CN110535027A - For manufacturing the method and optoelectronic semiconductor component of optoelectronic semiconductor component - Google Patents

Abstract

The invention discloses a method for manufacturing an optoelectronic semiconductor component in the field of semiconductor technology and an optoelectronic semiconductor component, including a semiconductor and a pressure washer, the pressure washer is installed on the outer wall of the semiconductor, and the two pressure washers are connected and fixed by inserting rods. A limit ring for fixing the insertion rod is installed on the insertion rod. The manufacturing method of the optoelectronic semiconductor component is as follows: step 1: install the pressure washer on the semiconductor; step 2: overlap the two semiconductors with the pressure washer installed ; Step 3: Squeeze the two pressure washers through the pressure device, so that the bottom of the pressure washers is parallel to the surface of the semiconductor, and connect and fix the two semiconductors through the pressure gasket. The pressure gasket has a certain Excellent deformation performance, so that the two semiconductors are in contact with each other, and the purpose of uniform pressure is achieved through the pressure gasket.

Description

Method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component

technical field

The invention relates to the field of semiconductor technology, in particular to a method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component.

Background technique

Semiconductor optoelectronic devices are various functional devices made of semiconductor photo-electron (or electro-photon) conversion effect. It is different from semiconductor optical devices (such as optical waveguide switches, optical modulators, optical deflectors, etc.). The design principle of the optical device is based on the change of the propagation mode of the guided wave by the external field, which is also different from the optoelectronic device used by the early people. The latter only focuses on the reception and conversion of light energy (such as photoresistors, photocells, etc.). Early optoelectronic devices were limited to passive applications. The advent of semiconductor lasers as coherent optical carrier sources in the 1960s brought it into the active application stage. The functions of combined applications of optoelectronic devices are in some aspects (such as optical communication, optical information processing, etc.) etc.) are extending functionality that is difficult for electronics to perform.

When manufacturing optoelectronic semiconductor components, considering the fragility of semiconductors, they are assembled by precision machines. Since the value input by the machine is fixed during assembly, the connection position with the components cannot be adjusted in real time, which is likely to cause hard damage. Moreover, after the semiconductor components are connected, the adjacent semiconductors are fixed by the machine in a large range, resulting in high pressure at the surrounding joints, while the pressure at the middle joints is small, resulting in uneven force.

Contents of the invention

The purpose of the present invention is to provide a method for manufacturing an optoelectronic semiconductor component and an optoelectronic semiconductor component, so as to solve the problem of uneven pressure between semiconductors on the semiconductor component and easy damage caused by the aforementioned background art.

In order to achieve the above object, the present invention provides the following technical solutions: an optoelectronic semiconductor component, including a semiconductor and a pressure washer, the pressure washer is installed on the outer wall of the semiconductor, and the two pressure washers are connected and fixed by inserting rods, and the insert A limit ring for fixing the plunger is installed on the rod.

Preferably, the fabrication method of the optoelectronic semiconductor component is as follows:

Step 1: Install the pressure washer on the semiconductor;

Step 2: Overlap the two semiconductors with pressure washers installed;

Step 3: Squeeze the two pressure washers through a press, so that the bottom of the pressure washers is parallel to the surface of the semiconductor;

Step 4: Insert the insertion rod into the through hole on the pressure washer, and install the limit ring to the other end of the insertion rod to fix the position of the pressure washer;

Step 5: Carry out infrared scanning on the gap between the overlapped optoelectronic semiconductor components;

Step 6: Drive the pressure device according to the scan data to adjust the data;

Step 7: Detect the bearing pressure between the two optoelectronic semiconductors;

Step 8: Adjust the pressure device according to the scanning data and the maximum pressure;

Step 9: Take the best data of the two optoelectronic semiconductors being in contact with each other while the two optoelectronic semiconductors are under pressure and the gap between the two optoelectronic semiconductors to obtain the best pressure bearing state.

Preferably, in the first step, the pressure washer is bonded to the semiconductor, and an insulating gasket is installed between the pressure washer and the semiconductor.

Preferably, the overlapping in the second step is to put the two pressure washers in a stacked state, so that the through holes on the pressure washers correspond to each other.

Preferably, the working method of the pressure device in the third step is to press the bottom of the telescopic rod through the pressure plate corresponding to the pressure washer to press the pressure washer.

Preferably, in the step four, the insertion of the insertion rod into the pressure washer and the fixing of the insertion rod are both completed by machine.

Preferably, the infrared scanning in step five is completed by an infrared scanner.

Preferably, the data adjustment in step six is completed through the control terminal.

Preferably, the pressure detection in step seven is accomplished by a pressure sensor.

Preferably, the data adjustment in the eighth step and the ninth step is completed through the control terminal.

Compared with the prior art, the beneficial effect of the present invention is: through the method for manufacturing an optoelectronic semiconductor component and the optoelectronic semiconductor component, the optoelectronic semiconductor component is assembled by a precision machine in consideration of the fragility of the semiconductor during manufacture, During assembly, since the value input by the machine is fixed, the connection position with the component cannot be adjusted in real time, which may easily cause hard damage. Moreover, after the semiconductor component is connected, the adjacent semiconductors are fixed by the machine in a large range, resulting in The pressure on the surrounding joints is high, while the pressure on the middle joints is small, causing uneven stress. In this application document, the two semiconductors are connected and fixed through a pressure gasket. The pressure gasket has certain deformation properties, so that the two semiconductors can be evenly pressed through the pressure gasket while they are in contact.

Description of drawings

Fig. 1 is a structural representation of the present invention;

Fig. 2 is a schematic view of the top view structure of the present invention;

Fig. 3 is a structural schematic diagram of the pressure device of the present invention.

In the figure: 100 pressure washers, 200 semiconductors, 300 insert rods, 400 through holes, 500 pressure devices.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The present invention provides the following technical solutions: An optoelectronic semiconductor assembly, please refer to Figures 1-3, includes a semiconductor 200 and a pressure washer 100, the pressure washer 100 is installed on the outer wall of the semiconductor 200, and the two pressure washers 100 are connected and fixed by an insertion rod 300 , a limit ring for fixing the insertion rod 300 is installed on the insertion rod 300 .

Wherein, the fabrication method of the optoelectronic semiconductor component is as follows:

Step 1: Install the pressure washer 100 on the semiconductor 200;

Step 2: Overlap the two semiconductors 200 with the pressure washers 100 installed;

Step 3: Squeeze the two pressure washers 100 through the pressure device 500, so that the bottom of the pressure washers 100 is parallel to the surface of the semiconductor 200;

Step 4: Insert the insertion rod 300 into the through hole 400 on the pressure washer 100, and install the limit ring on the other end of the insertion rod 300 to fix the position of the pressure washer 100;

Step 5: Carry out infrared scanning on the gap between the overlapped optoelectronic semiconductor components;

Step 6: Drive the pressure device 500 according to the scan data to adjust the data;

Step 7: Detect the bearing pressure between the two optoelectronic semiconductors 200;

Step 8: Adjust the pressure device 500 according to the scan data and the maximum pressure;

Step 9: Take the best data of the two optoelectronic semiconductors 200 being in contact with each other while the two optoelectronic semiconductors 200 are under pressure and the gap between the two optoelectronic semiconductors 200 to obtain the best pressure bearing state.

Wherein, in step 1, the pressure washer 100 is bonded to the semiconductor 200, and an insulating gasket is installed between the pressure washer 100 and the semiconductor 200. Specifically, the insulating gasket is used to achieve insulation between the pressure washer 100 and the semiconductor 200. , thereby preventing the impact between the pressure washer 100 and the semiconductor 200 .

Wherein, overlapping in step 2 is to put the two pressure washers 100 in a stacked state, so that the through holes 400 on the pressure washers 100 correspond to each other. Specifically, the stacked pressure washers 100 make their pressure surfaces more compact when under pressure. Uniformity, to prevent the semiconductor 200 components from tilting caused by uneven pressure.

Wherein, the working method of the pressure device 500 in step three is to squeeze the pressure washer 100 through the pressure plate corresponding to the pressure washer 100 at the bottom of the telescopic rod. Specifically, the pressure device 500 is composed of a telescopic rod and a pressure plate. The rod is threadedly connected with the pressure plate.

Wherein, in Step 4, the insertion of the insertion rod 300 into the pressure washer 100 and the fixing of the insertion rod 300 are all completed by the machine. Specifically, the machine is composed of a lifting device and a clamping device, and both the clamping device and the lifting device are controlled by the control terminal. , the control end controls the lifting device to lift, the clamping device clamps the insertion rod 300, and cooperates with the lifting device to realize the movement of the insertion rod 300.

Wherein, the infrared scanning in step five is completed by an infrared scanner, specifically, the infrared scanner transmits the scanned information to the control terminal for data processing.

Wherein, the data adjustment in Step 6 is completed through the control terminal, specifically, the control terminal is an external control device, and the detected data is compared with informationized intelligent adjustment.

Wherein, the pressure detection in step seven is completed by a pressure sensor, specifically, the pressure sensor transmits the detected pressure information to the control terminal.

Wherein, the data adjustment in step 8 and step 9 are both completed through the control terminal, specifically, the control terminal is an external control device for informational adjustment of data.

While the invention has been described above with reference to certain embodiments, various modifications may be made and equivalents may be substituted for parts thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, each feature in each embodiment disclosed in the present invention can be used in combination with each other in any way, and the description of these combinations is not exhaustive in this specification only for the sake of Omit length and resource conservation considerations. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims (10)

1. a kind of optoelectronic semiconductor component, it is characterised in that: including semiconductor (200) and pressure disc (100), the pressure Washer (100) is mounted on semiconductor (200) outer wall, is connected between two pressure discs (100) by inserted link (300) solid It is fixed, the spacing collar for fixing inserted link (300) is installed on the inserted link (300).

2. the method according to claim 1 for manufacturing optoelectronic semiconductor (200) component, it is characterised in that: the light Electronic semiconductor components the production method is as follows:

Step 1: pressure disc (100) is mounted on semiconductor (200)；

Step 2: the semiconductor (200) that two install pressure disc (100) is overlapped；

Step 3: two pressure discs (100) are squeezed by pressure device (500), reach the bottom end of pressure disc (100) To with the surface of semiconductor (200) be in parallel shape；

Step 4: inserted link (300) is inserted into the through-hole (400) on pressure disc (100) Nei, spacing collar is installed to inserted link (300) the other end fixes the position of pressure disc (100)；

Step 5: infrared scan will be carried out at the optoelectronic semiconductor component gap of coincidence；

Step 6: data adjusting is carried out according to scanning data drive pressure device (500)；

Step 7: the receiving pressure between two optoelectronic semiconductors (200) of detection；

Step 8: pressure device (500) is adjusted according to scan data and maximum pressure of bearing；

Step 9: take the contact of two optoelectronic semiconductors (200) bear between two optoelectronic semiconductors (200) simultaneously pressure and Gap three's optimum data between two optoelectronic semiconductors (200), obtains optimal pressure bearing state.

3. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 1 It is be bonded between middle pressure disc (100) and semiconductor (200), insulation is installed between pressure disc (100) and semiconductor (200) Gasket.

4. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 2 It is middle to be overlapped to be in the state stacked by two pressure discs (100), keep the through-hole (400) on pressure disc (100) corresponding.

5. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 3 The working method of middle pressure device (500) is by platen corresponding with pressure disc (100) by the bottom of telescopic rod to pressure Washer (100) is squeezed.

6. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 4 Middle inserted link (300) is inserted into pressure disc (100) and inserted link (300) is fixed and completed by machine.

7. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 5 Middle infrared scan is completed by infrared scanner.

8. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 6 Middle data are adjusted to be completed by control terminal.

9. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step 7 Middle pressure detecting is completed by pressure sensor.

10. the method according to claim 2 for manufacturing optoelectronic semiconductor component, it is characterised in that: the step Eight and step 9 in data adjust by control terminal completion.