CN111074238A - Leveling device, leveling method and semiconductor processing equipment - Google Patents
Leveling device, leveling method and semiconductor processing equipment Download PDFInfo
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- CN111074238A CN111074238A CN201811215894.0A CN201811215894A CN111074238A CN 111074238 A CN111074238 A CN 111074238A CN 201811215894 A CN201811215894 A CN 201811215894A CN 111074238 A CN111074238 A CN 111074238A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000009434 installation Methods 0.000 claims abstract description 35
- 238000003825 pressing Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 abstract description 13
- 238000010030 laminating Methods 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 14
- 239000010408 film Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a leveling device, a leveling method thereof and semiconductor processing equipment. The leveling device is used for adjusting the parallelism and the coaxiality of the base relative to the cavity and comprises a leveling tool, wherein the leveling tool comprises a horizontal mounting part, a vertical mounting part and a vertical connecting part for connecting the horizontal mounting part and the vertical mounting part; wherein, the lower surface of horizontal installation department is used for laminating with the upper surface of cavity, and the lower surface of vertical installation department laminates with support piece's installation face to make the depth of parallelism of base and cavity satisfy preset requirement, vertical connecting portion run through in the mounting hole of cavity, and the periphery wall of vertical connecting portion cooperatees with the internal perisporium of mounting hole, makes the axiality of base and cavity satisfy preset requirement. The leveling tool is adopted to level and adjust the base and the cavity, so that the process of leveling and adjusting the base can be greatly simplified, the mounting precision of the base can be greatly improved, the film forming uniformity can be effectively ensured, and the process yield is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a leveling device and a leveling method and semiconductor processing equipment.
Background
In general, in the semiconductor industry, feature sizes and aspect ratios are becoming more challenging as the geometries of electronic devices continue to decrease and the density of devices continues to increase. Atomic Layer Deposition (ALD) is a new thin film deposition method proposed to meet this challenge. Atomic layer deposition has the advantages of precise and controllable thickness of thin film growth, excellent conformality, controllable components and the like due to a unique self-limiting growth mode, and is more and more concerned by scientific workers all over the world.
In general, ALD equipment is used for placing substrates on bases made of different materials in a reaction chamber, and the bases are generally fixed in a lifting mechanism, and a motor drives a screw rod and other transmission mechanisms to control the process position of the bases; after the substrate is placed on the upper surface of the base by the manipulator, the film forming process can be carried out after the environment of the cavity is controlled. However, the positional accuracy of the susceptor directly affects the quality of film formation.
In the related art, in order to level and adjust the base, the base is generally fixed on a lifting base, and then the base is mounted on a set of relatively complex leveling mechanism of a lifting frame to operate. The leveling mechanism is complex, the technical requirements for installation and operation are high, the installation efficiency is influenced, and different personnel are different in operation and installation effects, so that the quality is difficult to ensure.
Disclosure of Invention
The invention aims to at least solve one technical problem in the prior art, and provides a leveling device, a leveling method and semiconductor processing equipment.
In order to achieve the above object, a first aspect of the present invention provides a leveling device for adjusting parallelism and coaxiality of a base with respect to a chamber, the leveling device including a leveling tool, the leveling tool including a horizontal mounting portion, a vertical mounting portion, and a vertical connecting portion connecting the horizontal mounting portion and the vertical mounting portion; wherein,
the lower surface of the horizontal mounting part is used for being attached to the upper surface of the cavity, and the lower surface of the vertical mounting part is used for being attached to the mounting surface of the supporting piece for supporting the base, so that the parallelism between the base and the cavity meets the preset requirement;
the vertical connecting portion penetrates through the mounting hole of the cavity, and the outer peripheral wall of the vertical connecting portion is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the base and the cavity meets the preset requirement.
Optionally, the vertical installation portion includes with the first installation portion that vertical connection portion connects and certainly the second installation portion that the outside extension of first installation portion formed, the lower surface of second installation portion with support piece's installation face is laminated mutually.
Optionally, leveling device still includes clamping ring and fastener, the clamping ring superpose is in the upper surface of second installation department, the fastener passes in proper order the clamping ring the second installation department extremely in the support piece, so that the lower surface of second installation department with the installation face of support piece is laminated mutually.
Optionally, the leveling device further comprises a frame and at least one locking assembly, and the frame is fixed on the lower surface of the chamber through the locking assembly.
Optionally, the locking assembly comprises a stud, a nut and a fastening screw; wherein,
one end of the stud bolt is connected with the lower surface of the cavity, and the other end of the stud bolt is fixed on the rack through the nut;
the fastening screw is positioned on one side of the stud bolt, and the fastening screw penetrates through the machine frame to the cavity.
Optionally, the locking assembly comprises a stud and two locking nuts; wherein,
one end of the stud bolt penetrates through the rack to the cavity, and the other end of the stud bolt extends out of the rack;
the two locking nuts are respectively screwed on the parts, located on the two sides of the rack, of the double-ended stud.
Optionally, the flatness of the lower surface of the horizontal mounting part and the upper surface of the chamber is less than 0.1 mm; and/or the parallelism between the lower surface of the vertical mounting part and the lower surface of the horizontal mounting part is less than 0.2 mm; and/or the size of the vertical connecting part is smaller than that of the mounting hole by 0.1-0.5 mm.
In a second aspect of the present invention, there is provided a method for leveling a base, using the leveling device described above, the method comprising:
step S110, adjusting the parallelism and the coaxiality of the base relative to the cavity by using the leveling tool so that the parallelism and the coaxiality of the base and the cavity meet preset requirements;
and S120, enabling the base to penetrate through the mounting hole to abut against the mounting surface of the support piece, and leveling the base.
Optionally, step S110 specifically includes:
the vertical connecting part penetrates through a mounting hole of the cavity, and the outer peripheral wall of the vertical connecting part is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the base and the cavity meets a preset requirement;
the lower surface of horizontal installation department laminates with the upper surface of cavity mutually, the lower surface of vertical installation department with support piece's installation face laminates mutually, so that the base with the depth of parallelism of cavity satisfies the preset requirement.
In a third aspect of the present invention, there is provided a semiconductor processing apparatus comprising the leveling device described above.
The invention provides a leveling device, a leveling method and semiconductor processing equipment. The leveling tool comprises a horizontal mounting part, a vertical mounting part and a vertical connecting part for connecting the horizontal mounting part and the vertical mounting part; wherein, the lower surface of horizontal installation department is used for laminating with the upper surface of cavity, the lower surface of vertical installation department with support piece's installation face laminating, so that the base with the depth of parallelism of cavity satisfies the requirement of predetermineeing, vertical connecting portion run through in the mounting hole of cavity, the periphery wall of vertical connecting portion with the internal perisporium of mounting hole cooperatees, so that the base satisfies the requirement of predetermineeing with the axiality of cavity. The leveling tool is adopted to level and adjust the base and the cavity, so that the process of leveling and adjusting the base can be greatly simplified, the mounting precision of the base can be greatly improved, the film forming uniformity can be effectively ensured, and the process yield is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a leveling device according to a first embodiment of the present invention;
FIG. 2 is a schematic view of the arrangement of the locking assembly on the frame in a second embodiment of the present invention;
FIG. 3 is a schematic structural view of a locking assembly in a third embodiment of the present invention;
FIG. 4 is a flow chart of a method for leveling a base according to a fourth embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1, a first aspect of the present invention relates to a leveling device 100 for adjusting the parallelism and coaxiality of a base with respect to a chamber 210. The leveling device 100 includes a leveling tool 110. The leveling tool 110 includes a horizontal mounting portion 111, a vertical mounting portion 112, and a vertical connecting portion 113 connecting the horizontal mounting portion 111 and the vertical mounting portion 112.
As shown in fig. 1, the lower surface 111a of the horizontal mounting portion 111 is adapted to be attached to the upper surface 211 of the chamber 210. The lower surface 112a of the vertical mounting portion 112 is adapted to be fitted to a mounting surface 221 of the supporter 220 supporting the base. In this way, the parallelism of the mounting surface 221 of the supporter 220 and the upper surface 211 of the chamber 210 may satisfy a preset requirement, and thus, when the base is placed on the mounting surface 221 of the supporter 220, the parallelism of the base and the chamber 210 may satisfy the preset requirement.
As shown in fig. 1, the vertical connecting portion 113 penetrates through the mounting hole 212 of the cavity 210, and an outer circumferential wall 113a of the vertical connecting portion 113 is matched with an inner circumferential wall 212a of the mounting hole 212, for example, a clearance fit may be adopted between the two, so that the coaxiality of the leveling tool 110 and the mounting hole 212 (i.e., the coaxiality of the center of the cavity 210) can meet a preset requirement, and thus when the base is placed on the support 220 through the mounting hole 212, the base can meet the coaxiality requirement with respect to the cavity 210.
The leveling tool 110 is used to level a substrate (not shown) before loading the substrate onto the chamber 210 (the substrate is substantially similar to the leveling tool 110). Specifically, the leveling tool 110 passes through the mounting hole 212, such that the lower surface 112a of the vertical mounting portion 112 is attached to the mounting surface 221 of the supporting member 220, and the lower surface 111a of the horizontal mounting portion 111 is attached to the upper surface 211 of the cavity 210. The leveling tool 110 and the cavity 210 are machined parts, and flatness and coaxiality of the leveling tool 110 relative to the cavity 210 can be well guaranteed through reasonable arrangement of tolerance matching. Then, the leveling tool 110 can be separated from the supporting piece 220 and the chamber 210, and finally, the base passes through the mounting hole 212 and is placed on the mounting surface 221 of the supporting piece 220, so that the mounting accuracy requirement of the base can be effectively guaranteed, and the base and the chamber 210 can meet the requirements of coaxiality and parallelism.
In the leveling device 100 in this embodiment, the leveling tool 110 is used to level and align the coaxiality and the parallelism of the base and the chamber 210, so that the process of leveling and aligning the base can be greatly simplified, and the mounting accuracy of the base can be greatly improved, thereby effectively ensuring the uniformity of film formation and improving the process yield.
As shown in fig. 1, in order to facilitate effective fixing of the vertical mounting part 112 to the supporting member 220, the vertical mounting part 112 includes a first mounting part 112b connected to the vertical connecting part 113 and a second mounting part 112c formed to extend outward from the first mounting part 112 b. In this way, the second mounting portion 112c is fixedly connected to the supporting member 220, so that the lower surface of the second mounting portion 112c (i.e., the lower surface 112a of the vertical mounting portion 112) can be attached to the mounting surface 221 of the supporting member 220.
Specifically, as shown in fig. 1, the leveling device 100 further includes a pressing ring 120 and a fastener 130 (the fastener 130 may be a threaded member such as a fastening screw in general). The pressing ring 120 is stacked on the upper surface of the second mounting portion 112c, and the fastening member 130 sequentially penetrates through the pressing ring 120 and the second mounting portion 112c into the supporting member 220, so that the lower surface of the second mounting portion 112c can be attached to the mounting surface 221 of the supporting member 220. Of course, besides the clamping ring 120 and the fastening member 130, which can be used to fixedly connect the vertical mounting portion 112 and the supporting member 220, other fastening structures can be used, for example, only fastening screws or the like can be provided.
As shown in fig. 1, the leveling device 100 further includes a frame 140 and at least one locking assembly 150, and the frame 140 is fixed to the lower surface of the chamber 210 by the locking assembly 150.
Specifically, as shown in fig. 1 and 2, the locking assembly 150 includes a stud bolt 151, a nut 152, and a fastening screw 153. Wherein, one end of the stud 151 is connected with the lower surface of the chamber 210, the other end is fixed on the frame 140 through the nut 152 (a gasket may also be installed between the nut 152 and the frame 140), the fastening screw 153 is located at one side of the stud 151, and the fastening screw 153 passes through the frame 140 into the chamber 210.
As shown in fig. 2, the leveling device 100 may include three locking assemblies 150, and the three locking assemblies 150 may be distributed on the frame 140 in a right triangle, however, the three locking assemblies 150 may be distributed on the frame 140 in other distribution manners, such as an equilateral triangle, etc.,
additionally, as shown in FIG. 3, the locking assembly 150 may also include a stud 154 and two lock nuts 155. One end of the stud 154 passes through the housing 140 into the chamber 210 and the other end of the stud 154 extends outside the housing 140. Two lock nuts 155 are screwed to portions of the stud 154 on both sides of the frame 140.
Generally, the angle between the upper plane of the base and the reference plane is required to be less than or equal to +/-0.05 degrees, and the coaxiality deviation between the base and the center of the chamber is less than 1.5mm, so that the use requirement can be met; in combination with the processing requirements commonly used for semiconductor devices, the flatness between the lower surface 111a of the horizontal mounting portion 111 and the upper surface 211 of the chamber 210 is less than 0.1mm, the parallelism between the lower surface 112a of the vertical mounting portion 112 and the lower surface 111a of the horizontal mounting portion 111 is less than 0.2mm, and the size range of the vertical connecting portion 113 is smaller than the size range of the mounting hole 212 by 0.1-0.5 mm. Therefore, the mounting precision requirement of the base can be effectively met, the film forming yield can be effectively improved, and the economic benefit is improved.
As shown in fig. 1, in order to further improve the installation efficiency of the base, the leveling device 100 further includes a driving mechanism 160, and the driving mechanism 160 is connected to the supporting member 220 to drive the supporting member 220 to move up and down. Thus, the driving mechanism 160 can be used to drive the supporting member 220 to move, so as to ensure the leveling and centering of the supporting member 220 when the supporting member 220 is at the lowest position (the lowest position means that the base does not descend when mounted on the supporting member 220, but only ascends along the current position), that is, the initial mounting position of the base is the lowest position, and generally, the height of the leveling tool 110 can be determined according to the height of the mounting surface 221 of the supporting member 220 from the upper surface 211 of the chamber 210 when the supporting member 220 is at the lowest position, so that the process of repeatedly adjusting the height of the base after the initial mounting of the base can be omitted, and the mounting efficiency and the mounting quality can be improved.
Of course, instead of using the driving mechanism 160 to drive the supporting member 220 to move, the supporting member 220 may be driven to move manually, and so on.
Specifically, as shown in fig. 1, the driving mechanism 160 includes a driving motor 161, a guide rail 162, and a lead screw (not shown). Wherein, the lead screw is respectively connected with the output shaft of the driving motor 161 and the support member 220, and the lead screw can move along the guide rail 162 under the driving of the driving motor 161 to drive the support member 220 to lift.
Of course, the driving mechanism 160 may be other driving mechanisms besides the above-mentioned structure, for example, the driving mechanism may be a driving motor + a gear transmission mechanism, a driving motor + a slider-crank mechanism, and so on.
In a second aspect of the present invention, as shown in fig. 4, a method S100 for leveling a base is provided, where the leveling device described above is adopted, and the specific content of the leveling device may refer to the related description above, which is not described herein again, and the leveling method S100 includes:
step S110, adjusting the parallelism and the coaxiality of the base relative to the cavity by using a leveling tool so that the parallelism and the coaxiality of the base and the cavity meet preset requirements and the coaxiality of the base and the cavity meet the preset requirements;
and step S120, enabling the base to penetrate through the mounting hole to abut against the mounting surface of the support piece, and leveling the base.
In the leveling method for the base in the embodiment, the leveling tool is adopted to level and adjust the parallelism and the coaxiality of the base relative to the cavity, so that the process of leveling and adjusting the base can be greatly simplified, the mounting precision of the base can be greatly improved, the film forming uniformity can be effectively ensured, and the process yield is improved.
Specifically, referring to fig. 1, the leveling tool 110 passes through the mounting hole 212 and is fixed to the supporting member 220 through the pressing ring 120 and the fastening member 130, and at this time, the stud 151 and the fastening screw 153 are in a non-locking state, that is, the leveling tool 110, the frame 140, and the supporting member 220 form a freely movable whole; under the action of gravity, the lower surface 111a of the horizontal mounting portion 111 of the leveling tool 110 is attached to the upper surface 211 of the cavity 210, and meanwhile, the outer surface 113a of the vertical connecting portion 113 forms a small clearance fit with the mounting hole 212. Thus, the support member 22 and the chamber 210 can be effectively ensured to have good parallelism and coaxiality under the guarantee of better machining precision of the leveling tool 110.
Then, the adjusted position of the frame 140 is locked by the locking assembly 150 formed by the three sets of fastening screws 153 and the studs 151 distributed at different positions on the frame 140, and the position of the supporting member 220 meeting the requirements of parallelism and coaxiality is also locked.
Finally, only the leveling tool 110, the pressing ring 120 and the fastener 130 need to be detached, the base is placed on the supporting piece 220, and the pressing ring 120 and the fastener 130 are used again for fastening; thus, the installation and position adjustment of the base are completed without other operations.
In a third aspect of the present invention, there is provided a semiconductor processing apparatus (not shown) comprising the leveling device described above.
In the embodiment, the semiconductor processing equipment is provided with the leveling device, and the leveling tool is adopted to level and adjust the parallelism and the coaxiality of the base relative to the cavity, so that the process of leveling and adjusting the base can be greatly simplified, the mounting precision of the base can be greatly improved, the film forming uniformity can be effectively ensured, and the process yield can be improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A leveling device is used for adjusting the parallelism and the coaxiality of a base relative to a cavity and is characterized by comprising a leveling tool, wherein the leveling tool comprises a horizontal installation part, a vertical installation part and a vertical connection part for connecting the horizontal installation part and the vertical installation part; wherein,
the lower surface of the horizontal mounting part is used for being attached to the upper surface of the cavity, and the lower surface of the vertical mounting part is used for being attached to the mounting surface of a supporting piece for supporting the base, so that the parallelism between the base and the cavity meets the preset requirement;
the vertical connecting portion penetrates through the mounting hole of the cavity, and the outer peripheral wall of the vertical connecting portion is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the base and the cavity meets the preset requirement.
2. The leveling device of claim 1, wherein the vertical mounting portion comprises a first mounting portion connected to the vertical connecting portion and a second mounting portion extending outward from the first mounting portion, and a lower surface of the second mounting portion is attached to the mounting surface of the supporting member.
3. The leveling device of claim 2, further comprising a pressing ring and a fastener, wherein the pressing ring is stacked on the upper surface of the second installation part, and the fastener sequentially penetrates through the pressing ring and the second installation part to the inside of the support part, so that the lower surface of the second installation part is attached to the installation surface of the support part.
4. The leveling device of claim 1, further comprising a frame and at least one locking assembly, wherein the frame is secured to a lower surface of the chamber by the locking assembly.
5. The leveling device of claim 4, wherein the locking assembly comprises a stud, a nut, and a fastening screw; wherein,
one end of the stud bolt is connected with the lower surface of the cavity, and the other end of the stud bolt is fixed on the rack through the nut;
the fastening screw is positioned on one side of the stud bolt, and the fastening screw penetrates through the machine frame to the cavity.
6. The leveling device of claim 4, wherein the locking assembly comprises a stud and two locking nuts; wherein,
one end of the stud bolt penetrates through the rack to the cavity, and the other end of the stud bolt extends out of the rack;
the two locking nuts are respectively screwed on the parts, located on the two sides of the rack, of the double-ended stud.
7. Leveling device according to one of the claims 1 to 6,
the flatness of the lower surface of the horizontal mounting part and the upper surface of the cavity is less than 0.1 mm; and/or the presence of a gas in the gas,
the parallelism between the lower surface of the vertical mounting part and the lower surface of the horizontal mounting part is less than 0.2 mm; and/or the presence of a gas in the gas,
the size of the vertical connecting part is 0.1-0.5 mm smaller than that of the mounting hole.
8. A method for leveling a base, characterized by using the leveling device of any one of claims 1 to 7, the method comprising:
step S110, adjusting the parallelism and the coaxiality of the base relative to the cavity by using the leveling tool so that the parallelism and the coaxiality of the base and the cavity meet preset requirements;
and S120, enabling the base to penetrate through the mounting hole to abut against the mounting surface of the support piece, and leveling the base.
9. The leveling method according to claim 8, wherein the step S110 specifically comprises:
the vertical connecting part penetrates through a mounting hole of the cavity, and the outer peripheral wall of the vertical connecting part is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the base and the cavity meets a preset requirement;
the lower surface of horizontal installation department laminates with the upper surface of cavity mutually, the lower surface of vertical installation department with support piece's installation face laminates mutually, so that the base with the depth of parallelism of cavity satisfies the preset requirement.
10. A semiconductor processing apparatus, characterized by comprising the leveling device of any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811215894.0A CN111074238B (en) | 2018-10-18 | 2018-10-18 | Leveling device, leveling method and semiconductor processing equipment |
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| CN201811215894.0A CN111074238B (en) | 2018-10-18 | 2018-10-18 | Leveling device, leveling method and semiconductor processing equipment |
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| CN111074238A true CN111074238A (en) | 2020-04-28 |
| CN111074238B CN111074238B (en) | 2023-05-16 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111534809A (en) * | 2020-05-11 | 2020-08-14 | 北京北方华创微电子装备有限公司 | A semiconductor process equipment |
| CN115110053A (en) * | 2022-07-26 | 2022-09-27 | 北京北方华创微电子装备有限公司 | Leveling base and semiconductor process equipment |
| CN118581431A (en) * | 2023-03-03 | 2024-09-03 | 北京北方华创微电子装备有限公司 | A leveling tool and a leveling method for a magnetic component of a magnetron sputtering device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206040216U (en) * | 2016-08-30 | 2017-03-22 | 山西北方机械制造有限责任公司 | Plane levelling device |
-
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206040216U (en) * | 2016-08-30 | 2017-03-22 | 山西北方机械制造有限责任公司 | Plane levelling device |
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| CN115110053B (en) * | 2022-07-26 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Adjustable level base and semiconductor process equipment |
| CN118581431A (en) * | 2023-03-03 | 2024-09-03 | 北京北方华创微电子装备有限公司 | A leveling tool and a leveling method for a magnetic component of a magnetron sputtering device |
| CN118581431B (en) * | 2023-03-03 | 2025-11-11 | 北京北方华创微电子装备有限公司 | Leveling tool and leveling method for magnetic assembly of magnetron sputtering equipment |
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