CN111076389A - Heat abstractor and have its air conditioner - Google Patents
Heat abstractor and have its air conditioner Download PDFInfo
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- CN111076389A CN111076389A CN201911310856.8A CN201911310856A CN111076389A CN 111076389 A CN111076389 A CN 111076389A CN 201911310856 A CN201911310856 A CN 201911310856A CN 111076389 A CN111076389 A CN 111076389A
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- heat dissipation
- channel
- refrigerant
- dissipation substrate
- hydrophobic
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 177
- 239000003507 refrigerant Substances 0.000 claims abstract description 146
- 239000000758 substrate Substances 0.000 claims abstract description 139
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 230000000694 effects Effects 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 210000001503 joint Anatomy 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052802 copper Inorganic materials 0.000 abstract description 13
- 239000010949 copper Substances 0.000 abstract description 13
- 238000005057 refrigeration Methods 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000005457 Black-body radiation Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat sink comprises a heat dissipation substrate, a refrigerant channel for directly circulating refrigerant is arranged in the heat dissipation substrate, and at least one side surface of the heat dissipation substrate is provided with a first hydrophobic channel for guiding condensed water on the heat dissipation substrate to the bottom of the substrate and a plurality of second hydrophobic channels for guiding the condensed water on the heat dissipation substrate to the first hydrophobic channel. The first hydrophobic channel and the second hydrophobic channel are arranged in a crossed mode, and at least one intersection is formed at the acute-angle crossed portion of the first hydrophobic channel and the second hydrophobic channel. At the intersection, the connecting angle of the first drainage channel and the second drainage channel is a circular arc chamfer, and the circle center of the circular arc chamfer points to the direction opposite to the intersection. An arc surface is formed below the arc chamfer and extends from the arc chamfer to the intersection. The thermal resistance between the copper pipe and the radiating substrate is reduced when a refrigerant circulates in the copper pipe in the prior art, so that the chip can stably and safely operate at a high-efficiency radiating rate, and the risk of short circuit is greatly reduced.
Description
Technical Field
The invention relates to a heat dissipation device and an air conditioner with the same, in particular to a heat dissipation device for heat dissipation of a controller of the air conditioner, and belongs to the technical field of air conditioners.
Background
In the technical field of the existing air conditioner, a chip in the air conditioner has high running speed and large heat dissipation capacity, particularly a driving chip of the variable frequency air conditioner has large workload and large heat dissipation capacity, and a heat dissipation device is required to be arranged to dissipate heat of the chip in real time when the chip works. In the prior art, the chip of the air conditioner is mainly arranged on the controller of the air conditioner, so that a heat dissipation device needs to be arranged on the controller of the air conditioner, and at the present stage, the heat dissipated by the chip is mainly dissipated by adding fins on the controller of the air conditioner in an air cooling mode. However, in areas with high environmental temperature such as high-temperature tropical areas throughout the year, the air cooling mode cannot meet the heat dissipation requirement of the chip, and the use of the air conditioner in the high-temperature tropical areas is greatly influenced. In summer, where the average temperature is highest in the year, outdoor hot weather also causes the air cooling mode to fail to meet the requirement of heat dissipation of the controller. In recent years, copper pipes are often added to aluminum heat dissipation substrates that are in contact with controllers, and the heat of the controllers is removed by evaporation of refrigerants in the copper pipes. However, the evaporation and heat dissipation method of the refrigerant in the copper pipeline is limited to the thermal contact resistance between the copper pipe and the aluminum heat dissipation substrate, the heat dissipation requirement of the controller is difficult to meet, the temperature of the refrigerant is low, condensed water is easy to generate on the aluminum heat dissipation substrate, and the discharged condensed water is not well dredged to flow onto the controller, so that the short circuit of the high-power air conditioner controller is caused, a controller chip is burnt out, and the operation reliability and safety of the air conditioner are influenced.
In summary, the controller with the chip in the existing air conditioner adopts two heat dissipation modes of air-cooled fin heat dissipation and refrigerant heat conduction, and the air-cooled heat dissipation seriously affects the heat dissipation effect of the controller with the chip under the condition of high outdoor environment temperature. In the mode of heat conduction and heat dissipation by using the refrigerant, the temperature of the refrigerant is extremely low, condensed water is easily generated on the heat dissipation substrate, the short circuit of the chip is caused, the chip is burnt, and the stability of the air conditioner is influenced. And the thermal contact resistance between the copper pipe for circulating the refrigerant and the heat dissipation substrate is large, so that the heat dissipation of the controller is influenced.
Disclosure of Invention
In view of this, the invention provides a heat dissipation device and an air conditioner with the same, which directly guides the throttled refrigerant into the heat dissipation device, reduces the thermal contact resistance between a copper pipe where the refrigerant is located and a heat dissipation substrate in the prior art, and takes away the heat generated on a controller chip by utilizing the heat absorbed by the evaporation of the refrigerant. The heat dissipation device is not in direct contact with the controller, and the two groups of drainage channels which are arranged in a cross mode are formed on the heat dissipation substrate of the heat dissipation device, so that the condensed water on the heat dissipation device can be drained efficiently and quickly, and the condensed water is prevented from flowing into the controller of the air conditioner. The problems that the traditional air-cooled heat dissipation is poor in heat dissipation effect when the ambient temperature is high and large in thermal contact resistance exists in a refrigerant heat conduction mode are solved, and the problem that condensed water in the refrigerant heat conduction mode drips on a controller of an air conditioner due to accumulation to cause chip short circuit in the controller is solved.
Specifically, the method comprises the following steps:
the invention relates to a heat dissipation device, which comprises a heat dissipation substrate, wherein a refrigerant channel for directly circulating a refrigerant is formed in the heat dissipation substrate, and at least one side surface of the heat dissipation substrate is provided with a first hydrophobic channel for guiding condensed water on the heat dissipation substrate to the bottom of the heat dissipation substrate and a plurality of second hydrophobic channels for guiding the condensed water on the heat dissipation substrate to the first hydrophobic channel.
Further optionally, the first hydrophobic channel and the second hydrophobic channel are arranged in a crossing manner, and at least one intersection is formed at the acute-angle crossing part of the first hydrophobic channel and the second hydrophobic channel.
Further optionally, at the intersection, a connection angle between the first drainage channel and the second drainage channel is an arc chamfer, and a circle center of the arc chamfer points to a direction opposite to the intersection.
Further optionally, an arc surface is formed below the arc chamfer, and the arc surface extends from the arc chamfer to the intersection.
Further optionally, the diameter of the first hydrophobic channel
Is larger than the diameter of the second hydrophobic canal
When in use
The diameter range of the arc chamfer is 1-3 mm.
Further optionally, the heat dissipation device includes a first heat dissipation substrate and a second heat dissipation substrate; one side of the first heat dissipation substrate is provided with a channel, and one side of the second heat dissipation substrate is provided with a channel corresponding to the first heat dissipation substrate; when one side surface of the first radiating substrate provided with the channel is butted with one side surface of the second radiating substrate provided with the channel, the two channels correspondingly arranged form a refrigerant channel; the first and second hydrophobic channels are formed on the opposite surfaces of the side surfaces of the channels formed on the first and second heat dissipation substrates.
Further optionally, the first and second hydrophobic channels are formed on two opposite side surfaces of the heat dissipation substrate, and the refrigerant channel is integrally formed in the heat dissipation substrate and disposed between the two opposite side surfaces.
Further optionally, the heat dissipation device includes a first heat dissipation substrate and a second heat dissipation substrate; one side of the first heat dissipation substrate is provided with a channel, and the opposite side is provided with a first drainage channel and a second drainage channel; the first and second drainage channels are formed on one side surface of the second heat dissipation substrate, and when the other side surface opposite to the first drainage channel is in butt joint with one side surface of the first heat dissipation substrate with the channels, the channels form a refrigerant channel.
Further optionally, a plurality of refrigerant channels are arranged in the heat dissipation substrate, a total refrigerant inlet and a total refrigerant outlet are arranged in the heat dissipation substrate and are respectively connected with the refrigerant liquid inlet pipe and the refrigerant liquid outlet pipe, and each refrigerant channel is provided with a refrigerant outlet and a refrigerant inlet; each refrigerant outlet is connected to the total refrigerant outlet and each refrigerant inlet is connected to the total refrigerant inlet.
The invention also relates to an air conditioner, which adopts any heat dissipation device to dissipate heat of the controller of the air conditioner.
Further optionally, the refrigerant flowing through the heat dissipation device comes from a refrigeration system of the air conditioner, and the heat dissipation device is connected in the refrigeration system to release heat to the refrigerant, so that the effect of the evaporator is realized.
Further optionally, the air conditioner includes a controller, the heat sink is disposed around the controller and does not contact with the controller, and the heat sink cools the controller in a radiation and convection heat exchange manner.
Has the advantages that:
the invention directly guides the throttled refrigerant in the air conditioner refrigeration system into the heat dissipation substrate, reduces the thermal resistance removal between the copper pipe and the heat dissipation substrate when the refrigerant circulates in the copper pipe in the prior art, takes away heat by utilizing the latent heat of evaporation of the refrigerant, and meets the requirement of an air conditioner, particularly a variable frequency air conditioner controller chip, on rapid heat dissipation. The heat dissipation substrate in the heat dissipation device is not in contact with the controller, and the temperature is reduced in a radiation and convection heat exchange mode. The first drainage channels which are arranged in a crossed mode and guide the condensed water on the heat dissipation substrate to the bottom of the heat dissipation substrate and the second drainage channels which guide the condensed water on the heat dissipation substrate to the first drainage channels are formed on the heat dissipation substrate, the intersection of the first drainage channels and the second drainage channels is connected through the arc chamfer, and an arc surface is formed below the arc chamfer and extends to the intersection. The setting of first, second drainage canal can make the quick water conservancy diversion of the comdenstion water on heat dissipation substrate surface to heat dissipation substrate bottom, and the collection that can be better and dredging the comdenstion water of setting up of the arc surface of intersection and circular arc chamfer makes the quick discharge heat dissipation substrate of comdenstion water, and can not gather on the chip that falls the controller, avoids the short circuit of chip. The chip of the controller can stably and safely operate at a high-efficiency heat dissipation rate, the risk of short circuit of the chip is greatly reduced, and the operation safety and stability of the air conditioner controller are improved.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. The drawings described below are merely exemplary embodiments of the present disclosure, and other drawings may be derived by those skilled in the art without inventive effort.
FIG. 1 is a front view of a heat sink in an embodiment of the present invention;
FIG. 1(a) is an enlarged view of a portion of an embodiment of the present invention at the intersection of first and second hydrophobic channels;
FIG. 2 is a schematic diagram of an internal structure of a heat dissipation device according to an embodiment of the present invention;
FIG. 3 is an exploded view of the heat sink in the embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating a refrigerant flow direction of the refrigeration system according to an embodiment of the present invention;
in the figure:
a100-a heat sink; a110-total refrigerant inlet; a120-refrigerant bent pipe; a130-total refrigerant outlet; a140-first hydrophobic channel; a150-a second hydrophobic channel; a151-first unit second hydrophobic channel; a152-a second unit second hydrophobic channel; a160-channel; a161-refrigerant inlet; a162-refrigerant outlet; a170-a first heat dissipation substrate; a180-a second heat dissipation substrate; a190-the intersection of the first and second channels; a191-arc chamfering; a192-arc surface;
b100-a refrigeration system; b110-a reservoir; b120-compressor; b130-a condenser; b140-a throttling element; b150-an evaporator; b160-refrigerant regulating valve;
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and "a" and "an" generally include at least two, but do not exclude at least one, unless the context clearly dictates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.
[ example 1 ]
In a specific embodiment, the heat dissipation device may include first and second heat dissipation substrates, or may include only one heat dissipation substrate. The following briefly exemplifies the structure of the heat dissipation device, specifically:
optional first example: the heat dissipation device comprises a first heat dissipation substrate and a second heat dissipation substrate; one side of the first heat dissipation substrate is provided with a channel, and one side of the second heat dissipation substrate is provided with a channel corresponding to the first heat dissipation substrate; when one side surface of the first radiating substrate provided with the channel is butted with one side surface of the second radiating substrate provided with the channel, the two channels correspondingly arranged form a refrigerant channel; the first and second channels are formed on opposite sides of the side surface on which the channel is formed.
Optional second example: the first and second hydrophobic channels are formed on two opposite side surfaces of the radiating substrate, the refrigerant channel is integrally formed in the radiating substrate, and the refrigerant channel is arranged between the two opposite side surfaces on which the first and second hydrophobic channels are formed.
An optional third example: the heat dissipation device comprises a first heat dissipation substrate and a second heat dissipation substrate; one side of the first heat dissipation substrate is provided with a channel, and the opposite side is provided with a first and a second drainage channels. When the other side surface opposite to the first heat dissipation substrate is butted with the side surface of the first heat dissipation substrate with the channel, the opening of the channel of the first heat dissipation substrate is sealed by the side surface of the second heat dissipation substrate opposite to the side surface formed with the first and second hydrophobic channels, so that the channel of the first heat dissipation substrate forms a refrigerant channel at the moment.
In any optional example above, the heat dissipation substrate of the heat dissipation device is provided with a plurality of refrigerant channels, a total refrigerant inlet a110 and a total refrigerant outlet a130 are arranged in the heat dissipation substrate and are respectively connected with the refrigerant inlet pipe and the refrigerant outlet pipe, and each refrigerant channel is provided with a refrigerant outlet and a refrigerant inlet; each refrigerant outlet is connected to the total refrigerant outlet a130 and each refrigerant inlet is connected to the total refrigerant inlet a 110. The refrigerant comes from the refrigerating system of the air conditioner, and the heat dissipation device is connected in the refrigerating system to release heat to the refrigerant, so that the effect of the evaporator is realized. The air conditioner comprises a controller, wherein the heat dissipation device is arranged around the controller and is not in contact with the controller, and the heat dissipation device cools the controller in a radiation and convection heat exchange mode.
Specifically disclosed in this embodiment is the structure of the heat sink mentioned in the third example above. The embodiment specifically discloses a structure of a heat dissipation device, an air conditioner with the heat dissipation device, and a refrigerant flow direction of a refrigeration system of the air conditioner with the heat dissipation device. And the structure of the heat dissipation device in the embodiment has a heat dissipation effect on a controller in the air conditioner through specific formula operation. The following description will be made with specific reference to fig. 1 to 4.
Fig. 1 is a front view of a heat dissipating device according to an embodiment of the present invention, and fig. 1(a) is a partially enlarged view of a junction of first and second hydrophobic channels according to an embodiment of the present invention. Fig. 2 is a schematic diagram of an internal structure of a heat dissipation device according to an embodiment of the present invention. Fig. 3 is an exploded view of the heat dissipating device according to the embodiment of the present invention.
Referring to fig. 1 and 3, the heat dissipation device of the present embodiment has two heat dissipation substrates, namely a first heat dissipation substrate a170 and a second heat dissipation substrate a 180. The structure of the heat dissipating substrate in this embodiment will be described in detail below. As shown in fig. 1, two sets of hydrophobic channels, namely a first hydrophobic channel a140 set and a second hydrophobic channel a150 set, are disposed on one side of each of the first and second heat dissipation substrates. In this embodiment, the first hydrophobic channels a140 include a plurality of first hydrophobic channels a140, each of the first hydrophobic channels a140 is parallel to each other and parallel to the side of the heat dissipation substrate in the length direction, and each of the first hydrophobic channels a140 is perpendicular to the side of the heat dissipation substrate in the width direction.
In this embodiment, the second hydrophobic channel a150 group includes a first unit second hydrophobic channel a151 and a second unit second hydrophobic channel a152, and each of the first and second units second hydrophobic channels includes a plurality of second hydrophobic channels a 150. Each second drainage channel A150 of the first unit second drainage channels A151 is arranged in parallel, and the acute included angle with each first drainage channel A140 is a first fixed angle theta1. Each second drainage channel A150 of the second unit second drainage channels A152 is arranged in parallel, and the acute included angle with each first drainage channel A140 is a first fixed angle theta1。θ1The value of theta is not less than 50 degrees1≤70°。
As shown in fig. 1, a portion of the second hydrophobic channel a150 in the first unit second hydrophobic channel a151 intersects with a portion of the second hydrophobic channel a150 in the second unit second hydrophobic channel a152 at a middle portion of the heat dissipation substrate. The included angle of two crossed drainage channels A150 is 2 theta1。
The linear distance of the second drainage channels a150 arranged in parallel and adjacent to each other in the first unit second drainage channel a151 and the second unit second drainage channel a152 is in the range of [30mm, 40mm ].
At the intersection a190 of the first and second drainage channels, the connecting angle between the second drainage channel a150 and the first drainage channel a140 is an arc chamfer a191, and the center of the arc chamfer a191 points in the opposite direction to the intersection of the second drainage channel a150 and the first drainage channel a 140.
An arc surface A192 is formed below the arc chamfer A191, and the arc surface A192 extends from the arc chamfer A191 to the junction A190 of the first drainage channel and the second drainage channel.
The beneficial effects are that: the setting of circular arc chamfer and arc surface makes second hydrophobic ditch and first hydrophobic ditch intersection have the curved surface and is connected, and smooth arc surface more is favorable to the flow of second hydrophobic ditch and first hydrophobic ditch intersection comdenstion water, prevents that the accumulation of comdenstion water from spilling over. The condensed water formed on the surface of the heat dissipation substrate flows into the junction of the second drainage channel and the first drainage channel through the arc chamfer and the arc surface more quickly and smoothly, flows out of the heat dissipation substrate through the first drainage channel, avoids the contact between the condensed water on the surface of the heat dissipation substrate and the air conditioner controller, and avoids the short circuit of a chip in the air conditioner controller due to the inflow of the condensed water.
Diameter of the first hydrophobic channel A140
Is larger than the diameter of the second drainage channel A150
When in use
The diameter of the arc chamfer A191 is 1-3 mm.
As shown in fig. 2 and fig. 3, in the present embodiment, the plurality of channels a160 are disposed in parallel on one side surface of the second heat dissipation substrate, and a first group of drain channels a140 and a second group of drain channels a150 are formed on the opposite side surface. Each channel a160 is provided with a refrigerant outlet a162 and a refrigerant inlet a 161.
The heat sink in this embodiment includes a first heat dissipating substrate a170 and a second heat dissipating substrate a 180. When one side surface of the second heat dissipation substrate a180 is formed with the first and second hydrophobic channels, and the other opposite side surface is butted with one side surface of the first heat dissipation substrate a170 having the channels, the opening of the channel a160 of the first heat dissipation substrate a170 is sealed by the second heat dissipation substrate a180 and the side surface opposite to the side surface formed with the first and second hydrophobic channels, so that each channel a160 of the first heat dissipation substrate forms a refrigerant channel at this time.
When one side of the first heat dissipation substrate a170, on which the channels a160 are disposed, is butted with one side of the second heat dissipation substrate a180, each channel a160 forms a refrigerant channel of a heat dissipation device. The first and second hydrophobic channels are not provided on one side surface of the second heat dissipating substrate a180 that is in butt joint with the first heat dissipating substrate a170, and the first and second hydrophobic channels are provided on the other side surface opposite to the one side surface.
A refrigerant inlet A161 of a refrigerant channel formed at one end of the two radiating base plates is a total refrigerant inlet A110, and the total refrigerant inlet A110 is connected with a refrigerant outlet pipe in a refrigerating system;
a refrigerant outlet A162 of a refrigerant channel formed at the other end of the two heat dissipation substrates is a total refrigerant outlet A130, and the total refrigerant outlet A130 is connected with a refrigerant inlet pipe of a refrigeration system;
in addition, the refrigerant outlet a162 of each refrigerant channel of the heat dissipating device in the embodiment is connected to the refrigerant inlet a161 of each refrigerant channel through a refrigerant elbow a 120.
It should be noted that, in the present embodiment, the refrigerant outlet a162 and the refrigerant inlet a161 of each refrigerant channel are determined by the flow direction of the refrigerant in the refrigerant channel, in the present embodiment, a refrigerant pipeline joint is disposed at both ends of each refrigerant channel, and each refrigerant pipeline joint forms the refrigerant inlet a161 or the refrigerant outlet a162 of each refrigerant channel.
To sum up, the heat dissipation device in this embodiment includes two heat dissipation substrates and a plurality of refrigerant bent pipes a 120.
In this embodiment, the heat sink is spaced from the controller by 3mm to 7mm, and the width of the channel A160 is within 10mm to 15mm, including 10mm and 15 mm. The heat sink of the present embodiment is provided with the channel a160 through which the refrigerant can flow, and has the advantages that the refrigerant can directly flow in the heat sink substrate, and the heat is taken away by the evaporation and heat absorption of the refrigerant; the thermal contact resistance generated in the process of enabling the refrigerant to flow through the copper pipe and absorbing heat of the radiating substrate in the prior art is avoided.
Preferably, the heat dissipation substrate in this embodiment is made of copper.
As shown in fig. 4, the refrigeration system B100 includes an accumulator B110, a compressor B120, a condenser B130, a throttling element B140, an evaporator B150, and a refrigerant regulating valve B160. The direction indicated by the arrows is the direction of flow of the refrigerant in the present refrigeration system B100.
The refrigerant of the heat dissipation device a100 of the present embodiment comes from a refrigeration system B100 of an air conditioner.
In the refrigeration system B100 of the air conditioner, two parallel refrigerant flow paths are formed at the refrigerant outflow end of the throttling element B140, and an evaporator B150 is connected to one refrigerant flow path; the other refrigerant flow path is connected to a refrigerant regulating valve B160, the refrigerant outflow end of the refrigerant regulating valve B160 of the refrigeration system B100 is connected to the total refrigerant inlet a110 of the middle heat sink a100 of the refrigeration system, i.e., the refrigerant inlet a161 of a refrigerant channel at one end of the two heat dissipation substrates is connected to a refrigerant outlet pipe of the refrigeration system B100 of the air conditioner in this embodiment.
The refrigerant flowing out of the main refrigerant outlet a130 of the heat sink a100 joins the refrigerant flowing out of the evaporator B150, merges into the main refrigerant flow path of the refrigeration system, continues to flow into the reservoir B110, then flows through the compressor B120, then flows to the condenser B130, and finally flows into the refrigerant inlet of the throttling element B140, thereby completing a cycle process of the refrigerant in the refrigeration system B100.
The refrigerant regulating valve B160 may regulate the flow rate of the refrigerant flowing into the heat sink a 100.
The heat dissipation effect of the heat dissipation device in this embodiment will be further described based on theoretical analysis and related calculation.
When the temperature of the controller of the air conditioner is set to t2The heating value Q is 100W at 95 ℃, and the controller size is 100mm × 200 mm. In this embodiment, the controller is provided with a chip of the air conditioner, and the back of the controller is a plane. The above-mentioned dimensions are dimensions of the back of the controller. Refrigerant temperature is set to t1The distance delta between the chip on the controller and one heat dissipation substrate of the heat dissipation device is 3mm at 9 ℃.
ComputingCoating silicon carbide coating on the chip of the controller and the radiating substrate according to the radiation heat exchange amount between the chip and the radiating substrate, and taking the emissivity epsilon of the chip in the controller20.92, emissivity of heat-dissipating substrate ∈10.9, black body radiation constant sigma 5.67 × 10-8W/(m2·K4). Radiation heat exchange quantity between radiating substrate and chip
Calculated to obtain Q1＝52W。
Calculating the convection heat exchange amount and average temperature between the chip and the heat dissipation substrate
The physical properties of air at 52 deg.C are checked by the attached table of heat transfer science, λ is 0.028W/(m.K), ν is 19.6 × 10-6m2S, Pr 0.698, Nu 0.212 between chip and heat exchange substrate (Gr Pr)1/4Convection heat transfer coefficient between chip and heat transfer substrate
Convection heat exchange quantity Q between chip and heat exchange substrate2＝h(t2-t1) 61W. Total quantity Q of convective heat transfer between chip and heat exchange substrate3＝Q1+Q2＝113W。Q3>And Q, the heat dissipation device in the embodiment can meet the heat dissipation requirement of the chip in the controller.
And similarly, when the distance delta between the chip and the heat dissipation substrate in the controller is calculated to be 7mm, the total heat exchange quantity Q between the chip and the heat dissipation substrate in the controller3＝Q1+Q2＝99W，Q3<And Q, when the distance between the chip and the heat dissipation substrate is too close, the chip is easily damaged by the condensed water, so that the distance between the chip and the heat dissipation substrate is not less than 3mm and not more than delta and not more than 7 mm.
The included angle between the second drain channel A150 and the first drain channel A140 on the heat dissipation substrate is kept within 50-70 degrees, if the diameter of the second drain channel A150 is 3mm, the diameter of the first drain channel A140 is 5mm,
Avertical drainage channel>2AOblique drainage channelAt the moment, the condensed water can meet the requirement of a larger flow rate and can not fall off on the drainage channel.
The distance between the second drainage channels A150 is kept between 30mm and 40mm, and when the distance is smaller than 30mm, the heat exchange effect between the heat dissipation substrate and the chips in the controller is influenced; when the diameter is larger than 40mm, the number of the second drainage channels a150 is small, which is not favorable for drainage of condensed water.
When the refrigerant flows from the pipe having a small cross section into the pipe having a large cross section, it cannot be expanded abruptly but gradually according to the shape of the pipe due to inertia of the fluid. Thus, a vortex is formed between the corner of the tube wall and the main flow stream, which vortex is rotated by the main flow stream, which vortex dissipates the resulting energy into the rotational motion. Therefore, a refrigerant channel formed by the refrigerant bent pipe A120 and the channel A160 in the second radiating substrate is taken as a section 1 and a section 2, a pipe wall between the two sections is a control surface, and Bernoulli equation between the two sections is taken
By the equation of continuity v1A1＝ν2A2The above formula is rewritten into
Therefore, the width of the channel A160 is within 10 mm-15 mm, the flowing and heat exchanging effects are good, and the channel A160 and the refrigerant bent pipe A120 are connected through chamfers. The refrigerant elbow a120 is a copper pipe.
Exemplary embodiments of the present disclosure are specifically illustrated and described above. It is to be understood that the present disclosure is not limited to the precise arrangements, instrumentalities, or instrumentalities described herein; on the contrary, the disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (11)
1. A heat dissipation device, characterized in that: the heat dissipation device comprises a heat dissipation substrate, a refrigerant channel for directly circulating a refrigerant is formed in the heat dissipation substrate, and at least one side surface of the heat dissipation substrate is provided with a first hydrophobic channel for guiding condensed water on the heat dissipation substrate to the bottom of the heat dissipation substrate and a plurality of second hydrophobic channels for guiding the condensed water on the heat dissipation substrate to the first hydrophobic channel.
2. The heat dissipating device of claim 1, wherein: the first hydrophobic channel and the second hydrophobic channel are arranged in a crossed mode, and at least one intersection is formed at the acute-angle crossed portion of the first hydrophobic channel and the second hydrophobic channel.
3. The heat dissipating device of claim 2, wherein: and at the intersection, the connecting angle of the first drainage channel and the second drainage channel is an arc chamfer, and the circle center of the arc chamfer points to the direction opposite to the intersection.
4. The heat dissipating device of claim 3, wherein: an arc surface is formed below the arc chamfer and extends from the arc chamfer to the intersection.
5. The heat dissipating device of claim 4, wherein: diameter of the first hydrophobic channel
Is larger than the diameter of the second hydrophobic canal
When in use
The diameter range of the arc chamfer is 1-3 mm.
6. The heat dissipating device of any of claims 1-5, wherein: the heat dissipation device comprises a first heat dissipation substrate and a second heat dissipation substrate; one side of the first heat dissipation substrate is provided with a channel, and one side of the second heat dissipation substrate is provided with a channel corresponding to the first heat dissipation substrate; when one side surface of the first radiating substrate provided with the channel is butted with one side surface of the second radiating substrate provided with the channel, the two correspondingly arranged channels form the refrigerant channel; the first and second hydrophobic channels are formed on opposite surfaces of the side surfaces of the channel, which are formed on the first and second heat dissipation substrates.
7. The heat dissipating device of any of claims 1-5, wherein: the first and second hydrophobic channels are formed on two opposite side surfaces of the heat dissipation substrate, the refrigerant channel is integrally formed in the heat dissipation substrate, and the refrigerant channel is arranged between the two opposite side surfaces.
8. The heat dissipating device of any of claims 1-5, wherein: the heat dissipation device comprises a first heat dissipation substrate and a second heat dissipation substrate; one side surface of the first heat dissipation substrate is provided with a channel, and the opposite side surface is provided with the first and second drainage channels; the first and second drainage channels are formed on one side surface of the second heat dissipation substrate, and when the other side surface opposite to the first drainage channel is in butt joint with one side surface of the first heat dissipation substrate with the channels, the channels form the refrigerant channel.
9. The heat dissipating device of claim 6, 7 or 8, wherein: the heat dissipation substrate is provided with a plurality of refrigerant channels, a total refrigerant inlet and a total refrigerant outlet are arranged in the heat dissipation substrate and are respectively connected with a refrigerant liquid inlet pipe and a refrigerant liquid outlet pipe, and each refrigerant channel is provided with a refrigerant outlet and a refrigerant inlet; each of the refrigerant outlets is connected to the total refrigerant outlet, and each of the refrigerant inlets is connected to the total refrigerant inlet.
10. An air conditioner having the heat dissipating apparatus as set forth in claims 1 to 9, characterized in that: the refrigerant comes from a refrigerating system of the air conditioner, and the heat dissipation device is connected in the refrigerating system to release heat to the refrigerant, so that the effect of the evaporator is realized.
11. The air conditioner according to claim 10, wherein: the air conditioner comprises a controller, wherein the heat dissipation device is arranged around the controller and does not contact with the controller, and the heat dissipation device cools the controller in a radiation and convection heat exchange mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310856.8A CN111076389A (en) | 2019-12-18 | 2019-12-18 | Heat abstractor and have its air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310856.8A CN111076389A (en) | 2019-12-18 | 2019-12-18 | Heat abstractor and have its air conditioner |
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| Publication Number | Publication Date |
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| CN111076389A true CN111076389A (en) | 2020-04-28 |
Family
ID=70315692
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911310856.8A Pending CN111076389A (en) | 2019-12-18 | 2019-12-18 | Heat abstractor and have its air conditioner |
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