Disclosure of Invention
The invention aims to provide a hard disk read-write device based on liquid metal cooling, and aims to solve the problems that in the prior art, a magnetic head cannot be cooled effectively and quickly, so that the information read-write precision is poor, a disk is easy to damage, and the service life of a hard disk is shortened.
The technical scheme of the invention is as follows:
the utility model provides a hard disk read-write device based on liquid metal cooling, wherein, includes the disc and is located the read-write head subassembly of disc top, the read-write head subassembly includes the read-write head shell and sets up read-write magnetic head and the liquid metal cooling module of read-write head shell inside, liquid metal cooling module including be used for storing the liquid metal coolant the accumulator, with the liquid metal cooling pipe way of accumulator intercommunication, with the current generator of liquid metal cooling pipe way intercommunication and with the cooling structure that liquid metal cooling pipe way contact set up, liquid metal cooling pipe way is including the winding pipeline of winding on read-write magnetic head surface.
In the hard disk read-write device based on liquid metal cooling, two ports of the winding pipeline are respectively communicated with the other two ports of the liquid metal cooling pipeline through two cooling pipeline adapters to form an inner flow channel of the liquid metal cooling liquid; the current generator is respectively inserted into the two cooling pipeline adapters through two lead-out wires.
The hard disk read-write device based on liquid metal cooling is characterized in that the liquid metal cooling liquid is pure liquid metal or a mixed liquid composed of the pure liquid metal and a conductive medium.
The hard disk read-write device based on liquid metal cooling is characterized in that the pure liquid metal is one or more of gallium alloy, indium alloy, gallium-indium alloy and gallium-indium-tin alloy.
The hard disk read-write device based on liquid metal cooling is characterized in that the conductive medium is one or more of conductive oil, salt solution and sodium hydroxide.
The hard disk reading and writing device based on liquid metal cooling is characterized in that the reading and writing head assembly further comprises a magnetic head mounting seat used for fixing the reading and writing magnetic head, the magnetic head mounting seat comprises a first accommodating cavity and an annular sheet arranged on the outer side of the accommodating cavity in a surrounding mode, and a plurality of through holes used for penetrating through the liquid metal cooling pipeline are formed in the first accommodating cavity.
The hard disk reading and writing device based on liquid metal cooling comprises a reading and writing magnetic head, a first accommodating cavity and a second accommodating cavity, wherein the reading and writing magnetic head comprises a cylindrical magnet fixedly connected with the bottom of the first accommodating cavity, the upper end of the cylindrical magnet is provided with a signal interface used for connecting an input and output signal line of a reading and writing head, and the lower end of the cylindrical magnet is provided with two magnetic sheets which are inclined inwards and are symmetrically arranged; the winding pipe is wound on the surface of the cylindrical magnet.
The hard disk reading and writing device based on liquid metal cooling is characterized in that the liquid metal cooling pipeline further comprises a first cooling pipeline and a second cooling pipeline which are located on two sides of the storage and communicated with the storage, and the cooling structures are arranged below the first cooling pipeline and the second cooling pipeline.
The hard disk read-write device based on liquid metal cooling comprises a semiconductor cooling chip, a plurality of energy conduction blocks arranged above the semiconductor cooling chip and a plurality of radiating fins arranged below the semiconductor cooling chip.
The hard disk reading and writing device based on liquid metal cooling comprises a storage, a first containing cavity, a sealing cover and a filter screen, wherein the storage comprises a second containing cavity used for storing liquid metal cooling liquid, the sealing cover is arranged above the second containing cavity, and the filter screen is arranged at the lower end of the sealing cover.
Has the advantages that: the hard disk reading and writing device based on liquid metal cooling comprises a disk and a reading and writing head assembly positioned above the disk, wherein the reading and writing head assembly comprises a reading and writing head shell, a reading and writing magnetic head and a liquid metal cooling assembly, the reading and writing magnetic head and the liquid metal cooling assembly are arranged in the reading and writing head shell, the liquid metal cooling assembly has the advantages of being simple in structure, compact in design and high in heat exchange efficiency, heat generated by the reading and writing magnetic head in the information reading and writing process can be effectively transported to the cooling structure through the liquid metal cooling assembly, the reading and writing magnetic head can be rapidly cooled, and therefore the service life of the hard disk reading and writing device is.
Detailed Description
The invention provides a hard disk read-write device based on liquid metal cooling, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and 2, an embodiment of the invention provides a hard disk read/write apparatus based on liquid metal cooling, which includes a disk 10 and a read/write head assembly 20 located above the disk 10, where the read/write head assembly 20 includes a read/write head housing 21, and a read/write head 30 and a liquid metal cooling assembly 40 that are disposed inside the read/write head housing 21, the liquid metal cooling assembly 40 includes a reservoir 50 for storing liquid metal cooling liquid, a liquid metal cooling pipe 60 communicated with the reservoir 50, a current generator 01 communicated with the liquid metal cooling pipe 60, and a cooling structure 70 disposed in contact with the liquid metal cooling pipe 60, and the liquid metal cooling pipe 60 includes a winding pipe 61 wound on a surface of the read/write head 30.
In this embodiment, a liquid metal coolant is used as a heat exchange medium in a heat exchange process, and an electric field generated by the current generator 01 can drive the liquid metal coolant in the reservoir 50 to flow, so that the liquid metal coolant flows through the winding pipe 61 and a liquid metal cooling pipe portion in contact with the cooling structure 70 and circulates back and forth, the liquid metal coolant absorbs heat generated by the read-write magnetic head 30 when flowing through the winding pipe 61 and changes into a high-temperature liquid metal coolant, and the cooling structure can cool the high-temperature liquid metal coolant when flowing through the liquid metal cooling pipe portion in contact with the cooling structure 70, thereby achieving convective heat exchange; that is to say, in this embodiment, the liquid metal cooling assembly is disposed inside the read/write head housing 21, so that heat generated by the read/write magnetic head 30 during information reading/writing can be effectively transported to the cooling structure for heat exchange, thereby achieving rapid cooling of the read/write magnetic head 30, and effectively improving the information reading/writing precision and the service life of the hard disk reading/writing device.
In this embodiment, the current direction generated by the current generator 01 is the same as the flowing direction of the liquid metal cooling liquid, and the current generated by the current generator 01 not only can effectively drive the liquid metal cooling liquid to flow in the channel, but also can effectively reduce the surface tension of the liquid metal cooling liquid and enhance the wetting characteristic thereof, thereby reducing the flowing resistance of the liquid metal cooling liquid.
The hard disk reading and writing device based on liquid metal cooling provided by the embodiment has the advantages of simple structure, compact design and relative independence of all components, and is convenient to maintain and overhaul; the hard disk read-write device based on liquid metal cooling also has the characteristic of good interchangeability, and can realize modularization, serialization and rapid design; the hard disk reading and writing device based on liquid metal cooling has no special requirements on working environment, can adapt to various special environments, has good cooling effect of the reading and writing magnetic head, has high heat dissipation efficiency in the hard disk reading and writing device, and can effectively prolong the service life of the hard disk reading and writing device.
In some embodiments, different liquid metal cooling liquids can be selected according to cooling requirements, common temperature states and environmental requirements, when the working temperature of the heat source is higher, a liquid metal with a higher melting point can be selected, and the composition of different liquid metal cooling liquids can be designed and selected according to heat dissipation requirements.
In some embodiments, the liquid metal coolant is a pure liquid metal or a mixed liquid composed of a pure liquid metal and a conductive medium. By way of example, the pure liquid metal is one or more of gallium alloy, indium alloy, gallium indium alloy, and gallium indium tin alloy, but is not limited thereto; the conductive medium is one or more of conductive oil, salt solution and sodium hydroxide, but is not limited thereto.
In some embodiments, a micro pump may be further disposed on the liquid metal cooling pipe 60, and the micro pump may be used as a flow power source of the liquid metal micro pump heat exchanging device, and when the liquid metal cooling liquid flows slowly or does not flow under the action of an electric field generated by the current generator, the micro pump may be activated to force the liquid metal cooling liquid to flow in the channel, so as to improve the convection heat exchanging efficiency. By way of example, the micropump is one of a micro peristaltic pump, a micro plunger pump, a micro pressure pump, or a micro gear pump, but is not limited thereto.
In some embodiments, as shown in fig. 2 and 3, the head assembly 20 further includes a head mount 80 for fixing the read/write head 30, the head mount 80 includes a first receiving cavity 81 and a ring 82 surrounding the first receiving cavity 81, and the first receiving cavity 81 is provided with a plurality of through holes for passing through the liquid metal cooling channel. In this embodiment, the magnetic head mount 80 is conveniently fixed inside the head housing 21 by the ring piece 82; first last side and the lower side that holds chamber 81 all are provided with 2 and perforate 83, the both ends of winding pipeline 61 are passed through earlier two perforation bendings of side stretch into down the first inside that holds chamber 81, later follow again two perforation of going up the side are worn out the first outside that holds chamber 81, the both ends of winding pipeline 61 are worn out respectively are connected with a cooling tube adapter 62 behind the first outside that holds chamber 81, winding pipeline 61 passes through cooling tube adapter 62 with two other ports 63 of liquid metal cooling tube 60 communicate, form the circulation internal flow passageway of liquid metal coolant liquid.
In some embodiments, as shown in fig. 2 and 7, two ports of the winding pipe 61 are respectively communicated with the other two ports 63 of the liquid metal cooling pipe 60 through two cooling pipe joints 62 to form an inner flow channel of the liquid metal cooling liquid; current generator 01 inserts respectively through two extraction wires 02 in two cooling tube adapters 62, the electric field that current generator 01 produced can drive liquid metal coolant liquid is in flow in the circulation passageway.
In some embodiments, as shown in fig. 3, the read/write magnetic head 30 includes a cylindrical magnet 31 fixedly connected to the bottom of the first accommodating cavity 81, a signal interface 32 for connecting an input/output signal line of the read/write head is disposed at an upper end of the cylindrical magnet 31, and two magnetic sheets 33 are disposed at a lower end of the cylindrical magnet 31, wherein the two magnetic sheets are tilted inward and are symmetrically disposed; the winding tube 61 is wound around the surface of the cylindrical magnet 31. In this embodiment, in the process of reading and writing information by the read-write magnetic head 30, the magnetic sheet 33 disposed at the lower end of the cylindrical magnet 31 directly contacts with the disk 10, heat generated by the magnetic sheet 33 is transmitted to the cylindrical magnet 31, the winding pipe 61 wound on the surface of the cylindrical magnet 31 absorbs the heat by the liquid metal cooling liquid therein and transmits the liquid metal cooling liquid after absorbing the heat to the cooling structure for heat exchange, so as to achieve rapid cooling of the read-write magnetic head 30, thereby improving fine information reading and writing of the read-write magnetic head and prolonging the service life of the hard disk read-write apparatus.
In some embodiments, the read/write head 30 is removably attached to the head mount 80 for easy disassembly, assembly, and replacement. For example, an external thread is disposed outside the cylindrical magnet 31 of the read/write magnetic head 30, an internal thread is disposed inside the first accommodating cavity 81 of the magnetic head mounting seat 80, and the cylindrical magnet 31 and the first accommodating cavity 81 are screwed by matching the external thread and the internal thread, so that the read/write magnetic head 30 and the magnetic head mounting seat 80 are connected.
In some specific embodiments, the read-write magnetic head 30 and the magnetic head mounting seat 80 can be fixedly bonded by an adhesive.
In some embodiments, as shown in fig. 3 and 4, the liquid metal cooling conduit 60 further comprises a first cooling conduit 64 and a second cooling conduit 65 positioned on both sides of the reservoir 50 and in communication with the reservoir 50, and the cooling structure 70 is disposed below each of the first cooling conduit 64 and the second cooling conduit 65. In order to improve the heat exchange efficiency of the liquid metal cooling assembly, two cooling pipelines are arranged in the embodiment, and a cooling structure 70 is arranged below each cooling pipeline.
In some embodiments, the first cooling conduit 64 and the second cooling conduit 65 are both conduits in an S-shaped arrangement. The liquid metal cooling liquid located in the winding pipe 61 absorbs the heat of the read-write magnetic head 30 and then flows through the first cooling pipe 64 and the second cooling pipe 65 in sequence, in this embodiment, the first cooling pipe 64 and the second cooling pipe 65 are set to be S-shaped, so that the contact area between the cooling pipes and the cooling structure can be effectively increased, the heat exchange efficiency of the liquid metal cooling assembly is effectively improved, the read-write magnetic head 30 is cooled quickly, and the fine information read-write of the read-write magnetic head and the service life of the hard disk read-write device are further realized.
In some embodiments, as shown in FIG. 4, the head housing 21 is arranged in a Y-shaped configuration, and the first cooling conduit 64 and the second cooling conduit 65 are arranged at the left diagonal portion and the right diagonal portion of the Y-shaped head housing, respectively; the storage 50 is disposed at the junction of the left and right oblique portions of the Y-shaped head housing, and the read/write head 30 and the head mount 80 are disposed at the vertical portion of the Y-shaped head housing. In the embodiment, the shape of the head housing 21 is designed to be Y-shaped, because the cooling pipes arranged closely to the outline of the Y-shaped housing can make the cooling pipes longer, increase the heat exchange area, and make the overall structure of the assembly more compact.
In some embodiments, as shown in fig. 1, 4-5, a cooling structure 70 is disposed below each of the first cooling pipe 64 and the second cooling pipe 65, and taking the cooling structure 70 below the first cooling pipe 64 as an example, the cooling structure 70 includes a plurality of energy conduction blocks 71 directly contacting the first cooling pipe 64, a semiconductor cooling chip 72 below the energy conduction blocks 71, and a plurality of heat dissipation fins 73 below the semiconductor cooling chip 72. In this embodiment, the semiconductor cooling chip 72 can be rapidly cooled after being connected to a chip power supply, and at this time, the energy conduction block 71 is equivalent to a cooling block, and when the high-temperature liquid metal coolant absorbing heat of the read/write magnetic head 30 flows through the first cooling pipe 64, the energy conduction block 71 can rapidly conduct cold air generated by the semiconductor cooling chip 63 into the high-temperature liquid metal coolant, so that the temperature of the high-temperature liquid metal coolant is rapidly reduced, thereby achieving efficient convective heat transfer. In this embodiment, the energy conduction block 71 can also effectively prevent the semiconductor cooling chip 72 from directly contacting the first cooling pipe 64, so as to prevent the liquid metal cooling liquid inside the first cooling pipe 64 from condensing, and thus block or obstruct the flow of the liquid metal cooling liquid in the first cooling pipe 64. By way of example, 3 energy conduction blocks 71 can be disposed above the semiconductor cooling chip 72, and 3 heat dissipation fins 73 can be disposed below the semiconductor cooling chip 72, wherein the heat dissipation fins 73 are mainly used for dissipating heat generated by the semiconductor cooling chip 72 during a cooling process.
In some embodiments, to improve the heat convection efficiency of the liquid metal cooling assembly 40, the cooling structures 70 may be disposed at both upper and lower ends of the first cooling pipe 64 and the second cooling pipe 65, so as to double the heat exchange efficiency of the liquid metal cooling assembly 40.
In some embodiments, as shown in fig. 2 and 6, the reservoir 50 includes a second receiving chamber 51 for storing the liquid metal coolant, a sealing cover 52 disposed above the second receiving chamber 51, and a filter net 54 disposed at a lower end of the sealing cover 52. In this embodiment, the sealing cover 52 can prevent the liquid metal in the second accommodating cavity 51 from leaking, and the filter screen 54 can be used for filtering micro-nano aggregated particles formed in the liquid metal during the flowing process and dust deposited in the flow channel, so as to effectively prevent the liquid metal from being blocked during the flowing process; the filter screen 54 can also be used as a droplet generator, and when the liquid metal coolant passes through the filter screen, the filter screen can divide the liquid metal coolant into smaller droplets, so that the liquid metal coolant has a larger specific surface area, the heat exchange efficiency can be improved, and the temperature of the read-write head can be reduced more efficiently.
In some specific embodiments, as shown in fig. 6, the filter screen 54 includes a plurality of filter sheets 541 arranged in a matrix, and a plurality of filter holes 542 are disposed on the filter sheets 541. The size of the filtering holes 542 can be set according to requirements.
In some embodiments, as illustrated in FIG. 1, the disk 10 is provided with a data recording region 11 and a head landing region 12. Specifically, the head parking area 12 is disposed at an edge position of the disk 10, the head parking area 12 surrounds the data recording area 11, the read/write head 30 is suspended on the data recording area 11 for data writing and reading when the hard disk is in operation, and the read/write head 30 is placed in the head parking area 12 when the hard disk is out of operation.
In summary, in the present invention, liquid metal is used as a heat exchange medium in a heat exchange process, and an electric field generated by the current generator can drive liquid metal coolant in the reservoir to flow, so that the liquid metal coolant flows through the winding pipe and a liquid metal cooling pipe portion in contact with the cooling structure and circulates back and forth, the liquid metal coolant absorbs heat generated by the read-write head when flowing through the winding pipe to change into high temperature liquid metal coolant, and the cooling structure can cool the high temperature liquid metal coolant when flowing through the liquid metal cooling pipe portion in contact with the cooling structure, thereby achieving convective heat exchange; that is to say, this embodiment through set up inside the read-write head shell the liquid metal cooling module can effectively with the heat that read-write magnetic head produced at information reading and writing in-process is transported to cooling structure and is carried out the heat transfer to the realization is to the rapid cooling of read-write magnetic head, thereby effectively promotes information reading and writing precision and hard disk read-write device's life.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.