CN111048502A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN111048502A CN111048502A CN201911375133.6A CN201911375133A CN111048502A CN 111048502 A CN111048502 A CN 111048502A CN 201911375133 A CN201911375133 A CN 201911375133A CN 111048502 A CN111048502 A CN 111048502A
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Abstract
The application provides a display panel, a manufacturing method thereof and a display device, which relate to the technical field of display and comprise an array substrate, a binding electrode and a micro light-emitting diode; the array substrate comprises a plurality of first grooves and second grooves, a bulge is arranged between any adjacent first grooves and second grooves, and an adhesive is arranged on the top of the bulge; the binding electrodes comprise a first binding electrode and a second binding electrode, at least part of the first binding electrode is positioned in the first groove, and at least part of the second binding electrode is positioned in the second groove; the micro light-emitting diode comprises a light-emitting body, a first electrode and a second electrode, wherein the first electrode is electrically connected with the first binding electrode, and the second electrode is electrically connected with the second binding electrode; the light emitting body is bonded to the protrusion by an adhesive. This application is through increasing the bonding area of little emitting diode and array substrate for little emitting diode's bonding firmness increases, thereby avoids removing and the risk that drops, is favorable to improving the product yield.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
A Micro light-emitting diode (Micro LED) is a micron-sized LED, and the Micro LED has a small size, so that the Micro LED can be used as a pixel on a display panel, and the display panel manufactured by the Micro LED can be called a Micro LED display panel. Compared with an Organic Light-Emitting Diode (OLED) display panel, the Micro LED display panel has a longer service life and a better viewing angle than the OLED display panel, and thus the Micro LED display technology is the focus of research in the current display technology field.
In order to simplify the manufacturing process of the Micro LED display panel, the Micro LED is usually fixed by using an adhesive, but in the existing Micro LED display panel, the bonding area of the adhesive and the Micro LED is small, so that the Micro LED is not firmly bonded, the Micro LED falls off, and yield loss is caused.
Disclosure of Invention
In view of this, the present disclosure provides a display panel, a manufacturing method thereof and a display device, which increase the bonding area between the micro light emitting diode and the array substrate to increase the bonding firmness of the micro light emitting diode, thereby avoiding the risk of movement and dropping, and facilitating the improvement of the product yield.
In order to solve the technical problem, the following technical scheme is adopted:
in a first aspect, the present application provides a display panel comprising: the array substrate, the binding electrode and the micro light-emitting diode;
the array substrate comprises a plurality of grooves and bulges, the grooves comprise first grooves and second grooves, and the bulges are arranged between any adjacent first grooves and second grooves; the protrusion comprises a top part far away from the bottom of the groove, and the top part of the protrusion is provided with an adhesive;
the binding electrodes comprise a first binding electrode and a second binding electrode, at least part of the first binding electrode is positioned in the first groove, and at least part of the second binding electrode is positioned in the second groove;
the micro light-emitting diode is positioned on one side of the binding electrode, which is far away from the array substrate; the micro light-emitting diode comprises a light-emitting body, a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected with the light-emitting body and are both positioned on one side of the light-emitting body close to the array substrate; the first electrode is electrically connected with the first binding electrode, and the second electrode is electrically connected with the second binding electrode; the light emitting body is bonded to the protrusion by an adhesive.
In a second aspect, the present application provides a method for manufacturing a display panel, including:
providing an array substrate;
the array substrate is provided with a plurality of grooves and bulges, the grooves comprise first grooves and second grooves, and the bulges are arranged between any adjacent first grooves and second grooves; the protrusion comprises a top portion away from the bottom of the groove;
coating an adhesive on top of the protrusions;
arranging binding electrodes, wherein the binding electrodes comprise a first binding electrode and a second binding electrode, at least part of the first binding electrode is positioned in the first groove, and at least part of the second binding electrode is positioned in the second groove;
arranging a micro light-emitting diode on one side of the binding electrode, which is far away from the array substrate, wherein the micro light-emitting diode comprises a light-emitting body, a first electrode and a second electrode, the first electrode and the second electrode are electrically connected with the light-emitting body, and the first electrode and the second electrode are both positioned on one side, which is close to the array substrate, of the light-emitting body; electrically connecting the first electrode with the first binding electrode, the second electrode with the second binding electrode;
and carrying out high-temperature curing treatment on the adhesive to fixedly connect the light-emitting body.
In a third aspect, the present application further provides a display device, including a display panel, where the display panel is the display panel provided in the present application.
Compared with the prior art, the display panel, the manufacturing method thereof and the display device provided by the invention at least realize the following beneficial effects:
the application provides a display panel, a manufacturing method thereof and a display device, wherein a first groove, a second groove and a bulge are arranged on an array substrate, and an adhesive is coated on the top of the bulge, so that, when the first electrode and the second electrode of the micro light-emitting diode are respectively positioned in the first groove and the second groove, the light-emitting body on the micro light-emitting diode can be bonded with the projection through the adhesive, and a plurality of other regions of the micro light emitting diode, except for the first electrode and the second electrode, are in contact with the adhesive on the protrusions, and thus, the bonding area between the micro light emitting diode and the array substrate is large enough and is in direct proportion to the bonding firmness, so that when the bonding area is increased, the bonding firmness is also increased, so that the micro light-emitting diode is firmer, the micro light-emitting diode is more favorably prevented from moving or falling off, and the product yield is favorably improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a top view of a display panel according to an embodiment of the present disclosure;
FIG. 2 is an AA' cross-sectional view of the display panel of FIG. 1;
FIG. 3 is another cross-sectional view AA' of the display panel of FIG. 1;
FIG. 4 is an enlarged view of a portion of the BB area of FIG. 3;
FIG. 5 is a cross-sectional view of still another AA' of the display panel of FIG. 1;
fig. 6 is a schematic view illustrating a connection relationship between a micro light emitting diode and a thin film transistor according to an embodiment of the present disclosure;
fig. 7 is a schematic view illustrating another connection relationship between a micro light emitting diode and a thin film transistor according to an embodiment of the present disclosure;
fig. 8 is a schematic view illustrating another connection relationship between a micro light emitting diode and a thin film transistor according to an embodiment of the present disclosure;
fig. 9 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 10 is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Detailed Description
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. Furthermore, the term "coupled" is intended to encompass any direct or indirect electrical coupling. Thus, if a first device couples to a second device, that connection may be through a direct electrical coupling or through an indirect electrical coupling via other devices and couplings. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims. The same parts between the embodiments are not described in detail.
In order to simplify the manufacturing process of the Micro LED display panel, the Micro LED is usually fixed by using an adhesive, but in the existing Micro LED display panel, the bonding area of the adhesive and the Micro LED is small, so that the Micro LED is not firmly bonded, the Micro LED falls off, and yield loss is caused.
In view of this, the present disclosure provides a display panel, a manufacturing method thereof and a display device, which increase the bonding area between the micro light emitting diode and the array substrate to increase the bonding firmness of the micro light emitting diode, thereby avoiding the risk of movement and dropping, and facilitating the improvement of the product yield.
Fig. 1 is a top view of a display panel 100 according to an embodiment of the present disclosure, and fig. 2 is an AA' cross-sectional view of the display panel 100 in fig. 1, please refer to fig. 1 and fig. 2, the display panel 100 according to the embodiment of the present disclosure includes: an array substrate 110, a binding electrode 120 and a micro light emitting diode 130;
the array substrate 110 comprises a plurality of grooves 111 and protrusions 114, the grooves 111 comprise first grooves 112 and second grooves 113, and the protrusions 114 are arranged between any adjacent first grooves 112 and second grooves 113; the protrusion 114 comprises a top 115 distal from the bottom of the groove 111, the top 115 of the protrusion 114 being provided with an adhesive 140;
the binding electrode 120 includes a first binding electrode 121 and a second binding electrode 122, at least a portion of the first binding electrode 121 being located within the first groove 112, and at least a portion of the second binding electrode 122 being located within the second groove 113;
the micro light emitting diode 130 is positioned on one side of the binding electrode 120 away from the array substrate 110; the micro light emitting diode 130 includes a light emitting body 131, a first electrode 132 and a second electrode 133 electrically connected to the light emitting body 131, wherein the first electrode 132 and the second electrode 133 are both located at a side of the light emitting body 131 close to the array substrate 110; the first electrode 132 is electrically connected to the first binding electrode 121, and the second electrode 133 is electrically connected to the second binding electrode 122; the light emitting body 131 is adhered to the protrusion 114 by an adhesive 140.
Specifically, referring to fig. 1 and fig. 2, the display panel 100 provided in the present embodiment includes an array substrate 110, a bonding electrode 120, and a micro light emitting diode 130, wherein the micro light emitting diode 130 is located on a side of the bonding electrode 120 away from the array substrate 110; the micro light emitting diode 130 comprises a light emitting body 131 and a first electrode 132 and a second electrode 133 which are respectively electrically connected with the light emitting body 131, a plurality of grooves 111 are arranged on one side of the array substrate 110 close to the micro light emitting diode 130, so that the first electrode 132 and the second electrode 133 are respectively positioned in the grooves 111, the groove 111 for accommodating the first electrode 132 is a first groove 112, the groove 111 for accommodating the second electrode 133 is a second groove 113, and a first binding electrode 121 and a second binding electrode 122 are respectively arranged in the first groove 112 and the second groove 113, so that the first electrode 132 is electrically connected with the first binding electrode 121, the second electrode 133 is electrically connected with the second binding electrode 122, and a voltage signal is provided for the micro light emitting diode 130 through the first binding electrode 121 and the second binding electrode 122 to drive the micro light emitting diode 130 to emit light, thereby realizing image display. When a plurality of grooves 111 are formed on the array substrate 110, independent protrusions 114 are formed between the grooves 111, when the first electrode 132 and the second electrode 133 of the light emitting diode are respectively positioned in the first groove 112 and the second groove 113, the protrusion 114 on the array substrate 110 corresponds to the light emitting body 131, to enable the attachment of micro-leds 130, the present application provides an adhesive 140 on the top 115 of each bump 114, the micro light emitting diodes 130 are attached to the array substrate 110 by an adhesive 140, and thus, a plurality of other regions of the micro light emitting diode 130 except for the first electrode 132 and the second electrode 133 may be bonded to the array substrate 110, therefore, the bonding area between the micro light emitting diode 130 and the array substrate 110 can be increased, which is beneficial to increasing the bonding firmness of the micro light emitting diode 130, and avoiding the risk of displacement and even falling off, thereby avoiding the yield loss.
It should be noted that fig. 2 is only a schematic illustration of the position of the micro light emitting diode 130 on the array substrate 110, and does not represent the specific size and structure of the micro light emitting diode 130, nor the specific size and number of the groove 111 and the protrusion 114.
Optionally, with reference to fig. 2, along the first direction, the width of the first groove 112 is greater than or equal to the width of the first electrode 132, and the width of the second groove 113 is greater than or equal to the width of the second electrode 133. Specifically, with reference to fig. 2, in the present embodiment, the cross-sectional shapes of the first groove 112 and the second groove 113 are trapezoidal, the widths of the first groove 112 and the second groove 113 along the first direction gradually decrease from top to bottom, in order to ensure that the first electrode 132 can be placed in the first groove 112 and the second electrode 133 can be placed in the second groove 113, in the present embodiment, the minimum width of the first groove 112 is set to be greater than or equal to the width of the first electrode 132, and the minimum width of the second groove 113 is set to be greater than or equal to the width of the second electrode 133, so that the first electrode 132 can be electrically connected to the first bonding electrode 121 located at the bottom of the first groove 112, and the second electrode 133 is electrically connected to the second bonding electrode 122 located at the bottom of the second groove 113, so that the first electrode 132 and the second electrode 133 can receive a voltage signal, thereby implementing image display. In addition, the first electrode 132 and the second electrode 133 are completely located in the groove, and the top 115 of the protrusion 114 can be ensured to be in contact with the micro light emitting diode 130 through the adhesive 140, so that the micro light emitting diode 130 can be ensured to be fixed by the adhesive 140, and the yield of the display panel 100 is prevented from being lost due to the falling of the micro light emitting diode 130.
Alternatively, with continued reference to FIG. 2, the adhesive 140 has a modulus of elasticity in the range of 30kPa to 50 kPa. Preferably, the elastic modulus of the adhesive 140 is less than the elastic modulus of the protrusions 114. Specifically, the smaller the elastic modulus is, the more favorable the deformation is, and therefore, in the present embodiment, the elastic modulus of the adhesive 140 is set to be equal to or greater than 30Kpa and equal to or less than 50Kpa, and the elastic modulus of the adhesive 140 is set to be smaller than the elastic modulus of the protrusion 114, so that when the display panel 100 is subjected to bending deformation, since the elastic modulus of the adhesive 140 is smaller, it is easier to bend along with the bending of the display panel 100, and therefore, the risk of peeling the adhesive 140 from the light emitting body 131 is favorably reduced, and the risk of reducing the yield can be reduced.
Alternatively, fig. 3 is another cross-sectional view AA' of the display panel 100 in fig. 1, and fig. 4 is a partial enlarged view of a BB area in fig. 3, please refer to fig. 3 and 4, a surface of the protrusion 114 facing the light emitting body 131 is an uneven structure, and the adhesive 140 covers the uneven structure. Preferably, the surface of the protrusion 114 facing the light emitting body 131 has a first sub-groove 116, and the adhesive 140 is filled in the first sub-groove 116. Specifically, referring to fig. 3 and 4, in the embodiment, the top 115 of the protrusion 114 is disposed in a concave-convex structure, and each concave portion is a first sub-groove 116, and when the top 115 of the protrusion 114 is covered with the adhesive 140, each concave portion located at the top 115 of the protrusion 114 is also filled with the adhesive 140, that is, each first sub-groove 116 is filled with the adhesive 140, so that the contact area between the adhesive 140 and the protrusion 114 can be increased, thereby increasing the bonding firmness between the adhesive 140 and the protrusion 114, avoiding the risk that the adhesive 140 is peeled off from the protrusion 114 when the display panel 100 is bent, further facilitating to reduce the risk that the micro light emitting diode falls off, and improving the yield of products.
It should be noted that the concave-convex structure on the protrusion 114 of the array substrate 110 in fig. 3 and fig. 4 is only a schematic illustration, and does not represent the size and number of the actual concave-convex structure, and of course, the shape of the first sub-groove 116 is also only a schematic illustration, in other embodiments, the first sub-groove 116 may be set to other shapes, such as a trapezoid, an inverted triangle, or an arc, and the like, which is not specifically limited in this application.
Alternatively, referring to fig. 2, the adhesive 140 is a pressure sensitive adhesive whose tack increases with increasing force applied to the pressure sensitive adhesive. Specifically, in the embodiment, the adhesive 140 is a pressure sensitive adhesive, which has sensitivity to pressure and has viscosity proportional to the force applied thereon, that is, as the force applied to the pressure sensitive adhesive increases, the viscosity of the pressure sensitive adhesive also increases, so that when the micro light emitting diode 130 is transferred to the display panel 100, the first electrode 132 and the second electrode 133 of the micro light emitting diode 130 are pre-aligned, and the micro light emitting diode 130 is detected after the pre-alignment, if the micro light emitting diode 130 cannot normally emit light, the non-light emitting micro light emitting diode 130 is removed, and a new micro light emitting diode 130 is replaced for detection, and when the micro light emitting diode 130 is detected to normally emit light, the micro light emitting diode 130 is pressed, so that the micro light emitting diode 130 is firmly attached to the array substrate 110, and thus, when the micro light emitting diode 130 is detected to not normally emit light, because the micro light emitting diodes 130 are not pressed and have low viscosity, the micro light emitting diodes 130 which cannot normally emit light can be easily removed, thereby being beneficial to reducing the difficulty of the process for removing the micro light emitting diodes 130 which cannot normally emit light. In addition, when the micro light emitting diodes 130 can normally emit light, the micro light emitting diodes 130 are pressed, and the viscosity of the adhesive 140 is increased, so that the bonding firmness of the micro light emitting diodes 130 is increased, and the problem that the micro light emitting diodes 130 are deviated or even fall off is solved.
Alternatively, fig. 5 is a cross-sectional view of still another AA' of the display panel 100 in fig. 1, and referring to fig. 1 and fig. 5, the light-emitting body 131 includes a first region 134, a second region 135 and a third region 136 arranged along a first direction, the first region 134, the second region 135 and the third region 136 all extend along a second direction, and the first direction and the second direction are crossed; the first electrode 132 is electrically connected to the first region 134, the second electrode 133 is electrically connected to the second region 135, and the third region 136 is bonded to the protrusion 114 by an adhesive 140. Preferably, the third region 136 includes a first sub-region 137, a second sub-region 138 and a third sub-region 139 arranged in the first direction; the first subregion 137 is located on the side of the first region 134 remote from the second region 135, the second subregion 138 is located between the first region 134 and the second region 135, and the third subregion 139 is located on the side of the second region 135 remote from the first region 134. Specifically, referring to fig. 5, the light emitting body 131 is divided into a first region 134, a second region 135 and a third region 136 arranged along a first direction, wherein the first electrode 132 is electrically connected to the first region 134, the second electrode 133 is electrically connected to the second region 135, and the third region 136 not connected to the electrode is bonded to the protrusion 114 on the array substrate 110 through the adhesive 140, so that the micro light emitting diode is fixedly bonded to the array substrate 110, and the micro light emitting diode is prevented from shifting or falling off. In general, the first electrode 132 and the second electrode 133 of the micro light emitting diode are not entirely located at the edge of the light emitting body 131, accordingly, the first and second regions 134 and 135 respectively connected to the first and second electrodes 132 and 133 are not located at the edge of the light emitting body 131, the third region 136 is divided by the first region 134 and the second region 135 into three sub-regions, a first sub-region 137, a second sub-region 138 and a third sub-region 139, by providing an adhesive layer on each of the protrusions 114 corresponding to the three sub-regions, the light emitting body 131 can be adhered to the protrusion 114 of the array substrate 110 through a plurality of regions, thereby increasing the bonding area between the micro light emitting diode and the array substrate 110, improving the bonding firmness of the micro light emitting diode, further, the micro light emitting diode can be prevented from shifting or falling off, and the product yield can be improved.
Optionally, fig. 6 is a schematic diagram illustrating a connection relationship between a micro light emitting diode and a thin film transistor 102 provided in the present embodiment, please refer to fig. 6, in which an array substrate 110 includes a substrate base 101, a first metal layer 104, a second metal layer 106 and an insulating layer 108, the second metal layer 106 is located on a side of the first metal layer 104 away from the substrate base 101, and the insulating layer 108 is located on a side of the second metal layer 106 away from the substrate base 101; the array substrate 110 further comprises a plurality of thin film transistors 102, each thin film transistor 102 comprises a gate 103, a source 105 and a drain 107, the gate 103 is located on the first metal layer 104, and the source 105 and the drain 107 are located on the second metal layer 106; the first binding electrode 121 is electrically connected to the drain 107, and the second binding electrode 122 receives a first voltage signal. Specifically, referring to fig. 6, a plurality of thin film transistors 102 are disposed on an array substrate 110, each thin film transistor 102 includes a gate 103, a source 105, a drain 107 and an active layer 109, wherein the gate 103 is disposed on a first metal layer 104, the source 105 and the drain 107 are disposed on a second metal layer 106, in order to avoid signal interference between the metal layers, in this embodiment, an insulating layer 108 is disposed between the second metal layer 106 and a micro light emitting diode 130, an interlayer insulating layer is also disposed between the first metal layer 104 and the second metal layer 106, and the first bonding electrode 121 is electrically connected to the drain 107, and a first voltage signal is provided to the second bonding electrode 122, a voltage signal is provided to a first electrode 132 of the micro light emitting diode 130 through the drain 107, and the first voltage signal received by the second bonding electrode 122 is transmitted to a second electrode 133 of the micro light emitting diode, and driving the micro light emitting diode to emit light according to the voltage signals received by the first electrode 132 and the second electrode 133, thereby realizing image display.
It should be noted that the value of the first voltage signal may be set according to the output voltage of the drain 107, for example, when the output end of the drain 107 is a positive voltage, the first voltage signal may be a negative voltage; alternatively, when the output terminal of the drain 107 is a negative voltage, the first voltage signal may be a positive voltage, as long as the voltage difference between the two can drive the micro light emitting diode 130 to emit light, which is not limited in the present application. In addition, in the present embodiment, the first binding electrode 121 and the drain electrode 107 are electrically connected, which is only a schematic illustration and is not a limitation of the present application, and in other embodiments, the first binding electrode 121 may also be electrically connected to the source electrode 105 of the thin film transistor 102, and fig. 6 shows the thin film transistor 102 with a top gate structure, besides, the thin film transistor 102 may also be the thin film transistor 102 with a bottom gate structure, which is not limited in the present application.
Optionally, fig. 7 is a schematic view illustrating another connection relationship between the micro light emitting diode and the thin film transistor 102 provided in the embodiment of the present application, referring to fig. 7, a first groove 112, a second groove 113 and a protrusion 114 are located on the insulating layer 108, the first groove 112 penetrates the insulating layer 108 along a direction perpendicular to the substrate 101, and the drain 107 is reused as the first binding electrode 121. Specifically, referring to fig. 7, an insulating layer 108 is disposed between the second metal layer 106 and the micro light emitting diode, and in this embodiment, the first groove 112 is disposed to penetrate through the insulating layer 108 between the second metal layer 106 and the micro light emitting diode along a direction perpendicular to the substrate 101, and the drain 107 is multiplexed as the first binding electrode 121, so that the first electrode 132 can be directly electrically connected to the drain 107, and there is no need to separately dispose a first binding electrode 121 for electrically connecting the first electrode 132 and the drain 107, and therefore, the number of manufacturing steps can be reduced, which is beneficial to reducing the manufacturing difficulty and improving the manufacturing efficiency.
It should be noted that the multiplexing of the drain 107 as the first binding electrode 121 is merely an embodiment in the present embodiment, and is not a limitation of the present application, and in other embodiments, the multiplexing of the source 105 as the first binding electrode 121 may be performed. In addition, the thin film transistor 102 in fig. 7 is also only a schematic illustration, which does not represent the actual size of the thin film transistor 102, and the film layer structure and the film layer thickness in fig. 7 are also only a schematic illustration, which does not represent the actual film layer thickness.
Optionally, fig. 8 is a schematic view illustrating another connection relationship between a micro light emitting diode and a thin film transistor 102 provided in the present embodiment, please refer to fig. 8, in which the display panel 100 further includes a planarization layer 118, and the planarization layer 118 is located on a side of the insulating layer 108 away from the substrate 101; the first groove 112, the second groove 113 and the protrusion 114 are located on the planarization layer 118, and the first groove 112 penetrates through the planarization layer 118 in a direction perpendicular to the substrate base plate 101; the insulating layer 108 includes a plurality of via holes 119, and the first binding electrode 121 is electrically connected to the drain electrode 107 through the via holes 119. Specifically, in a general case, a planarization layer 118 is disposed between the array substrate 110 and the micro light emitting diode 130, the planarization layer 118 may be an organic layer of acryl, polyimide, benzocyclobutene, or the like, and the stress ratio thereof is relatively small, and therefore, in the present embodiment, the first groove 112, the second groove 113, and the protrusion 114 are disposed on the planarization layer 118, and the first groove 112 penetrates through the planarization layer 118 in a direction perpendicular to the substrate 101, such that when the first electrode 132 is disposed in the first groove 112, the first electrode 132 and the first binding electrode 121 can be electrically connected, and then the first binding electrode 121 is electrically connected to the drain electrode 107 through the via 119, and simultaneously the first voltage signal is provided to the second binding electrode 122, the voltage signal is provided to the first electrode 132 of the micro light emitting diode through the drain electrode 107, and the first voltage signal received by the second binding electrode 122 is transmitted to the second electrode 133 of the micro light emitting diode, the micro light emitting diodes are driven to emit light according to the voltage signals received by the first electrode 132 and the second electrode 133, thereby realizing image display.
Based on the same inventive concept, the present application provides a method for manufacturing a display panel 100, fig. 9 is a flowchart of a method for manufacturing a display panel 100 according to an embodiment of the present application, please refer to fig. 1 to 9, where the method for manufacturing a display panel 100 according to the embodiment of the present application includes:
step 10: providing an array substrate 110;
step 20: a plurality of grooves 111 and protrusions 114 are arranged on the array substrate 110, the grooves 111 include first grooves 112 and second grooves 113, and the protrusions 114 are arranged between any adjacent first grooves 112 and second grooves 113; the protrusion 114 includes a top 115 distal from the bottom of the groove 111;
step 30: applying an adhesive 140 on the tops 115 of the protrusions 114;
step 40: providing a binding electrode 120, wherein the binding electrode 120 comprises a first binding electrode 121 and a second binding electrode 122, at least part of the first binding electrode 121 is located in the first groove 112, and at least part of the second binding electrode 122 is located in the second groove 113;
step 50: the micro light emitting diode 130 is arranged on one side of the binding electrode 120 away from the array substrate 110, the micro light emitting diode 130 includes a light emitting body 131, a first electrode 132 electrically connected to the light emitting body 131, and a second electrode 133, and both the first electrode 132 and the second electrode 133 are located on one side of the light emitting body 131 close to the array substrate 110; electrically connecting the first electrode 132 with the first binding electrode 121, and the second electrode 133 with the second binding electrode 122;
step 60: the adhesive 140 is cured at a high temperature to fixedly connect the light emitting body 131.
Specifically, referring to fig. 1 to 9, in the manufacturing method of the display panel 100 provided in this embodiment, an array substrate 110 is provided first, and then a plurality of first grooves 112 and second grooves 113 are disposed on the array substrate 110 through step 20, and a protrusion 114 is disposed between any adjacent first groove 112 and second groove 113; after the protrusion 114 is disposed, an adhesive 140 is applied on the top 115 of the protrusion 114 through step 30, and in step 40, the first binding electrode 121 is disposed in the first groove 112 and the second binding electrode 122 is disposed in the second groove 113; setting the micro light emitting diode 130 through the step 50, electrically connecting the first electrode 132 of the micro light emitting diode 130 with the first binding electrode 121, electrically connecting the second electrode 133 with the second binding electrode 122, and supplying power to the micro light emitting diode 130 through the first binding electrode 121 and the second binding electrode 122 to drive the micro light emitting diode 130 to emit light; the adhesive 140 is cured in step 60 to fixedly connect the light emitting body 131, and the curing method here is high temperature curing, but not limited to high temperature curing, and photo-curing may also be used.
The present application provides a liquid crystal display device by providing a first groove 112 and a second groove 113 on an array substrate 110, forming an independent protrusion 114 between the grooves 111, when the first electrode 132 and the second electrode 133 of the light emitting diode are positioned in the first recess 112 and the second recess 113 respectively, the protrusions 114 on the array substrate 110 correspond to the light emitting bodies 131, and in order to fix the micro light emitting diodes 130, an adhesive 140 is disposed on the top 115 of each of the protrusions 114, and the micro light emitting diodes 130 are attached to the array substrate 110 by the adhesive 140, and thus, the micro light emitting diodes 130 except for the first and second electrodes 132 and 133 may be bonded to the array substrate 110, therefore, the bonding area between the micro light emitting diode 130 and the array substrate 110 can be increased, which is beneficial to increasing the bonding firmness of the micro light emitting diode 130 and avoiding the risk of falling off, thereby avoiding the yield loss.
Optionally, fig. 10 is another flowchart illustrating a manufacturing method of the display panel 100 according to an embodiment of the present disclosure, referring to fig. 10, before performing a high temperature curing process on the adhesive 140, the method further includes: step 51: whether the micro light emitting diodes 130 emit light normally is detected, the micro light emitting diodes 130 which cannot emit light normally are removed, and new micro light emitting diodes 130 are set. Specifically, in this embodiment, before the curing process in step 60 is performed, whether the leds can emit light normally is further detected through step 51, that is, before the curing process is performed, the micro leds 130 aligned in advance are first detected, if the micro leds 130 cannot emit light normally, the micro leds 130 that cannot emit light normally are removed, new micro leds 130 are replaced, and then the detection is performed, until all the micro leds 130 can emit light normally, the adhesive 140 is cured, so that the micro leds 130 and the array substrate 110 are firmly attached to each other.
Based on the same inventive concept, the present application further provides a display device 200, please refer to fig. 11, where fig. 11 is a schematic structural diagram of the display device 200 according to the embodiment of the present application, and the display device 200 includes a display panel, which is any one of the display panels 100 according to the embodiments of the present application. It should be noted that, for the embodiments of the display device 200 provided in the present application, reference may be made to the embodiments of the display panel 100, and the same parts are not described again. The display device 200 provided by the present application may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
According to the embodiments, the application has the following beneficial effects:
the application provides a display panel, a manufacturing method thereof and a display device, wherein a first groove, a second groove and a bulge are arranged on an array substrate, and an adhesive is coated on the top of the bulge, so that, when the first electrode and the second electrode of the micro light-emitting diode are respectively positioned in the first groove and the second groove, the light-emitting body on the micro light-emitting diode can be bonded with the projection through the adhesive, and a plurality of other regions of the micro light emitting diode, except for the first electrode and the second electrode, are in contact with the adhesive on the protrusions, and thus, the bonding area between the micro light emitting diode and the array substrate is large enough and is in direct proportion to the bonding firmness, so that when the bonding area is increased, the bonding firmness is also increased, so that the micro light-emitting diode is firmer, the micro light-emitting diode is more favorably prevented from moving or falling off, and the product yield is favorably improved.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (15)
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| CN111613632A (en) * | 2020-05-22 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method of making the same |
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| CN113257961A (en) * | 2021-04-22 | 2021-08-13 | 惠州视维新技术有限公司 | Light source and preparation method thereof |
| CN113764326A (en) * | 2021-09-09 | 2021-12-07 | 湖北长江新型显示产业创新中心有限公司 | Micro light emitting diode and transfer device and transfer method thereof |
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| CN111524912B (en) * | 2020-04-30 | 2022-07-22 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method of array substrate and display device |
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| CN111613632A (en) * | 2020-05-22 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method of making the same |
| CN112993134A (en) * | 2020-06-03 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Binding method of micro LED, display back plate and display device |
| CN112993134B (en) * | 2020-06-03 | 2022-04-29 | 重庆康佳光电技术研究院有限公司 | Binding method of micro LED, display backplane and display device |
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| CN114765196A (en) * | 2021-01-15 | 2022-07-19 | 扬朋科技股份有限公司 | Repairing method of display panel |
| CN114823648A (en) * | 2021-01-28 | 2022-07-29 | 成都辰显光电有限公司 | Display panel and display device |
| CN112928192A (en) * | 2021-02-09 | 2021-06-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113066813A (en) * | 2021-03-18 | 2021-07-02 | 武汉天马微电子有限公司 | Miniature diode display bearing substrate, display panel and display device |
| CN113257961A (en) * | 2021-04-22 | 2021-08-13 | 惠州视维新技术有限公司 | Light source and preparation method thereof |
| CN113257961B (en) * | 2021-04-22 | 2022-12-13 | 惠州视维新技术有限公司 | Light source and preparation method thereof |
| CN113764326A (en) * | 2021-09-09 | 2021-12-07 | 湖北长江新型显示产业创新中心有限公司 | Micro light emitting diode and transfer device and transfer method thereof |
| CN113764326B (en) * | 2021-09-09 | 2024-01-19 | 湖北长江新型显示产业创新中心有限公司 | Microluminescent diode and transfer device and method thereof |
| CN114334924A (en) * | 2021-12-29 | 2022-04-12 | 湖北长江新型显示产业创新中心有限公司 | Substrate, transfer substrate, display panel, manufacturing method of display panel and display device |
| CN114334924B (en) * | 2021-12-29 | 2025-07-15 | 湖北长江新型显示产业创新中心有限公司 | Substrate, transfer substrate, display panel, manufacturing method thereof, and display device |
| CN114284412A (en) * | 2021-12-30 | 2022-04-05 | 厦门天马微电子有限公司 | Display panel and display device |
| CN114284412B (en) * | 2021-12-30 | 2023-12-08 | 厦门天马微电子有限公司 | Display panel and display device |
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Application publication date: 20200421 |