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CN111076104A - Refrigeration fluorescence module and laser lighting system - Google Patents

Refrigeration fluorescence module and laser lighting system Download PDF

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Publication number
CN111076104A
CN111076104A CN201911192555.XA CN201911192555A CN111076104A CN 111076104 A CN111076104 A CN 111076104A CN 201911192555 A CN201911192555 A CN 201911192555A CN 111076104 A CN111076104 A CN 111076104A
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China
Prior art keywords
fluorescent
thermoelectric conversion
substrate
refrigeration
laser
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Pending
Application number
CN201911192555.XA
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Chinese (zh)
Inventor
孙鹏
胡皓阳
肖昱琨
刘永福
蒋俊
江浩川
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Ningbo Institute of Material Technology and Engineering of CAS
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Ningbo Institute of Material Technology and Engineering of CAS
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Priority to CN201911192555.XA priority Critical patent/CN111076104A/en
Publication of CN111076104A publication Critical patent/CN111076104A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The application discloses a refrigeration fluorescent module and a laser lighting system, which comprise two insulating substrates and a plurality of thermoelectric conversion units arranged between the two insulating substrates, wherein the thermoelectric conversion units are mutually connected; one of the two insulating substrates is a fluorescent substrate. This application sets up one of two insulating substrates as the fluorescence base plate, uses a plurality of thermoelectric conversion units to conduct away the temperature that the fluorescence base plate produced by laser irradiation simultaneously and dispels the heat. Because the fluorescent substrate is directly connected with the thermoelectric conversion unit, other insulating materials are not needed in the middle for heat conduction, so that the heat conductivity is higher, the heat conduction speed is higher, the heat dissipation speed of the fluorescent substrate is accelerated, the fluorescent saturation threshold of the fluorescent substrate under laser irradiation is greatly improved, and the laser power when the fluorescent saturation occurs can be improved by 1 time. This application laser lighting system, owing to used above-mentioned refrigeration fluorescence module, laser lighting system's performance is better.

Description

Refrigeration fluorescence module and laser lighting system
Technical Field
The application relates to a refrigeration fluorescence module and a laser lighting system, and belongs to the technical field of laser lighting.
Background
The conventional laser lighting system mainly uses blue light to excite the fluorescent material of the fluorescent module to obtain yellow converted light, and then combines the yellow light and the blue light to obtain white light. However, when the device is in operation, because the laser power density is too high, and the fluorescent material cannot completely absorb the laser for light conversion, the unconverted laser is released in a thermal form, so that the local temperature of the irradiated fluorescent material exceeds 150 ℃ in a short time, temperature quenching is caused, fluorescence saturation is caused, and the performance of the device is greatly reduced.
In a conventional fluorescent module, in order to increase a fluorescence saturation threshold of a fluorescent material, a heat sink or a heat dissipation substrate is generally mounted on the fluorescent material to reduce a temperature of the fluorescent material. However, as the temperature of the fluorescent material is increased, the heat conduction of the heat sink is slow, which causes the temperature of the heat sink to increase rapidly, so that the effect of increasing the saturation threshold of the fluorescence is limited.
Disclosure of Invention
The invention aims to provide a refrigerating fluorescent module to solve the technical problem that the fluorescent saturation threshold is low due to slow heat conduction of a heat dissipation device in the conventional fluorescent module. Meanwhile, the invention also provides a laser lighting system using the refrigeration fluorescent module.
The invention provides a refrigeration fluorescent module, comprising: the thermoelectric conversion module comprises two insulating substrates and a plurality of thermoelectric conversion units arranged between the two insulating substrates, wherein the thermoelectric conversion units are mutually connected;
one of the two insulating substrates is a fluorescent substrate.
Preferably, the other of the two insulating substrates is a ceramic substrate, a metal substrate with an insulating layer, or a fluorescent substrate.
Preferably, the material of the fluorescent substrate is one of a fluorescent crystal, a fluorescent ceramic, a fluorescent glass or a fluorescent thin film.
Preferably, the material system of the fluorescent substrate is one or more of aluminate, silicate, nitride and oxynitride.
Preferably, the thermoelectric conversion unit includes a P-type semiconductor, an N-type semiconductor, a first current guide plate, and two second current guide plates;
one end of the P-type semiconductor is connected with one end of the N-type semiconductor through a first flow deflector;
the other end of the P-type semiconductor and the other end of the N-type semiconductor are respectively provided with a second flow deflector;
the second guide vanes are used to connect different types of semiconductors of two adjacent thermoelectric conversion units.
Preferably, a plurality of the thermoelectric conversion units are disposed between the two insulating substrates in a uniform or non-uniform manner.
The invention also discloses a laser lighting system using the refrigeration fluorescent module, which comprises: the laser light source and the refrigeration fluorescent module; the refrigeration fluorescent module is arranged on a transmission path of the laser light source, and the refrigeration fluorescent module is applied to the laser lighting system in a reflection mode.
Preferably, the emission peak of the laser light source is 200nm to 800 nm.
Compared with the prior art, the refrigeration fluorescent module and the laser lighting system have the following beneficial effects:
one of the two insulating substrates is set as a fluorescent substrate, and the temperature generated by laser irradiation of the fluorescent substrate is conducted out for heat dissipation by using the plurality of thermoelectric conversion units. Because the fluorescent substrate is directly connected with the thermoelectric conversion unit, other insulating materials are not needed in the middle for heat conduction, so that the heat conductivity is higher, the heat conduction speed is higher, the heat dissipation speed of the fluorescent substrate is accelerated, the fluorescent saturation threshold of the fluorescent substrate under laser irradiation is greatly improved, the laser power when the fluorescent saturation occurs can be improved by more than 1 time, and the performance of a laser lighting system is improved.
The invention aims to make the thermal conductivity higher and increase the heat radiation speed of the fluorescent substrate by using one of the two insulating substrates as the fluorescent substrate and the other one as the ceramic substrate or the metal substrate with the insulating layer.
The material of the fluorescent substrate is one of fluorescent crystal, fluorescent ceramic, fluorescent glass or fluorescent film, so that the fluorescent substrate has the advantages of high heat resistance and high thermal conductivity.
The material system of the fluorescent substrate is one or more of aluminate, silicate, nitride and oxynitride. The LED light source can provide different wave band light emitting requirements, and can also obtain wider emission wave bands through combination to realize full spectrum emission.
The invention can also set the two insulating substrates as the fluorescent substrates, so that both surfaces of the fluorescent substrates can receive laser irradiation, thereby realizing application diversification.
The thermoelectric conversion unit of the invention uses P-type and N-type semiconductor thermoelectric materials to combine into a P-N junction, and utilizes the thermoelectric conversion principle to accelerate the heat dissipation speed of the fluorescent substrate.
Because the temperature of the irradiation center is higher than the temperature of the periphery when the fluorescent substrate is irradiated by laser, more thermoelectric conversion units can be reasonably arranged according to the temperature distribution of the irradiation center in order to accelerate heat dissipation and avoid the fragmentation of the fluorescent substrate, so that the temperature gradient between the irradiation center and the periphery is reduced and the fragmentation of the fluorescent substrate is avoided.
According to the laser lighting system, due to the adoption of the refrigeration fluorescent module, the laser power is improved by more than 1 time when the fluorescence saturation occurs, and the performance of the laser lighting system is better.
Drawings
FIG. 1 is a schematic view of a refrigeration fluorescent module according to the present invention.
List of parts and reference numerals:
1. an insulating substrate; 2. a P-type semiconductor; 3. an N-type semiconductor; 4. a first guide vane; 5. a second guide vane; 6. and (4) conducting wires.
Detailed Description
The present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.
Referring to fig. 1, the present embodiment provides a refrigerating fluorescent module, including: two insulating substrates 1 and a plurality of thermoelectric conversion units disposed between the two insulating substrates 1, the plurality of thermoelectric conversion units being connected to each other;
one of the two insulating substrates 1 is a fluorescent substrate.
In this embodiment, one of the insulating substrates 1 is set as a fluorescent substrate, and the temperature of the fluorescent substrate generated by laser irradiation is conducted away by using a plurality of thermoelectric conversion units to dissipate heat. The thermoelectric conversion unit is connected to a power supply through a wire 6. Because the fluorescent substrate is directly connected with the thermoelectric conversion unit, other insulating materials are not needed in the middle for heat conduction, so that the heat conductivity is higher, the heat conduction speed is higher, the heat dissipation speed of the fluorescent substrate is accelerated, the fluorescent saturation threshold of the fluorescent substrate under laser irradiation is greatly improved, and the laser power when the fluorescent saturation occurs can be improved by 1 time.
In order to further increase the heat dissipation speed, one of the two insulating substrates 1 is provided as a ceramic substrate or a metal substrate with an insulating layer attached thereto. The thermoelectric conversion unit quickly transfers the heat of the fluorescent substrate to the ceramic substrate or the metal substrate with the insulating layer for heat dissipation, and the heat dissipation speed is greatly increased due to the use of the ceramic substrate or the metal substrate with the insulating layer.
In order to make the thermal conductivity of the fluorescent layer itself better, the material of the fluorescent substrate is one of a fluorescent crystal, a fluorescent ceramic, a fluorescent glass or a fluorescent film. The materials have the advantages of high heat resistance and high thermal conductivity.
In order to widen the application range of the refrigeration fluorescent module, the material system of the fluorescent substrate of the embodiment is one or more of aluminate, silicate, nitride, and oxynitride. The LED light source can provide different wave band light emitting requirements, and can also obtain wider emission wave bands through combination to realize full spectrum emission.
In order to improve the practicability, the present embodiment sets both the two insulating substrates 1 as fluorescent substrates so that both sides thereof can receive laser irradiation.
In order to improve the conversion efficiency of the thermoelectric conversion unit and increase the heat dissipation speed of the fluorescent substrate, the thermoelectric conversion unit of the embodiment includes a P-type semiconductor 2, an N-type semiconductor 3, a first flow deflector 4 and two second flow deflectors 5; one end of the P-type semiconductor 2 is connected with one end of the N-type semiconductor 3 through a first flow deflector 4; the other end of the P-type semiconductor 2 and the other end of the N-type semiconductor 3 are respectively provided with a second flow deflector 5; the second flow deflectors 5 are used to connect different types of semiconductors of two adjacent thermoelectric conversion units. Preferably, the first guide vane 4 and the second guide vane 5 both have copper guide vanes. The invention uses the P-type semiconductor 2 and the N-type semiconductor 3 to be combined into the P-N junction semiconductor, so that the conversion efficiency is higher, and the heat dissipation speed of the fluorescent substrate is accelerated.
Because the temperature of the irradiation center is higher than that of the periphery of the fluorescent substrate when the fluorescent substrate is irradiated by laser, in order to accelerate heat dissipation and avoid the fragmentation of the fluorescent substrate, in the embodiment, a plurality of thermoelectric conversion units are arranged between two insulating substrates 1 in a non-uniform mode, more thermoelectric conversion units can be arranged at the irradiation center according to actual conditions, and the number of thermoelectric conversion units is gradually reduced at the periphery of the irradiation center, so that the temperature gradient between the irradiation center and the periphery is reduced, and the fragmentation of the fluorescent substrate is avoided. Of course, a plurality of thermoelectric conversion units may be disposed between the two insulating substrates 1 in a uniform manner.
The embodiment also discloses a laser lighting system, which comprises a laser light source and the refrigeration fluorescent module; the refrigeration fluorescent module is arranged on a transmission path of the laser light source and is applied to the laser lighting system in a reflection mode. Wherein the emission peak of the laser light source is set to 200nm to 800 nm.
Below, will combine specific experiment to verify the effect of this application refrigeration fluorescence module.
Example 1
YAG to Ce is selected3+The fluorescent crystal is used as a fluorescent substrate, the other insulating substrate is an alumina ceramic substrate, 127 thermoelectric conversion units are used, each thermoelectric conversion unit comprises a P-N junction semiconductor, and the refrigerating fluorescent module is manufactured after assembly. A9 v, 3A power supply was applied to the fluorescent module, and the laser source was a 455nm laser diode. The maximum luminous flux of the refrigeration fluorescent module can reach 1500lm, and compared with the existing structure which only uses a fluorescent layer and a heat dissipation device for external connection, the fluorescent saturation threshold value is improved by nearly two times.
Example 2
Selecting LuAG: Ce3+The fluorescent glass is used as a fluorescent substrate, the other insulating substrate is a copper radiator, 80 thermoelectric conversion units are used, each thermoelectric conversion unit comprises a P-N junction semiconductor, the thermoelectric conversion units are connected through heat-conducting silicone grease and fixedly assembled through high-temperature glue, and the refrigerating fluorescent module is manufactured after assembly. And 3v and 3A power supplies are applied to the fluorescent module, and a laser light source is a laser diode with the wavelength of 450 nm. The maximum luminous flux of the refrigeration fluorescent module can reach 600lm, and the fluorescent saturation threshold is improved by 1.3 times compared with the existing structure which only uses a fluorescent layer and a heat dissipation device for external connection.
Example 3
Selecting LMAS: Ce3+The fluorescent ceramic is used as a fluorescent substrate, the other insulating substrate is an alumina ceramic substrate, 100 thermoelectric conversion units are used, each thermoelectric conversion unit comprises a P-N junction semiconductor, in order to further increase the heat dissipation effect, the output end of each thermoelectric conversion unit is connected with a copper radiator, and the copper radiator is also connected with a fan. The ratio of the arrangement number of the thermoelectric conversion units in the laser irradiation center to the arrangement number of the thermoelectric conversion units around the laser irradiation center is 2:1, and the refrigeration fluorescent module is manufactured after assembly. A9 v, 3A power supply is applied to the fluorescent module, and a laser light source is a 460nm laser diode. The maximum luminous flux of the refrigeration fluorescent module can reach 3000lm, and the fluorescence saturation threshold value is relative to the prior artIn the prior art, the structure that the fluorescent layer and the heat dissipation device are only used for external connection is improved by more than 3 times.
Example 4
A silicate fluorescent film is selected as a fluorescent substrate, an alumina ceramic substrate is selected as another insulating substrate, 50 thermoelectric conversion units are used, each thermoelectric conversion unit comprises a P-N junction semiconductor, and the refrigerating fluorescent module is manufactured after assembly. A power supply of 6v and 2A is applied to the fluorescent module, and a laser light source is a 254nm laser diode. The maximum luminous flux of the refrigeration fluorescent module can reach 500lm, and compared with a structure in the prior art that only a fluorescent layer and a heat dissipation device are used for external connection, the fluorescent saturation threshold is improved by more than 1 time.
Although the present application has been described with reference to a few embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application as defined by the appended claims.

Claims (8)

1.一种制冷荧光模组，其特征在于，包括：两个绝缘基板及设置于两个绝缘基板之间的多个热电转换单元，多个所述热电转换单元相互连接；1. A refrigeration fluorescent module, characterized in that it comprises: two insulating substrates and a plurality of thermoelectric conversion units arranged between the two insulating substrates, and a plurality of the thermoelectric conversion units are connected to each other; 两个所述绝缘基板中其中一个绝缘基板为荧光基板。One of the two insulating substrates is a fluorescent substrate. 2.根据权利要求1所述的制冷荧光模组，其特征在于，两个所述绝缘基板中另一个绝缘基板为陶瓷基板、附有绝缘层的金属基板或者荧光基板。2 . The refrigeration fluorescent module according to claim 1 , wherein the other insulating substrate among the two insulating substrates is a ceramic substrate, a metal substrate with an insulating layer, or a fluorescent substrate. 3 . 3.根据权利要求1所述的制冷荧光模组，其特征在于，所述荧光基板的材质为荧光晶体、荧光陶瓷、荧光玻璃或荧光薄膜中的一种。3 . The refrigeration fluorescent module according to claim 1 , wherein the material of the fluorescent substrate is one of fluorescent crystal, fluorescent ceramic, fluorescent glass or fluorescent film. 4 . 4.根据权利要求1所述的制冷荧光模组，其特征在于，所述荧光基板的材料体系为铝酸盐、硅酸盐、氮化物、氮氧化物中的一种或多种。4 . The refrigeration fluorescent module according to claim 1 , wherein the material system of the fluorescent substrate is one or more of aluminate, silicate, nitride, and oxynitride. 5 . 5.根据权利要求1所述的制冷荧光模组，其特征在于，所述热电转换单元包括P型半导体、N型半导体、第一导流片及两个第二导流片；5. The refrigerated fluorescent module according to claim 1, wherein the thermoelectric conversion unit comprises a P-type semiconductor, an N-type semiconductor, a first guide fin and two second guide fins; 所述P型半导体的一端通过第一导流片与所述N型半导体的一端连接；One end of the P-type semiconductor is connected to one end of the N-type semiconductor through a first guide plate; 所述P型半导体的另一端和N型半导体的另一端分别设置第二导流片；The other end of the P-type semiconductor and the other end of the N-type semiconductor are respectively provided with second guide plates; 所述第二导流片用于连接两个相邻的热电转换单元的不同类型的半导体。The second guide plate is used for connecting different types of semiconductors of two adjacent thermoelectric conversion units. 6.根据权利要求1或5所述的制冷荧光模组，其特征在于，多个所述热电转换单元以均匀或非均匀形式设置于两个所述绝缘基板之间。6 . The refrigerated fluorescent module according to claim 1 or 5 , wherein a plurality of the thermoelectric conversion units are arranged between the two insulating substrates in a uniform or non-uniform form. 7 . 7.一种激光照明系统，其特征在于，包括：激光光源和权利要求1～6任一项所述的制冷荧光模组；所述制冷荧光模组设置于所述激光光源的传输路径上。7 . A laser lighting system, comprising: a laser light source and the refrigerated fluorescent module according to any one of claims 1 to 6 ; the refrigerated fluorescent module is arranged on a transmission path of the laser light source. 8 . 8.根据权利要求7所述的激光照明系统，其特征在于，所述激光光源的发射峰值为200nm～800nm。8 . The laser illumination system according to claim 7 , wherein the emission peak of the laser light source is 200 nm˜800 nm. 9 .
CN201911192555.XA 2019-11-28 2019-11-28 Refrigeration fluorescence module and laser lighting system Pending CN111076104A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1873973A (en) * 2006-06-19 2006-12-06 朱建钦 Envelope for luminous elements of semiconductor in large power
CN101471337A (en) * 2007-12-28 2009-07-01 富士迈半导体精密工业（上海）有限公司 Light source die set with good radiating performance
CN103647017A (en) * 2013-12-17 2014-03-19 江西纳米克热电电子股份有限公司 Million-times hot and cold impact resistance thermoelectricity semiconductor refrigeration/heating device and manufacturing method thereof
JP2018142414A (en) * 2017-02-27 2018-09-13 株式会社小糸製作所 Light source device
CN109282519A (en) * 2018-11-18 2019-01-29 陈俞任 Heat transmits reversible mini thermoelectric heat refrigerator
CN109437900A (en) * 2018-12-12 2019-03-08 中国科学院宁波材料技术与工程研究所 A kind of fluorescence ceramics block, preparation method and its application in laser lighting

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1873973A (en) * 2006-06-19 2006-12-06 朱建钦 Envelope for luminous elements of semiconductor in large power
CN101471337A (en) * 2007-12-28 2009-07-01 富士迈半导体精密工业（上海）有限公司 Light source die set with good radiating performance
CN103647017A (en) * 2013-12-17 2014-03-19 江西纳米克热电电子股份有限公司 Million-times hot and cold impact resistance thermoelectricity semiconductor refrigeration/heating device and manufacturing method thereof
JP2018142414A (en) * 2017-02-27 2018-09-13 株式会社小糸製作所 Light source device
CN109282519A (en) * 2018-11-18 2019-01-29 陈俞任 Heat transmits reversible mini thermoelectric heat refrigerator
CN109437900A (en) * 2018-12-12 2019-03-08 中国科学院宁波材料技术与工程研究所 A kind of fluorescence ceramics block, preparation method and its application in laser lighting

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Application publication date: 20200428