CN111026253A - Liquid-cooled chip radiator with low-resistance flow channel enhanced heat exchange upper cover - Google Patents
Liquid-cooled chip radiator with low-resistance flow channel enhanced heat exchange upper cover Download PDFInfo
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- CN111026253A CN111026253A CN201911249236.8A CN201911249236A CN111026253A CN 111026253 A CN111026253 A CN 111026253A CN 201911249236 A CN201911249236 A CN 201911249236A CN 111026253 A CN111026253 A CN 111026253A
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- G06—COMPUTING OR CALCULATING; COUNTING
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- G06F1/20—Cooling means
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Abstract
本发明公开了一种具有低阻流道强化换热上盖的液冷芯片散热器，散热器由上盖和底托构成。上盖设有一个进水两个出水口，换热腔体位于上盖的中央，靠近进水口一侧设有分水池。出水口与换热腔体的集水池相通，分水池与集水池分隔开，分水池框架的外侧空间与集水池连通。分水池框架内设有密封垫，密封垫的正中间开有喷水口。上盖水流通道的设计，具有低阻力循环强化散热的作用。尤其是上盖密封垫的面积与微槽道上表面相等，冷流体通过密封垫开口进入微槽道只能从槽道微小翅片的间隙中流出，使得冷流体与微槽道能够充分换热。由于流体在上盖内流动的路径没有死角，所以阻力明显降低。散热器厚度较薄，但换热面积相对较大，非常适用于服务器窄小的空间。
The invention discloses a liquid-cooled chip radiator with a low-resistance flow channel and an upper cover for strengthening heat exchange. The radiator is composed of an upper cover and a bottom bracket. The upper cover is provided with one water inlet and two water outlets, the heat exchange cavity is located in the center of the upper cover, and a water dividing pool is arranged on the side close to the water inlet. The water outlet is communicated with the water collecting pool of the heat exchange cavity, the water dividing pool is separated from the water collecting pool, and the outer space of the water dividing pool frame is communicated with the water collecting pool. A sealing gasket is arranged in the frame of the water distribution pool, and a water spout is opened in the middle of the sealing gasket. The design of the water flow channel on the upper cover has the effect of low resistance circulation and enhanced heat dissipation. In particular, the area of the gasket on the top cover is equal to the upper surface of the micro-channel, and the cold fluid entering the micro-channel through the opening of the gasket can only flow out from the gap between the micro-fins of the channel, so that the cold fluid and the micro-channel can fully exchange heat. Since the path of the fluid flowing in the upper cover has no dead ends, the resistance is significantly reduced. The thickness of the radiator is thin, but the heat exchange area is relatively large, which is very suitable for the narrow space of the server.
Description
Technical Field
The invention belongs to the field of heat energy engineering enhanced heat transfer, and particularly relates to a radiator device for cooling a computer CPU chip.
Background
All computers including chips of mobile phones are high heat flow density heating devices, a computer server usually has dozens or even hundreds of multi-core CPUs, and the high performance is accompanied by higher heating value and heat flow density, and the problem of efficient cooling of the CPU chips becomes the fetcher for further improving the performance of the computer. At present, the chip cooling of the data center mainly takes air cooling as a main part, namely, a fan is arranged in a server, and heat is taken away by cold air which flows forcibly. It is known that the cooling efficiency is high if the heat of the chip is taken away by water cooling, and various water-cooled radiators are available at present. The main problem or research focus of water-cooled heat dissipation is how to improve the heat dissipation efficiency of fluid and how to take away more heat. The key technology is the heat dissipation unit structure and the packaging structure in the cavity of the heat sink.
The liquid cooling radiator adopted by the existing data center generally consists of a bottom support and a sealing cover which are combined together to form a heat exchange cavity. The bottom support is provided with radiating units of different forms, such as a fin column, a micro-channel, a small fin and the like, and the radiating units exchange heat with cooling fluid. The design of the sealing cover structure mainly plays important roles of reasonable flow guide of fluid, heat exchange path of fluid and the like except for forming a sealing cavity. At present, most of research on radiators by many research and development institutions focuses on a bottom support, so that various radiating units are designed, and the emphasis is on how to increase the heat exchange area and the like. The form and the structure of the heat dissipation unit can be designed into various forms, and the purpose is how to increase the heat exchange area under the same appearance volume. However, the problems that arise from this are: the heat exchange area is increased, and the flowing resistance of cooling water is greatly improved, so that the research on the structure of the bottom support heat dissipation unit is very difficult. However, people neglect the research on the sealing upper cover of the water-cooling radiator, the optimized design of the upper cover can play a role of getting twice with half effort on the improvement of the heat exchange efficiency of the radiator, the reasonable flow guide and the optimized heat exchange path structure in the upper cover can relatively reduce the flow resistance, a low-resistance flow field is formed, and the efficiency and the performance of the water (liquid) cooling radiator can be greatly improved.
Disclosure of Invention
The invention aims to provide a liquid cooling chip radiator device with a low-resistance flow channel reinforced heat exchange upper cover, which is used for cooling a computer CPU chip and effectively improving the heat radiation performance of the CPU on the basis of reducing the flow resistance of a cooling fluid.
The technical scheme adopted for realizing the purpose of the invention is as follows: the radiator device is formed by integrating an upper cover and a bottom, the upper cover is provided with a water inlet and two water outlets, the water inlet is positioned in the middle of the upper cover, and the two water outlets are positioned on the upper part or the lower part of the upper cover. The heat exchange cavity is positioned in the center of the upper cover, a diversion basin is arranged on one side, close to the water inlet, in the heat exchange cavity, the two water outlets are communicated with a water collecting basin of the heat exchange cavity, and the diversion basin is separated from the water collecting basin. The outer space of the diversion basin frame is communicated with the water collecting basin, a sealing gasket is arranged in the diversion basin frame, a water spraying opening is formed in the middle of the sealing gasket, and sealing grooves are formed in the periphery of the upper cover heat exchange cavity and used for placing sealing rings.
As an integral radiator, the structure of its collet is: the collet is provided with a rectangular micro-channel, a plurality of dense micro fins are processed on the micro-channel, the edges of the left side and the right side of the micro-channel are provided with slopes of 45 degrees, and the central processing of the micro-channel is provided with a U-shaped water inlet groove. The depth of the water inlet groove, the height of the micro-groove 1/2 and the area of the whole micro-groove are equal to the area of the upper cover sealing gasket. The periphery of the micro-channel is provided with a water collecting tank, and after the upper cover and the bottom support are sealed and combined into a whole, the water collecting tank is communicated with the outer space of the upper cover diversion basin frame.
In addition to the structure of the radiator, the flow mode of the cooling fluid on the upper cover is innovative compared with the prior art in that the design points are that in consideration of low flow resistance: (1) the water diversion pool in the fluid inlet and the heat exchange cavity is designed into a cylindrical structure (with the volume of 1/4), namely, the fluid is jetted into the rectangular micro-channel on the bottom support from top to bottom through the circular-arc water diversion pool (through the water jet of the sealing gasket). (2) And after heat exchange is carried out between cooling fluid and the micro fins on the micro channel, the cooling fluid flows into the water collecting tank through the outer space around the water dividing tank frame, round holes are formed in the left end and the right end of the top end inside the water collecting tank and are respectively communicated with the water outlet, and the wall surface of an end corner is also arc-shaped, namely, no dead angle exists in the flowing path of the fluid in the upper cover. The position of the water diversion pool is not at the center of the heat exchange cavity, but deviates from the center line and is closer to the position of the water inlet. The design aims to shorten the path of cold fluid in the upper cover and enter the heat exchange cavity as soon as possible.
The direction of the micro-channel small fins is consistent with the flowing direction of the fluid, the flowing resistance can be reduced, the micro-fins are immersed in the water flow, the fluid can form a uniform flow field, the CPU chip can be fully cooled, and the heat transfer is enhanced.
The important technical characteristic is the determination of parameters of all parts of the bottom support structure. Except that the area of the upper cover sealing gasket is equal to the upper surface of the micro-channel, the heat transfer experiment and the numerical calculation are based on the fact that the heat exchange area of the micro-channel, the inlet temperature of the fluid and the flow rate of the cooling water are determined according to the heat flow density (converted temperature) of the chip. Wherein the heat transfer area includes: the net height of the small fins, the height higher than the plane of the bottom support, the depth of the water collecting tank from the plane of the bottom support, and the length and the width of the whole micro-channel. The thickness and the spacing (including the machining capacity) of the micro-channel small fins are calculated through fluid mechanics experiments and numerical simulation.
The temperature and flow of the cooling liquid can be changed and adjusted according to the heat load (heat flux density) of the CPU, so that good parameter matching is achieved. Experiments prove that the pressure drop caused by the structure is very small, the heat of the bottom support is transferred to the micro fins in a high heat conduction mode, and then the heat is dissipated through cooling fluid.
The invention has the characteristics and beneficial effects that the design of the water flow channel of the upper cover of the radiator has the function of low resistance circulation enhanced heat dissipation. The key technology is that the area of the upper cover sealing gasket is equal to the upper surface of the micro-channel, and cold fluid enters the micro-channel through the sealing gasket opening and only flows out of the gap of the micro-fin of the channel, so that the cold fluid and the micro-channel can exchange heat fully. Since the path of the fluid flowing in the upper cover has no dead space, the resistance is remarkably reduced. The radiator is thin, but the heat exchange area is relatively large, so that the radiator is very suitable for narrow spaces of computer servers, the liquid cooling enables the temperature equalizing effect of a CPU chip to be better, and the working temperature of the CPU can be effectively reduced.
Drawings
Fig. 1 is a front perspective view of the cover attaching apparatus according to the present invention.
Fig. 2 is a perspective view showing a flat position of the gasket according to the present invention.
Fig. 3 is a perspective view showing a vertical position of the gasket according to the present invention.
Fig. 4 is a perspective view of the bottom of the upper cover of the device of the present invention.
Fig. 5 is a front perspective view of the shoe device of the present invention.
Detailed Description
The principles and construction of the present invention are further described in the following detailed description of the preferred embodiments in conjunction with the accompanying drawings. It should be noted that the present embodiment is illustrative and not restrictive, and the scope of the invention is not limited by the embodiment.
The liquid cooling chip radiator with the low-resistance flow channel reinforced heat exchange upper cover is characterized in that the radiator device is formed by integrating an upper cover and a bottom, and the structure is as follows: the upper cover 1 is provided with a water inlet and two water outlets, the water inlet 1-1 is positioned in the middle of the upper cover, and the two water outlets 1-2 and 1-3 are positioned on the upper part or the lower part of the upper cover. The heat exchange cavity 1-4 is positioned in the center of the upper cover, a water diversion pool 1-5 is arranged on one side of the heat exchange cavity close to the water inlet, and the two water outlets are communicated with a water collection pool 1-6 of the heat exchange cavity. The diversion basin is separated from the water collecting basin, and the outer space of the diversion basin frame is communicated with the water collecting basin. The inside of the diversion basin frame is provided with a sealing gasket 1-7, the middle of the sealing gasket is provided with a water spray port 1-8, the sealing gasket is embedded in the diversion basin frame, and the thickness of the sealing gasket is exactly equal to that of the diversion basin frame. And sealing grooves 1-10 are arranged outside the heat exchange cavity body and used for placing sealing rings.
Only one of the two water outlets of the upper cover is utilized, and the position of the water outlet can be designed to be the same side with the water inlet; it can also be designed on the opposite side of the water inlet. The water inlet and the water outlet are provided with an interface device with an angle capable of being adjusted at will and fixed for installing an external movable joint.
The bottom support 2 is provided with a rectangular micro-channel, a plurality of dense micro fins are processed on the micro-channel, the edges of the left side and the right side of the micro-channel are provided with slopes of 45 degrees, and the center of the micro-channel is processed with a U-shaped (concave) water inlet groove 2-1. The depth of the water inlet groove is 1/2 of the height of the micro-groove, and the area of the whole micro-groove is equal to that of the sealing gasket of the upper cover. The periphery of the micro-channel is provided with a water collecting tank 2-2, and after the upper cover and the bottom support are sealed and combined into a whole, the water collecting tank is communicated with the outer space of the upper cover water diversion pool frame.
The sealing gasket of the upper cover is provided with positioning grooves 1-9 (shown in figures 2 and 3), and positioning bosses are arranged at corresponding positions in the diversion basin frame of the upper cover and used for accurately installing the sealing gasket. After the sealing gasket is installed in a lying position, the sealing gasket and the diversion basin frame just form a complete plane, so the thickness of the sealing gasket is the reserved depth of the upper eave of the diversion basin frame.
A groove with the depth of 1mm is arranged on the reverse side of the bottom support from the edge to the center of the bottom support and is used for installing a thermocouple and monitoring the temperature of the bottom surface of the chip in real time.
The small fin matrix with the bottom support as the heat exchange unit is generally called a micro-channel, and the net height of the small fins of the rectangular micro-channel of the bottom support is 2-3 mm; the small fins are 1-1.5mm higher than the plane of the bottom support; the depth of the water collecting tank from the plane of the bottom support is 1-1.5 mm; the length of the whole micro-channel is 30-35 mm; the whole width is 20-25 mm; the thickness and the interval of the micro-channel small fins are both 0.01mm, and the bottom support is made of red copper material.
And sealing grooves 2-3 for placing sealing rings are also arranged at the positions corresponding to the sealing grooves of the heat exchange cavity of the upper cover and the bottom support.
When the heat dissipation device is used, the heat dissipation base is closely contacted and fixed with the heat-dissipated device, and a thermal bonding layer material with high thermal conductivity is arranged between the base and the heat-dissipated device.
As an example, the area of the bottom support is 80X 80 mm; the thickness is 2.5 mm; the area of the rectangular micro-channel part of the bottom support is 30 multiplied by 22mm, and the whole height of the upper cover is 15 mm.
The upper cover, the sealing ring and the bottom support are fastened and sealed through screws, a special screw hole designed for the bottom support is fixed with the CPU and the substrate, and the bottom surface (figure 4) of the upper cover is actually the upper surface or the front surface of the radiator in use. The heat exchange cavity is positioned in the center of the upper cover, but the water diversion pool is not positioned in the center of the heat exchange cavity and is positioned on one side close to the water inlet of the heat exchange cavity of the upper cover. The cooling water enters a diversion basin of a radiator (water inlet) from an external water pipeline, and a sealing gasket is arranged below the diversion basin. The function of the sealing gasket is two: firstly, the diversion basin has the function of a 'water supply tank', namely the diversion basin is always in a 'full water' state in the cooling water circulation process, and the function of the diversion basin is to ensure that the water supply entering the rectangular micro-channel (small fin) of the bottom support is always stable. The second function of the sealing gasket is to make the cooling water only enter the water inlet groove recessed from the bottom support through the water outlet in the middle of the sealing gasket (the recessed part occupies about the microchannel 4/5, as shown in fig. 5), because the sealing gasket covers the top of the heat exchange unit (the small fin matrix), the cooling water only can flow out through the gap between the small fins (the gap is called as microchannel in the theory of intensified heat transfer), then the cooling water (with increased temperature) is converged in the water collecting grooves (as shown in fig. 5) arranged around the microchannel, and finally discharged through the water outlet of the upper cover. The process belongs to micro-channel enhanced heat exchange. In order to reduce the flow resistance, the edges of the left side and the right side of the micro-channel are provided with 45-degree slopes,
the device is mainly used for water-cooling heat dissipation of a computer CPU chip and is loaded on a server substrate. Because computer server racks are populated with multiple substrates and the components on each substrate are very dense, the area or volume of the heat sink is particularly important. In view of this, the form of the server substrate components is of various types, so the design of the water inlet and outlet positions of the water-cooled radiator on the same side or on the other side is more critical. The water inlet and outlet positions of the device can be conveniently replaced and installed, the water inlet and outlet of the upper cover are provided with sealing self-locking (convenient for fixing the position) structures, and the angle position of the movable joint can be set at will without water leakage.
The path of the fluid flowing in the upper cover has no dead angle, and the flow resistance is obviously reduced. The whole thickness of the radiator is thin, but the heat exchange area is relatively large, and the radiator is suitable for narrow space of a computer server.
Claims (8)
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Cited By (5)
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| CN113761758A (en) * | 2021-11-09 | 2021-12-07 | 飞腾信息技术有限公司 | Heat dissipation performance optimization method for water-cooled head radiator, radiator and server |
| CN113905580A (en) * | 2021-09-02 | 2022-01-07 | 浙江零跑科技股份有限公司 | ADAS domain controller integral type water-cooling heat radiation structure |
| CN114531824A (en) * | 2022-01-27 | 2022-05-24 | 南京恒电电子有限公司 | High heat flux density binary channels cooling system |
| CN114594837A (en) * | 2022-03-14 | 2022-06-07 | 英业达科技有限公司 | CPU liquid cooling plate |
| TWI785409B (en) * | 2020-10-30 | 2022-12-01 | 大陸商深圳昂湃技術有限公司 | Easily expanded liquid-cooled heat sink |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI785409B (en) * | 2020-10-30 | 2022-12-01 | 大陸商深圳昂湃技術有限公司 | Easily expanded liquid-cooled heat sink |
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