CN111067564A - Backing block of ultrasonic area array probe, ultrasonic area array probe and ultrasonic diagnosis imaging equipment - Google Patents
Backing block of ultrasonic area array probe, ultrasonic area array probe and ultrasonic diagnosis imaging equipment Download PDFInfo
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- CN111067564A CN111067564A CN201811223748.2A CN201811223748A CN111067564A CN 111067564 A CN111067564 A CN 111067564A CN 201811223748 A CN201811223748 A CN 201811223748A CN 111067564 A CN111067564 A CN 111067564A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
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Abstract
一种超声面阵探头的背衬块、超声面阵探头以及超声诊断成像设备。该背衬块的连接电路具有多个引线，该引线的第一连接端位于背衬块本体第一端部的端面，而第二连接端则穿经背衬块本体内部并延伸至第二端部的端面。为了降低第二连接端与转接电路在连接时的对位难度，该连接电路将至少部分相邻引线的第二连接端之间的间距设计为大于其第一连接端之间的间距，这样可以使连接电路在背衬块本体第二端部的端面上分布的更广，而相邻第二连接端之间的间距更大，从而便于将该第二连接端与转接电路对应的位置对位连接，降低制造难度。
A backing block of an ultrasonic area array probe, an ultrasonic area array probe, and an ultrasonic diagnostic imaging device. The connection circuit of the backing block has a plurality of lead wires, the first connection end of the lead wire is located on the end face of the first end of the backing block body, and the second connection end passes through the backing block body and extends to the second end end face of the part. In order to reduce the difficulty of alignment when connecting the second connection end and the transfer circuit, the connection circuit designs the distance between the second connection ends of at least part of the adjacent leads to be larger than the distance between the first connection ends thereof, so that The connection circuit can be distributed more widely on the end face of the second end of the backing block body, and the distance between the adjacent second connection ends is larger, so that the position corresponding to the second connection end and the switching circuit is convenient. Alignment connection reduces manufacturing difficulty.
Description
Technical Field
The application relates to an ultrasonic area array probe, in particular to a backing block structure of the ultrasonic area array probe.
Background
The ultrasonic probe is an important part of ultrasonic equipment (such as ultrasonic diagnosis imaging equipment), and the working principle of the ultrasonic probe is that an excitation electric pulse signal of an ultrasonic complete machine is converted into an ultrasonic signal by utilizing a piezoelectric effect to enter a patient body, and then an ultrasonic echo signal reflected by a tissue is converted into an electric signal, so that the detection of the tissue is realized.
The array of transducer elements of the ultrasonic probe needs to be electrically connected with a control circuit of a host, and how to connect the array of transducer elements is a very important process for manufacturing the ultrasonic probe. Particularly for an area array probe, it is difficult to realize circuit connection of a vibrator matrix by a traditional wire welding mode, and a circuit connection scheme of a multilayer FPC flexible circuit board is adopted, but the mode has higher requirement on positioning and also has larger influence on the acoustic performance of the ultrasonic probe.
In order to solve the above-mentioned problems, a backing block with an internal circuit is currently provided, but the circuit array density inside the backing block is high, the pitch is small, and particularly, the circuit distribution at one end matched with the connecting circuit is particularly dense, which will increase the alignment difficulty with the connecting circuit in the subsequent process.
Disclosure of Invention
The present application generally provides a backing block of an ultrasonic area array probe to make it easier to interface and assemble with a connection circuit. The application also provides an ultrasonic area array probe adopting the backing block and an ultrasonic diagnostic imaging device adopting the ultrasonic area array probe.
In one embodiment, a backing block of an ultrasonic area array probe is provided, which comprises a backing block body and a connecting circuit installed in the backing block body, wherein the backing block body is provided with a first end part used for matching with an oscillator array and a second end part used for matching with a switching circuit, the connecting circuit is provided with a plurality of leads, the leads are provided with first connecting ends used for connecting with the oscillator array and second connecting ends used for connecting with the switching circuit, the first connecting ends are positioned on the end surface of the first end part, the leads penetrate through the inside of the backing block body from the first end part and extend to the second end part, the second connecting ends are positioned on the end surface of the second end part, and the distance between the second connecting ends of at least part of adjacent leads is larger than the distance between the first connecting ends of the leads.
In one embodiment, the spacing between adjacent leads increases from the first connection end to the second connection end.
In one embodiment, the spacing between the second connection ends of adjacent leads is less than or equal to 1.5 times the spacing between the first connection ends thereof.
In one embodiment, all adjacent leads have equal spacing between them on the end face of the first end portion.
In one embodiment, all adjacent leads have equal spacing between them on the end face of the second end portion.
In one embodiment, the end face of the first end portion is a first end face, the end face of the second end portion is a second end face, the first end face is parallel to the second end face, and all adjacent leads have equal spacing in any plane located between and parallel to the first end face and the second end face.
In one embodiment, all leads are arranged in the same plane inside the body of the backing block.
In one embodiment, the leads are arranged in a rectangular array inside the body of the backing block.
In one embodiment, in the leads arranged in the rectangular array, a pitch between adjacent leads arranged in the row direction or the column direction is constant from the first connection end to the second connection end.
An embodiment provides an ultrasonic area array probe, which comprises an oscillator element array and a switching circuit, and is characterized by further comprising the backing block as described in any one of the above items, wherein the oscillator element array is installed at the first end part of the backing block and connected with the first connecting end of the lead wire at the first end part, and the switching circuit is installed at the second end part of the backing block and connected with the second connecting end of the lead wire.
In one embodiment, the end face of the first end portion is coated with glue, so that the first connection end is fixedly bonded with the vibration element array.
An embodiment provides an ultrasonic diagnostic imaging apparatus comprising an ultrasonic area array probe as claimed in any preceding claim.
The backing block according to the above embodiment has a plurality of leads, the first connecting ends of the leads are located at the end face of the first end of the body of the backing block, and the second connecting ends penetrate through the inside of the body of the backing block and extend to the end face of the second end. In order to reduce the alignment difficulty of the second connecting ends and the switching circuit when the second connecting ends and the switching circuit are connected, the distance between the second connecting ends of at least part of adjacent leads of the connecting circuit is designed to be larger than the distance between the first connecting ends of the connecting circuit, so that the connecting circuit can be more widely distributed on the end face of the second end part of the backing block body, the distance between the adjacent second connecting ends is larger, the corresponding positions of the second connecting ends and the switching circuit are conveniently aligned and connected, and the manufacturing difficulty is reduced.
Drawings
FIG. 1 is a schematic illustration of a backing mass construction according to an embodiment of the present application;
FIG. 2 is a schematic illustration of a backing mass configuration according to an embodiment of the present application;
FIG. 3 is a schematic illustration of a backing mass configuration according to an embodiment of the present application;
fig. 4 is a schematic diagram of leads arranged in a rectangular array in one embodiment of the present application.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
The embodiment provides a backing block of an ultrasonic area array probe. Referring to fig. 1-3, the backing block 100 includes a backing block body 110 and a connection circuit 120 mounted on the backing block body 110. To enable the connection circuit 120 to be seen, the backing block body 110 is shown transparent in fig. 1-3.
The backing block body 110 is made of a common backing block material, and on one hand, the backing block body is used as a sound attenuation material to absorb adverse ultrasonic waves transmitted backwards by the ultrasonic probe, and on the other hand, the backing block body is used as a structural supporting block to ensure the structural reliability of the ultrasonic probe element array. The connection circuit 120 is used for connecting the vibration element array, and connects the vibration element with the control circuit of the host machine, so that the control circuit drives the vibration element. The connection circuit 120 generally has a plurality of leads 121, and each lead 121 is independently disposed to communicate the corresponding transducer with the corresponding transducer circuit.
With continued reference to fig. 1-3, the backing block body 110 has a first end 111 for mating with the transducer array and a second end 112 for mating with the patch circuit. The lead 121 has a first connection 1211 for connecting to the transducer array and a second connection 1212 for connecting to a switching circuit. The first connection end 1211 is located on the end surface 1111 of the first end portion 111, so as to facilitate connection of the vibrator array and the lead 121. The lead 121 passes through the inside of the backing block body 110 from the first end 111 and extends to the second end 112, so that the second connection end 1212 is located at the end surface 1121 of the second end 112, thereby facilitating the connection between the adapter circuit and the second connection end 1212. In order to reduce the difficulty of aligning the second connection terminals 1212 with the adapter circuit during connection, the connection circuit 120 designs the distance between the second connection terminals 1212 of at least some adjacent leads 121 to be greater than the distance between the first connection terminals 1211 thereof, so that the connection circuit 120 can be distributed more widely on the end surface 1121 of the second end portion 112, and the distance between the adjacent second connection terminals 1212 is greater, thereby facilitating the alignment connection between the second connection terminals 1212 and the adapter circuit at corresponding positions, and reducing the difficulty of manufacturing.
In some embodiments, the spacing between the second connection ends 1212 of all the adjacent leads 121 may be greater than the spacing between the first connection ends 1211 thereof, or the spacing between the second connection ends 1212 of only some of the adjacent leads 121 may be greater than the spacing between the first connection ends 1211 thereof.
Referring to fig. 1-3, in an embodiment, the distance between the adjacent leads 121 may gradually increase from the first connection end 1211 to the second connection end 1212. Alternatively, the spacing may remain constant for a distance extending from the first connection end 1211 to the second connection end 1212 and then gradually increase as the distance approaches the second connection end 1212.
Of course, in view of the compactness requirement of the ultrasonic area array probe and the size requirement of the backing block 100, in one embodiment, the spacing between the second connection ends 1212 of adjacent leads 121 is less than or equal to 1.5 times the spacing between the first connection ends 1211 thereof. That is, the distance between the second connection ends 1212 is 1-1.5 times (including 1.5 times, but not including 1 time) the distance between the first connection ends 1211, so that the oversized size of the backing block 100 caused by the oversized distance between the second connection ends 1212 can be avoided, which is beneficial to the miniaturization of the ultrasonic area array probe, and is also beneficial to the alignment positioning in the subsequent circuit connection board assembling process.
In one embodiment, all of the adjacent leads 121 have equal spacing between them on the end surface 1111 of the first end portion 111. That is, on the end surface 1111 of the first end portion 111, all the leads 121 are spaced apart from the adjacent leads 121 by the same interval. Of course, in some embodiments, the spacing between some leads 121 and their adjacent leads 121 can be selectively adjusted to be different on the end surface 1111 of the first end portion 111.
Similarly, in one embodiment, all the adjacent leads 121 have equal spacing between them on the end surface 1121 of the second end portion 112. That is, on the end surface 1121 of the second end portion 112, all the leads 121 are spaced apart from their neighboring leads 121 by the same amount of spacing. Likewise, in some embodiments, the spacing between some leads 121 and their adjacent leads 121 can also be selectively adjusted to be different on the end surface 1121 of the second end portion 112.
Preferably, in an embodiment, the end surface 1111 of the first end portion 111 is a first end surface, and the end surface 1121 of the second end portion 112 is a second end surface. The first end surface is parallel to the second end surface, and all the adjacent leads 121 have equal spacing in any plane between and parallel to the first end surface and the second end surface. That is, the distances between all adjacent leads 121 vary according to the same increase, if a plane located between the first end surface and the second end surface and parallel to the first end surface and the second end surface is used to cut off the leads, the distances (referring to the distances between the adjacent leads) of these leads in this plane are equal, so as to ensure the uniformity of the whole connection circuit 120, and it is beneficial for the second connection end 1212 to form a regular and predictable positioning position on the end surface 1121 of the second end portion 112, so that the connection ends on the switch circuit can be conveniently and accurately arranged according to the position of the second connection end 1212, and thus the connection ends on the switch circuit can be conveniently and accurately connected with the second connection end 1212.
Referring to fig. 1, in one embodiment, the leads 121 are arranged in a rectangular array inside the backing block body 110. Referring to fig. 4, the rectangular array refers to the first connection 1211 and/or the second connection 1212 of the lead 121 are formed in a rectangular array, where a is a row of the rectangular array and b is a column of the rectangular array.
Alternatively, referring to fig. 2, in one embodiment, all of the leads 121 are arranged in the same plane inside the backing block body 110.
In the leads 121 arranged in a rectangular array, the pitch between adjacent leads 121 arranged in the row direction or the column direction is constant from the first connection end 1211 to the second connection end 1212. Referring to fig. 3, in the embodiment, the distance between two adjacent leads 121 in the horizontal direction (which can be regarded as the row direction) gradually increases from the first connection end 1211 to the second connection end 1212, and the distance between two adjacent leads 121 in the vertical direction (which can be regarded as the column direction) remains unchanged. This may reduce the difficulty of making the backing block 100, but may also result in a backing block 100 with a larger pitch for the second connection end 1212 to facilitate the connection of the patch circuit.
An embodiment provides an ultrasonic area array probe, which comprises an array of vibration elements, a switching circuit and a backing block 100 as shown in any one of the above embodiments. Of course, the ultrasonic area array probe may also include components such as an acoustic window, which is not explicitly described herein. The array of transducers is mounted at the first end 111 of the backing block 100 and is connected to the first end 1211 of the lead 121 at the first end 111. The patching circuit is mounted at the second end 112 of the backing block 100 and is connected to the second connection ends 1212 of the leads 121. The switching circuit is connected to the control circuit of the host through a cable, and the oscillator array can be connected to the control circuit of the host through the switching circuit and the connection circuit 120 in the backing block 100.
In one embodiment, the end surface 1111 of the first end portion 111 is coated with a glue solution, so that the first connection end 1211 is fixedly bonded to the array of vibration elements.
One embodiment provides an ultrasonic diagnostic imaging apparatus, such as an ultrasonic diagnostic apparatus. The ultrasonic diagnostic imaging apparatus includes an ultrasonic area array probe.
The present application has been described with reference to specific examples, which are provided only to aid understanding of the present application and are not intended to limit the present application. Variations of the above-described embodiments may occur to those of ordinary skill in the art in light of the teachings of this application.
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811223748.2A CN111067564B (en) | 2018-10-19 | 2018-10-19 | Ultrasonic area array probe backing block, ultrasonic area array probe and ultrasonic diagnostic imaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811223748.2A CN111067564B (en) | 2018-10-19 | 2018-10-19 | Ultrasonic area array probe backing block, ultrasonic area array probe and ultrasonic diagnostic imaging equipment |
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| Publication Number | Publication Date |
|---|---|
| CN111067564A true CN111067564A (en) | 2020-04-28 |
| CN111067564B CN111067564B (en) | 2024-03-19 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6419633B1 (en) * | 2000-09-15 | 2002-07-16 | Koninklijke Philips Electronics N.V. | 2D ultrasonic transducer array for two dimensional and three dimensional imaging |
| JP2002345094A (en) * | 2001-05-22 | 2002-11-29 | Aloka Co Ltd | Backing for ultrasonic wave probe and its manufacturing method |
| CN102283677A (en) * | 2011-07-12 | 2011-12-21 | 中国科学院深圳先进技术研究院 | Ultrasound array sound head and production method thereof |
| CN103876775A (en) * | 2012-12-20 | 2014-06-25 | 深圳迈瑞生物医疗电子股份有限公司 | Array element connecting element of ultrasonic probe and ultrasonic probe and ultrasonic imaging system thereof |
| US20180049717A1 (en) * | 2010-10-13 | 2018-02-22 | Sharon L. Adam | Multiple aperture probe internal apparatus and cable assemblies |
| CN209751085U (en) * | 2018-10-19 | 2019-12-10 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block, ultrasonic area array probe and ultrasonic diagnostic imaging equipment |
-
2018
- 2018-10-19 CN CN201811223748.2A patent/CN111067564B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6419633B1 (en) * | 2000-09-15 | 2002-07-16 | Koninklijke Philips Electronics N.V. | 2D ultrasonic transducer array for two dimensional and three dimensional imaging |
| JP2002345094A (en) * | 2001-05-22 | 2002-11-29 | Aloka Co Ltd | Backing for ultrasonic wave probe and its manufacturing method |
| US20180049717A1 (en) * | 2010-10-13 | 2018-02-22 | Sharon L. Adam | Multiple aperture probe internal apparatus and cable assemblies |
| CN102283677A (en) * | 2011-07-12 | 2011-12-21 | 中国科学院深圳先进技术研究院 | Ultrasound array sound head and production method thereof |
| CN103876775A (en) * | 2012-12-20 | 2014-06-25 | 深圳迈瑞生物医疗电子股份有限公司 | Array element connecting element of ultrasonic probe and ultrasonic probe and ultrasonic imaging system thereof |
| CN209751085U (en) * | 2018-10-19 | 2019-12-10 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block, ultrasonic area array probe and ultrasonic diagnostic imaging equipment |
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| CN111067564B (en) | 2024-03-19 |
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