CN1110235C - Chip Component installation device - Google Patents
Chip Component installation device Download PDFInfo
- Publication number
- CN1110235C CN1110235C CN98102758A CN98102758A CN1110235C CN 1110235 C CN1110235 C CN 1110235C CN 98102758 A CN98102758 A CN 98102758A CN 98102758 A CN98102758 A CN 98102758A CN 1110235 C CN1110235 C CN 1110235C
- Authority
- CN
- China
- Prior art keywords
- stage
- transport platform
- template
- chip
- chip part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A chip element mounting device has an element supply stage for supplying chip elements from a funnel to a template, a mounting stage for transferring the chip elements from the template to a printing substrate, a substrate supply and draining stage for handover from the printing substrate to a transport. Two transporting tables of fixed templates are moved in different circular paths during the element supply stage and the mounting stage to transporting the chip elements which are in an array state, and the transporting tables are moved during the mounting stage and the substrate supply and draining stage to transport the printing substrate. The transporting tables reciprocatingly removes and oscillates the chip elements ratherish when being moved to make the chip elements have a good array.
Description
The present invention relates to a kind of chip component installation device that the chip part of the lead that does not have resistor, electric capacity etc. is installed on the defined position of printed base plate, particularly relate to a kind ofly on printed base plate, the chip component installation device that multichannel is installed that is called as of several chip parts is installed in action once simultaneously.
As Fig. 7, existing chip component installation device shown in Figure 8, it is open in No. 15835/91 communique of Japanese patent laid-open publication gazette.As shown in Figure 7, be equipped with a plurality of funnels 1, in each funnel 1, contain plurality of chips parts 2 in the parts supply stage of chip component installation device.Each funnel 1 is connected on the compoboard 4 of location by guide pipe 3, is equipped with template 5 below this location compoboard 4.This template 5 is made up of mutual incorporate guiding die plate 5a and template substrate 5b, is formed with several retaining holes 6 on the guiding die plate 5a up.Template 5 can upper and lowerly move by the drive source (not shown), is transported to erection stage by the conveyer belt (not shown) simultaneously, more as shown in Figure 8, is setting the absorbing unit with plural adsorption nozzle 7 at erection stage.
Resemble the chip component installation device of said structure, at first supply with the stage, lift template 5 by drive source and overlap with location compoboard 4 at parts, at this state, send chip part 2 from funnel 1 guide spool 3, chip part 2 falls in the retaining hole 6 of template 5 through location compoboard 4.Chip part 2 is loaded into template 5 on the belt conveyor not shown in the figures after falling in each retaining hole 6 of template 5, and it is carried till erection stage, carries in the way at this, and by vibration template 5, chip part 2 is the state of laying across in retaining hole 6.Then, at erection stage, by adsorption nozzle 7 behind each chip part 2 of retaining hole 6 absorption of template 5, more as shown in Figure 8, by supplying with printed base plate 8, each chip part 2 temporarily is fixed on institute's allocation of the printed base plate 8 that is coated with pasty state scolding tin 9 in advance under adsorption nozzle 7.Like this, chip part 2 is from template 5 transfers to state on the printed base plate 8, and this printed base plate 8 of heating in reflow ovens dissolves pasty state scolding tin 9, the electrode of welding chip parts 2 on the flange of printed base plate 8 then.
That is, chip component installation device is as constituted above supplied with the stage at parts, after chip part 2 is dropped in each retaining hole 6 of template 5, by belt conveyor conveying template 5 till erection stage; At this erection stage, for each chip part 2 is shifted to printed base plate 8 from the retaining hole 6 of template 5, so be installed in the quantity of the chip part 2 on the printed base plate 8 and the retaining hole 6 of position being formed with correspondence on the template 5, once action, several chip parts 2 just can be installed on the printed base plate 8 simultaneously.
The chip part 2 of accommodating in funnel 1 is installed in this chip component installation device on the printed base plate 8 by template 5, template 5 is supplied with the stage to the course of conveying of delivery phase from parts, template 5 is vibrated, chip part 2 must be the state of laying across in retaining hole 6, so must use the portrait recognition device, confirm the ordered state of chip part 2 in retaining hole 6, carry out these actions just must have vibration stage and portrait cognitive phase.
Above-mentioned existing chip apparatus for mounting component by the belt conveyor of endless shape, is supplied with the stage from parts and is carried template 5 to erection stage, as shown in Figure 9, by belt conveyor, must carry a plurality of templates 5 simultaneously in order in a direction indicated by the arrow.Promptly supply with the stage at parts, when on template 5 arbitrarily, falling chip part 2, carry out desirable action in other vibration stage with portrait cognitive phase and corresponding respectively other template 5 of erection stage, simultaneously, from the template 5 of the sky of erection stage after the parts supply stage is reclaimed taking-up chip part 2, then, in a direction indicated by the arrow, press the amount rotation belt conveyor of defined, each template 5 is transported to next stage respectively in order.
For example,, find the ordered state condition of poor of chip part 2, revise during this bad chip part 2 that all the mobile of template 5 is stopped, so the low problem of running efficiency with regard to having erecting device at the portrait cognitive phase.The template 5 that the number that corresponding each stage must be arranged is arranged again, particularly chip part 2 must be the shape of laying across really in retaining hole 6, so must use several vibrating mechanisms, template 5 is given in turn the vibration of various amplitude, in the vibration stage 2-3 sheet template 5 must be arranged, the empty template 5 that reclaims usefulness must have three to four, must prepare 10 templates 5 in whole process, so have the high problem of manufacturing cost.
The objective of the invention is to, a kind of chip component installation device is provided, it has first to the 3rd transport platform of the movable part that constitutes the two-dimensional linear motor, in these transport platform, between parts supply stage and erection stage, move the template that is positioned in respectively on first and second transport platform with mutual different circulating path, between erection stage and conveyer, carry the printed base plate on the 3rd transport platform.By first transport platform and second transport platform two templates are moved respectively with different circulating paths like this, when a side of first and second transport platform is stopped, when carrying out the arrangement correction etc. of chip part, allow the opposing party's transport platform and the 3rd transport platform move, can be on printed base plate the mounting core chip part, can improve running efficiency like this, can reduce the quantity of template significantly, reduce manufacturing cost.
The objective of the invention is to realize by following technical scheme.
The invention provides a kind of chip component installation device, its device has: XY worktable, the fixed part of formation two-dimensional linear motor; First transport platform, the movable part of formation two-dimensional linear motor by circulating path, is moving between supply stage of the parts on the described XY worktable and erection stage; Second transport platform, the movable part of formation two-dimensional linear motor by being different from the circulating path of described first transport platform, is supplied with between stage and the erection stage mobile at parts; The 3rd transport platform, the movable part of formation two-dimensional linear motor moves for row at erection stage on the described XY worktable and substrate between the stage; Template is placed on respectively on described first and second transport platform; First conveyer is being positioned at the printed base plate conveying in described substrate on described the 3rd transport platform of row on the stage; The parts supply mean is housed in chip part in a plurality of funnels by the positional alignment of defined, with chip part be supplied in described parts supply with the stage be placed on described first or the template of second transport platform on; Absorbing unit, absorption are positioned at erection stage and supply to chip part on the described template, chip part are installed on the printed base plate of described the 3rd transport platform that is positioned at erection stage; Second conveyer is carried to be equipped with to be positioned at the described printed base plate that described substrate is given the described chip part of described three transport platform of row on the stage.
By the XY direction small move back and forth described first and second transport platform, arrange the described chip part of supplying with on described template thus.
Chip component installation device of the present invention, on described XY worktable, portrait cognitive phase with ordered state of confirming the chip part of supply on described template, the mobile process respectively of described first and second transport platform is arranged on the described portrait cognitive phase at diverse location place.
Concrete structure of the present invention is provided in detail by following examples and accompanying drawing thereof.
Fig. 1 is the front elevation of chip component installation device of the present invention.
Fig. 2 is the side view of chip component installation device of the present invention.
Fig. 3 is the mode view of the transport platform mobile route that has in the chip component installation device of the present invention.
Fig. 4 is the profile of the operating principle of explanation transport platform.
Fig. 5 is the plane graph of mounting template on transport platform.
Fig. 6 is the profile of the critical piece of template and transport platform.
Fig. 7 is the action schematic diagram that falls chip part on template that has in the existing chip component installation device.
Fig. 8 is from the template of Fig. 7 action schematic diagram to printed base plate mounting core chip part.
Fig. 9 is the template transport path schematic diagram of Fig. 7.
See also Fig. 1 to shown in Figure 3, on the stand 10 of chip component installation device, be fixed with XY worktable 11, upload in this XY worktable 11 and be equipped with first to the 3rd transport platform 12,13,14.Above XY worktable 11, be equipped with a plurality of funnels 15, in this funnel 15, contain chip part.Each funnel 15 is connected with winding displacement dish 17 on being installed in stand 10 by guide pipe 16, is that parts are supplied with stage S1 under the winding displacement dish 17 of component parts supply mean.The video camera 19 of absorbing unit 18 and a pair of shooting usefulness is installed on stand 10, is erection stage S2 under absorbing unit 18.Be portrait cognitive phase S3 under the video camera 19 of two shooting usefulness, this portrait cognitive phase S3 is positioned at the straight line bilateral symmetry position that parts supply stage S1 and erection stage S2 connect into.By the situation shown in Fig. 1, absorbing unit 18 moves to the right, and the video camera 19 of the shooting usefulness on right side has just omitted, and has in the front side of XY worktable 11 again, is equipped with two conveyers 20, carries printed base plate 21 by this conveyer 20.Between two conveyers 20, give row stage S4 for substrate.
As shown in Figure 4, XY worktable 11 constitutes the fixed part of secondary linear motors, is formed with several protuberances 22a on the stator of being made up of the high magnetic permeable material of pure iron etc. 22, for example in 1mm pitch formation clathrate, by the surface of resin molding 23 covering stators 22.On the other hand, first to the 3rd transport platform 12,13,14 constitutes the movable part of two-dimensional linear motor, on the rotor of forming by the nonmagnetic substance of aluminium etc. 24, pack into and have a plurality of magnetic cores 25 of sinker dentation end face, each protuberance 22a of this sinker dentation end face relative stator 22 has some relative phase differences.Be wound with coil 26 on each magnetic core 25, by the direction and the size of these coil 26 control supplying electric currents, first to the 3rd transport platform 12,13,14 for example at 0.01mm pitch scale, can move freely at two-dimensional directional on XY worktable.Because be blown into the pressure-air that forms the air gap at stator 22 and 24 of rotors, move so first to the 3rd transport platform 12,13,14 can be slided on XY worktable.
On first transport platform 12 and second transport platform 13, be fixed with template 27, the first transport platform 12 respectively and 1.-4. circulate with the circulating path of the left-half of Fig. 3 and move, second transport platform 13 with the right half part circulating path of Fig. 3 5.-8. move back and forth.Move back and forth between row stage S4 at the erection stage S2 and the substrate of mounting printed base plate 21, the three transport platform 14 on the 3rd transport platform 14 at Fig. 3.As shown in Figure 5 and Figure 6, be formed with several retaining holes 27a on template 27, this retaining hole 27a correspondence is formed on the installation site that the chip part 28 on the printed base plate 21 is installed.
The following describes the action of the chip component installation device of above-mentioned formation.
At first, the work beginning allows first and second transport platform 12,13 be positioned at respectively on the XY worktable, for example moves to Fig. 3 upper left corner and the upper right corner, orientates the initial point of first and second transport platform 12,13 as with this.Supply with stage S1 to parts then and move first transport platform 12, supply with stage S1 at these parts, by guide pipe 16 and winding displacement dish 17, the chip part 28 that is housed in the funnel 15 falls in each retaining hole 27a of template 27 fixing on first transport platform 12.At this moment, second transport platform 13 is in above-mentioned origin position standby.
Like this, after chip part 28 falls within on the template 27 on first transport platform 12, the circulating path of first transport platform, 12 process Fig. 3 1., supplying with stage S1 from parts moves to portrait cognitive phase S3, then, 2., 3., 4. return supply stage S1 through circulating path, follow endless path later on and 1.-4. circulate mobile.Moreover, first transport platform 12 is supplied with stage S1 from parts and is moved to portrait cognitive phase S3, substitute first transport platform 12, second transport platform 13 is supplied with stage S1 from origin position to parts and is moved, and the chip part 28 that is housed in the funnel 15 falls in each retaining hole 27a of template 27 fixing on this second transport platform 13.After, second transport platform 13 lags behind for 1 to 3 operation of first transport platform 12, moves back and forth on 5.-8. at the circulating path of Fig. 3 simultaneously, for the template 27 on first to second transport platform 12,13, carries out the action of defined in each stage.
That is, first transport platform 12 is supplied with stage S1 when portrait cognitive phase S3 moves from parts, and first transport platform 12 moves back and forth minutely in the XY direction, and the chip part 28 among the retaining hole 27a of the template 27 on first transport platform 12 is vibrated.By the direction and the size of coil 26 control supplying electric currents, different according to amplitude and acceleration can move back and forth first transport platform 12 by various spread patterns.That is, in each retaining hole 27a of template 27, chip part 28 is laid across by vibration with various spread patterns, and the poor alignment phenomenon of chip 28 almost is eliminated.Then, at portrait cognitive phase S3, the video camera 19 by shooting usefulness can be identified in and comprise in each retaining hole 27a whether chip has or the arrangement situation such as do not lay across.
Then, first transport platform 12 moves to erection stage S2 from portrait cognitive phase S3, and at this erection stage S2, each chip 28 on the template 27 is adsorbed by the adsorption nozzle not shown in the figures of absorbing unit 18, takes out from retaining hole 27a.Then, first transport platform 12 is returned to portrait cognitive phase S3, and whether identification has chip part 28 to take out condition of poor, supplies with stage S1 if having with regard to Returning part, falls chip part 28 again in each retaining hole 27a of template 27.
On the other hand, the 3rd transport platform 14 gives row stage S4 after conveyer 20 is accepted printed base plate 21 at substrate, S2 moves to erection stage, at this erection stage S2, each chip part 28 on the absorbing unit 18 is fixed on the defined position of printed base plate 21 by pasty state scolding tin not shown in the figures.The 3rd transport platform 14 moves for row stage S4 from erection stage S2 to substrate then, gives row stage S4 at this substrate, the printed base plate 21 of each chip part 28 is installed is discharged to conveyer 20 from the 3rd transport platform 14.
For the template 27 on second transport platform 13, all carry out identical action in each stage, but first to the 3rd operation of above-mentioned second transport platform, 13 corresponding first transport platform 12 lags behind, 5.-8. circulate with different circulating paths with first transport platform 12 simultaneously and move, for example: 4. first transport platform 12 moves to circulating path, when supplying with stage S1 facing to parts, 7. second transport platform 13 moves to circulating path, facing to portrait cognitive phase S3.Therefore, for example for the template 27 on second transport platform 13, when finding chip part 28 poor alignments, only need from portrait cognitive phase S3 to second transport platform of revising on the mobile XY worktable 11 of stage S5 (consulting Fig. 3) 13, revise stage S5 at this, allow second transport platform 13 stop and revising, first transport platform 12 and the 3rd transport platform 14 are moved as described above like that, can mounting core chip part 28 to printed base plate 21.In contrast, when stopping first transport platform 12, second transport platform 13 and the 3rd transport platform 14 move as described above like that, can mounting core chip part 28 to printed base plate 21.
The invention process produce following effect after the above-mentioned structure.
Chip component installation device of the present invention, have the XY worktable that constitutes two-dimensional linear motor fixed part, constitute first to the 3rd transport platform of two-dimensional linear motor movable part, in the supply stage, arrangement by defined falls the parts supply mean of the chip part that is housed in a plurality of funnels, at erection stage, the chip part that falls and arranged by adsorption nozzle absorption, and it is installed in absorbing unit on the printed base plate, carries the conveyer of this printed base plate.Mounting has the template that keeps the said chip parts respectively on above-mentioned first and second transport platform, this first and second transport platform moves with mutual different circulating paths between above-mentioned parts are supplied with stage and above-mentioned erection stage, above-mentioned the 3rd transport platform is carried above-mentioned printed base plate between above-mentioned erection stage and above-mentioned conveyer, as a side who stops first and second transport platform, carry out the arrangement of chip part, revise when waiting, allow the opposing party's transport platform and the 3rd transport platform move, mounting core chip part on printed base plate, can improve running efficiency like this, reduce the quantity of template significantly, reduce manufacturing cost.
Moreover, by moving back and forth first and second transport platform minutely, can easily vibrate the chip that falls with the various spread patterns that amplitude is different with acceleration in the XY direction, arrange chip part by vibration, can eliminate the situation of poor alignment really.
Moreover, on said structure, move first and second transport platform by the portrait cognitive phase, confirm to remain on the ordered state of the chip part on the template at this portrait cognitive phase.
Claims (3)
1. a chip component installation device is characterized in that, its device has:
XY worktable (11), the fixed part of formation two-dimensional linear motor;
First transport platform (12), the movable part of formation two-dimensional linear motor by circulating path, is supplied with between stage (S1) and the erection stage (S2) mobile at the parts that are positioned on the described XY worktable (11);
Second transport platform (13), the movable part of formation two-dimensional linear motor by being different from the circulating path of described first transport platform (12), is supplied with between stage (S1) and the erection stage (S2) mobile at parts;
The 3rd transport platform (14), the movable part of formation two-dimensional linear motor is given between row's stage (S4) mobile at the erection stage (S2) and the substrate that are positioned on the described XY worktable (11);
Template (27) is placed on respectively on described first and second transport platform;
First conveyer (20) is carried printed base plate (21) being positioned at described substrate and is given on described the 3rd transport platform (14) on row's stage (S4);
Parts supply mean (15,16,17), be housed in chip part (28) in a plurality of funnels (15) by the positional alignment of defined, with chip part (28) be supplied in described parts supply with the stage (S1) be placed on described first or the template (27) of second transport platform on;
Absorbing unit (18), absorption are positioned at erection stage (S2) and supply to chip part (28) on the described template (27), chip part (28) are installed on the printed base plate (21) of described the 3rd transport platform (14) that is positioned at erection stage (S2);
Second conveyer (20) is carried to be equipped with to be positioned at the described printed base plate (21) that described substrate is given the described chip part (28) of described the 3rd transport platform (14) on row's stage (S4).
2. chip component installation device according to claim 1 is characterized in that, by the XY direction small move back and forth described first and second transport platform (12,13), arrange the described chip part of supplying with on described template (27) (28) thus.
3. chip component installation device according to claim 1 and 2, it is characterized in that, on described XY worktable (11), portrait cognitive phase (S3) with ordered state of confirming the chip part (28) of supply on described template (27), moving of described first and second transport platform (12,13) respectively through being arranged on the described portrait cognitive phase (S3) at diverse location place.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17592797A JP3400929B2 (en) | 1997-07-01 | 1997-07-01 | Chip component mounting device |
| JP175927/1997 | 1997-07-01 | ||
| JP175927/97 | 1997-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1204942A CN1204942A (en) | 1999-01-13 |
| CN1110235C true CN1110235C (en) | 2003-05-28 |
Family
ID=16004690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98102758A Expired - Fee Related CN1110235C (en) | 1997-07-01 | 1998-07-01 | Chip Component installation device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3400929B2 (en) |
| KR (1) | KR100270763B1 (en) |
| CN (1) | CN1110235C (en) |
| GB (1) | GB2326981B (en) |
| MY (1) | MY120158A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020041481A1 (en) | 2000-09-28 | 2002-04-11 | Yoshinori Kano | Linear motor and electronic component feeding apparatus |
| JP4282018B2 (en) * | 2004-09-30 | 2009-06-17 | 東京エレクトロン株式会社 | Substrate transfer device |
| CN109060307B (en) * | 2018-09-18 | 2021-02-09 | 罗昕明 | Flip LED chip detection device |
| JP7542732B2 (en) * | 2021-04-29 | 2024-08-30 | 株式会社Fuji | Bulk feeder and parts supply control system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07157055A (en) * | 1993-12-06 | 1995-06-20 | Juki Corp | Chip component feeder |
| JPH09214177A (en) * | 1996-01-30 | 1997-08-15 | Matsushita Electric Ind Co Ltd | Chip supply method |
| JPH1013090A (en) * | 1996-06-18 | 1998-01-16 | Tdk Corp | Chip supply device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4501064A (en) * | 1981-09-08 | 1985-02-26 | Usm Corporation | Micro component assembly machine |
| DE4337811A1 (en) * | 1993-11-05 | 1995-05-11 | Philips Patentverwaltung | Arrangement for transporting printed circuit boards |
-
1997
- 1997-07-01 JP JP17592797A patent/JP3400929B2/en not_active Expired - Fee Related
-
1998
- 1998-05-15 GB GB9810319A patent/GB2326981B/en not_active Expired - Fee Related
- 1998-06-30 MY MYPI98002967A patent/MY120158A/en unknown
- 1998-06-30 KR KR1019980025438A patent/KR100270763B1/en not_active Expired - Fee Related
- 1998-07-01 CN CN98102758A patent/CN1110235C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07157055A (en) * | 1993-12-06 | 1995-06-20 | Juki Corp | Chip component feeder |
| JPH09214177A (en) * | 1996-01-30 | 1997-08-15 | Matsushita Electric Ind Co Ltd | Chip supply method |
| JPH1013090A (en) * | 1996-06-18 | 1998-01-16 | Tdk Corp | Chip supply device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2326981A (en) | 1999-01-06 |
| GB2326981B (en) | 2002-01-16 |
| JPH1126988A (en) | 1999-01-29 |
| GB9810319D0 (en) | 1998-07-15 |
| KR100270763B1 (en) | 2001-01-15 |
| KR19990013479A (en) | 1999-02-25 |
| JP3400929B2 (en) | 2003-04-28 |
| CN1204942A (en) | 1999-01-13 |
| MY120158A (en) | 2005-09-30 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |