CN110995893B - Smart phone motherboard that radiating efficiency is high - Google Patents
Smart phone motherboard that radiating efficiency is high Download PDFInfo
- Publication number
- CN110995893B CN110995893B CN201911106456.5A CN201911106456A CN110995893B CN 110995893 B CN110995893 B CN 110995893B CN 201911106456 A CN201911106456 A CN 201911106456A CN 110995893 B CN110995893 B CN 110995893B
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- China
- Prior art keywords
- heat dissipation
- mainboard
- recess
- smart phone
- side wall
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- 244000309464 bull Species 0.000 claims description 12
- 238000013016 damping Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention relates to the technical field of mobile phone accessories and discloses a smart phone mainboard with high heat dissipation efficiency, which comprises a mainboard body and a frame plate, wherein the mainboard body is fixedly arranged in the frame plate, a heat dissipation fan is fixedly arranged on the side wall of the mainboard body, which is far away from one side of the frame plate, the heat dissipation fan is arranged below the side wall of the mainboard body, two air ports are symmetrically formed in the side wall of the frame plate, annular grooves are formed in the side walls of the two air ports, placing grooves are formed in opposite sides of the two annular grooves, movable plates are arranged in the two placing grooves, movable mechanisms are arranged on the movable plates, a plurality of heat conduction copper plates are symmetrically arranged on the side wall of the mainboard body, which is far away from one side of the heat dissipation fan, and two ends of each. This smart mobile phone motherboard that radiating efficiency is high can improve when great to the mainboard generates heat, improves its radiating efficiency and effect, and then guarantees the life and the result of use of mainboard, the people's of being convenient for use.
Description
Technical Field
The invention relates to the technical field of mobile phone accessories, in particular to a smart mobile phone mainboard with high heat dissipation efficiency.
Background
With the development of science and technology, smart phones have become essential in life. The smart phone is a general name which has an independent operating system and an independent operating space like a personal computer, can be used by a user to install programs provided by third-party service providers such as software, games, navigation and the like, and can realize wireless network access to a mobile phone type through a mobile communication network. The smart phone mainly operates on a main board, which is also called a main board, a system board, a logic board, a mother board, a bottom board, etc., and forms a complex electronic system, such as a center or a main circuit board of an electronic computer. In short, the main board of the mobile phone is the core of the smart phone.
At present, when a mobile phone runs a large-scale game or is applied to a plurality of applications, the heat generated by a mainboard of the mobile phone is large, and in the prior art, the temperature reduction and the heat dissipation of the mainboard of the smart phone mostly depend on passive heat dissipation, which greatly influences the service life of the mainboard, thereby influencing the service life of the mainboard and being inconvenient for people to use.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the smart phone mainboard with high heat dissipation efficiency, which has the advantages of improving the heat dissipation efficiency and effect when the mainboard generates heat greatly, further ensuring the service life and the use effect of the mainboard, and being convenient for people to use, and solves the problems that the service life of the mainboard is influenced and the use of the mainboard is inconvenient because the temperature reduction and the heat dissipation of the smart phone mainboard mostly depend on passive heat dissipation.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a smart mobile phone motherboard that radiating efficiency is high, includes mainboard body and deckle board, the mainboard body is fixed to be set up in the deckle board, the mainboard body deviates from the fixed radiator fan that is equipped with of lateral wall on one side of the deckle board mutually, and radiator fan is located the below setting of mainboard body lateral wall, two wind gaps have been seted up to the lateral wall symmetry of deckle board, and the ring channel has been seted up to the lateral wall in two wind gaps, two the standing groove has all been seted up to the opposite one side of ring channel, two all be equipped with the fly leaf in the standing groove, and be equipped with the moving mechanism on the fly leaf, the lateral wall symmetry of mainboard body radiating fan one side in opposite directions is equipped with a plurality of heat conduction copper, and the both ends of heat conduction copper set up with the both sides inner wall fixed connection of deckle.
Preferably every the movable mechanism all includes clamp plate, a plurality of spring and a plurality of stopper, the lateral wall that the movable plate deviates from mainboard body one side has seted up the recess, and the recess sets up with the wind gap cooperatees, the clamp plate is located the recess, and the both sides wall of clamp plate respectively with the lateral wall fixed connection setting of a plurality of stoppers, a plurality ofly have all been seted up to the both sides wall of recess and have been a plurality of with stopper assorted spacing groove, a plurality of the spring is located the recess respectively, and the both ends of a plurality of springs respectively with the lateral wall of clamp plate and the tank bottom fixed connection setting of recess, a plurality of the spring is evenly distributed and sets up.
Preferably, rubber gaskets are fixedly arranged on four side walls of the two pressure plates and are abutted to the four side walls of the air opening.
Preferably two the strip groove has all been seted up to the clamp plate lateral wall that leaves recess one side back to the back, and the strip inslot is equipped with the bull stick, the one end movable sleeve of bull stick is equipped with the pivot, and the both ends of pivot respectively with the both sides wall fixed connection setting in strip groove.
Preferably, two side walls of the strip-shaped grooves far away from one side of the rotating shaft are fixedly provided with damping layers, and the damping layers are abutted to the rotating rod.
Preferably, the top of the two movable plates is fixedly connected with a pulling block, and a pulling hole is formed in the side wall of the pulling block.
Preferably, the plurality of heat-conducting copper plates are all arranged in an inclined manner, and the inclination angles of the plurality of heat-conducting copper plates are 30 degrees.
(III) advantageous effects
Compared with the prior art, the invention provides the smart phone mainboard with high heat dissipation efficiency, which has the following beneficial effects:
1. this smart mobile phone mainboard that radiating efficiency is high, through the clamp plate that is equipped with, press the clamp plate, make the clamp plate move to the recess in, and then make the fly leaf move in ring channel and standing groove, and then through the bull stick that is equipped with, stimulate the bull stick, make it rotate 90, thus stimulate the bull stick, can make clamp plate and fly leaf move, and then make the wind gap open, when the mainboard body is heated greatly, through the radiator fan that is equipped with, start radiator fan, can make radiator fan induced draft from one of them wind gap, and discharge from another wind gap, and then through being equipped with a plurality of heat conduction copper plates and a plurality of through-holes, can make wind just discharge after a plurality of through-holes, and then can carry out comprehensive heat dissipation to the mainboard body, improve radiating efficiency and effect, be convenient for people's use;
2. this smart mobile phone mainboard that radiating efficiency is high when need not start radiator fan, through the spring that is equipped with, corresponding with the position in wind gap when the clamp plate, through the elasticity of spring, can drive the clamp plate and remove, and then make the wind gap closed, guarantee the aesthetic property of deckle board, and prevent the entering of debris during long-term use, the people's of being convenient for use.
Drawings
Fig. 1 is a schematic structural diagram of a smart phone motherboard with high heat dissipation efficiency according to the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a schematic structural view of the pressing plate and the rotating rod of the present invention;
fig. 4 is a schematic view of the structure of the heat-conducting copper plate according to the present invention.
In the figure: the heat dissipation structure comprises a main board body 1, a frame plate 2, a heat dissipation fan 3, a movable plate 4, a heat conduction copper plate 5, a through hole 6, a pressing plate 7, a spring 8, a limiting block 9, a rotating rod 10, a rotating shaft 11, a pulling block 12, a damping layer 13 and a rubber gasket 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a smart phone motherboard with high heat dissipation efficiency comprises a motherboard body 1 and a frame plate 2, wherein the motherboard body 1 is fixedly arranged in the frame plate 2, a heat dissipation fan 3 is fixedly arranged on a side wall of the motherboard body 1 opposite to one side of the frame plate 2, the heat dissipation fan 3 is arranged below the side wall of the motherboard body 1, two air ports are symmetrically arranged on the side wall of the frame plate 2, annular grooves are arranged on the side walls of the two air ports, placing grooves are arranged on opposite sides of the two annular grooves, a movable plate 4 is arranged in the two placing grooves, a movable mechanism is arranged on the movable plate 4, a plurality of heat-conducting copper plates 5 are symmetrically arranged on the side wall of the motherboard body 1 opposite to the heat dissipation fan 3, two ends of the heat-conducting copper plates 5 are respectively fixedly connected with inner walls on two sides of the frame plate 2, through holes 6 are arranged on the side walls of the plurality, through radiator fan 3 that is equipped with, start radiator fan 3, can make radiator fan 3 induced draft from one of them wind gap to discharge from another wind gap, a plurality of heat conduction copper 5 and a plurality of through-hole 6 that the rethread was equipped with can make wind and just discharge after a plurality of through-holes 6, and then can carry out comprehensive heat dissipation to mainboard body 1, improve radiating efficiency and effect, the people's of being convenient for use.
Every moving mechanism all includes clamp plate 7, a plurality of springs 8 and a plurality of stopper 9, fly leaf 4 back to the lateral wall of mainboard body 1 one side seted up the recess, and the recess cooperatees with the wind gap and sets up, clamp plate 7 is located the recess and sets up, and the both sides wall of clamp plate 7 sets up with the lateral wall fixed connection of a plurality of stopper 9 respectively, a plurality of and stopper 9 assorted spacing grooves have all been seted up to the both sides wall of recess, a plurality of springs 8 are located the recess respectively, and the both ends of a plurality of springs 8 set up with the lateral wall of clamp plate 7 and the tank bottom fixed connection of recess respectively, a plurality of springs 8 are evenly distributed and set up, through clamp plate 7 that is equipped with, press clamp plate 7, make clamp plate 7 move to the recess in, and then make fly leaf 4 can move in ring channel and standing groove, can make clamp plate 7 and fly leaf 4 remove.
The four side walls of the two pressing plates 7 are all fixedly provided with rubber gaskets 14, the rubber gaskets 14 are abutted to the four side walls of the air port, and the sealing performance between the pressing plates 7 and the air port can be improved through the rubber gaskets 14 arranged on the four side walls of the air port, so that the sealing effect of the air port is ensured.
Two clamp plates 7 back to the lateral wall in recess one side has all seted up the bar groove, and the bar inslot is equipped with bull stick 10, and the one end activity cover of bull stick 10 is equipped with pivot 11, and the both ends of pivot 11 set up with the both sides wall fixed connection in bar groove respectively, and pulling bull stick 10 makes it rotate 90 to pulling bull stick 10 can make clamp plate 7 and fly leaf 4 remove.
Two strip-shaped grooves are far away from both sides wall on one side of the rotating shaft 11 and are fixedly provided with damping layers 13, the damping layers 13 are abutted to the rotating rod 10, and the damping layers 13 are arranged, so that the stability of the clamping between the rotating rod 10 and the strip-shaped grooves can be improved, and the rotation of the rotating rod can be prevented.
The top of two fly leaf 4 all fixedly connected with draws piece 12, and draws the lateral wall of piece 12 and seted up the trompil, through the piece 12 that draws that is equipped with, the pulling draws piece 12, can stimulate fly leaf 4, can prevent fly leaf 4 from removing completely to the recess in.
A plurality of heat conduction copper 5 all are the slope setting, and the angle of inclination of a plurality of heat conduction copper 5 is 30, can make the flow of wind better to dispel the heat to mainboard body 1 better.
In conclusion, when the smart phone motherboard with high heat dissipation efficiency is used, the pressing plate 7 is pressed through the pressing plate 7, the pressing plate 7 is moved to the groove, the movable plate 4 can move in the annular groove and the placing groove, the rotating rod 10 is pulled through the rotating rod 10, the rotating rod 10 is rotated by 90 degrees, the pressing plate 7 and the movable plate 4 can be moved through the rotating rod 10, the air outlet is opened, when the motherboard body 1 is heated greatly, the heat dissipation fan 3 is started through the heat dissipation fan 3, the heat dissipation fan 3 can suck air from one air outlet and discharge the air from the other air outlet, and the air can be discharged through the plurality of through holes 6 through the plurality of heat conduction copper plates 5 and the plurality of through holes 6, so that the motherboard body 1 can be comprehensively cooled, the heat dissipation efficiency and effect are improved, and the use of people is facilitated, when no cooling fan 3 needs to be started, the spring 8 is arranged, the pressing plate 7 corresponds to the air port in position, the pressing plate 7 can be driven to move through the elasticity of the spring 8, the air port is closed, the attractiveness of the frame plate 2 is guaranteed, sundries are prevented from entering the air port for a long time, and the air outlet cooling fan is convenient for people to use.
It is to be noted that the term "comprises," "comprising," or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a smart mobile phone motherboard that radiating efficiency is high, includes mainboard body (1) and framed panel (2), mainboard body (1) is fixed to be set up in framed panel (2), its characterized in that: the side wall of the main board body (1) opposite to one side of the frame plate (2) is fixedly provided with a cooling fan (3), the cooling fan (3) is arranged below the side wall of the main board body (1), the side wall of the frame plate (2) is symmetrically provided with two air ports, the side walls of the two air ports are provided with annular grooves, one sides of the two annular grooves opposite to each other are provided with placing grooves, two placing grooves are respectively provided with a movable plate (4), the movable plate (4) is provided with a movable mechanism, the side wall of the main board body (1) opposite to one side of the cooling fan (3) is symmetrically provided with a plurality of heat-conducting copper plates (5), two ends of each heat-conducting copper plate (5) are respectively and fixedly connected with the inner walls of two sides of the frame plate (2), the side walls of the plurality of heat-conducting copper plates (5) are provided with through holes (6);
every moving mechanism all includes clamp plate (7), a plurality of spring (8) and a plurality of stopper (9), lateral wall that fly leaf (4) back of the body of mainboard (1) one side of the back is seted up flutedly, and the recess cooperatees with the wind gap and sets up, clamp plate (7) are located the recess and set up, and the both sides wall of clamp plate (7) respectively with the lateral wall fixed connection setting of a plurality of stopper (9), the both sides wall of recess all seted up a plurality ofly with stopper (9) assorted spacing groove, and is a plurality of spring (8) are located the recess respectively, and the both ends of a plurality of spring (8) respectively with the lateral wall of clamp plate (7) and the tank bottom fixed connection setting of recess, and is a plurality of spring (8) are evenly distributed and set up.
2. The smart phone motherboard with high heat dissipation efficiency according to claim 1, wherein: and rubber gaskets (14) are fixedly arranged on four side walls of the two pressing plates (7), and the rubber gaskets (14) are abutted to the four side walls of the air opening.
3. The smart phone motherboard with high heat dissipation efficiency according to claim 1, wherein: two the strip groove has all been seted up to clamp plate (7) lateral wall on one side of the back-to-back recess, and the strip inslot is equipped with bull stick (10), the one end movable sleeve of bull stick (10) is equipped with pivot (11), and the both ends of pivot (11) respectively with the both sides wall fixed connection setting in strip groove.
4. The smart phone motherboard with high heat dissipation efficiency according to claim 3, wherein: two both sides wall that pivot (11) one side was kept away from in the bar groove all is fixed and is equipped with damping layer (13), and damping layer (13) and bull stick (10) counterbalance setting.
5. The smart phone motherboard with high heat dissipation efficiency according to claim 1, wherein: the top of the two movable plates (4) is fixedly connected with a pulling block (12), and a pulling hole is formed in the side wall of the pulling block (12).
6. The smart phone motherboard with high heat dissipation efficiency according to claim 1, wherein: a plurality of the heat-conducting copper plates (5) are all obliquely arranged, and the inclination angles of the heat-conducting copper plates (5) are 30 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911106456.5A CN110995893B (en) | 2019-11-13 | 2019-11-13 | Smart phone motherboard that radiating efficiency is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911106456.5A CN110995893B (en) | 2019-11-13 | 2019-11-13 | Smart phone motherboard that radiating efficiency is high |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110995893A CN110995893A (en) | 2020-04-10 |
| CN110995893B true CN110995893B (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911106456.5A Expired - Fee Related CN110995893B (en) | 2019-11-13 | 2019-11-13 | Smart phone motherboard that radiating efficiency is high |
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| Country | Link |
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| CN (1) | CN110995893B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150521A (en) * | 2005-11-25 | 2007-06-14 | Kyocera Corp | Portable electronic device, portable electronic device unit, and control method for portable electronic device |
| CN205052036U (en) * | 2015-09-08 | 2016-02-24 | 郑州职业技术学院 | A high efficiency mainboard cooling system for smart mobile phone |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7990724B2 (en) * | 2006-12-19 | 2011-08-02 | Juhasz Paul R | Mobile motherboard |
| CN103049045B (en) * | 2011-10-17 | 2015-11-18 | 华硕电脑股份有限公司 | Main board module and electronic device using the main board module |
| TW201424556A (en) * | 2012-12-11 | 2014-06-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation system for motherboard |
| CN106657449A (en) * | 2015-10-30 | 2017-05-10 | 上海蔓郁信息科技有限公司 | Mobile phone mainboard with high-efficiency heat dissipation |
| CN207625620U (en) * | 2017-12-22 | 2018-07-17 | 东莞市信太通讯设备有限公司 | A heat-dissipating mobile phone motherboard structure |
| CN109981867A (en) * | 2019-03-26 | 2019-07-05 | 努比亚技术有限公司 | Heat dissipating method, mobile terminal and computer readable storage medium |
| CN110430298A (en) * | 2019-08-23 | 2019-11-08 | 河南省酷美智能科技有限公司 | Anti-static cell phone mainboard with radiator structure |
-
2019
- 2019-11-13 CN CN201911106456.5A patent/CN110995893B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150521A (en) * | 2005-11-25 | 2007-06-14 | Kyocera Corp | Portable electronic device, portable electronic device unit, and control method for portable electronic device |
| CN205052036U (en) * | 2015-09-08 | 2016-02-24 | 郑州职业技术学院 | A high efficiency mainboard cooling system for smart mobile phone |
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| CN110995893A (en) | 2020-04-10 |
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Granted publication date: 20210302 |