: firstly, the acceleration of the motion table is directly promoted, but the positioning precision and the setting time are influenced by the vibration generated by the reaction force of the motor. Secondly, the number of the bonding heads is increased, so that a plurality of chips can be bonded in one period, but the method can improve the load of a bonding motion platform, reduce the Y-axis motion speed, simultaneously complicate the teaching and calibration work flow of a bonding module, and increase the number of tool materials such as suckers and the like, so as to cause the management cost of customers.

Disclosure of Invention

The invention aims to provide a high-precision Fan-out bonder.

The technical purpose of the invention is realized by the following technical scheme:

a high-precision Fan-out bonder comprises an upper rack base, wherein the upper rack base is provided with four functional areas, the lowest layer is a wafer material transmission area, the middle layer is a chip material transmission area, the upper layer is a chip bonding area, and the right side is a substrate material transmission area;

the wafer material area comprises a wafer loading and unloading module used for transporting wafers to a wafer carrying platform, and a thimble module is arranged below the wafer carrying platform;

the chip material transmission area comprises a chip pickup camera, a left double-head chip pickup head, a right double-head chip pickup head, a left double-chip relay table, a right double-chip relay table, a left double-turnover head module and a right double-turnover head module, the chip relay table can move in the Z-axis direction, the chip pickup head picks up and transfers the chip to the turnover head module, and the turnover head module can turn over and transfer the chip to the chip relay table;

the chip bonding area comprises a left bonding motion table and a right bonding motion table, a bonding camera and a bonding head are arranged at the position of the bonding motion table, the bonding motion table drives the bonding camera and the bonding head to move in the Y-axis direction, a glue scraping table and a bonding upward-looking camera are sequentially arranged on a path of a chip from behind a chip relay table, the bonding head sucks the chip located at the position of the chip relay table, the chip is glued through the glue scraping table and is visually positioned through the bonding upward-looking camera, and then the bonding head attaches the chip to a wafer substrate of the substrate motion table.

The invention is further provided with: the upper frame base is rigidly connected with the lower frame, and high-damping leveling vibration-damping ground feet are arranged at the supporting feet of the lower frame.

The invention is further provided with: a wafer box lifting table is arranged on the outer side of the upper rack base, a wafer box is arranged on the wafer box lifting table, a wafer is placed on the wafer box, a wafer rail is arranged on the left side of the upper end of the upper rack base, and the wafer moves towards the right side from the wafer rail and is transported to a wafer loading platform through a wafer loading module; the ejector pin module is used for sequentially stripping and ejecting the chips on the wafer.

The invention is further provided with: the chip picking camera is positioned between the left chip picking head and the right chip picking head and is used for positioning the picking work of the chip picking heads.

The invention is further provided with: the two substrate motion tables can move in the X-axis direction and are positioned on the rear side of the wafer carrier; the bonding motion table is a gantry Y-axis sliding table module, and the substrate motion table moves below the bonding motion table; the bonding camera is located at the rear side of the bonding head, and the bonding head can move in the Z-axis direction.

The invention is further provided with: the substrate material transmission area is located on the right side of the upper rack base and comprises a substrate loading module, a wafer carrying manipulator and a deviation rectifying table, and the wafer carrying manipulator carries and transfers substrate wafers at the substrate loading module to the substrate moving table.

In conclusion, the invention has the following beneficial effects:

the whole layout scheme of the bonder can perfectly adapt to various process requirements related to advanced packaging processes such as FO, FC and the like, and can realize high-precision and high-yield performance indexes with lower cost. Compact structure, the overall dimension of the machine is smaller than that of similar equipment, and the use area of a clean room of a user is saved. Under the condition of not reducing the yield, the position detection and the periodic temperature drift compensation of the chip which completes the bonding can be realized, and the stability and the reliability of the whole equipment are guaranteed.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a front view of the present invention.

Fig. 3 is a schematic structural diagram of a chip material conveying area and a chip bonding area.

FIG. 4 is a schematic diagram of a substrate material transport region.

The corresponding part names indicated by the numbers and letters in the drawings:

wherein: 10-mounting a frame base; 101-lower frame; 102-ground feet; 103-a wafer stage; 104-wafer load/unload module; 105-a thimble module; 106-wafer cassette lift table; 107-wafer track; 108-chip pick-up camera; 109-a chip pick-up head; 110-chip relay station; 111-turnover head module; 112-a bonded motion stage; 113-a bonded camera; 114-a bond head; 115-a glue scraping table; 116-a bonded view-on camera; 117-substrate motion stage; 118-a substrate loading module; 119-a wafer handling robot; 120-deviation rectifying table.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the invention is further described with reference to the figures and the specific embodiments.

As shown in fig. 1 to 4, the high-precision Fan-out bonder provided by the present invention includes an upper frame base 10, the upper frame base 10 has four functional areas, a lowest layer is a wafer material transmission area, a middle layer is a chip material transmission area, an upper layer is a chip bonding area, and a right side is a substrate material transmission area;

the wafer material area comprises a wafer loading-unloading module 104 for transporting the wafer to a wafer carrying platform 103, and an ejector pin module 105 is arranged below the wafer carrying platform 103;

the chip material transmission area comprises a chip pickup camera 108, a left double-head chip pickup head 109, a right double-head chip pickup head 109, a left double-chip relay station 110, a right double-chip relay station 110, a left double-turnover-head module 111 and a right double-turnover-head module 111, wherein the chip relay station 110 can move in the Z-axis direction, the chip pickup head 108 picks up and transfers the chip to the turnover-head module 111, and the turnover-head module 111 can turn over the chip and transfer the chip to the chip relay station 110;

the chip bonding area comprises a left bonding motion table 112 and a right bonding motion table 112, a bonding camera 113 and a bonding head 114 are arranged at the position of the bonding motion table 112, the bonding motion table 112 drives the bonding camera 113 and the bonding head 114 to move in the Y-axis direction, a glue scraping table 115 and a bonding upward-looking camera 116 are further sequentially arranged on a path of a chip from the chip relay table 110, the bonding head 114 sucks a chip located at the position of the chip relay table 110, the chip is glued through the glue scraping table 115 and is visually positioned through the bonding upward-looking camera 116, and then the bonding head 114 fits the chip to a wafer substrate of a substrate motion table 117.

The upper frame base 10 is rigidly connected with a lower frame 101, and high-damping leveling vibration-reduction feet 102 are arranged at supporting feet of the lower frame 101.

In the technical scheme, the lower frame 101 adopts a steel plate welding structure, and the strength and rigidity of the lower frame are ensured while the height space is compressed to the maximum extent; the micro-vibration is an important factor of the precision and the stability of the image semiconductor equipment, and the precision and the stability of the equipment can be improved by installing the high-damping leveling vibration-reduction anchor at the supporting leg.

A wafer box lifting table 106 is arranged on the outer side of the upper rack base 10, a wafer box is arranged on the wafer box lifting table 106, a wafer is placed on the wafer box, a wafer rail 107 is arranged on the left side of the upper end of the upper rack base 10, and the wafer moves to the right side from the wafer rail 107 and is transported to a wafer carrying platform 103 through a wafer loading module 104; the thimble module 115 is used for sequentially stripping and ejecting chips on the wafer.

In the above technical solution, the wafer is transferred from the wafer cassette to the wafer carrier, and then the ejector pin module 115 sequentially peels off and ejects the chips on the wafer, supplies the chip material to the chip material transfer area, and preferably retracts the blue film ring with the chips taken out into the wafer cassette.

The invention is further provided with: the chip pick-up camera 108 is located between the left and right chip pick-up heads 109, and the chip pick-up camera 108 is used for positioning the pick-up work of the chip pick-up heads 109; the number of the substrate motion tables 117 is two, the two substrate motion tables 117 can move in the X-axis direction, and the two substrate motion tables 117 are both located on the rear side of the wafer carrier 103; the bonding motion table 112 is a gantry Y-axis sliding table module, and the substrate motion table 117 moves below the bonding motion table 112; the bonding camera 113 is located at the rear side of the bond head 114, and the bond head 114 is movable in the Z-axis direction.

In the technical scheme, the chip materials are picked up and transmitted to the left and right turnover head modules 111, and the bottom wafer material transmission area and the top chip bonding area are connected, so that the material supply to the chip bonding areas at two sides is realized, whether the turnover heads are used or not can be switched on line, and the requirements of quick and convenient switching of turnover and non-turnover processes are met; the chip bonding area comprises a double-platform bonding motion platform, a double-head bonding head, a double-platform substrate motion platform, a bonding camera, a double-bonding upper view camera and a double-glue scraping platform, the function area is that the bonding head absorbs the chip, glue is adhered to the chip after the completion of the function area, the chip is adhered to a wafer substrate after the action of a visual positioning process, the left and right mirror-image double-platform bonding motion platforms realize high yield, the X axis and the Y axis of a fixed gantry structure are independent, and the Table Mapping algorithm of the motion platform is simplified. In order to realize the high-speed transmission of the chip, a Y axis of the bonding motion table adopts a floating stator structure, so that the counterforce of thrust does not directly act on a base of a motion system during acceleration, vibration disturbance is reduced, and the acceleration and the speed of the bonding motion table are improved. Therefore, the yield of the whole equipment is obviously improved, and the level of 12kUPH is reached.

The substrate material conveying area is located on the right side of the upper rack base 10, the substrate material conveying area comprises a substrate loading module 118, a wafer carrying manipulator 119 and a deviation rectifying table 120, and the wafer carrying manipulator 119 carries and transfers the substrate wafer at the substrate loading module 118 onto the substrate moving table 117.

In the above technical solution, the function area is used for supplying substrate wafer materials to the chip bonding area and recovering the substrate wafer materials completing the bonding process.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. a high-precision Fan-out bonder, comprising an upper frame base (10), characterized in that: the upper frame base (10) has four functional areas, and the bottom layer is a wafer material transfer area, and the middle layer It is the chip material transmission area, the upper layer is the chip bonding area, and the right side is the substrate material transmission area;

The wafer material area includes a wafer loading and unloading module (104) for transporting wafers to a wafer carrier (103), and an ejector module (105) is arranged under the wafer carrier (103). );

The chip material transfer area includes a chip pickup camera (108), a left and right double-head chip pickup head (109), a left and right double chip repeater (110), and a left and right double flip head module (111), and the chip repeater (110) ) can be moved in the Z-axis direction, the chip pickup head (108) picks up and transfers the chip to the flip head module (111), and the flip head module (111) can flip the chip and transfer it to the chip relay station (110). )superior;

The chip bonding area includes a left and right double bonding motion table (112), a bonding camera (113) and a bonding head (114) are arranged at the bonding motion table (112), and the bonding motion table is provided with a bonding camera (113) and a bonding head (114). (112) Drive the bonding camera (113) and the bonding head (114) to move in the Y-axis direction, and a squeegee station (115) is also provided in sequence on the chip path from the chip relay station (110) and bonding the top-view camera (116), the bonding head (114) sucks the chip located at the chip relay station (110) and passes through the squeegee station (115) for gluing, and then passes through the bonding top-view camera (116). Visually positioned, the bonding head (114) then attaches the chip to the wafer substrate of the substrate motion stage (117).

2. A high-precision Fan-out bonding machine according to claim 1, characterized in that: the upper frame base (10) and the lower frame (101) are rigidly connected, and the lower frame (101) A high-damping adjustable leveling vibration-absorbing foot (102) is installed at the supporting foot of ).

3. A high-precision Fan-out bonding machine according to claim 1, characterized in that: the outer side of the upper frame base (10) is provided with a wafer cassette lifting platform (106), the wafer The cassette lifting platform (106) is provided with a wafer cassette on which wafers are placed, and a wafer track (107) is provided on the left side of the upper end of the upper frame base (10), and the wafers are placed on the wafer cassette. It moves from the wafer track (107) to the right and is transported to the wafer stage (103) by the wafer loading module (104); the ejector module (115) is used to sequentially load the chips on the wafer Peel the ejector.

4. A high-precision Fan-out bonding machine according to claim 1, characterized in that: the chip pickup camera (108) is located between the left and right chip pickup heads (109), and the chip pickup camera (109) (108) is used for positioning the pickup work of the chip pickup head (109).

5. A high-precision Fan-out bonding machine according to claim 1, characterized in that: the substrate moving table (117) has two, and both substrate moving tables (117) can be in the X-axis direction To move, two substrate moving stages (117) are located on the back side of the wafer stage (103); the bonding moving stage (112) is a gantry Y-axis slide module, and the substrate moving stage (117) ) moves under the bonding motion stage (112); the bonding camera (113) is located on the rear side of the bonding head (114), and the bonding head (114) can be performed in the Z-axis direction move.

6. The high-precision Fan-out bonding machine according to claim 1, wherein the substrate material transfer area is located on the right side of the upper frame base (10), and the substrate material transfer area is located on the right side of the upper frame base (10). It includes a substrate loading module (118), a wafer handling robot (119), and a deviation correction stage (120). 117) on.