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CN111096101B - 元件安装装置 - Google Patents

元件安装装置 Download PDF

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Publication number
CN111096101B
CN111096101B CN201780094739.5A CN201780094739A CN111096101B CN 111096101 B CN111096101 B CN 111096101B CN 201780094739 A CN201780094739 A CN 201780094739A CN 111096101 B CN111096101 B CN 111096101B
Authority
CN
China
Prior art keywords
image
component mounting
mounting apparatus
component
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780094739.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN111096101A (zh
Inventor
高间和志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of CN111096101A publication Critical patent/CN111096101A/zh
Application granted granted Critical
Publication of CN111096101B publication Critical patent/CN111096101B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201780094739.5A 2017-09-28 2017-09-28 元件安装装置 Active CN111096101B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/035172 WO2019064413A1 (fr) 2017-09-28 2017-09-28 Dispositif de montage de composant

Publications (2)

Publication Number Publication Date
CN111096101A CN111096101A (zh) 2020-05-01
CN111096101B true CN111096101B (zh) 2021-06-22

Family

ID=65901080

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780094739.5A Active CN111096101B (zh) 2017-09-28 2017-09-28 元件安装装置

Country Status (5)

Country Link
US (1) US11277950B2 (fr)
JP (1) JP6831472B2 (fr)
CN (1) CN111096101B (fr)
DE (1) DE112017008107T5 (fr)
WO (1) WO2019064413A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6862567B2 (ja) * 2017-09-21 2021-04-21 株式会社Ｆｕｊｉ 装着部品保持用チャックおよび部品装着機
WO2022049875A1 (fr) * 2020-09-02 2022-03-10 パナソニックＩｐマネジメント株式会社 Système de montage, procédé de montage, et programme
KR102693683B1 (ko) * 2020-10-05 2024-08-12 야마하하쓰도키 가부시키가이샤 기판 작업 장치
JP7554105B2 (ja) * 2020-12-02 2024-09-19 ヤマハ発動機株式会社 距離認識システムおよびその制御方法、船舶

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001109879A (ja) * 1999-08-05 2001-04-20 Sony Corp 画像処理装置および方法、並びに媒体
CN104937367A (zh) * 2013-01-17 2015-09-23 赛博光学公司 用于电路板的三维成像的多照相机传感器
WO2017064776A1 (fr) * 2015-10-14 2017-04-20 ヤマハ発動機株式会社 Dispositif de montage de composants
WO2017064786A1 (fr) * 2015-10-15 2017-04-20 ヤマハ発動機株式会社 Appareil de montage de composant

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864999A (ja) 1994-08-19 1996-03-08 Shigeki Kobayashi 検査装置、三次元形状計測方法及び製品の製造方法
JP4596422B2 (ja) 2005-05-20 2010-12-08 キヤノンマシナリー株式会社 ダイボンダ用撮像装置
JP4757595B2 (ja) 2005-10-04 2011-08-24 株式会社日立ハイテクインスツルメンツ 実装部品の検査装置
GB201019537D0 (en) * 2010-11-18 2010-12-29 20X20 Vision Ltd PCB reflow inspection angled measurement
JP2014216621A (ja) 2013-04-30 2014-11-17 株式会社日立製作所 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001109879A (ja) * 1999-08-05 2001-04-20 Sony Corp 画像処理装置および方法、並びに媒体
CN104937367A (zh) * 2013-01-17 2015-09-23 赛博光学公司 用于电路板的三维成像的多照相机传感器
WO2017064776A1 (fr) * 2015-10-14 2017-04-20 ヤマハ発動機株式会社 Dispositif de montage de composants
WO2017064786A1 (fr) * 2015-10-15 2017-04-20 ヤマハ発動機株式会社 Appareil de montage de composant

Also Published As

Publication number Publication date
CN111096101A (zh) 2020-05-01
WO2019064413A1 (fr) 2019-04-04
DE112017008107T5 (de) 2020-06-25
JP6831472B2 (ja) 2021-02-17
US11277950B2 (en) 2022-03-15
JPWO2019064413A1 (ja) 2020-09-24
US20200253103A1 (en) 2020-08-06

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