CN111010801A - A double-sided heat dissipation chip package structure, method and device - Google Patents
A double-sided heat dissipation chip package structure, method and device Download PDFInfo
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- CN111010801A CN111010801A CN201911391556.7A CN201911391556A CN111010801A CN 111010801 A CN111010801 A CN 111010801A CN 201911391556 A CN201911391556 A CN 201911391556A CN 111010801 A CN111010801 A CN 111010801A
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- chip
- double
- heat dissipation
- copper
- sided
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H10P72/0438—
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- H10W40/22—
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- H10W74/111—
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a double-sided heat dissipation chip packaging method, which comprises the following steps: reserving chip holes on the dielectric plate; placing a chip into the chip hole, and laminating the upper side and the lower side of the dielectric plate by using a dielectric layer and a copper foil to form a double-sided copper-clad plate; drilling and copper plating are carried out on the double-sided copper-clad plate to ensure that the electrodes of the chip are connected to the copper foils on the two sides of the double-sided copper-clad plate; manufacturing a graphic circuit on the copper foil; and a heat dissipation device is arranged on the copper foils on the two sides of the double-sided copper-clad plate through heat conducting glue for heat dissipation. The invention also discloses a packaging device and a packaging structure manufactured by the packaging method or the packaging device.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a double-sided heat dissipation chip packaging structure, a method and a device.
Background
With the development of the functionalization and the intellectualization of electronic products, the high integration degree, the thinning and the miniaturization of the electronic products become mainstream trends, and the printed circuit board inevitably develops towards the directions of thinning, high density, three-dimensional structure and the like on the premise of meeting the good electrical and thermal properties of the electronic products, so that the design requirements of the miniaturization and the high integration degree of modern electronic products are met. This means that the circuit board package design must meet the following requirements: reduce the packaging height and improve the packaging density. Therefore, the chip-embedded technology is becoming an important development direction. The chip embedding process is to embed a chip in a dielectric layer in the manufacturing process of a printed circuit board, and then realize the conduction and interconnection of an external pattern and an inner layer chip through a metallized micropore.
With the popularization of electric vehicles, high-power chips are widely applied, the power density is higher and higher, the traditional chip packaging adopts a single-side heat dissipation packaging mode, the heat dissipation capacity is limited by the single-side heat dissipation area, and the development of the power chips to higher power density is restricted.
Disclosure of Invention
The invention aims to provide a chip packaging structure with double-sided heat dissipation, a method and a device for the same, aiming at the defects of the prior art, so that double-sided heat dissipation of a chip circuit board can be realized, the power density of the packaging structure is effectively improved, and the heat dissipation requirement is met.
The technical scheme of the invention is as follows:
a double-side heat dissipation chip packaging method comprises the following steps:
s1, reserving chip holes on the dielectric slab;
s2, placing a chip into the chip hole, and laminating the dielectric layer and the copper foil on the upper side and the lower side of the dielectric plate to form a double-sided copper-clad plate;
s3, drilling and copper plating are carried out on the double-sided copper-clad plate to enable the electrodes of the chip to be connected to the copper foils on the two sides of the double-sided copper-clad plate;
s4, manufacturing a graphic circuit on the copper foil;
and S5, arranging a heat dissipation device on the copper foils on the two sides of the double-sided copper-clad plate through heat conducting glue for heat dissipation.
Further, the step S5 includes:
s501, arranging a spring plate electrode on the copper foil through conductive adhesive, wherein the spring plate electrode is connected with an electrode of the chip;
s502, arranging insulating heat-conducting glue on the copper foil except the conducting glue;
s503, arranging the heat dissipation device on the insulating heat conducting glue.
Further, the step S5 includes:
s511, arranging a spring plate electrode on the copper foil through conductive adhesive, wherein the spring plate electrode is connected with an electrode of the chip;
s512, plastic packaging is carried out on the copper foil, and a radiating surface is reserved;
s513, arranging the heat dissipation device on the heat dissipation surface through heat conduction glue.
Further, the step S502 is: and arranging insulating heat-conducting glue on the copper foil except the conductive glue, and sequentially arranging DBC (direct bonded copper) ceramics and the insulating heat-conducting glue on the insulating heat-conducting glue.
Further, the heat dissipation device is a water-cooling heat dissipation device.
Further, the copper plating mode of the hole is electroless copper plating or electrolytic copper plating.
Further, the thickness of the chip hole is 20 microns larger than that of the chip, and the diameter of the chip hole is 30 microns larger.
Further, the dielectric layer and the dielectric plate are both prepregs.
The invention also discloses a double-sided heat dissipation chip packaging device, which comprises:
the chip placing equipment is used for placing the chip into a chip hole reserved on the dielectric plate;
the laminating equipment is used for laminating the upper side and the lower side of the dielectric plate by using the dielectric layer and the copper foil to form a double-sided copper-clad plate;
the circuit manufacturing equipment is used for manufacturing a graphic circuit on the copper foil;
and the heat dissipation setting equipment is used for setting a heat dissipation device on the copper foils on the two sides of the double-sided copper-clad plate through heat conducting glue for heat dissipation.
The invention also discloses a double-sided heat dissipation chip packaging structure which is processed by the double-sided heat dissipation chip packaging method.
The invention also discloses a double-sided heat dissipation chip packaging structure which is processed by the double-sided heat dissipation chip packaging device.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a double-side heat dissipation chip packaging structure, a method and a device.
Drawings
Fig. 1 is a schematic flow chart of a method for processing an embedded wiring board according to embodiment 1 of the present invention.
Fig. 2 is a schematic view of a part of the steps of the method for processing an embedded wiring board according to embodiment 1 of the present invention.
Fig. 3 is a schematic view of a part of the steps of the method for processing an embedded wiring board according to embodiment 1 of the present invention.
Fig. 4 is a schematic view of a part of the steps of the method for processing an embedded wiring board according to embodiment 1 of the present invention.
Fig. 5 is a schematic view of a part of the steps of the method for processing an embedded wiring board according to embodiment 1 of the present invention.
Fig. 6 is a schematic view of a part of the steps of the method for processing an embedded wiring board according to embodiment 1 of the present invention.
Fig. 7 is a schematic view of a part of the steps of the method for processing an embedded wiring board according to embodiment 2 of the present invention.
Detailed Description
In order to fully understand the objects, features and effects of the present invention, several preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1 to 6, the present embodiment discloses a method for packaging a chip with double-sided heat dissipation, which includes the following steps:
and S1, reserving chip holes on the medium plate 2.
Specifically, the thickness of the chip hole is 20 micrometers greater than the thickness of the chip 1, and the diameter is 30 micrometers greater.
S2, placing the chip 1 into the chip hole 2, and laminating the dielectric layer 3 and the copper foil 4 on the upper side and the lower side of the dielectric plate 2 to form the double-sided copper-clad plate.
Specifically, the dielectric layer 3 and the dielectric plate 2 are both prepregs or ABF, wherein the resin of the prepregs is epoxy resin, polymaleimide triazine resin, polyimide, polyphenylene oxide or polytetrafluoroethylene.
And S3, drilling and copper plating the double-sided copper-clad plate to enable the electrodes of the chip to be connected to the copper foils on the two sides of the double-sided copper-clad plate.
Specifically, in step S3, laser drilling or mechanical drilling is used to obtain the blind hole 5 between the chip 1 and the copper foil 4, and the blind hole 5 is subjected to desmearing, electroless copper plating/electrolytic copper plating to lead out the three electrodes of the chip 1 and communicate with the copper foil 4.
Specifically, the laser drilling is to drill a printed circuit board or an integrated circuit package substrate by using carbon dioxide laser or UV laser. Specifically, the smear removal is to remove the smear on the drilled hole wall by using an alkaline potassium permanganate solution or an alkaline sodium permanganate solution, or to remove the smear in the hole by using plasma. Specifically, the electro-coppering is carried out by using an electro-coppering liquid medicine or a traditional board surface electro-coppering liquid medicine, so that the conduction of the electrical property between the layers of the printed circuit board is realized.
S4, pattern wiring is formed on the copper foil 4.
Specifically, the pattern circuit may be formed by a subtractive method or a semi-additive method, which is exemplified in this embodiment, and specifically, in step S4, a pattern transfer technique is used to form a copper circuit pattern on the surface of the copper foil 4 of the double-sided copper-clad laminate embedded in the chip 1, so as to obtain the copper circuit pattern 41.
And S5, arranging a heat dissipation device 11 on the copper foils 4 on the two sides of the double-sided copper-clad plate through the heat conducting glue 6 for heat dissipation.
Specifically, step S5 includes:
s501, arranging an elastic sheet electrode 7 on the copper foil through a conductive adhesive 6, wherein the elastic sheet electrode 7 is connected with an electrode of the chip 1.
S502, arranging insulating heat-conducting glue 8 on the copper foil 4 except for the conductive glue 6, and sequentially arranging DBC (dielectric ceramic) 9 and insulating heat-conducting glue 10 on the insulating heat-conducting glue 8.
And S503, arranging a heat dissipation device 11 on the insulating heat-conducting glue 10.
Specifically, the conductive paste may be a conductive silver paste, an anisotropic conductive film, or an anisotropic conductive liquid material. Specifically, the main component of the conductive adhesive is a mixture of a high molecular polymer and conductive metal particles. The high molecular polymer is thermoplastic resin or thermosetting resin, and the thermoplastic resin is polyethylene, polypropylene, polystyrene, polycarbonate or rubber. The thermosetting resin is epoxy resin or polyimide. The conductive metal particles are metal nickel, gold, silver, tin and tin alloy.
Specifically, the heat sink 11 is a water-cooling heat sink.
The embodiment provides a double-side heat dissipation chip packaging method, the electrodes of a chip are led out to copper foils from two sides, and a heat dissipation device is used for heat dissipation, so that double-side heat dissipation of a chip circuit board can be achieved, the heat dissipation area is effectively increased, meanwhile, laser holes made of copper materials are high in heat conductivity coefficient, the power density of a packaging structure is effectively improved, and the heat dissipation requirement is met.
Example 2
As shown in fig. 1-5 and fig. 7, the present embodiment discloses a double-sided heat dissipation chip packaging method, which has steps similar to those of embodiment 1, except that step S5 includes:
and S511, arranging a spring plate electrode 7 on the copper foil 4 through the conductive adhesive 6, wherein the spring plate electrode 7 is connected with the electrode of the chip 1.
And S512, plastic packaging 12 is carried out on the copper foil 4, and a radiating surface is reserved.
S513, the heat sink 11 is mounted on the heat dissipating surface 12 through the heat conductive paste 13. Specifically, the heat sink 11 is disposed on the heat conductive paste 13 through the heat conductive block 14.
Through the arrangement of the heat dissipation device in the embodiment different from that in the embodiment 1, the heat dissipation effect can be realized only by using one layer of heat-conducting glue, and the material cost is saved.
Example 3
The present embodiment discloses a double-sided heat dissipation chip package device corresponding to embodiment 1 or 2, including:
and the chip placing equipment is used for placing the chip into the chip hole reserved on the dielectric plate.
And the laminating equipment is used for laminating the upper side and the lower side of the dielectric plate by using the dielectric layer and the copper foil to form the double-sided copper-clad plate.
And the circuit manufacturing equipment is used for manufacturing a graphic circuit on the copper foil.
And the heat dissipation setting equipment is used for setting a heat dissipation device on the copper foils on the two sides of the double-sided copper-clad plate through heat conducting glue for heat dissipation.
Specifically, the execution steps of each device correspond to the method steps in embodiment 1 or 2, and the steps and details specifically included therein also correspond to those in embodiment 1 or 2, and the technical effects thereof are similar, and are not described herein again.
Example 4
The embodiment discloses a double-sided heat dissipation chip packaging structure, which is processed by the double-sided heat dissipation chip packaging method as described in embodiment 1 or 2. The steps and details specifically included therein also correspond to those in embodiment 1 or 2, and the technical effects are similar, which are not described herein again.
Example 5
The embodiment discloses a double-sided heat dissipation chip packaging structure, which is processed by the double-sided heat dissipation chip packaging device described in embodiment 3. The steps and details specifically included therein also correspond to those in embodiment 1 or 2, and the technical effects are similar, which are not described herein again.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the devices is merely a logical division, and the actual implementation may have another division, for example, multiple devices or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The devices described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one device, or may be distributed on a plurality of devices. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
While the preferred embodiments of the present invention have been illustrated and described in detail, it should be understood that modifications and variations can be effected by one skilled in the art in light of the above teachings without undue experimentation. Therefore, any technical solutions that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the prior art according to the present inventive concept should be within the scope of protection defined by the present claims.
Claims (10)
1. A double-side heat dissipation chip packaging method is characterized by comprising the following steps:
s1, reserving chip holes on the dielectric slab;
s2, placing a chip into the chip hole, and laminating the dielectric layer and the copper foil on the upper side and the lower side of the dielectric plate to form a double-sided copper-clad plate;
s3, drilling and copper plating are carried out on the double-sided copper-clad plate to enable the electrodes of the chip to be connected to the copper foils on the two sides of the double-sided copper-clad plate;
s4, manufacturing a graphic circuit on the copper foil;
and S5, arranging a heat dissipation device on the copper foils on the two sides of the double-sided copper-clad plate through heat conducting glue for heat dissipation.
2. The method for packaging a double-sided heat dissipation chip as recited in claim 1, wherein the step S5 includes:
s501, arranging a spring plate electrode on the copper foil through conductive adhesive, wherein the spring plate electrode is connected with an electrode of the chip;
s502, arranging insulating heat-conducting glue on the copper foil except the conducting glue;
s503, arranging the heat dissipation device on the insulating heat conducting glue.
3. The method for packaging a double-sided heat dissipation chip as recited in claim 1, wherein the step S5 includes:
s511, arranging a spring plate electrode on the copper foil through conductive adhesive, wherein the spring plate electrode is connected with an electrode of the chip;
s512, plastic packaging is carried out on the copper foil, and a radiating surface is reserved;
s513, arranging the heat dissipation device on the heat dissipation surface through heat conduction glue.
4. The method for packaging a double-sided heat dissipation chip as recited in claim 2, wherein the step S502 is: and arranging insulating heat-conducting glue on the copper foil except the conductive glue, and sequentially arranging DBC (direct bonded copper) ceramics and the insulating heat-conducting glue on the insulating heat-conducting glue.
5. The double-sided heat-dissipating chip packaging method according to any one of claims 1 to 4, wherein the heat sink is a water-cooled heat sink.
6. The method for packaging a double-sided heat dissipation chip as recited in claim 1, wherein the copper plating of the hole is performed by electroless copper plating or electroplating copper plating.
7. The method for packaging a double-sided heat dissipating chip as claimed in claim 1, wherein the thickness of the chip hole is 20 microns greater than the thickness of the chip and the diameter is 30 microns greater.
8. The method of claim 1, wherein the dielectric layer and the dielectric plate are both prepregs.
9. A double-sided heat dissipation chip packaging device is characterized by comprising:
the chip placing equipment is used for placing the chip into a chip hole reserved on the dielectric plate;
the laminating equipment is used for laminating the upper side and the lower side of the dielectric plate by using the dielectric layer and the copper foil to form a double-sided copper-clad plate;
the circuit manufacturing equipment is used for manufacturing a graphic circuit on the copper foil;
and the heat dissipation setting equipment is used for setting a heat dissipation device on the copper foils on the two sides of the double-sided copper-clad plate through heat conducting glue for heat dissipation.
10. A double-sided heat-dissipating chip package structure, which is processed by the double-sided heat-dissipating chip package method according to any one of claims 1 to 8, or by the double-sided heat-dissipating chip package device according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911391556.7A CN111010801A (en) | 2019-12-30 | 2019-12-30 | A double-sided heat dissipation chip package structure, method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911391556.7A CN111010801A (en) | 2019-12-30 | 2019-12-30 | A double-sided heat dissipation chip package structure, method and device |
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| CN111010801A true CN111010801A (en) | 2020-04-14 |
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| CN201911391556.7A Pending CN111010801A (en) | 2019-12-30 | 2019-12-30 | A double-sided heat dissipation chip package structure, method and device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140538A (en) * | 2021-04-21 | 2021-07-20 | 上海闻泰信息技术有限公司 | Adapter plate, packaging structure and manufacturing method of adapter plate |
| CN115551226A (en) * | 2021-06-30 | 2022-12-30 | 深南电路股份有限公司 | Manufacturing method of embedded element circuit board and circuit board |
| CN117440601A (en) * | 2023-10-23 | 2024-01-23 | 无锡芯动半导体科技有限公司 | Power module |
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| US20040173901A1 (en) * | 2003-03-05 | 2004-09-09 | Intel Corporation | Thermally enhanced electronic flip-chip packaging with external-connector side die and method |
| US20060145328A1 (en) * | 2005-01-06 | 2006-07-06 | Shih-Ping Hsu | Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140538A (en) * | 2021-04-21 | 2021-07-20 | 上海闻泰信息技术有限公司 | Adapter plate, packaging structure and manufacturing method of adapter plate |
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| CN117440601A (en) * | 2023-10-23 | 2024-01-23 | 无锡芯动半导体科技有限公司 | Power module |
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