CN110636698B

CN110636698B - Circuit Board

Info

Publication number: CN110636698B
Application number: CN201911034861.0A
Authority: CN
Inventors: 王博赟; 杨龚轶凡; 郑瀚寻; 闯小明
Original assignee: Zhonghao Xinying Hangzhou Technology Co ltd
Current assignee: Zhonghao Xinying Hangzhou Technology Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2025-05-06
Anticipated expiration: 2039-10-29
Also published as: CN110636698A

Abstract

The embodiment of the invention discloses a circuit board, which comprises a circuit board body and a welding spot structure, wherein the welding spot structure comprises a lead and a base. The solder joint structures are arranged on the circuit board body in parallel in a staggered mode, wherein leads of two adjacent solder joint structures are distributed on different surfaces of the solder joint body. The base is provided with a first welding spot area and a second welding spot area, and the welding spot areas are used for welding pins of the electronic element. The circuit board provided by the embodiment of the invention can reduce transmission impedance, improve heat dissipation area and improve transmission power.

Description

Circuit board

Technical Field

The invention relates to the technical field of integrated circuits, in particular to a circuit board.

Background

PCB (Printed Circuit Board), the chinese name printed circuit board, also known as printed wiring board, is both an important electronic component and a support for electronic components. It is also known as a printed circuit board because it is made using electronic printing. In recent years, with the continuous development of integrated circuit technology, the functions of printed circuit components are continuously enhanced, especially the integrated density of integrated circuits is continuously increased, the power requirement is gradually increased, the signal frequency is continuously floated, and the printed circuit has gradually started to present more and more application problems. For example, the lead width is limited by the size of the integrated circuit chip package, so that the lower limit of the lead impedance is fixed, and the problem of limited maximum transmission power occurs; because the existing integrated circuit chip needs to simultaneously provide power transmission by a plurality of pins (also called pins or leads) in parallel, the conventional PCB technology adopts a solder joint lead mode as shown in figure 1, and the problems of serious signal interference among leads, limitation of the width of the leads and the like are caused by the high density of the plurality of solder joint leads and the small spacing among the leads in the mode.

Disclosure of Invention

In view of this, the present invention provides a circuit board to solve the problems of difficult lower limit of conductive impedance of pins, limited pin width, serious influence of signal interference between pins, etc. in an integrated circuit board.

The embodiment of the invention provides a circuit board, which comprises a welding spot structure and a circuit board body, wherein the welding spot structure comprises leads (also called pins or signal wires) and a base part, the base part of the welding spot structure penetrates through the circuit board body, a plurality of welding spot structures are arranged on the circuit board body in parallel, and the leads of at least one group of two adjacent welding spot structures are distributed on different surfaces of the circuit board body. According to the embodiment of the invention, the welding spot structures are arranged on the circuit board body in parallel and staggered, and the leads of the adjacent welding spot structures are arranged on different surfaces of the circuit board body, so that the distance between the leads is increased, and the high-frequency signal interference between the adjacent leads is reduced.

Further, the welding spot structure further comprises an expansion part, the expansion part is arranged at one end of the base, the expansion part extends to the direction that the lead wire is far away from the base, the expansion part comprises a first plane, the lead wire is arranged on the first plane, and the lead wire covers the first plane.

Further, the lead includes a first end, the extension includes a top surface, the top surface being the first plane, and the first end of the lead is disposed on the top surface.

Further, the thickness of the expansion part is larger than the thickness of the lead wire and smaller than the difference between the thickness of the circuit board body and the thickness of the lead wire. By arranging the expansion part, the welding spot structure ensures that the contact area between the top surface of the expansion part and the lead can be used as the area of the narrowest conductive section in the welding spot structure under the condition that the cross section area of the lead or the cross section area of the base part is larger than the contact area of the lead and the expansion part, ensures the narrowest conductive path of the welding spot structure and reduces the lower limit of the impedance of the lead.

Still further, the lead includes a second end, the second end of the lead having a width that is greater than a width of the first end of the lead.

Further, the maximum value of the width of the second end of the lead is equal to or less than twice the first end of the lead. In the case where the width of the first end of the wire is determined, the width of the second end may be widened, at most, to twice the width of the first end. By widening the width of the lead, the area of the lead is increased, the impedance of the lead is greatly reduced, the difference between the development and actual operation of an Integrated Circuit (IC) element is reduced, the reliability and service life of a PCB circuit are improved, the heat dissipation area of the lead is greatly increased, the heat dissipation performance of the lead is improved, and the maximum transmission power is further improved.

Still further, the solder joint structure includes a first solder joint region and a second solder joint region, the base includes a top end and a bottom end, the first solder joint region is located at the top end of the base, and the second solder joint region is located at the bottom end of the base.

Further, the first welding spot area and the second welding spot area are equal in width. The widths of the welding spot areas on the welding spot structure are set to be equal, so that the two welding spot areas can have the same welding area when the pins of the chips with the same specification are welded, and the normal passage of connection is ensured.

Further, the lead and the base and the extension in the circuit board are integrally formed.

The solder joint structures are alternately arranged in the circuit board, and the lead wires are alternately arranged on different surfaces of different circuit boards, so that the limitation of the chip packaging size is broken through, the relative distance between the lead wires can be increased while the width of the lead wires is expanded, and the high-frequency signal interference between adjacent lead wires is reduced. Meanwhile, the lead wires meet the requirements of welding widths of other elements within the shortest distance, and the wiring difficulty of the circuit board is reduced.

Further combinations of the present invention may be made to provide further implementations based on the implementations provided in the above aspects.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a prior art PCB solder joint lead;

Fig. 2 is a schematic surface view of a circuit board 200 according to an embodiment of the present invention;

FIG. 3 is a schematic perspective view of a solder joint structure 300 according to an embodiment of the present invention;

Fig. 4 is a schematic perspective view of a set of two adjacent soldering structures 400 in a circuit board 200 according to an embodiment of the present invention;

Fig. 5 is a schematic perspective view of a circuit board connected to an electronic chip according to an embodiment of the present invention;

Fig. 6 is a cross-sectional view of a direct connection of a PCB double-sided IC chip according to an embodiment of the present invention;

fig. 7 is a schematic perspective view of another solder joint structure 700 according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The following describes embodiments of the present invention in detail.

Fig. 2 is a schematic surface view of a circuit board 200 according to an embodiment of the invention. As shown in fig. 2, the circuit board 200 includes a circuit board body 201 and a plurality of solder joint structures 502. The solder joint structure 502 includes a lead and a base including a top end and a bottom end, wherein the top end is connected to one end of the lead. The circuit board body 201 is divided into an upper surface, which is shown in fig. 2, and a lower surface, which is another surface, which is not shown in fig. 2. The bases of the plurality of solder joint structures 502 penetrate through the circuit board body 201, wherein the top and bottom ends of the base and the leads connecting the top ends are exposed on the upper or lower surface of the circuit board body 201. The solder joint structures 502 are arranged in parallel and staggered, wherein the leads of at least one group of two adjacent solder joint structures 502 are distributed on different surfaces of the circuit board body 501.

Fig. 3 is a schematic perspective view of a solder joint structure 300 according to an embodiment of the invention. As shown in fig. 3, the solder joint structure 300 includes a lead 301, a base 302, and an extension 303. The lead 301 is strip-shaped with a narrower end (the end closer to the base and the expansion) being the first end of the lead 301 and a wider end (the end farther from the base and the expansion) being the second end of the lead 301. The first end of the lead 301 is integrally formed with the top ends of the base 302 and the extension 303. The width of the first end of the wire 301 is smaller than the width of the second end. The base 302 is oblate, with a first pad area 3021 at the top and a second pad area 3022 at the bottom. The first welding spot area and the second welding spot area are used for welding with the electronic chip. An expansion part 303 is further arranged on the side surface of the base part 302, which is close to the top end, the expansion part is in a crescent columnar shape, and the expansion part 303 extends towards the direction that the lead wire is far away from the upper end of the base part 302. The extension 303 includes a first plane, which is a surface on which the leads are disposed. In this embodiment, the first plane is the upper surface of the expansion 303. As shown in the drawing, the upper surface of the extension 303 is covered by the lead 301, and a dotted line area E in fig. 2 is formed, i.e. the contact area between the extension 303 and the lead 301. In this embodiment, the thickness of the extension 303 is half of the thickness of the base 302, and in some other embodiments, the thickness of the extension 303 is greater than the thickness of the lead 301 and less than the difference between the thickness of the base 302 and the thickness of the lead 301.

Referring to fig. 4, a schematic perspective view of a set of two adjacent solder joint structures 400 in the circuit board 200 according to an embodiment of the invention is shown. As shown in fig. 4 (a), 400 is a set of two adjacent pad structures on the circuit board 200. As shown in fig. 4 (b), a set of pad structures 400 includes a pad structure 401 and a pad structure 402, wherein the top ends of the leads and the base of the pad structure 401 are placed above and exposed on the upper surface of the circuit board body, the top end surface is provided with a first pad region 4011, the bottom end of the base is placed below and exposed on the lower surface of the circuit board body, the bottom end surface is provided with a second pad region (not shown in the figure), the top ends of the leads and the base of the pad structure 402 are placed below and exposed on the lower surface of the circuit board body, the top end surface is provided with a first pad region (not shown in the figure) of the pad structure 402, the bottom end of the base is placed above and exposed on the upper surface of the circuit board body, and the bottom end surface is provided with a second pad region 4022 of the pad structure 402. The welding spot structures are alternately arranged in the circuit board body, and leads of two adjacent welding spot structures are arranged on the upper surface of the circuit board body and on the lower surface of the circuit board body. Similarly, the first welding spot area and the second welding spot area are also arranged in the same mode, namely, one of the first welding spot areas of two adjacent welding spot structures is positioned on the upper surface of the circuit board body, the other is positioned on the lower surface of the circuit board body, and the other of the second welding spot areas is positioned on the upper surface of the circuit board body. The first welding spot area is closely adjacent to the second welding spot area on the same surface of the circuit board body, and the minimum safety distance is kept between the first welding spot area and the second welding spot area and is equal to the distance between each lead wire in one side of the circuit board body. In this embodiment, the widths of the first pad area and the second pad area are equal to each other, which is equal to the width of the first end of the lead.

Fig. 5 is a schematic perspective view illustrating connection between a circuit board and an electronic chip according to an embodiment of the invention. As shown in fig. 5, a plurality of pins 5011 are disposed on the electronic chip 501, and a printed circuit board body 502 is provided with a queue formed by the positive and negative arrangement of the solder joint structures of the integrated circuit, including a lead 5021, a first solder joint region 5022 and a second solder joint region 5023, wherein the width of the second end of the lead 5021 is 2 times that of the first end. The width of the second end in some other embodiments is 1.5 times the width of the first section. Each of the pins 5011 of the electronic chip 501 will be soldered to either the first solder joint area 5022 or the second solder joint area 5023 on the printed circuit board body 502. The other electronic chip 503 and electronic chip 501 type includes a plurality of leads 5031, each of which leads of the electronic chip 503 is to be soldered to a first solder joint area and a second solder joint area of the lower surface of the printed circuit board body 502. The leads 5021 may be used to connect other electronic components or wires.

Fig. 6 is a cross-sectional view of a direct connection of a PCB double-sided IC chip according to an embodiment of the present invention. As shown in fig. 6, the solder joint structure penetrates through the circuit board body 601, wherein the lead 6021 and the first solder joint region (not shown in the figure) are located on the upper surface of the circuit board body 601, the lower surface of the base 6023, that is, the second solder joint region (not shown in the figure) is located on the lower surface of the circuit board body, and the base 6023 is located in the circuit board body 601. The first solder joint area on the upper surface may be soldered to a lead 6031 of an electronic component 603 and the second solder joint area on the lower surface may be soldered to a lead 6041 of another electronic component 604. Through the connection mode, the direct communication of the two IC chips can be realized.

Fig. 7 is a schematic perspective view of another solder joint structure 700 according to an embodiment of the invention. As shown in fig. 7, solder joint structure 700 includes a lead 701, a base 702, and an extension 703. Wherein the expansion portion 703 is configured as a circular-curved column, and includes a circular-curved surface 7031 thereon. The round curved surface is used for reducing electromagnetic interference and reflection at the corner of the high-frequency signal.

By arranging the expansion part, the welding spot structure ensures that the contact area between the top surface of the expansion part and the lead can be used as the area of the narrowest conductive section in the welding spot structure under the condition that the cross section area of the lead or the cross section area of the base part is larger than the contact area of the lead and the expansion part, ensures the narrowest conductive path of the welding spot structure and reduces the lower limit of the impedance of the lead. In the case where the width of the first end of the wire is determined, the width of the second end may be widened, at most, to twice the width of the first end. By widening the width of the lead, the area of the lead is increased, the impedance of the lead is greatly reduced, the difference between the development and actual operation of an Integrated Circuit (IC) element is reduced, the reliability and service life of a PCB circuit are improved, the heat dissipation area of the lead is greatly increased, the heat dissipation performance of the lead is improved, and the maximum transmission power is further improved. The solder joint structures are alternately arranged in the circuit board, and the lead wires are alternately arranged on different surfaces of different circuit boards, so that the limitation of the chip packaging size is broken through, the relative distance between the lead wires can be increased while the width of the lead wires is expanded, and the high-frequency signal interference between adjacent lead wires is reduced. Meanwhile, the lead wires meet the requirements of welding widths of other elements within the shortest distance, and the wiring difficulty of the circuit board is reduced.

While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and alternative arrangements included within the spirit and scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims

1. A circuit board, comprising a solder joint structure and a circuit board body, wherein the solder joint structure comprises a lead and a base, the base of the solder joint structure penetrates the circuit board body, a plurality of the solder joint structures are arranged in parallel on the circuit board body, and the leads of at least one group of two adjacent solder joint structures are distributed on different surfaces of the circuit board body;

The solder joint structure includes a first solder joint area and a second solder joint area; the base includes a top end and a bottom end, the first solder joint area is located at the top end, and the second solder joint area is located at the bottom end; the top end is connected to one end of the lead; one of the first solder joint areas of two adjacent solder joint structures is located on the upper surface of the circuit board body, and the other is located on the lower surface of the circuit board body; one of the second solder joint areas of two adjacent solder joint structures is located on the upper surface of the circuit board body, and the other is located on the lower surface of the circuit board body;

The solder joint structure also includes an extension portion, which is arranged at one end of the base; the extension portion extends in a direction in which the lead is away from the base; the extension portion includes a first plane; the lead is arranged on the first plane; and the lead covers the first plane.

2 . The circuit board according to claim 1 , wherein the lead includes a first end; the extended portion includes a top surface; and the top surface is the first plane.

3 . The circuit board according to claim 2 , wherein the thickness of the extension portion is greater than the thickness of the lead and less than the difference between the thickness of the circuit board body and the thickness of the lead.

4 . The circuit board according to claim 2 , wherein the lead includes a second end, and a width of the second end is greater than that of the first end.

5 . The circuit board according to claim 4 , wherein the maximum value of the width of the second end is less than or equal to twice the width of the first end.

6 . The circuit board according to claim 5 , wherein the first solder joint area and the second solder joint area are of equal width.

7 . The circuit board according to claim 6 , wherein the first end is as wide as the first solder joint area.

8. The circuit board according to any one of claims 1 to 7, characterized in that the lead is integrally formed with the base and the extension portion.