CN1108928C - Ink gun for train printing equipment and its manufacturing method - Google Patents
Ink gun for train printing equipment and its manufacturing method Download PDFInfo
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- CN1108928C CN1108928C CN00100209A CN00100209A CN1108928C CN 1108928 C CN1108928 C CN 1108928C CN 00100209 A CN00100209 A CN 00100209A CN 00100209 A CN00100209 A CN 00100209A CN 1108928 C CN1108928 C CN 1108928C
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- ink
- photosensitive film
- substrate
- printing device
- ink gun
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- 238000007639 printing Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000007921 spray Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 38
- 238000005530 etching Methods 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
本发明用于列印装置的喷墨头及其制造方法，其包括有一形成有多个喷嘴元件的基板，于该基板上形成一第一感光薄膜，再于该第一感光薄膜上定义出多个墨水槽图案；一正光阻形式的第二感光薄膜设于第一感光薄膜上，于该第二感光薄膜上定义出多个喷孔，蚀刻该第二感光薄膜上喷孔图案及第一感光薄膜上墨水槽图案，以形成多个喷孔及墨水槽，一讯号传输装置连接于该基板上，用于将讯号传递至多个喷嘴元件上。
The inkjet head used in printing device and the manufacturing method thereof of the present invention include a substrate formed with a plurality of nozzle elements, a first photosensitive film is formed on the substrate, and a plurality of nozzles are defined on the first photosensitive film. An ink tank pattern; a second photosensitive film in the form of a positive photoresist is arranged on the first photosensitive film, and a plurality of nozzle holes are defined on the second photosensitive film, and the nozzle hole pattern and the first photosensitive film are etched on the second photosensitive film. The ink groove pattern on the film is used to form a plurality of spray holes and ink grooves, and a signal transmission device is connected on the substrate for transmitting signals to a plurality of nozzle elements.
Description
Technical field
The present invention relates to a kind of ink gun and manufacture method thereof that is used for printing device, be meant a kind of method of utilizing the photoetch mode to form spray orifice especially, this method can make the fine ratio of product of ink gun promote and reduce production costs.
Background technology
Traditional thermal (Thermal Bubble) formula ink gun is to utilize heater to produce high temperature, the ink transient heating that will be positioned at inking chamber on the heater produces bubble, pressure by bubble is released ink by the jet orifice of ink gun, and make ink droplet be attached on the ground (as paper) desiring to print, to reach the purpose of prining.Yet for the bubble that heating is produced can be used for the pressure that it produced ink droplet is extruded and formed to ink fully, therefore, the design of ink gun must be confined to ink in the inking chamber in it, allows ink along specific jet orifice ejection.
Another kind of piezoelectricity (Piezo) formula ink gun is to utilize piezoelectric to be used for ink-jet as type of drive, promptly utilizes the change of electrode to see through film and applies pressure to ink, the ink of this point is sprayed via nozzle, and be attached on the base material to be printd.
The ink gun of known a kind of hot bubble type ink jet printing device, its jet orifice are that the mode with electrotyping process is formed on the spray nozzle sheet, spray nozzle sheet are fitted on the thick film photoresistance in accurate contraposition mode again.
Like this, it must very accurately be aimed at the jet orifice on the spray nozzle sheet respectively in the mode of accurate contraposition when assembling with inking chamber, makes the ink that heats through heater in the inking chamber by this jet orifice ejection.Therefore, the cost that this kind processing procedure is consumed is quite high, comprises the facility expense that accurate contraposition is required, and if contraposition assembling and the good general not of fitting reduce the fine ratio of product of product.
The ink gun of another kind of hot bubble type ink jet printing device is as United States Patent (USP) the 5th, 537, No. 133, it is gone up at TAB (flexible circuit board) and forms jet orifice in the radium-shine mode of burrowing, and in accurate contraposition mode TAB is fitted on the substrate again, makes jet orifice and inking chamber fine registration.
Yet, go up forming jet orifice in the radium-shine mode that burrows in TAB, its cost of equipment is quite expensive, will the manufacturing cost of whole ink gun significantly be improved, and it also has because of accurate contraposition and assembly failure and produces the situation of product yield reduction.
Summary of the invention
In view of this, the inventor is originally in the spirit of keeping on improving, innovate breakthrough, be devoted to the research and development of ink gun, invent out ink gun and manufacture method thereof that the present invention is used for printing device, it can improve the shortcoming that equipment cost is high and the production yield is low in the present known ink gun manufacturing, to reach more practical purpose.
Main purpose of the present invention is to provide a kind of ink gun and manufacture method thereof that is used for printing device, and it has the effect that simplifies the ink gun processing procedure, to reach the purpose of saving equipment disbursement and raising product yield.
Another purpose of the present invention is to provide a kind of ink gun and manufacture method thereof that is used for printing device, and it has accurate contraposition and the effect accurately of fitting, and can reach the purpose that improves the product yield and simplify processing procedure.
Another object of the present invention is to provide a kind of ink gun and manufacture method thereof that is used for printing device, it can not make the structural damage of ink container in forming the spray orifice processing procedure, to reach the purpose that promotes the product yield.
A further object of the present invention is to provide a kind of ink gun and manufacture method thereof that is used for printing device, and it can make the signal transmitting device contact effectively with substrate and be fixing.
For achieving the above object, the feature that the present invention is used for the ink gun of printing device and manufacture method thereof in: a substrate is provided, is formed with a plurality of nozzle members on it; Provide one first photosensitive film on this substrate; On this first photosensitive film, define a plurality of ink container patterns; Second photosensitive film that one positive photoresistance form is provided is on first photosensitive film; On this second photosensitive film, define a plurality of spray orifices; Ink container pattern on the spray orifice pattern and first photosensitive film on this second photosensitive film of etching is to form a plurality of spray orifices and ink container; One signal transmitting device is provided, and the one end is connected on this substrate, in order to signal is passed on a plurality of nozzle members.
So, can reach the effect and the purpose of the invention described above.
For making purpose of the present invention, feature and advantage energy thereof more than you know understandable,, do one and be described in detail as follows especially exemplified by going out a preferred embodiment.
Description of drawings
Fig. 1 is used for the first processing procedure figure of the ink gun manufacture method of printing device for the present invention.
Fig. 2 is used for the second processing procedure figure of the ink gun manufacture method of printing device for the present invention.
Fig. 3 is used for the 3rd processing procedure figure of the ink gun manufacture method of printing device for the present invention.
Fig. 4 is used for the 4th processing procedure figure of the ink gun manufacture method of printing device for the present invention.
Fig. 5 is used for the 5th processing procedure figure of the ink gun manufacture method of printing device for the present invention.
Fig. 6 is used for the ink gun constitutional diagram of printing device for the present invention.
The specific embodiment
Consult Fig. 1, be used for the first processing procedure figure of the ink gun manufacture method of printing device for the present invention, a SiO at first is provided
2The substrate of making 10 forms a plurality of nozzle members 12 in the photoetch mode on substrate 10, be positioned at ink on the nozzle member 10 in order to start, by spray orifice (figure shows) ejection.Nozzle member 12 can be heating plate, piezoelectric membrane or alternate manner, and this is a known techniques, therefore repeats no more.
Consult Fig. 2, provide a kind of first photosensitive film 14 on substrate 10, first photosensitive film 14 can be the thick film photoresistance of positive form or cloudy form.If the thick film photoresistance of positive form, then exposure region can etchedly be removed, if the thick film photoresistance of cloudy form, then the unexposed area can etchedly be removed.
Consult Fig. 3, provide one first light shield 16 on first photosensitive film 14, to define a plurality of ink container patterns 19, ink channel pattern 21 reaches and define a plurality of support column patterns 23 on ink channel.If first photosensitive film 14 is the photoresistance of cloudy form, then this ink container pattern 19 and ink channel pattern 21 be for loseing the light district, and most support column pattern 23 is for seeing the light district; If first photosensitive film 14 is the photoresistance of positive form, then this ink container pattern 19 and ink channel pattern 21 be for seeing the light district, and a plurality of support column pattern 23 is for loseing the light district.
Consult Fig. 4, second photosensitive film 24 that a positive photoresistance form is provided is on first photosensitive film 14, and second photosensitive film 24 is the thick film photoresistance, and mode that can roll extrusion is formed on first photosensitive film 14.One second light shield 26 is provided, on second photosensitive film 24, defines a plurality of spray orifice patterns 25, and a plurality of spray orifice pattern 25 is for seeing the light district, can etched formation spray orifice.
Because second photosensitive film 24 is positive photoresistance, therefore, ink container pattern 19 and ink channel pattern 21 that it can not hurt in exposure process on first photosensitive film 14 can improve the ink gun quality.
Consult Fig. 5, with a plurality of spray orifice patterns 25 on dry ecthing or wet etching mode etching second photosensitive film 24, on second photosensitive film 24, to form a plurality of spray orifices 28.Ink container pattern 19 and ink channel pattern 21 on etching first photosensitive film 14 retain on the ink channel 20 with ink channel 20 and 22 of a plurality of support columns that forms a plurality of ink containers 18, connection ink container 18 again, thereby finish the wafer 15 of ink gun.This support column 22 can be used for supporting second photosensitive film 24, makes second photosensitive film 24 be unlikely sagging in the zone of ink channel 20, and hinders the ink supply of ink gun.
Consult Fig. 6, one signal transmitting device 27 is provided, cloth is implanted with electrical interconnection 29 on it, the one end is that signal output end 30 is connected on the wafer 15, in order to signal is passed on a plurality of nozzle members 12, the other end is that signal input end 32 is connected on the printing device, is sent to nozzle member 12 in order to the signal with printing device.Signal transmitting device 27 is a flexible circuit board, is formed with an opening 34 on it, with so that wafer 15 expose by opening 34, spray orifice 12 is sprayed prints, opening 34 is little than wafer 15, makes signal transmitting device 27 can stick in wafer 15 peripheries, to finish the assembling of ink gun.
By above-mentioned structure and manufacture method thereof, ink gun of the present invention can accurately directly be made in spray orifice on the ink gun, can remove known radium-shine burrowing from and form with high costs that the spray orifice mode is caused, and must be with the shortcoming of the accurate contraposition of spray orifice and nozzle member, can effectively promote the fine ratio of product of ink gun and reduce production costs.And second photosensitive film supports by a plurality of support columns 22, makes it be unlikely sagging in ink channel 20 zones, can improve the yield of product.Moreover second photosensitive film 24 is positive photoresistance, makes it in exposure process, can not damage the ink container pattern 19 and the ink channel pattern 21 of lower floor's first photosensitive film 14, can effectively reach and intactly make ink container 18 and ink channel 20.
The above only is the present invention's preferred embodiment, any such as those who are familiar with this art, and any modification of being done in the field of the invention has equal effect person, all contains to be placed in the claim of the present invention.
Figure number explanation substrate 10 nozzle members 12 first photosensitive films 14 first light shields 16 ink containers 18 ink channels 20 support columns 22 second light shields 26 ink container patterns 19 ink channel patterns 21 support column patterns 23 spray orifice patterns 25 second photosensitive films 24 signal output ends 30 electrical interconnections 29 signal input ends 32 openings 34 wafers 15 spray orifices 28 signal transmissions 27
Claims (14)
1. manufacture method that is used for the ink gun of printing device, it comprises the following steps:
Step 1 provides a substrate, is formed with a plurality of nozzle members on it;
Step 2 provides one first photosensitive film on this substrate;
Step 3 provides one first light shield, so that define a plurality of ink containers and ink channel on this first photosensitive film;
Step 4, second photosensitive film that a positive photoresistance form is provided is on this first photosensitive film;
Step 5 provides one second light shield, so that define a plurality of spray orifice patterns on this second photosensitive film;
Step 6, spray orifice pattern on this second photosensitive film of etching and ink container and the ink channel pattern on this first photosensitive film are to form a plurality of spray orifices, ink container and ink channel;
Step 7 provides a signal transmitting device to be connected on this substrate, in order to signal is passed on these a plurality of nozzle members.
2. the ink gun manufacture method that is used for printing device according to claim 1, the thick film photoresistance that wherein said first photosensitive film is positive form or cloudy form.
3. the ink gun manufacture method that is used for printing device according to claim 1, wherein said second photosensitive film is the thick film photoresistance.
4. the ink gun manufacture method that is used for printing device according to claim 1, wherein
Be to form a plurality of spray orifices, ink container and ink channel in the described step 6 with dry ecthing or wet etching mode.
5. the ink gun manufacture method that is used for printing device according to claim 1, wherein
Described signal transmitting device is formed with and is used to opening that this substrate is exposed, and this opening is little than this substrate.
6. the ink gun manufacture method that is used for printing device according to claim 1, wherein
Described signal transmitting device is a flexible circuit board, fits on this substrate, and the spray orifice of this substrate is exposed by this opening.
7. the ink gun manufacture method that is used for printing device according to claim 1 wherein defines a plurality of support column patterns on the ink channel of first photosensitive film, keep this support column during etching on ink channel.
8. ink gun that is used for printing device, it includes haply:
One substrate is formed with a plurality of nozzle members on it;
One first photosensitive film is formed on this substrate, is formed with ink container with respect to each nozzle member position on it;
Second photosensitive film of one positive form is formed on first photosensitive film, forms spray orifice with respect to each nozzle member position on it;
One signal transmitting device, one end are connected on this substrate, in order to signal is passed on a plurality of nozzle members.
9. the ink gun that is used for printing device according to claim 8, the thick film photoresistance that wherein said first photosensitive film is positive form or cloudy form.
10. the ink gun that is used for printing device according to claim 8, wherein said second photosensitive film is the thick film photoresistance.
11. the ink gun that is used for printing device according to claim 8, wherein said first photosensitive film is provided with ink channel and is communicated in this ink container.
12. the ink gun that is used for printing device according to claim 11 is formed with a plurality of support columns on the wherein said ink channel.
Be used to opening that substrate is exposed 13. the ink gun that is used for printing device according to claim 8, wherein said signal transmitting device are formed with, this opening is little than this substrate.
14. the ink gun that is used for printing device according to claim 8, wherein said signal transmitting device is a flexible circuit board, and it fits on this substrate, and the spray orifice on this substrate is exposed by this opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN00100209A CN1108928C (en) | 2000-01-07 | 2000-01-07 | Ink gun for train printing equipment and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN00100209A CN1108928C (en) | 2000-01-07 | 2000-01-07 | Ink gun for train printing equipment and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1303775A CN1303775A (en) | 2001-07-18 |
| CN1108928C true CN1108928C (en) | 2003-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00100209A Expired - Fee Related CN1108928C (en) | 2000-01-07 | 2000-01-07 | Ink gun for train printing equipment and its manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN1108928C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100469580C (en) * | 2004-11-22 | 2009-03-18 | 佳能株式会社 | Method of manufacturing liquid discharge head, and liquid discharge head |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453323C (en) * | 2005-07-13 | 2009-01-21 | 国际联合科技股份有限公司 | Ink jet printing head and its manufacturing process |
| EP1957282B1 (en) * | 2005-12-02 | 2013-04-10 | Canon Kabushiki Kaisha | Liquid discharge head producing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1044407A (en) * | 1996-08-02 | 1998-02-17 | Ricoh Co Ltd | Method of manufacturing inkjet head |
| JPH10166580A (en) * | 1996-12-09 | 1998-06-23 | Seiko Epson Corp | Ink jet recording head |
| CN1227792A (en) * | 1998-03-04 | 1999-09-08 | 大霸电子股份有限公司 | The Method of Thick Film Exposure Alignment of Nozzle Head Ink Chamber |
| JPH11277755A (en) * | 1998-01-28 | 1999-10-12 | Seiko Epson Corp | Method for manufacturing silicon substrate having concave portion and ink jet head, and silicon substrate and ink jet head |
| JPH11320874A (en) * | 1998-05-12 | 1999-11-24 | Ricoh Co Ltd | Inkjet head |
-
2000
- 2000-01-07 CN CN00100209A patent/CN1108928C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1044407A (en) * | 1996-08-02 | 1998-02-17 | Ricoh Co Ltd | Method of manufacturing inkjet head |
| JPH10166580A (en) * | 1996-12-09 | 1998-06-23 | Seiko Epson Corp | Ink jet recording head |
| JPH11277755A (en) * | 1998-01-28 | 1999-10-12 | Seiko Epson Corp | Method for manufacturing silicon substrate having concave portion and ink jet head, and silicon substrate and ink jet head |
| CN1227792A (en) * | 1998-03-04 | 1999-09-08 | 大霸电子股份有限公司 | The Method of Thick Film Exposure Alignment of Nozzle Head Ink Chamber |
| JPH11320874A (en) * | 1998-05-12 | 1999-11-24 | Ricoh Co Ltd | Inkjet head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100469580C (en) * | 2004-11-22 | 2009-03-18 | 佳能株式会社 | Method of manufacturing liquid discharge head, and liquid discharge head |
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| Publication number | Publication date |
|---|---|
| CN1303775A (en) | 2001-07-18 |
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