CN111004998A - Evaporation device and preparation method of mask plate thereof - Google Patents
Evaporation device and preparation method of mask plate thereof Download PDFInfo
- Publication number
- CN111004998A CN111004998A CN201911236364.9A CN201911236364A CN111004998A CN 111004998 A CN111004998 A CN 111004998A CN 201911236364 A CN201911236364 A CN 201911236364A CN 111004998 A CN111004998 A CN 111004998A
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- mask plate
- layer
- reflective material
- heat
- material layer
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- 238000001704 evaporation Methods 0.000 title claims abstract description 37
- 230000008020 evaporation Effects 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims description 70
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 6
- 229920002313 fluoropolymer Polymers 0.000 claims description 4
- 239000012774 insulation material Substances 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 9
- 239000011810 insulating material Substances 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides an evaporation device and a preparation method of a mask plate thereof. The vapor plating device comprises a mask plate mounting platform, a mask plate, a substrate, a magnetic plate and an attaching piece. The mask plate is arranged on the mask plate mounting platform, the substrate is arranged between the mask plate and the magnetic plate, the attaching pieces are arranged on two sides of the substrate and the magnetic plate, and a heat reflecting material layer is coated on the surface of the mask plate. The surface of the mask plate of the evaporation device is coated with the heat reflection material layer, so that the temperature of the mask plate and the substrate of the evaporation device can be reduced, and the risk of pollution of the vacuum cavity is reduced.
Description
Technical Field
The invention relates to the technical field of vacuum evaporation, in particular to an evaporation device and a preparation method of a mask plate thereof.
Background
The organic light emitting diode element is prepared by vacuum evaporation technology, firstly, organic materials and an evaporation substrate are placed in a vacuum cavity, the organic materials are evaporated or sublimated by heating the organic materials, and then a thin film is formed on the substrate. In the evaporation process, the temperature of the vacuum chamber and the substrate is increased due to the action of heat radiation, while the glass transition temperature (Tg) of the material is generally low (about 100 ℃), and the service life of the device is affected due to the influence of the over-high temperature of the substrate on the material characteristics. Therefore, it is very important to lower the temperature of the substrate.
Referring to fig. 1, a conventional vapor deposition apparatus 10 includes a mask plate mounting stage 20, a mask plate 30, a substrate 40, a bonding material 50, a magnetic plate 60, and a cooling pipe 70. Specifically, the mask plate 30 and the magnetic plate 60 are connected to each other by a cooling pipe 70, and the cooling pipe 70 is cooled by a cooling liquid. The magnetic plate 60 connected to the cooling pipe 70 may reduce the temperature of the substrate 40 using a cooling liquid, the mask plate 30 connected to the cooling pipe 70 may reduce the temperature of the mask plate 30 itself using a cooling liquid, and the mask plate 30, the substrate 40, and the magnetic plate 60 are fixed by the bonding material 50. However, the heat conduction degree of the mask plate mounting platform 20 and the mask plate 30 determines the temperature and the cooling effect of the mask plate 30 itself, and the existing evaporation device 10 has a cooling tube 70, which increases the complexity of the evaporation device and also has the risk of contamination of the vacuum chamber.
Disclosure of Invention
The invention relates to a vapor plating device which comprises a mask plate mounting platform, a mask plate, a substrate, a magnetic plate and a fitting piece. The mask plate is arranged on the mask plate mounting platform, the substrate is arranged between the mask plate and the magnetic plate, the attaching pieces are arranged on two sides of the substrate and the magnetic plate, and a heat reflecting material layer is coated on the surface of the mask plate.
In an embodiment of the invention, the heat reflective material layer is composed of metal and metal oxide.
In one embodiment of the present invention, the heat reflective material layer is composed of a nano-thermal insulation material layer and a metal foil.
In an embodiment of the invention, the thickness of the heat reflective material layer is between 50 to 200 μm.
In an embodiment of the invention, the surface of the heat reflective material layer is further coated with a protective layer, and the protective layer includes fluorocarbon polymer.
Another method for preparing a mask plate of an evaporation device in an embodiment of the present invention includes: providing a frame; carrying out heat treatment on the frame; a welding area between the isolation frame and the patterned mask layer; forming a first layer of heat reflective material on the frame; welding the frame and the patterned mask layer; forming a second heat reflection material layer between the patterned mask layers; and forming a protective layer on the first heat reflective material layer and the second heat reflective material layer.
In an embodiment of the invention, the first heat reflective material layer and the second heat reflective material layer are composed of metal and metal oxide.
In one embodiment of the present invention, the first and second layers of heat reflective material are comprised of a layer of nano-thermal insulating material and a metal foil comprising silver and aluminum.
In an embodiment of the present invention, the thickness of the nano thermal insulation material layer is between 200 and 400 μm.
In an embodiment of the invention, the thickness of the first heat reflective material layer and the second heat reflective material layer is between 50 to 200 μm, and the thickness of the metal foil is between 300 to 800 nm.
The invention provides an evaporation device and a preparation method of a mask plate thereof, which are used for reducing the temperature of the mask plate and a substrate of the evaporation device, simplifying the structure of the evaporation device and reducing the risk of pollution.
Drawings
FIG. 1 is a schematic view of a prior art evaporation apparatus;
FIG. 2 is a schematic view of an evaporation apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a mask according to an embodiment of the present invention; and
fig. 4 is a flowchart of a method for manufacturing a mask for an evaporation apparatus according to an embodiment of the present invention.
Detailed Description
Generally, the temperature of the substrate is much lower than that of the evaporation source, and when the molecules or atoms are evaporated from the evaporation source and leave the evaporation source, the molecules or atoms have the temperature of the evaporation source, and are converted from a gas phase to a solid phase, and a thin film is formed on the substrate, and the temperature of the substrate itself is also increased due to the heat radiation, so that the evaporated molecules or atoms and the substrate reach temperature equilibrium in a short time. In the process of forming the thin film, the temperature of the vacuum cavity of the whole evaporation device is high, and the temperature of the substrate cannot be reduced in relation to heat release, so that the characteristics of the material are affected, and the service life of the element is influenced. Therefore, the embodiment of the invention provides an evaporation device and a method for preparing a mask plate of the evaporation device, so as to reduce the temperature of the mask plate and a substrate of the evaporation device, simplify the structure of the evaporation device and reduce the risk of pollution.
Referring to fig. 2, an evaporation apparatus 100 includes a mask mounting platform 110, a mask 120, a substrate 130, a magnetic plate 140, and a fitting member 150. Specifically, the mask plate 120 is disposed on the mask plate mounting platform 110, the substrate 130 is disposed between the mask plate 120 and the magnetic plate 140, and the attaching members 150 are disposed on both sides of the substrate 130 and the magnetic plate 140 and are used to fix the substrate 130 and the magnetic plate 140 in a cavity of the evaporation apparatus, and the surface of the mask plate 120 is coated with the heat reflective material layer 170.
In detail, a metal and its metal oxide are coated on the surface of the mask 120 by a vacuum magnetron sputtering method to form a heat reflective material layer 170, which may also be composed of multiple metal layers and their metal oxides, and the magnetic plate 140 provides a magnetic field. The thickness of the heat reflective material layer 170, which is composed of a plurality of metal layers and metal oxides thereof, is between 50 and 200 micrometers. On the other hand, a vacuum magnetron sputtering method may be used to coat the composition of the nano heat insulating material and the metal foil on the surface of the mask 120 to form a layer of the heat reflective material layer 170. The metal foil includes Ag and Al, and the thickness of the metal foil is in a 300-800 nm environment. The heat reflective material layer 170 formed of the combination of the nano heat insulating material and the metal foil has a thickness of 200 to 400 μm. This kind of heat reflection material layer 170 all has fine effect to infrared ray shielding, radiation and reflection, can also effectively reduce the heat absorption capacity in the object unit interval simultaneously, reduces object surface temperature, has high heat reflectivity, high rigidity, high temperature thermal shock advantage such as simultaneously, still can further coat the protective layer on the surface of heat reflection material layer in addition, and the protective layer includes fluorocarbon polymer, and then has acidproof, alkali-proof and anticorrosive function.
According to fig. 3, the mask plate 120 of the evaporation apparatus according to the embodiment of the present invention includes a frame 121, a patterned mask layer 122, a first heat reflective material layer 123 formed on a surface of the frame 121, a second heat reflective material layer 124 formed between the patterned mask layer 122, and a protective layer (not shown) formed on the first heat reflective material layer 123 and the second heat reflective material layer 124.
According to fig. 4, another method for preparing a mask for an evaporation device according to an embodiment of the present invention is further described, including: providing a suitably sized frame; carrying out heat treatment on the frame; a welding area between the isolation frame and the patterned mask layer; forming a first layer of heat reflective material on the frame; welding the frame and the patterned mask layer through laser; forming a second heat reflection material layer between the patterned mask layers; and forming a protective layer on the first and second layers of heat reflective material, the protective layer comprising a fluorocarbon polymer.
In detail, the first heat reflective material layer is formed on the frame and the second heat reflective material layer is formed between the patterned mask layers by a vacuum magnetron sputtering method. The thickness of the heat reflecting material layer composed of the multiple metal layers and the metal oxides thereof is between 50 and 200 micrometers. On the other hand, the composition of the nano heat insulating material and the metal foil may be coated on the surface of the mask plate using a vacuum magnetron sputtering method, vacuum evaporation, or an electrolytic method to form the heat reflective material layer. Further, the metal foil comprises silver and aluminum, and the thickness of the metal foil is between 300 and 800 nanometers. The heat reflecting material layer formed by the combination of the nanometer heat insulating material and the metal foil has the thickness of 200-400 microns. The heat reflection material layer has good effects of shielding, radiating and reflecting infrared rays, can effectively reduce the heat absorption amount of an object in unit time, reduces the surface temperature of the object, and has the advantages of high heat reflectivity, high hardness, high-temperature thermal shock and the like. In addition, the surface of the heat reflecting material layer is further coated with a protective layer, so that the heat reflecting material layer has the functions of acid resistance, alkali resistance and corrosion resistance.
The evaporation device provided by the embodiment of the invention can reduce the temperature of the mask plate, so that the temperature of the mask plate can be reduced while the temperature of the substrate can be reduced, the mask plate is coated with a high-reflection heat material, heat energy radiated from an evaporation source is reflected back to the vacuum cavity, the temperature of the mask plate is ensured not to be changed greatly, the temperature of the substrate is reduced, the temperature of the mask plate is maintained through the mode, and the influence of the temperature of the mask plate on the quality of an evaporated film is reduced. The evaporation device provided by the embodiment of the invention does not need to be additionally provided with the cooling pipe, so that the energy consumption loss caused by using the cooling pipe is reduced, and meanwhile, the risk caused by the fact that cooling liquid leaks out and pollutes a vacuum cavity due to the aging of a pipeline or the poor interface is also reduced.
While the invention has been described in conjunction with specific embodiments thereof, it is to be understood that many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the included claims.
Claims (10)
1. An evaporation apparatus, comprising:
a mask plate mounting platform;
a mask plate;
a substrate;
a magnetic plate; and
fitting parts;
the mask plate is arranged on the mask plate mounting platform, the substrate is arranged between the mask plate and the magnetic plate, the attaching pieces are arranged on two sides of the substrate and the magnetic plate, and a heat reflecting material layer is coated on the surface of the mask plate.
2. The vapor deposition apparatus according to claim 1, wherein the heat reflective material layer is composed of a metal and a metal oxide.
3. The vapor deposition apparatus according to claim 1, wherein the heat reflective material layer is composed of a nano thermal insulation material layer and a metal foil.
4. The evaporation device according to claim 1, wherein the thickness of the heat reflective material layer is between 50 and 200 μm.
5. The evaporation apparatus according to claim 1, wherein a surface of said heat reflective material layer is further coated with a protective layer, said protective layer comprising a fluorocarbon polymer.
6. A preparation method of a mask plate for an evaporation device is characterized by comprising the following steps:
providing a frame;
heat treating the frame;
isolating a welding area between the frame and the patterned mask layer;
forming a first layer of heat reflective material on the frame;
welding the frame and the patterned mask layer;
forming a second layer of heat reflective material between the patterned masks; and
forming a protective layer on the first heat reflective material layer and the second heat reflective material layer.
7. The method of claim 6, wherein the first and second layers of heat reflective material are comprised of metals and metal oxides.
8. The method of claim 6, wherein said first and second layers of heat-reflective material are comprised of a layer of nanoinsulating material and a metal foil comprising hg and al.
9. The method of claim 8, wherein the thickness of the nano thermal insulation material layer is between 200 and 400 μm, and the thickness of the metal foil is between 300 and 800 nm.
10. The method of claim 7, wherein the first layer of heat reflective material and the second layer of heat reflective material have a thickness of between 50 and 200 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911236364.9A CN111004998A (en) | 2019-12-05 | 2019-12-05 | Evaporation device and preparation method of mask plate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911236364.9A CN111004998A (en) | 2019-12-05 | 2019-12-05 | Evaporation device and preparation method of mask plate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111004998A true CN111004998A (en) | 2020-04-14 |
Family
ID=70115647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911236364.9A Pending CN111004998A (en) | 2019-12-05 | 2019-12-05 | Evaporation device and preparation method of mask plate thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN111004998A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012140253A1 (en) * | 2011-04-15 | 2012-10-18 | Von Ardenne Anlagentechnik Gmbh | Method and device for thermally treating substrates |
| CN105420675A (en) * | 2015-12-30 | 2016-03-23 | 山东大学 | Device for reducing baking temperature rise influence on substrate in evaporation coating equipment or material on substrate and application |
| CN107686960A (en) * | 2017-07-25 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | A kind of film formation device |
| CN108934170A (en) * | 2016-03-10 | 2018-12-04 | 鸿海精密工业股份有限公司 | Vapor deposition mask, mask member for vapor deposition mask, method for manufacturing vapor deposition mask, and method for manufacturing organic E L display device |
| CN109722625A (en) * | 2017-10-31 | 2019-05-07 | 佳能特机株式会社 | Film formation device, film build method and electronic device manufacturing method |
| CN109722635A (en) * | 2017-10-31 | 2019-05-07 | 佳能特机株式会社 | The manufacturing method of evaporation source, film formation device, film build method and electronic equipment |
-
2019
- 2019-12-05 CN CN201911236364.9A patent/CN111004998A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012140253A1 (en) * | 2011-04-15 | 2012-10-18 | Von Ardenne Anlagentechnik Gmbh | Method and device for thermally treating substrates |
| CN105420675A (en) * | 2015-12-30 | 2016-03-23 | 山东大学 | Device for reducing baking temperature rise influence on substrate in evaporation coating equipment or material on substrate and application |
| CN108934170A (en) * | 2016-03-10 | 2018-12-04 | 鸿海精密工业股份有限公司 | Vapor deposition mask, mask member for vapor deposition mask, method for manufacturing vapor deposition mask, and method for manufacturing organic E L display device |
| CN107686960A (en) * | 2017-07-25 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | A kind of film formation device |
| CN109722625A (en) * | 2017-10-31 | 2019-05-07 | 佳能特机株式会社 | Film formation device, film build method and electronic device manufacturing method |
| CN109722635A (en) * | 2017-10-31 | 2019-05-07 | 佳能特机株式会社 | The manufacturing method of evaporation source, film formation device, film build method and electronic equipment |
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Application publication date: 20200414 |