CN1109998A - Electronic lead element and manufacturing method thereof - Google Patents
Electronic lead element and manufacturing method thereof Download PDFInfo
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- CN1109998A CN1109998A CN94116819A CN94116819A CN1109998A CN 1109998 A CN1109998 A CN 1109998A CN 94116819 A CN94116819 A CN 94116819A CN 94116819 A CN94116819 A CN 94116819A CN 1109998 A CN1109998 A CN 1109998A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/242—Terminals the capacitive element surrounding the terminal
- H01G4/245—Tabs between the layers of a rolled electrode
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Abstract
Description
本发明涉及电子引线元件及其制造方法,特别是涉及将多个引线间按预定间隔固定到薄金属带上,然后将铝焊片焊接到引线上并将接头压成平片形状。这样,焊片带有毛刺的表面定向在同一方向,这些毛刺通常是在焊片进行加压工艺时产生的,之后将薄带卷绕成金属带卷形,以形成一套完整的电子引线元件的步骤。The present invention relates to an electronic lead element and its manufacturing method, in particular to fixing a plurality of leads to a thin metal strip at predetermined intervals, then welding aluminum solder tabs to the leads and pressing the joint into a flat sheet shape. In this way, the surfaces of the solder tabs are oriented in the same direction with the burrs usually produced when the solder tabs are subjected to a pressurization process, after which the thin strip is wound into a metal strip roll to form a complete set of electronic lead components A step of.
本发明将引线元件直接提供给焊片焊接设备而不依靠传统的很难使焊片上形成毛刺的这一面定位在同一方向的送料器。本发明是用来防止形成毛刺的焊接片表面加到薄铝箔上,因为毛刺将会损伤铝箔,从而损坏成品电容器的质量。在这一意义上,本发明可以说是开创了一个新时代。The present invention provides the lead components directly to the lug bonding equipment without relying on the conventional feeder which is difficult to orient the side where the burr is formed on the lug in the same direction. The invention is intended to prevent the application of the solder tab surface to the thin aluminum foil which would form burrs which would damage the foil and thus the quality of the finished capacitor. In this sense, the present invention can be said to have created a new era.
如图5,6和11-14所示,众所周知的是电子引线元件1是由一条引线1a和一个焊接在引线一端的接头1d上的一个铝焊片1b组成。然后将焊片1b的部分地压成平片1c,再通过修整加工形成预定的外形。在这种情况下,电子引线元件1被加工成各自分离的状态并且以各自分离的状态投放到市场。As shown in FIGS. 5, 6 and 11-14, it is well known that an
如图5和6所示,由于焊接加工的结果,引线1a和焊片1b之间的接头1d通常形成坚硬而锋利的突起部分1e,另外由于加压处理的结果,在平片1c的一个表面上,沿着平片的周边通常形成毛刺1f。由于处理而使铝硬化,因此突起部分1e和毛刺1f非常坚硬。As shown in Figures 5 and 6, as a result of the soldering process, the
如图11和12所示,通过振动型送料器(未画出)形成的涡旋使引线元件1转动,以使引线1a成直线下落,将电子引线元件1传送到焊片焊接设备(未画出),然后将引线1a传送到一对导轨2之间的空隙2a中。送料器通过重力或施加在导轨2的振动将引线元件1按箭头A指示的方向传送到焊片焊接设备。As shown in Figures 11 and 12, the
传送期间,引线元件1实际上,是在导轨2之间如箭头B或C所示方向朝轴向转动引线元件1的转动,造成接头1d与导轨2的相对的边缘2b摩擦,从而在传送引线元件1时刮坏导轨2的边缘2b。该刮削作用将很快地损坏导轨2的传送功能。如果引线元件1在这种刮过的导轨2上传送,导轨2损坏的边缘2a会将引线1a卡住,并且不能平滑地传送。因此需要经常修理导轨2或使用新的导轨。During transfer, the
如图13和14所示,为制造电解电容器元件,需要采用机械压力将引线元件1的平片1c牢固地搭接到铝箔3(所谓的焊片搭接)。然而,如果平片1c带有毛刺1f的表面的与铝箔3接触,然后施加机械压力,毛刺1f将按箭头D所示的方向损坏或切开铝箔3。结果,电解电容器元件的电性能将明显地变坏。As shown in FIGS. 13 and 14, in order to manufacture electrolytic capacitor elements, it is necessary to firmly lap the
为了防止铝箔3被损伤,需要将平片1c没有毛刺1f的表面与铝箔接触,然后施加机械压力。然而如图8所示,当引线元件1在导轨2上传送时,它们按箭头B或C所示的方向轴向转动。实际上不可能将所有平片1c的同样的表面定位在同一方向,以使所有平片1c的同样的表面与铝箔3接触。在电解电容器元件较小的情况下,由于引线元件1的平片1c更小,因此显得尤其困难。In order to prevent the
电子引线元件1被传送时,平片1c表面是不定向的,平片1c带毛刺1f的表面接触并固定到铝箔3的可能性是50%。在这种情况下,毛刺1f很可能刺入铝箔3中并破坏电容器的电特性。毛刺1f将经常按箭头D所示的方向切开铝箔3,使成品电容器无用。When the
本发明消除了这些缺点和不利方面,本发明的主要目的是提供一种专门制造电子引线元件的方法,其中,制造一组薄金属带卷绕状态的电子引线元件,该薄金属带具有按预定间隔使相邻的引线元件相搭接的引线元件。本发明的另一个目的是不对传送设备造成损坏地传送引线元件。本发明的另一目的是平滑地传送引线元件,以明显地提高焊片塔接操作的有效性。本发明的另一目的是将在其之间带有预定间隔的引线的一端固定到薄金属带上,然后将焊片端焊接在引线的另一端,并将焊片的另一端压成平片,以使焊片在加压过程中产生有毛刺的一面定位在同一方向,以便带毛刺的表面不与要焊接的铝箔接触,从而防止了毛刺对铝箔造成损坏。The present invention eliminates these disadvantages and disadvantageous aspects, and the main object of the present invention is to provide a method for exclusively manufacturing electronic lead components, wherein a set of electronic lead components in a coiled state of a thin metal strip having a predetermined A lead element spaced such that adjacent lead elements overlap. Another object of the invention is to transport lead elements without causing damage to the transport equipment. Another object of the present invention is to smoothly transport leaded components to significantly increase the effectiveness of the tab splicing operation. Another object of the present invention is to fix one end of the lead with a predetermined space therebetween to a thin metal strip, then solder the solder tab end to the other end of the lead and press the other end of the solder tab into a flat sheet to The side of the solder sheet with burrs generated during the pressurization process is positioned in the same direction, so that the surface with burrs does not contact the aluminum foil to be welded, thereby preventing the burrs from damaging the aluminum foil.
本发明的另一个目的是将在其间带有预定间隔的引线的一端固定到薄金属带上,该带具有一系列在其间带有预定间隔的进料口,然后将铝焊片焊接到引线的另一端,并将焊片的一端压成平片形状,然后使该带的进料口与传送该带的带齿卷盘啮合。本发明的再一个目的是最终将包括一组电子引线元件的薄金属带卷成金属带卷。因此可以容易而方便地加工引线元件。Another object of the present invention is to secure one end of a lead wire with a predetermined space therebetween to a thin metal strip having a series of feed ports with a predetermined space therebetween and then solder aluminum solder tabs to the ends of the lead wire The other end, and one end of the solder tab is pressed into a flat sheet shape, and then the feed port of the belt is engaged with the toothed reel that conveys the belt. It is a further object of the present invention to ultimately roll a thin metal strip comprising a set of electronic lead elements into a metal strip roll. Therefore, lead components can be processed easily and conveniently.
总之,本发明提供了形成薄金属带卷的方法,引线的一端,在薄金属带上按定间隔固定,引线的另一端与铝焊片的一端焊接,焊片另一端的被加压成平片。In summary, the present invention provides a method for forming a thin metal strip coil, one end of the lead wire is fixed at a fixed interval on the thin metal strip, the other end of the lead wire is welded to one end of the aluminum soldering piece, and the other end of the welding piece is pressed into a flat sheet .
本发明的另一个模式是将其间带有预定间隔的引线的一端固定到薄金属带上,然后将铝焊片的一端焊接到引线的另一端并对焊片另一端压成平片。Another mode of the invention is to fix one end of the lead wire with a predetermined space therebetween to a thin metal strip, then solder one end of an aluminum solder tab to the other end of the lead wire and press the other end of the solder tab into a flat sheet.
本发明的另一个模式是将引线的一端按预定间隔固定到薄金属带上,铝焊片的一端与引线的另一端焊接,然后将焊片另一端的部分压成平片。Another mode of the present invention is to fix one end of the lead wire to the thin metal strip at predetermined intervals, weld one end of the aluminum solder tab to the other end of the lead wire, and then press the other end of the solder tab into a flat sheet.
本发明的另一模式是按预定间隔将引线的一端固定到薄金属带上,在金属带上有按预定间隔形成的传送口,然后将铝焊片的一端焊接到引线的另端,之后,再对焊片另一端压成平片。Another mode of the present invention is to fix one end of the lead wire to a thin metal strip at predetermined intervals, on which there are delivery ports formed at predetermined intervals, and then weld one end of the aluminum soldering piece to the other end of the lead wire, after that, Then press the other end of the solder piece into a flat piece.
本发明的另一模式是按预定间隔将引线的一端固定到薄金属带上,铝焊片一端与引线的另一端焊接,而且在金属上按预定间隔形成有进料口,之后,再将焊片另一端的部分压成平片。Another mode of the present invention is to fix one end of the lead wire to the thin metal strip at predetermined intervals, weld one end of the aluminum solder sheet to the other end of the lead wire, and form feed ports on the metal at predetermined intervals, and then weld The other end of the sheet is pressed into a flat sheet.
本发明的另一个模式是提供一组呈薄金属带卷形式的电子引线元件,其中其间有预定间隔的引线元件的引线的一端焊接在金属带上,铝焊片的一端与引线的另一端焊接,并且焊片的另一端被压成平片。Another mode of the invention is to provide a set of electronic lead components in the form of coils of thin metal strip, wherein one end of the lead of the lead component with predetermined spacing therebetween is soldered to the metal strip, and one end of the aluminum solder tab is welded to the other end of the lead. , and the other end of the solder tab is pressed into a flat sheet.
本发明的另一个模式是将多条引线的一端焊接到薄金属带上,然后将铝焊片的一端焊接到引线的另一端,之后再对焊片另一的部分加压成平片。Another mode of the invention is to solder one end of a plurality of leads to a thin metal strip, then solder one end of an aluminum solder tab to the other end of the lead, and then press the other part of the solder tab into a flat sheet.
本发明的另一个模式是将多条引线的一端焊接到薄金属带上,铝焊片的一端与引线的另一端焊接,然后对焊片另一端的部分加压形成平片。Another mode of the invention is to weld one end of a plurality of lead wires to a thin metal strip, weld one end of an aluminum solder tab to the other end of the lead wire, and then pressurize the other end of the solder tab to form a flat sheet.
本发明的其它特性和优点将通过对本发明的优选实例的描述表现出来。Other characteristics and advantages of the present invention will appear through the description of the preferred examples of the present invention.
图1是按照本发明的焊接在薄金属带上的电子引线元件的正视图;Figure 1 is a front view of an electronic lead element welded on a thin metal strip according to the present invention;
图2是焊接到金属带上的电子引线元件的引线的轴侧图;Figure 2 is an isometric view of a lead of an electronic lead component soldered to a metal strip;
图3是金属带上固定有电子引线元件时的薄金属带卷的平面图;Figure 3 is a plan view of a roll of thin metal tape with electronic lead components fixed to the metal tape;
图4是铝焊片的一个表面搭接到铝箔上而不对铝箔造成损坏的电子引线元件的横截图;Figure 4 is a cross-section of an electronic lead component with one surface of the aluminum solder tab lapped to the aluminum foil without causing damage to the aluminum foil;
图5是作为实施例的局部放大的焊接到电子引线元件的引线上的一个焊片的截面图;Fig. 5 is a cross-sectional view of a welding piece welded to the lead of an electronic lead component as a partially enlarged part of an embodiment;
图6与图5相同,但所示的是另一实施例;Figure 6 is the same as Figure 5, but shows another embodiment;
图7-10是本发明的另一个实施例,其中,Fig. 7-10 is another embodiment of the present invention, wherein,
图7是引线端被焊接到薄金属带突出部分的电子引线元件的轴侧图;Figure 7 is an isometric view of an electronic leaded component with the lead ends soldered to the protruding portion of the thin metal strip;
图8是用激光焊接设备将引线元件的引线端部焊接到金属带突出部分的轴侧图;Fig. 8 is an isometric view of the lead end of the lead element welded to the protruding portion of the metal strip by laser welding equipment;
图9是由一个薄金属处压出的多个金属带的平面图;Figure 9 is a plan view of a plurality of metal strips extruded from a thin metal place;
图10是由该薄金属片压出并且彼此分离的多个金属带的轴侧图;Figure 10 is an isometric view of a plurality of metal strips extruded from the thin metal sheet and separated from each other;
图11-14是一个常规实施例,其中,11-14 is a conventional embodiment, wherein,
图11是在导轨上传送的电子引线元件平面图;Figure 11 is a plan view of electronic lead components conveyed on the guide rail;
图12是导轨被焊接的焊片部分损坏的轴侧图;Figure 12 is an isometric view of the guide rail being partially damaged by welding the lug;
图13是铝箔被焊片的平面上形成的毛刺切开的轴侧图;以及Figure 13 is an isometric view of an aluminum foil cut through by a burr formed on the plane of the solder tab; and
图14是引线元件和铝箔的横截面图,后者被毛刺切开。Figure 14 is a cross-sectional view of a lead element and aluminum foil, the latter being cut by a burr.
参照图1-4,每个电子引线元件10由一条引线12和一个铝焊片13构成。电子引线元件10图定到薄金属带11上。Referring to FIGS. 1-4 , each
用薄金属带11将其间有预定间隔的多个电子引线元件搭接其上。作为实施例,金属带11可以是厚度为0.05mm-0.1mm的不锈钢片,而且可以带有其间有预定间隔的圆形进料口11a。A
引线12是由低碳钢制成的金属丝(CP金属丝)。引线12的直径根据电子引线元件10的尺寸来改变。然而作为电解电容器元件的一部分,引线12的直径一般为0.1mm-1mm。The
焊片13是一根铝棒,其一端焊接到引线12的一端12a。公知的是,焊接工艺之后,在被焊接的部位10a有如图5和6所示的坚硬而锋利的突起部分。The
焊片13的另一个空端被压成平片。该平片被压成预定的形状13a。公知的是,经加压处理后,沿平片13a的一个表面的周边产生了毛刺13b。The other free end of the
按上述方法制成的许多的电子引线元件用这种方式固定到薄金属带11,将引线12的空端12b固定到金属带,即如图1所示。然后按图3中箭头E指示的方向传送金属带11,并按箭头F指示的方向将其卷绕以形成成品金属卷。即,该电子引线元件是以这种金属卷运送的。Many electronic lead components made as described above are secured to the
按照本发明,在焊片13被压成平片13a之前,可以将电子引线元件10按预定间隔固定到金属带11上。According to the present invention, the electronic
在这种情况下,由于焊片13固定到金属带11上之后,受加压处理而成为引线12的延长部分,其形成的平片13a按同一方向,从而使带毛刺13b的表面肯定会在同一方向取向。而这些带毛刺的面不会在不同的方向取向。In this case, after the
参照图1和2,作为实施例可以通过激光焊接设备14将引线12按其预定间隔固定到薄金属带11上。Referring to FIGS. 1 and 2, as an example, the
然后将铝焊片13的一端焊接到引线12的一端12a上,之后将焊片的空端部分压成平片13a。当然,在引线12焊接到金属带11之前可以将片13焊接到引线12上。Then one end of the
按照本发明,其制造过程是极高的效率连续自动地进行的,该制造过程包括步骤:传送引线12到薄金属带11,将引线12焊接到金属带11,铝焊片13焊接到引线12,对焊片13加压形成平片13a以及将金属带卷绕成金属卷形。According to the present invention, its manufacturing process is carried out continuously and automatically with extremely high efficiency. The manufacturing process includes the steps of: transferring the
如图3所示,由于电子引线元件10被卷成金属卷形式,与传统的许多单个电子元件一起装在容器中的方法相比,元件10的处理和运输就显得非常容易和方便。按照本发明,很明显,可以防止电子引线元件10扭绞和/或弯曲。另外,电子引线元件10能够容易而迅速地被清洗和化学处理。As shown in FIG. 3, since the
另外,按照本发明,搭接有电子引线元件10的金属带11通过进料口11a与带齿卷盘(未画出)啮合,然后传送到作为电容器制造设备一部分的焊片焊接设备(未画出),再将引线元件10从金属带11切去,之后,将平片13a的表面与铝箔20搭接,并施加机械压力将其固定到铝箔上。这些操作是连续而且是自动进行的。In addition, according to the present invention, the
按照本发明,由于采用带齿卷盘传送搭接有引线元件10的金属带,引线元件10不会损坏传送设备,而采用象涡旋型进料器这样的传统进料器的情况下,可能会以其他方式损坏传输设备。因此,本发明采用的进料器耐用,并且能将引线元件10平滑地传送到焊片焊接设备。According to the present invention, since the metal strip overlapped with the
如图4所示,注意到,焊片13是以如下的方式连接到铝箔20的,由于引线元件10是在平片13a有毛刺13b的表面在同一方向取向的状态下传送的,因此,平片13a无毛刺13b的表面肯定与铝箔20接触。很明显,当施加机械压力将焊片13连结到铝箔20时,毛刺13b不会损坏铝箔20。As shown in FIG. 4, notice that the
在该实施例中,薄金属带11是不锈钢片。但是该金属带也可以是黄铜片、铜片、铍片、低碳钢片或合成树脂片中的一种。另外可以采用粘接方法代替焊接方法将引线固定到金属带。In this embodiment the
参照图7-10,说明本发明的另一个实施例。在该实施例中,薄金属带的形状与第一个实施例中的不同。Another embodiment of the present invention is illustrated with reference to Figs. 7-10. In this embodiment, the shape of the thin metal strip is different from that of the first embodiment.
对于薄金属带,将采用不同的标注数字说明,而对于其它元件的标注数字将与第一实施例中的相同。For thin metal strips, different reference numerals will be used, while for other elements the reference numerals will be the same as in the first embodiment.
与第一个实施例中构成的具有与直线平行延伸的相对的横边的金属带11相比,第二个实施例中的金属带110是由按预定间隔设置有凹口110b和突出部分110c,其中凹口110b和突出部分110c是相对对准的薄金属100压成的。另外如图9和10所示,金属带110带有按预定间隔设置的传送口110a,它与凹口110b和突出部分110c一起设置在金属带110上。Compared with the
凹口110b和突出部分110c的面积的尺寸和形状相同。例如,金属带110的宽度为5mm,突出部分110c的横向宽度约1mm,比上文提到的电子引线元件10的引线12的0.1mm-1mm的直径略宽。The size and shape of the area of the
例如,用激光焊接设备14在焊片13焊接到导线12的相反端12a之后或之前,将导线12的一端12b焊接到金属带110的突出部分110c上。然后用第一个实施例中提到的相同的方法将金属带110卷成金属卷。For example, one
按照该实施例,由于焊接过程中产生的热被限定在金属带110的突出部分110c上,热量不会使金属带110弯曲或变形。According to this embodiment, since the heat generated during welding is confined to the protruding
参照优选的实施例说明了本发明。但本发明可以进行各种改型和变化。然而这些改型和变化并没有脱离本发明的精神以及本发明下列的权利要求的范围。The invention has been described with reference to preferred embodiments. However, various modifications and changes can be made to the present invention. However, these modifications and changes do not depart from the spirit of the present invention and the scope of the following claims of the present invention.
Claims (18)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP227923/1993 | 1993-08-19 | ||
| JP227923/93 | 1993-08-19 | ||
| JP5227923A JPH0757979A (en) | 1993-08-19 | 1993-08-19 | Lead wire of electronic device and manufacturing method and apparatus therefor |
| JP6135107A JPH07320990A (en) | 1994-05-25 | 1994-05-25 | Lead wire for electronic parts and method and device for manufacturing it |
| JP135107/94 | 1994-05-25 | ||
| JP135107/1994 | 1994-05-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98122815A Division CN1096086C (en) | 1993-08-19 | 1998-11-23 | Electronic lead elements and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1109998A true CN1109998A (en) | 1995-10-11 |
| CN1054229C CN1054229C (en) | 2000-07-05 |
Family
ID=26469043
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94116819A Expired - Fee Related CN1054229C (en) | 1993-08-19 | 1994-08-19 | Method for manufacturing a set of electronic lead components |
| CN98122815A Expired - Fee Related CN1096086C (en) | 1993-08-19 | 1998-11-23 | Electronic lead elements and production method thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98122815A Expired - Fee Related CN1096086C (en) | 1993-08-19 | 1998-11-23 | Electronic lead elements and production method thereof |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR950007218A (en) |
| CN (2) | CN1054229C (en) |
| GB (1) | GB2282089B (en) |
| MY (1) | MY111294A (en) |
| TW (2) | TW383895U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131597A (en) * | 2008-07-10 | 2011-07-20 | 夏伊洛工业公司 | Metal forming process and welded coil assembly |
| CH701973A1 (en) * | 2009-10-12 | 2011-04-15 | Polycontact Ag | Creating an electric connection between a contact plate of an electromechanic switch, and a stranded wire on a power supply and/or signaling line, comprises electrical conductively connecting together the plate and the stranded wire |
| CN112768247B (en) * | 2021-01-29 | 2022-03-08 | 南通三华电子工业有限公司 | Aluminum electrolytic capacitor lead-out wire and production equipment thereof |
| CN119368916A (en) * | 2023-07-26 | 2025-01-28 | 中国科学院半导体研究所 | Welding method for ultra-thin metal electrode connection |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4196959A (en) * | 1977-12-27 | 1980-04-08 | Beckman Instruments, Inc. | Carrier strip for round lead pins and method for making the same |
| GB2041256B (en) * | 1979-01-24 | 1983-02-09 | Bicc Burndy Ltd | Electric wiring harnesses |
| GB2057311B (en) * | 1979-08-31 | 1983-03-09 | Plessey Co Ltd | Making electrical connectors |
| DE3164349D1 (en) * | 1980-02-16 | 1984-08-02 | Plessey Overseas | Improvements in or relating to carrier strips for electrical contact members and methods of making such carrier strips and the electrical contact members |
| FR2625594B1 (en) * | 1988-01-05 | 1990-05-04 | Thomson Csf | CHARGE DUPLICATOR FOR CHARGE TRANSFER DEVICE |
| EP0492492B1 (en) * | 1990-12-21 | 1996-05-08 | The Whitaker Corporation | Method of securing a connector to a circuit element and soldering lead frame for use therein |
-
1994
- 1994-08-10 GB GB9416190A patent/GB2282089B/en not_active Expired - Fee Related
- 1994-08-15 MY MYPI94002131A patent/MY111294A/en unknown
- 1994-08-15 TW TW086214740U patent/TW383895U/en not_active IP Right Cessation
- 1994-08-15 TW TW086104659A patent/TW326540B/en active
- 1994-08-19 CN CN94116819A patent/CN1054229C/en not_active Expired - Fee Related
- 1994-08-19 KR KR1019940020468A patent/KR950007218A/en not_active Ceased
-
1998
- 1998-11-23 CN CN98122815A patent/CN1096086C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2282089B (en) | 1996-08-28 |
| GB2282089A (en) | 1995-03-29 |
| TW383895U (en) | 2000-03-01 |
| CN1096086C (en) | 2002-12-11 |
| CN1054229C (en) | 2000-07-05 |
| MY111294A (en) | 1999-10-30 |
| CN1222742A (en) | 1999-07-14 |
| KR950007218A (en) | 1995-03-21 |
| GB9416190D0 (en) | 1994-09-28 |
| TW326540B (en) | 1998-02-11 |
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