CN111007086A

CN111007086A - Defect detection method and device and storage medium

Info

Publication number: CN111007086A
Application number: CN201911165457.7A
Authority: CN
Inventors: 胡婷平
Original assignee: Hefei Visionox Technology Co Ltd
Current assignee: Hefei Visionox Technology Co Ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-04-14

Abstract

The invention discloses a defect detection method and device and a storage medium. The method comprises the steps of obtaining N gray level images of an electronic device to be tested under N light sources; acquiring pixel information occupied by the defects in the ith gray level image to form ith defect position information; determining the defect type of the defect in the ith gray level image according to the line position information of each line of the ith gray level image and the ith defect position information; and obtaining a defect summary result of the electronic device to be tested according to the defect type corresponding to the defect in the 1 st gray level image to the defect type corresponding to the defect in the Nth gray level image. According to the embodiment of the invention, the accuracy of judging the defect type can be improved.

Description

Defect detection method and device and storage medium

Technical Field

The present invention relates to the field of detection technologies, and in particular, to a defect detection method and apparatus, and a storage medium.

Background

When detecting defects of an array substrate, accurate judgment of defect types of the detected defects is required, and Automatic Optical Inspection (AOI) equipment is generally used. At present, when AOI equipment utilizes multiple light sources to detect defects, the AOI equipment adopts position information of each line in an array substrate under a single light source, so that the detected defects cannot be accurately judged according to the defect types.

Therefore, how to improve the accuracy of defect type judgment is a technical problem that needs to be solved urgently by those skilled in the art.

Disclosure of Invention

In order to solve the technical problems in the prior art, embodiments of the present invention provide a defect detection method and apparatus, and a storage medium, which aim to improve accuracy of defect type determination.

In a first aspect, an embodiment of the present invention provides a defect detection method, where the defect detection method includes:

acquiring N gray level images of an electronic device to be tested under N light sources, wherein an ith gray level image is formed under the ith light source, N is an integer greater than or equal to 2, i is a positive integer, and i is less than or equal to N;

acquiring pixel information occupied by the defects in the ith gray level image to form ith defect position information;

determining the defect type of the defect in the ith gray level image according to the line position information of each line of the ith gray level image and the ith defect position information;

and obtaining a defect summary result of the electronic device to be tested according to the defect type corresponding to the defect in the 1 st gray level image to the defect type corresponding to the defect in the Nth gray level image.

In one possible implementation manner of the first aspect, acquiring pixel information occupied by a defect in the ith gray scale image to form ith defect position information includes:

setting a gray scale value reference range of the ith gray scale image, and identifying pixel information which is not in the gray scale value reference range in the ith gray scale image;

taking the pixel information which is not in the reference range of the gray-scale value as the pixel information occupied by the defect in the ith gray-scale image;

and obtaining the ith defect position information of the defect in the ith gray scale image according to the pixel information occupied by the defect in the ith gray scale image.

In a possible implementation manner of the first aspect, determining a defect type of a defect in the ith gray scale image according to the line position information of each line of the ith gray scale image and the ith defect position information includes:

obtaining line position information of each line of an ith gray level image, and obtaining gray level value information of defects in the ith gray level image;

and determining the defect type of the defect in the ith gray scale image according to the position relationship between the line position information of each line of the ith gray scale image and the ith defect position information and the gray scale value information of the defect.

In one possible implementation of the first aspect, the method further comprises:

acquiring pixel information occupied by each line of the electronic device to be tested in the ith gray level image;

and setting the line position information of each line in the ith gray scale image according to the pixel information occupied by each line in the ith gray scale image.

the corresponding relation among the position relation, the gray-scale value information of the defect and the defect type is preset.

In a possible implementation manner of the first aspect, the positional relationship between the ith defect position information and the line position information of the first line and the second line in each line is an intersection relationship, and if a pixel gray-scale value in the ith defect position information belongs to a first preset range, the corresponding defect type is a short circuit;

and/or the presence of a gas in the gas,

the ith defect position information divides the area corresponding to the line position information into at least two areas, and the pixel gray-scale value in the ith defect position information belongs to a second preset range, so that the corresponding defect type is open circuit.

In a possible implementation manner of the first aspect, obtaining a defect summary result of the electronic device to be tested according to a defect type corresponding to a defect in a 1 st grayscale image to a defect type corresponding to a defect in an nth grayscale image includes:

counting the defect types corresponding to the defects in the 1 st gray level image to the defect types corresponding to the defects in the Nth gray level image;

judging whether the corresponding defect types of the defects at the same position in the N gray level images are the same or not;

and if the parts are the same, determining the number corresponding to each defect type, and taking the defect type with the maximum corresponding number as the defect type corresponding to the defect at the same position.

In a possible implementation manner of the first aspect, the defect summary result includes defect types existing in the electronic device under test and defect location information corresponding to each defect type.

In a second aspect, an embodiment of the present invention provides a defect detecting apparatus, including:

the image acquisition module is used for acquiring N gray level images of the electronic device to be detected under N light sources, wherein an ith gray level image is formed under the ith light source, N is an integer greater than or equal to 2, i is a positive integer, and i is less than or equal to N;

the defect position acquisition module is used for acquiring pixel information occupied by the defects in the ith gray level image to form ith defect position information;

the defect type determining module is used for determining the defect type of the defect in the ith gray level image according to the line position information of each line of the ith gray level image and the ith defect position information;

and the summary result determining module is used for obtaining a defect summary result of the electronic device to be tested according to the defect type corresponding to the defect in the 1 st gray level image to the defect type corresponding to the defect in the Nth gray level image.

In a third aspect, an embodiment of the present invention provides a storage medium having a program stored thereon, where the program, when executed by a processor, implements the defect detection method as above.

According to the embodiment of the invention, the defect detection is carried out on the electronic device to be detected by utilizing multiple light sources, the defect position information detected under the same light source is compared with the line position information, the defect type of the defect is judged, and the accuracy of judging the defect type can be improved.

Drawings

The present invention may be better understood from the following description of specific embodiments thereof taken in conjunction with the accompanying drawings, in which like or similar reference characters identify like or similar features.

FIG. 1 is a schematic flow chart of a defect detection method according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a defect location provided in accordance with an embodiment of the present invention;

FIG. 3 is a schematic flow chart illustrating a defect detection method according to another embodiment of the present invention;

fig. 4 is a schematic structural diagram of a defect detection apparatus according to an embodiment of the present invention.

Detailed Description

Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention.

Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

In order to solve at least one of the problems in the prior art, embodiments of the present invention provide a defect detection method and apparatus, and a storage medium. The following first describes a defect detection method provided by an embodiment of the present invention.

Fig. 1 is a schematic flow chart of a defect detection method according to an embodiment of the present invention. As shown in fig. 1, the defect detection method provided by the embodiment of the invention includes steps S10 to S40.

S10, obtaining N gray level images of the electronic device to be tested under N light sources, wherein the ith gray level image is formed under the ith light source, N is an integer larger than or equal to 2, i is a positive integer, and i ≦ N.

In some embodiments, the electronic device under test may be an array substrate, a Printed Circuit Board (PCB), or the like in the display panel. Illustratively, the array substrate includes a plurality of film layers, and N grayscale images of N light sources of a specific film layer can be acquired according to actual needs.

In some embodiments, the electronic device under test may be illuminated with N light sources at preset time intervals. The N light sources can be green light sources, purple light sources, red light sources, blue light sources, yellow light sources and the like. A light source may be a monochromatic light source or may be a white light source. The gray scale image information generated under each light source is different. Illustratively, some defects of the electronic device under test cannot be visualized on a grayscale image under a red light source, but these defects can be visualized on a grayscale image under a green light source. If only one light source is used for detecting the defects of the electronic device to be detected, the defects can not be detected. According to the embodiment of the invention, at least two light sources are used for irradiating the electronic device to be detected, and the gray level image under each light source is obtained, so that the problem that some defects cannot be detected by adopting a single light source is avoided.

And S20, acquiring pixel information occupied by the defect in the ith gray scale image to form ith defect position information.

In some embodiments, S20 includes: setting a gray scale value reference range of the ith gray scale image, and identifying pixel information which is not in the gray scale value reference range in the ith gray scale image; taking the pixel information which is not in the reference range of the gray-scale value as the pixel information occupied by the defect in the ith gray-scale image; and obtaining the ith defect position information of the defect in the ith gray scale image according to the pixel information occupied by the defect in the ith gray scale image.

Illustratively, the information of the gray scale image generated under each light source is different, and therefore, the reference range of the gray scale value corresponding to each gray scale image set can also be different. The obtained gray level image can be divided into regions according to the structural characteristics of the electronic device to be tested. For example, the electronic device to be tested is an array substrate, the array substrate includes a plurality of data lines, one data line can be divided into a first area, and an area between two data lines is divided into a second area. For example, under a red light source, the corresponding gray scale value range when no defect exists in the first region is set as the gray scale value reference range of the first region, the corresponding gray scale value range when no defect exists in the second region is set as the gray scale value reference range of the second region, and the gray scale value reference ranges of the gray scale images under other light sources are set in the same way. If the gray-scale values of some pixels in the area between the two data lines are not in the reference range of the gray-scale values corresponding to the area, the area has defects.

According to the embodiment of the invention, the defects and the position information of the defects in the gray-scale image can be detected more accurately, namely the defects and the position information of the defects in the electronic device to be detected can be detected more accurately.

And S30, determining the defect type of the defect in the ith gray scale image according to the line position information of each line of the ith gray scale image and the ith defect position information.

In some embodiments, S30 includes: obtaining line position information of each line of the ith gray level image, and obtaining gray level value information of defects in the ith gray level image; and determining the defect type of the defect in the ith gray scale image according to the position relationship between the line position information of each line of the ith gray scale image and the ith defect position information and the gray scale value information of the defect.

In some embodiments, the line position information of each line of the ith gray scale image may be coordinate information of edge pixels among pixels occupied by the line. The ith defect location information may be coordinate information of edge pixels among the pixels occupied by the defect.

For example, the electronic device to be tested is an array substrate, the array substrate includes a plurality of data lines and a plurality of scan lines, and each data line can be used as a circuit and each scan line can be used as a circuit. The array substrate further comprises a plurality of capacitors, each capacitor corresponds to an upper polar plate and a lower polar plate, and each polar plate can be used as a circuit.

Fig. 2 is a schematic diagram of a defect location according to an embodiment of the present invention. Fig. 2 is a partial region of the acquired ith gray scale image, in which S1 represents line position information of a first data line, S2 represents line position information of a second data line, and D1 represents defect position information of one of defects in the ith gray scale image. As shown in fig. 2, when the defect indicated by D1 overlaps the first data line indicated by S1 and the second data line indicated by S2, the defect position information of the defect intersects the line position relationship between the two data lines. Further, the gray scale value of the pixel corresponding to the defect location information represented by D1 belongs to a first predetermined range, for example, the first predetermined range is the gray scale value range corresponding to the metal material in the ith gray scale image, and the defect represented by D1 is that one more metal is located between the first data line and the second data line. Then, the corresponding defect type is a short circuit between the first data line and the second data line.

Illustratively, if the defect position information in the gray scale image under the red light source, the green light source, the violet light source, etc. is obtained, the defect position information is compared with the line position information of each line in the gray scale image under one color light source (e.g., the violet light source). Due to the fact that gray level image information under different light sources is different, the line position information of each line in the gray level image under the red light source is different from the line position information of each line in the gray level image under the purple light source, defect position information in the gray level image under the red light source is compared with the line position information of each line in the gray level image under the purple light source, and the obtained position relation is inaccurate.

In the embodiment of the invention, the position relation between the line position information and the defect position information of each line in the same gray level image is compared. The line position information and the defect position information of each line in the same gray level image are generated under the same light source, so that the position relation between the line position information and the defect position information can be judged more accurately, and the type of the defect can be judged more accurately.

In some embodiments, the defect detection method provided in the embodiments of the present invention further includes: acquiring pixel information occupied by each line of the electronic device to be tested in the ith gray level image; and setting the line position information of each line in the ith gray scale image according to the pixel information occupied by each line in the ith gray scale image.

For example, the size information of each line of the electronic device to be tested and the position information on the electronic device to be tested are fixed, and the pixel gray scale information of each line under the ith light source is also fixed, so that the pixel information occupied by each line in the ith gray scale image can be determined. The line position information of each line in the ith gray scale image can be understood as line position information corresponding to each line when no defect exists. The pixel information occupied by each line in the ith gray scale image may include information on the number of occupied pixels and information on coordinates of the occupied pixels.

According to the embodiment of the invention, the line position information of each line in the gray level image under each light source is preset and stored, and during actual detection, the line position information of each line in the gray level image under the same light source is directly called, so that the defect position information in the gray level image under the light source is compared with the called line position information, and the defect type determining speed can be accelerated.

In some embodiments, the defect detection method provided by the embodiments of the present invention further includes presetting a corresponding relationship among a position relationship, gray-scale value information of the defect, and a defect type. A variety of defect types may be set. For example, when the line position information of each line of the ith gray scale image and the position relationship of the ith defect position information are a first position relationship, and the gray scale value information of the defect belongs to a first preset range, the gray scale value information corresponds to a first defect type; and when the position relationship between the line position information of each line of the ith gray scale image and the ith defect position information is a second position relationship, and the gray scale value information of the defect belongs to a second preset range, corresponding to a second defect type. The positional relationship may include an intersecting relationship, a non-intersecting relationship, and the like. If the defect is the existence of the redundant metal, the gray scale value information of the defect corresponds to the gray scale value range of the metal, and if the defect is the existence of the redundant nonmetal, the gray scale value information of the defect corresponds to the gray scale value range of the nonmetal. The defect type may include a short, an open, having impurities, a non-display region defect, etc. According to the embodiment of the invention, the defect type determining speed can be accelerated.

In some embodiments, the positional relationship between the ith defect location information and the line location information of the first line and the second line in each line is an intersection relationship, and if the pixel gray-scale value in the ith defect location information falls within a first predetermined range, the corresponding defect type is a short circuit. The first preset range may be a gray scale range of the conductive material in the ith gray scale image, and the conductive material may include various metal materials, such as silver, magnesium, and the like. Specifically, the first preset range may be set according to a conductive material used in an actual process.

In some embodiments, the ith defect location information divides the area corresponding to the line location information into at least two areas, and if the pixel gray-scale value in the ith defect location information falls within a second predetermined range, the corresponding defect type is open circuit. The second preset range may be a gray scale range of a non-conductive material, such as a non-conductive material, e.g., silicon dioxide, silicon nitride, etc., appearing in the ith gray scale image. Specifically, the second preset range may be set according to a non-conductive material used in an actual process.

For example, as shown in fig. 2, if the line position information of the first data line indicated by S1 and the line position information of the second data line indicated by S2 intersect with the defect position information indicated by D1, and the gray-scale value of the pixel in the defect position information indicated by D1 is the gray-scale value of the metal material, a short-circuit defect exists between the first data line and the second data line. With reference to fig. 2, the area corresponding to the line position information of the first data line represented by S1 is divided into two areas by the area corresponding to the defect position information represented by D1, the area corresponding to the line position information of the second data line represented by S2 is also divided into two areas by the area corresponding to the defect position information represented by D1, and the gray level of the pixel in the defect position information represented by D1 is the gray level of the non-metallic material, so that the first data line and the second data line both have open circuit defects.

In some embodiments, the electronic device under test is a display panel including a display region and a non-display region. If only the defect in the display area is focused during defect detection, the defect type corresponding to the defect is other when the defect position information indicated by D1 is in the non-display area.

In some embodiments, the defect location information indicated by D1 does not intersect with the line location information of the first data line indicated by S1 and the line location information of the second data line indicated by S2, or the defect location information indicated by D1 is in the area corresponding to the line location information of the first data line indicated by S1 (i.e., the first data line is not divided into multiple segments), or the defect location information indicated by D1 is in the area corresponding to the line location information of the second data line indicated by S2 (i.e., the second data line is not divided into multiple segments), then the defect type corresponding to the defect is either not a short circuit or an open circuit. Further, the gray scale information of the defect may be compared with pre-stored gray scale information of the defect feature. The pre-stored gray scale value information of the defect characteristics may include gray scale value information of bubble defects, dust defects, etc. under the respective light sources.

And S40, obtaining a defect summary result of the electronic device to be tested according to the defect type corresponding to the defect in the 1 st gray level image to the defect type corresponding to the defect in the Nth gray level image.

In some embodiments, the defect summary result includes defect types of the electronic device under test and defect location information corresponding to each defect type. According to the embodiment of the invention, the electronic device to be tested can be repaired in a targeted manner, and further damage to the electronic device to be tested caused by improper repair is avoided.

In some embodiments, S40 includes: counting the defect types corresponding to the defects in the 1 st gray level image to the defect types corresponding to the defects in the Nth gray level image; judging whether the corresponding defect types of the defects at the same position in the N gray level images are the same or not; and if the parts are the same, determining the number corresponding to each defect type, and taking the defect type with the maximum corresponding number as the defect type corresponding to the defect at the same position.

The gray scale image information of the same electronic device to be tested under different light sources is different. For the same defect, for example, the defect can be shown in the gray-scale image under the red light source, and the defect cannot be shown in the gray-scale image under the green light source, so that the number of the defects corresponding to each of the N gray-scale images and the determined defect type are not the same. For example, for a defect at the same position on the electronic device to be tested, if the determination results in the 1 st gray scale image to the nth gray scale image are that the defect is a short-circuit defect, the defect is a short-circuit defect in the defect summary result. If the defect is a short-circuit defect as a result of the determination in the 1 st gray scale image, the defect is a short-circuit defect as a result of the determination in the 2 nd gray scale image, and the defect is an open-circuit defect as a result of the determination in the 3 rd gray scale image. And if the number of the defects which are judged to be open-circuit defects in the N gray-scale images is the maximum, the defects in the defect summary result are the open-circuit defects.

According to the embodiment of the invention, for the defects at the same position, when the defect types are judged to be different according to the gray images, the defect types of the defects can be determined more accurately.

Further, if a certain defect on the electronic device to be tested is detected only in a part of the gray images in the N gray images, the defect type corresponding to the defect is determined according to the gray image capable of detecting the defect.

For a better understanding of the invention, please refer to fig. 3. The defect detection method provided by the embodiment of the invention comprises the steps of scanning the array substrate by utilizing the light sources 1 to N to obtain gray image information under each light source. And setting line position information corresponding to each line of the array substrate on each gray scale image. And comparing the defect position information detected under the same light source with the line position information under the same light source to obtain the corresponding defect type under each light source. And synthesizing the corresponding defect types under each light source to obtain the defect classification result of the array substrate.

According to the embodiment of the invention, the defect position information detected under the same light source is compared with the line position information to judge the defect type of the defect, so that the accuracy of defect classification is improved.

As shown in fig. 4, an embodiment of the invention provides a defect detecting apparatus, which includes the following modules:

the image acquisition module 401 is configured to acquire N grayscale images of an electronic device to be detected under N light sources, where an ith grayscale image is formed under an ith light source, N is an integer greater than or equal to 2, i is a positive integer, and i ≦ N;

a defect position obtaining module 402, configured to obtain pixel information occupied by a defect in the ith gray scale image to form ith defect position information;

a defect type determining module 403, configured to determine a defect type of a defect in the ith gray scale image according to the line position information of each line of the ith gray scale image and the ith defect position information;

and a classification result determining module 404, configured to obtain a defect summary result of the electronic device to be tested according to the defect type corresponding to the defect in the 1 st grayscale image to the defect type corresponding to the defect in the nth grayscale image.

In some embodiments, the defect location obtaining module 402 is specifically configured to:

In some embodiments, the defect type determining module 403 is specifically configured to:

obtaining line position information of each line of the ith gray level image, and obtaining gray level value information of defects in the ith gray level image;

In some embodiments, the method further includes a line location information setting unit, specifically configured to:

In some embodiments, the apparatus further includes a correspondence setting unit, specifically configured to:

In some embodiments, the positional relationship between the ith defect position information and the line position information of the first line and the second line in each line is an intersection relationship, and if the pixel gray-scale value in the ith defect position information belongs to a first preset range, the corresponding defect type is a short circuit;

and/or the presence of a gas in the gas,

In some embodiments, the aggregated result determining module 404 is specifically configured to:

In some embodiments, the defect summary result includes defect types of the electronic device under test and defect location information corresponding to each defect type.

According to the embodiment of the invention, the defect detection is carried out on the electronic device to be detected by utilizing multiple light sources, and the defect position information detected under the same light source is compared with the line position information to judge the defect type of the defect, so that the accuracy of judging the defect type can be improved.

In addition, in combination with the defect detection method in the foregoing embodiments, the embodiments of the present invention may be implemented by providing a computer storage medium. The computer storage medium having computer program instructions stored thereon; the computer program instructions, when executed by a processor, implement any of the defect detection methods in the above embodiments.

It should be clear that the embodiments in this specification are described in a progressive manner, and the same or similar parts in the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. For the device embodiments, reference may be made to the description of the method embodiments in the relevant part. Embodiments of the invention are not limited to the specific steps and structures described above and shown in the drawings. Those skilled in the art may make various changes, modifications and additions to, or change the order between the steps, after appreciating the spirit of the embodiments of the invention. Also, a detailed description of known process techniques is omitted herein for the sake of brevity.

The functional blocks shown in the above-described structural block diagrams may be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it may be, for example, an electronic circuit, an Application Specific Integrated Circuit (ASIC), suitable firmware, plug-in, function card, or the like. When implemented in software, the elements of an embodiment of the invention are the programs or code segments used to perform the required tasks. The program or code segments may be stored in a machine-readable medium or transmitted by a data signal carried in a carrier wave over a transmission medium or a communication link. A "machine-readable medium" may include any medium that can store or transfer information. Examples of a machine-readable medium include electronic circuits, semiconductor memory devices, ROM, flash memory, Erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, Radio Frequency (RF) links, and so forth. The code segments may be downloaded via computer networks such as the internet, intranet, etc.

Embodiments of the present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. For example, the algorithms described in the specific embodiments may be modified without departing from the basic spirit of the embodiments of the present invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the embodiments of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. A method of defect detection, the method comprising:

determining the defect type of the defect in the ith gray scale image according to the line position information of each line of the ith gray scale image and the ith defect position information;

and obtaining a defect summarizing result of the electronic device to be tested according to the defect type corresponding to the defect in the 1 st gray image to the defect type corresponding to the defect in the Nth gray image.

2. The method of claim 1, wherein the obtaining pixel information occupied by the defect in the ith gray scale image forms ith defect location information, comprising:

setting a gray-scale value reference range of the ith gray-scale image, and identifying pixel information which is not in the gray-scale value reference range in the ith gray-scale image;

3. The method according to claim 1, wherein the determining the defect type of the defect in the ith gray scale image according to the line position information of each line of the ith gray scale image and the ith defect position information comprises:

4. The method of claim 3, further comprising:

5. The method of claim 3, further comprising:

and presetting the corresponding relation among the position relation, the gray-scale value information of the defect and the defect type.

6. The method of claim 5,

the position relations of the ith defect position information and the line position information of the first line and the second line in each line are intersecting relations, and if the pixel gray-scale value in the ith defect position information belongs to a first preset range, the corresponding defect type is a short circuit;

and/or the presence of a gas in the gas,

the ith piece of defect position information divides the area corresponding to the line position information into at least two areas, and if the pixel gray-scale value in the ith piece of defect position information belongs to a second preset range, the corresponding defect type is open circuit.

7. The method according to claim 1, wherein the obtaining a defect summary result of the electronic device under test according to the defect type corresponding to the defect in the 1 st gray image to the defect type corresponding to the defect in the nth gray image comprises:

counting the defect type corresponding to the defect in the 1 st gray level image to the defect type corresponding to the defect in the Nth gray level image;

8. The method of claim 1, wherein the defect summary result includes defect types of the electronic device under test and defect location information corresponding to each of the defect types.

9. A defect detection apparatus, the apparatus comprising:

a defect type determining module, configured to determine a defect type of the defect in the ith gray scale image according to the line position information of each line of the ith gray scale image and the ith defect position information;

10. A storage medium having a program stored thereon, wherein the program, when executed by a processor, implements the defect detection method of any one of claims 1-8.