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CN110487803A - The defect inspection method and device of infrared light-emitting component - Google Patents

The defect inspection method and device of infrared light-emitting component Download PDF

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Publication number
CN110487803A
CN110487803A CN201910770254.4A CN201910770254A CN110487803A CN 110487803 A CN110487803 A CN 110487803A CN 201910770254 A CN201910770254 A CN 201910770254A CN 110487803 A CN110487803 A CN 110487803A
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China
Prior art keywords
emitting component
infrared light
image
infrared
defect
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CN201910770254.4A
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Chinese (zh)
Inventor
黄友林
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Oppo Chongqing Intelligent Technology Co Ltd
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Oppo Chongqing Intelligent Technology Co Ltd
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Priority to CN201910770254.4A priority Critical patent/CN110487803A/en
Publication of CN110487803A publication Critical patent/CN110487803A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02Testing optical properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The application proposes the defect inspection method and device of a kind of infrared light-emitting component, wherein method includes: the infrared image for shooting infrared light-emitting component when shining;The object region comprising infrared light-emitting component is determined in infrared image;The characteristics of image of object region is extracted, and according to the defect of Image Feature Detection infrared light-emitting component.It solves infrared light-emitting component in the prior art as a result, to be arranged under the cover board of shell, it is difficult to which the technical issues of finding emission defects by naked eyes realizes the automatic detection to infrared light-emitting component, and can detecte the defect of diversification, testing cost is small, high-efficient.

Description

The defect inspection method and device of infrared light-emitting component
Technical field
This application involves mobile terminal manufacturing technology field more particularly to a kind of defect inspection methods of infrared light-emitting component And device.
Background technique
With popularizing for mobile terminal, the production mobile terminal of batch, which becomes, in the production line needs, in order to guarantee product Quality, in production essential quality inspection links, wherein when carrying out quality inspection to mobile terminal, infrared light-emitting component is due to setting It sets in the inside of mobile terminal, it is difficult to which, by naked-eye observation etc., thus, defects detection is more difficult.
In the related technology, whether normal come decision-making function by size of current when detection infrared light-emitting component work, however, In practical applications, the defect of infrared light-emitting component further includes blocking defect etc. in installation, thus, this detection mode, inspection The defect kind for surveying infrared light-emitting component is single, and practicability is not high.
Apply for content
The application proposes the defect inspection method and device of a kind of infrared light-emitting component, to solve infrared hair in the prior art Optical element defects detection efficiency is lower and defect type does not detect single technical problem.
The application one side embodiment provides a kind of defect inspection method of infrared light-emitting component, the infraluminescence member Part is contained in the shell of mobile terminal, and cover board is provided with above the infrared light-emitting component, and the cover board is arranged in the shell It on body, the described method comprises the following steps: infrared image of the shooting infrared light-emitting component when shining;In the infrared image Determine the object region comprising the infrared light-emitting component;Extract the characteristics of image of the object region, and according to Described image feature detects the defect of the infrared light-emitting component.
The application another aspect embodiment provides a kind of defect detecting device of infrared light-emitting component, the infraluminescence Element is contained in the shell of mobile terminal, and cover board is provided with above the infrared light-emitting component, and the cover board is arranged described On shell, described device includes: shooting module, for shooting infrared image of the infrared light-emitting component when shining;Determining module, For determining the object region comprising the infrared light-emitting component in the infrared image;Detection module, for extracting The characteristics of image of the object region, and detect according to described image feature the defect of the infrared light-emitting component.
The another aspect embodiment of the application provides a kind of mobile terminal, comprising: shell is contained in the infrared of the shell Light-emitting component memory, processor and storage are on a memory and the computer program that can run on a processor, described infrared Cover board is provided with above light-emitting component, on the housing, the processor executes the computer program for the cover board setting When, realize the defect inspection method of infrared light-emitting component as in the foregoing embodiment.
The application also one side embodiment provides a kind of computer readable storage medium, is stored thereon with computer journey Sequence realizes the defects detection of the infrared light-emitting component as described in above-described embodiment when the computer program is executed by processor Method.
Embodiment provided by the present application includes at least following advantageous effects:
Infrared image of the infrared light-emitting component when shining is shot, in turn, determines to include infraluminescence in infrared image The object region of element extracts the characteristics of image of object region, and according to Image Feature Detection infrared light-emitting component Defect.It solves infrared light-emitting component in the prior art as a result, to be arranged under the cover board of shell, it is difficult to find to shine by naked eyes The technical issues of defect, realizes the automatic detection to infrared light-emitting component, and can detecte the defect of diversification, testing cost It is small, it is high-efficient.
The additional aspect of the application and advantage will be set forth in part in the description, and will partially become from the following description It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The application is above-mentioned and/or additional aspect and advantage will become from the following description of the accompanying drawings of embodiments Obviously and it is readily appreciated that, in which:
Fig. 1 is the flow chart according to the defect inspection method of the infrared light-emitting component of the application one embodiment;
Fig. 2-1 is the schematic diagram according to the infrared image of the application one embodiment;
Fig. 2-2 is the schematic diagram according to the infrared image of the application another embodiment;
Fig. 2-3 is the schematic diagram according to the infrared image of the application another embodiment;
Fig. 3 is the structural schematic diagram according to the defect detecting device of the infrared light-emitting component of the application one embodiment;
Fig. 4 is the structural schematic diagram according to the defect detecting device of the infrared light-emitting component of the application another embodiment;
Fig. 5 is the structural schematic diagram according to the defect detecting device of the infrared light-emitting component of the application another embodiment; And
Fig. 6 is the structural schematic diagram according to the defect detecting device of the infrared light-emitting component of the application a still further embodiment.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to for explaining the application, and should not be understood as the limitation to the application.
Below with reference to the accompanying drawings the defect inspection method and device of the infrared light-emitting component of the embodiment of the present application are described.Wherein, The infrared light-emitting component of the embodiment of the present application may include the elements such as the floodlight of 3D structure light, wherein floodlight component includes Encapsulating housing, be arranged in the intracorporal light source of encapsulating shell, the optical element being arranged on encapsulating housing, setting it is intracorporal in encapsulating shell Photodetector and the processor being connect respectively with photodetector and light source.Light source is for emitting optical signal.Optical element position In in the luminous optical path of light source.Photodetector is used to convert electric signal for the optical signal reflected through optical element.Floodlight Commonly used in insufficient light environment than it is darker when, infrared camera imaging is relatively fuzzy, it is therefore desirable in infrared photography Head is nearby equipped with a floodlight, is used for light filling, the effect of light compensating lamp when taking pictures when being equivalent to dark, but 3D structure light is general Light lamp is generally mainly infrared light, and the light naked eyes issued are almost invisible.
It is bad since during the manufacturing, there are circuits, infrared light-emitting component is damaged, infrared light-emitting component is by foreign matter It blocks etc. bad, causes infrared light-emitting component can not work normally, it is therefore desirable to carry out the survey of infrared light-emitting component function in producing line Examination, prevents bad outflow, but what is issued by infrared light-emitting component is infrared light, invisible, the infraluminescence in the application of naked eyes Element refers to being contained in the shell of mobile terminal, and cover board is provided with above infrared light-emitting component (cover board is arranged on shell) Infrared light-emitting component, thus, directly test is difficult, for example, floodlight is bad to be cut in calibration and test station Out, production line test is had any problem.
In order to solve the technical problem, present applicant proposes a kind of at low cost and be not necessarily to reforming equipment, for example, existing The automated testing method that LCD test equipment can be realized.
Specifically, Fig. 1 is the process according to the defect inspection method of the infrared light-emitting component of the application one embodiment Figure, as shown in Figure 1, this method comprises:
Step 101, infrared image of the shooting infrared light-emitting component when shining.
It is understood that infrared light-emitting component, when luminous, naked eyes are also to be difficult to see that, thus, in the present embodiment Infrared image based on infrared camera shooting infrared light-emitting component when shining.
As a kind of possible embodiment, carried out using the infrared camera in above-mentioned LCD test equipment in the prior art Shooting.
In this example, LCD test equipment can send defects detection instruction to mobile terminal, so that mobile terminal is connecing Infrared light-emitting component is opened after receiving defects detection instruction, in turn, opens infrared camera shooting infrared light-emitting component when luminous Infrared image.
As alternatively possible embodiment, the camera in mobile terminal is made full use of to shoot infrared image, the movement Infrared camera in terminal can be Telescopic rotary, thus, it is instructed according to defects detection, related camera Telescopic rotating pair The cap locations of quasi- infrared light-emitting component shoot infrared image.
Step 102, the object region comprising infrared light-emitting component is determined in infrared image.
In this implementation, defect is judged based on the luminous situation of infrared light-emitting component in infrared image because, no matter which kind of Defect can end reaction on the image, for example, being the image of floodlight normal luminous as shown in Fig. 2-1, and work as floodlight When being blocked, then for the corresponding image of floodlight as shown in Fig. 2-2, shining can be obviously partially dark, when element damage shadow occurs in floodlight When ringing luminous, then the corresponding image such as reflective is as Figure 2-3, and apparent light emitting region is not present.
Thus, in the present embodiment, the object region comprising infrared light-emitting component is determined in infrared image, so as to In the defect for further determining infrared light-emitting component according to object region.
As a kind of possible embodiment, detect in infrared image whether include infrared light-emitting component profile, the profile Detection mode can be realized that details are not described herein by the prior art, in turn, if the profile comprising infrared light-emitting component, it is determined that should The region where pixel in profile and profile is object region.
It is emphasized that in the present embodiment, can be determined by the position of the corresponding pixel of detection infrared light should Profile position.
In this embodiment, if infrared light-emitting component damage leads to not shine, then infrared light pair may be can't detect The pixel answered, therefore, it is possible to obtain cover board region, and using cover board region as object region.Certainly, this When can also directly transmit warning message, inform technical staff, there are circumstance of occlusion for current infrared light-emitting component.
In the present embodiment, for infrared light image of preferably taking pictures, it can control the field that infrared optical element is in dark It is shot in scape.
Step 103, the characteristics of image of object region, and lacking according to Image Feature Detection infrared light-emitting component are extracted It falls into.
As analyzing above, the characteristics of image in object region can embody whether infrared light-emitting component has damage It is bad, therefore, it is possible to extract the characteristics of image of object region, and according to the defect of Image Feature Detection infrared light-emitting component.
It should be noted that in different application scenarios, characteristics of image is different, below with reference to illustrating:
The first example:
In this example, characteristics of image includes color pixel values.
Specifically, extracting the average value of the color pixel values in object region, that is, extract rgb pixel in the region The mean value of value, by the sum of rgb pixel value divided by the total pixel number for including in the region, wherein it is (such as black not include colour element Colour vegetarian refreshments) the color pixel values of pixel be considered 0, calculate the difference of default mean value and average value, which can With according between detection device and infrared light-emitting component acquisition parameters determine, the acquisition parameters include shooting angle and shooting away from From etc., in turn, the defect of infrared light-emitting component is determined according to mean value difference, if mean value difference close to 0, prove it is current infrared Light-emitting component is normal, if mean value difference is the biggish negative value of absolute value, shows that current infrared light-emitting component power is larger, can There can be short circuit, if mean value difference is the biggish positive value of absolute value, show that current infrared light-emitting component shines not Completely, it is understood that there may be blocked or damaged defect etc..
Second of example:
In this example, characteristics of image includes the quantity of colour element.
Specifically, extracting the quantity of the colour element of object region, preset quantity and the par are calculated Number differences, the preset quantity can according to the acquisition parameters between detection device and infrared light-emitting component determine, the shooting Parameter includes that shooting angle and shooting distance etc. determine the defect of infrared light-emitting component according to number differences in turn, if quantity Difference then proves that current infrared light-emitting component is normal close to 0, if number differences are the biggish negative value of absolute value, shows to work as Preceding infrared light-emitting component power is larger, it is understood that there may be short-circuit defect, if number differences are the biggish positive value of absolute value, table Bright current infrared light-emitting component shines incomplete, it is understood that there may be is blocked or damaged defect etc..
It based on the above embodiment, may not be by terminal inner element when there are infrared light-emitting components when blocking defect Caused by blocking, it may be possible to as caused by being covered with barrier on cover board, thus, when determining that defect type is to block defect When, the defect of infrared light-emitting component can be detected again in turn with reminding technology personnel's occlusion removal object, i.e. transmission reminder message, To avoid erroneous judgement.
In addition, in practical implementation, it, can be on the screen of the mobile terminal in order to more intuitively show testing result It shows testing result, if testing result is no defect, shows PASS on the screen, if defective, show " NG " And specific defect type etc..
In the present embodiment, the infrared light-emitting component detected during this period of time can also be summarized at regular intervals Defect type counts the quantity of the infrared light-emitting component of every kind of defect type, when the infrared light-emitting component of certain defect type When quantity is more than certain value, timely reminding technology personnel focus on for the defect type.
To sum up, the defect inspection method of the infrared light-emitting component of the embodiment of the present application, shooting infrared light-emitting component are shining When infrared image, in turn, in infrared image determine include infrared light-emitting component object region, extract target image The characteristics of image in region, and according to the defect of Image Feature Detection infrared light-emitting component.It solves as a result, infrared in the prior art Light-emitting component is arranged under the cover board of shell, it is difficult to which the technical issues of finding emission defects by naked eyes realizes to infraluminescence The automatic detection of element, and can detecte the defect of diversification, testing cost is small, high-efficient.
In order to realize above-described embodiment, the application also proposes a kind of defect detecting device of infrared light-emitting component.Infrared hair Optical element is contained in the shell of mobile terminal, and cover board is provided with above infrared light-emitting component, and cover board is arranged on shell.It is infrared When light-emitting component shines, infrared light threw cover board transmitting.
Fig. 3 is a kind of structural schematic diagram of the defect detecting device of infrared light-emitting component provided by the embodiments of the present application.
As shown in figure 3, the device includes: shooting module 10, determining module 20, detection module 30.
Wherein, shooting module 10, for shooting infrared image of the infrared light-emitting component when shining.
Determining module 20, for determining the object region comprising infrared light-emitting component in infrared image.
Detection module 30, for extracting the characteristics of image of object region, and according to Image Feature Detection infraluminescence The defect of element.
Further, in a kind of possible implementation of the embodiment of the present application, as shown in figure 4, as shown in Figure 3 On the basis of, determining module 20 includes: detection unit 21 and determination unit 22.
Wherein, detection unit 21, for detect in infrared image whether include infrared light-emitting component profile.
Determination unit 22, for when comprising profile, determining that the image-region in profile and profile is object region.
Determination unit 22, be also used to do not include profile when, obtain cover board region and using cover board region as Object region.
In a kind of possible implementation of the embodiment of the present application, as shown in figure 5, on the basis of as shown in Figure 3, inspection Surveying module 30 includes: the first extraction unit 31, the first computing unit 32 and the first recognition unit 33, wherein
First extraction unit 31, the average value of the color pixel values for extracting object region.
First computing unit 32, for calculating the mean value difference of default mean value and average value.
First recognition unit 33, for identifying the defect of infrared light-emitting component according to mean value difference.
In a kind of possible implementation of the embodiment of the present application, as shown in fig. 6, on the basis of as shown in Figure 3, inspection Surveying module 30 includes: the second extraction unit 34, the second computing unit 35 and the second recognition unit 36, wherein
Second extraction unit 34, the quantity of the colour element for extracting object region.
Second computing unit 35, for calculating the number differences of preset quantity and par.
Second recognition unit 36, for identifying the defect of infrared light-emitting component according to number differences.
It should be noted that the explanation of the aforementioned defect inspection method embodiment to infrared light-emitting component is also applied for The defect detecting device of the infrared light-emitting component of the embodiment, details are not described herein again.
To sum up, the defect detecting device of the infrared light-emitting component of the embodiment of the present application, shooting infrared light-emitting component are shining When infrared image, in turn, in infrared image determine include infrared light-emitting component object region, extract target image The characteristics of image in region, and according to the defect of Image Feature Detection infrared light-emitting component.It solves as a result, infrared in the prior art Light-emitting component is arranged under the cover board of shell, it is difficult to which the technical issues of finding emission defects by naked eyes realizes to infraluminescence The automatic detection of element, and can detecte the defect of diversification, testing cost is small, high-efficient.
In order to realize above-described embodiment, the application also proposed a kind of mobile terminal, comprising: shell is contained in shell Infrared light-emitting component memory, processor and storage are on a memory and the computer program that can run on a processor, infrared Cover board is provided with above light-emitting component, cover board is arranged on shell, when processor executes computer program, realizes such as aforementioned implementation The defect inspection method of infrared light-emitting component described in example.
In order to realize above-described embodiment, the application also proposed a kind of computer readable storage medium, be stored thereon with meter Calculation machine program realizes lacking for the infrared light-emitting component as described in previous embodiment when the computer program is executed by processor Fall into detection method.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples It closes and combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one this feature.In the description of the present application, the meaning of " plurality " is at least two, such as two, three It is a etc., unless otherwise specifically defined.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes It is one or more for realizing custom logic function or process the step of executable instruction code module, segment or portion Point, and the range of the preferred embodiment of the application includes other realization, wherein can not press shown or discussed suitable Sequence, including according to related function by it is basic simultaneously in the way of or in the opposite order, Lai Zhihang function, this should be by the application Embodiment person of ordinary skill in the field understood.
Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for Instruction execution system, device or equipment (such as computer based system, including the system of processor or other can be held from instruction The instruction fetch of row system, device or equipment and the system executed instruction) it uses, or combine these instruction execution systems, device or set It is standby and use.For the purpose of this specification, " computer-readable medium ", which can be, any may include, stores, communicates, propagates or pass Defeated program is for instruction execution system, device or equipment or the dress used in conjunction with these instruction execution systems, device or equipment It sets.The more specific example (non-exhaustive list) of computer-readable medium include the following: there is the electricity of one or more wirings Interconnecting piece (electronic device), portable computer diskette box (magnetic device), random access memory (RAM), read-only memory (ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk is read-only deposits Reservoir (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other are suitable Medium, because can then be edited, be interpreted or when necessary with it for example by carrying out optical scanner to paper or other media His suitable method is handled electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of the application can be realized with hardware, software, firmware or their combination.Above-mentioned In embodiment, software that multiple steps or method can be executed in memory and by suitable instruction execution system with storage Or firmware is realized.Such as, if realized with hardware in another embodiment, following skill well known in the art can be used Any one of art or their combination are realized: have for data-signal is realized the logic gates of logic function from Logic circuit is dissipated, the specific integrated circuit with suitable combinational logic gate circuit, programmable gate array (PGA), scene can compile Journey gate array (FPGA) etc..
Those skilled in the art are understood that realize all or part of step that above-described embodiment method carries It suddenly is that relevant hardware can be instructed to complete by program, the program can store in a kind of computer-readable storage medium In matter, which when being executed, includes the steps that one or a combination set of embodiment of the method.
It, can also be in addition, can integrate in a processing module in each functional unit in each embodiment of the application It is that each unit physically exists alone, can also be integrated in two or more units in a module.Above-mentioned integrated mould Block both can take the form of hardware realization, can also be realized in the form of software function module.The integrated module is such as Fruit is realized and when sold or used as an independent product in the form of software function module, also can store in a computer In read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..Although having been shown and retouching above Embodiments herein is stated, it is to be understood that above-described embodiment is exemplary, and should not be understood as the limit to the application System, those skilled in the art can be changed above-described embodiment, modify, replace and become within the scope of application Type.

Claims (11)

1. a kind of defect inspection method of infrared light-emitting component, which is characterized in that the infrared light-emitting component is contained in mobile whole In the shell at end, cover board is provided with above the infrared light-emitting component, the cover board is arranged on the housing, the method packet Include following steps:
Shoot infrared image of the infrared light-emitting component when shining;
The object region comprising the infrared light-emitting component is determined in the infrared image;
The characteristics of image of the object region is extracted, and lacking for the infrared light-emitting component is detected according to described image feature It falls into.
2. the method as described in claim 1, which is characterized in that infrared figure of the shooting infrared light-emitting component when shining Picture, comprising:
Defects detection instruction is sent to the mobile terminal, so that the mobile terminal is after receiving the defects detection instruction Open the infrared light-emitting component;
It opens infrared camera and shoots infrared image of the infrared light-emitting component when shining.
3. the method as described in claim 1, which is characterized in that described determine in the infrared image includes the infrared hair The object region of optical element, comprising:
Detect in the infrared image whether include the infrared light-emitting component profile;
If including the profile, it is determined that the image-region in the profile and the profile is the object region;
If not including the profile, the cover board region is obtained and using the cover board region as the target figure As region.
4. the method as described in claim 1, which is characterized in that extract the characteristics of image of the object region, and according to Described image feature detects the defect of the infrared light-emitting component, comprising:
Extract the average value of the color pixel values of the object region;
Calculate the mean value difference of default mean value and the average value;
The defect of the infrared light-emitting component is identified according to the mean value difference.
5. the method as described in claim 1, which is characterized in that extract the characteristics of image of the object region, and according to Described image feature detects the defect of the infrared light-emitting component, comprising:
Extract the quantity of the colour element of the object region;
Calculate the number differences of preset quantity and the par;
The defect of the infrared light-emitting component is identified according to the number differences.
6. a kind of defect detecting device of infrared light-emitting component, which is characterized in that the infrared light-emitting component is contained in mobile whole In the shell at end, cover board is provided with above the infrared light-emitting component, the cover board is arranged on the housing, described device packet It includes:
Shooting module, for shooting infrared image of the infrared light-emitting component when shining;
Determining module, for determining the object region comprising the infrared light-emitting component in the infrared image;
Detection module, for extracting the characteristics of image of the object region, and it is described red according to the detection of described image feature The defect of outer light-emitting component.
7. device as claimed in claim 6, which is characterized in that the determining module, comprising:
Detection unit, for detect in the infrared image whether include the infrared light-emitting component profile;
Determination unit, for when comprising the profile, determining that the image-region in the profile and the profile is the mesh Logo image region;
The determination unit is also used to obtain the cover board region and by the cover board institute when not including the profile In region as the object region.
8. device as claimed in claim 6, which is characterized in that the detection module, comprising:
First extraction unit, the average value of the color pixel values for extracting the object region;
First computing unit, for calculating the mean value difference of default mean value Yu the average value;
First recognition unit, for identifying the defect of the infrared light-emitting component according to the mean value difference.
9. device as claimed in claim 6, which is characterized in that the detection module, comprising:
Second extraction unit, the quantity of the colour element for extracting the object region;
Second computing unit, for calculating the number differences of preset quantity Yu the par;
Second recognition unit, for identifying the defect of the infrared light-emitting component according to the number differences.
10. a kind of mobile terminal characterized by comprising shell, be contained in the shell infrared light-emitting component memory, Processor and storage on a memory and the computer program that can run on a processor, are arranged above the infrared light-emitting component There is cover board, the cover board setting on the housing, when the processor executes the computer program, realizes such as claim The defect inspection method of any infrared light-emitting component of 1-5.
11. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the computer program The defect inspection method of infrared light-emitting component a method as claimed in any one of claims 1 to 5 is realized when being executed by processor.
CN201910770254.4A 2019-08-20 2019-08-20 The defect inspection method and device of infrared light-emitting component Pending CN110487803A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114061765A (en) * 2021-10-29 2022-02-18 歌尔股份有限公司 Device glue path detection method, control device and glue dispensing device
CN118671312A (en) * 2024-06-14 2024-09-20 龙泉市孙坑窑瓷庄 Ceramic defect detection system based on machine vision

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101251496A (en) * 2007-02-19 2008-08-27 奥林巴斯株式会社 Defect detection device and defect detection method
CN101713747A (en) * 2009-11-23 2010-05-26 华东交通大学 Thermal infrared imaging technology based method and device for detecting the early defect of fruit surface
CN102218406A (en) * 2011-01-04 2011-10-19 华南理工大学 Intelligent detection device of defects of mobile phone outer shell based on machine vision
US20120190590A1 (en) * 2001-06-29 2012-07-26 Meso Scale Technologies, Llc Assay Plates, Reader Systems and Methods for Luminescence Test Measurements
CN102727344A (en) * 2012-06-14 2012-10-17 上海伟赛智能科技有限公司 Intelligent incontinence alarm device
TW201339572A (en) * 2012-03-21 2013-10-01 Optivu Vision System Corp Apparatus and method for detecting defects in device
CN103765200A (en) * 2011-06-07 2014-04-30 光子动力公司 System and method for defect detection using entire raw image
CN103872983A (en) * 2014-04-04 2014-06-18 天津市鑫鼎源科技发展有限公司 Device and method for detecting defects on surface of solar cell
WO2014199869A1 (en) * 2013-06-12 2014-12-18 株式会社日立ハイテクノロジーズ Infrared inspection device
WO2015045751A1 (en) * 2013-09-26 2015-04-02 株式会社日立ハイテクノロジーズ Infrared inspection device and infrared inspection method
CN204649634U (en) * 2015-03-30 2015-09-16 华南理工大学 A kind of infrared imaging pick-up unit for surface-mounted devices
CN105466945A (en) * 2015-12-30 2016-04-06 深圳市创科自动化控制技术有限公司 Infrared detecting method for automatically locating detecting position and detecting equipment
CN105676053A (en) * 2016-02-23 2016-06-15 上海芯什达电子技术有限公司 Touch screen defect detection system
CN205643194U (en) * 2016-05-27 2016-10-12 南京点触智能科技有限公司 Touch -control ITO film conducting layer defect detection system based on machine vision
CN205826551U (en) * 2016-06-12 2016-12-21 深圳市智致物联科技有限公司 Mobile phone light guide panel defective vision automatic identification equipment
CN205844214U (en) * 2016-07-13 2016-12-28 黑龙江科技大学 Coating crack based on infrared imaging inspection defect detecting device
CN107907546A (en) * 2017-12-06 2018-04-13 华南理工大学 A kind of defects of vision detection method and system based on intelligent mobile terminal
CN108398440A (en) * 2018-02-05 2018-08-14 苏州市职业大学(苏州开放大学) A kind of mobile phone screen defect inspection machine and its detection method
CN109218711A (en) * 2018-09-14 2019-01-15 Oppo(重庆)智能科技有限公司 Detection method, system and the electronic equipment of flash lamp
US20190147577A1 (en) * 2017-11-15 2019-05-16 Samsung Display Co., Ltd. Device for detecting defect and method of driving the same
CN109886936A (en) * 2019-01-28 2019-06-14 深圳大学 A kind of low contrast defect inspection method and device
CN109884077A (en) * 2017-12-06 2019-06-14 上海太阳能工程技术研究中心有限公司 Infrared defect detection method and device for outdoor photovoltaic power station in natural light environment
CN109916906A (en) * 2018-10-11 2019-06-21 乐人株式会社 Defect detecting device and method

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120190590A1 (en) * 2001-06-29 2012-07-26 Meso Scale Technologies, Llc Assay Plates, Reader Systems and Methods for Luminescence Test Measurements
CN101251496A (en) * 2007-02-19 2008-08-27 奥林巴斯株式会社 Defect detection device and defect detection method
CN101713747A (en) * 2009-11-23 2010-05-26 华东交通大学 Thermal infrared imaging technology based method and device for detecting the early defect of fruit surface
CN102218406A (en) * 2011-01-04 2011-10-19 华南理工大学 Intelligent detection device of defects of mobile phone outer shell based on machine vision
CN103765200A (en) * 2011-06-07 2014-04-30 光子动力公司 System and method for defect detection using entire raw image
TW201339572A (en) * 2012-03-21 2013-10-01 Optivu Vision System Corp Apparatus and method for detecting defects in device
CN102727344A (en) * 2012-06-14 2012-10-17 上海伟赛智能科技有限公司 Intelligent incontinence alarm device
WO2014199869A1 (en) * 2013-06-12 2014-12-18 株式会社日立ハイテクノロジーズ Infrared inspection device
WO2015045751A1 (en) * 2013-09-26 2015-04-02 株式会社日立ハイテクノロジーズ Infrared inspection device and infrared inspection method
CN103872983A (en) * 2014-04-04 2014-06-18 天津市鑫鼎源科技发展有限公司 Device and method for detecting defects on surface of solar cell
CN204649634U (en) * 2015-03-30 2015-09-16 华南理工大学 A kind of infrared imaging pick-up unit for surface-mounted devices
CN105466945A (en) * 2015-12-30 2016-04-06 深圳市创科自动化控制技术有限公司 Infrared detecting method for automatically locating detecting position and detecting equipment
CN105676053A (en) * 2016-02-23 2016-06-15 上海芯什达电子技术有限公司 Touch screen defect detection system
CN205643194U (en) * 2016-05-27 2016-10-12 南京点触智能科技有限公司 Touch -control ITO film conducting layer defect detection system based on machine vision
CN205826551U (en) * 2016-06-12 2016-12-21 深圳市智致物联科技有限公司 Mobile phone light guide panel defective vision automatic identification equipment
CN205844214U (en) * 2016-07-13 2016-12-28 黑龙江科技大学 Coating crack based on infrared imaging inspection defect detecting device
US20190147577A1 (en) * 2017-11-15 2019-05-16 Samsung Display Co., Ltd. Device for detecting defect and method of driving the same
CN107907546A (en) * 2017-12-06 2018-04-13 华南理工大学 A kind of defects of vision detection method and system based on intelligent mobile terminal
CN109884077A (en) * 2017-12-06 2019-06-14 上海太阳能工程技术研究中心有限公司 Infrared defect detection method and device for outdoor photovoltaic power station in natural light environment
CN108398440A (en) * 2018-02-05 2018-08-14 苏州市职业大学(苏州开放大学) A kind of mobile phone screen defect inspection machine and its detection method
CN109218711A (en) * 2018-09-14 2019-01-15 Oppo(重庆)智能科技有限公司 Detection method, system and the electronic equipment of flash lamp
CN109916906A (en) * 2018-10-11 2019-06-21 乐人株式会社 Defect detecting device and method
CN109886936A (en) * 2019-01-28 2019-06-14 深圳大学 A kind of low contrast defect inspection method and device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
初禹等著: "《黑龙江省遥感矿化蚀变信息提取方法研究[M]》", 31 December 2014 *
文少波等编: "《新能源汽车及其智能化技术[M]》", 31 December 2017 *
王秀英: "基于TMS320C6748的机器视觉系统研发设计――以2017年"西门子杯"中国智能制造挑战赛工业硬件研发赛项为背景", 《赤峰学院学报(自然科学版)》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114061765A (en) * 2021-10-29 2022-02-18 歌尔股份有限公司 Device glue path detection method, control device and glue dispensing device
CN118671312A (en) * 2024-06-14 2024-09-20 龙泉市孙坑窑瓷庄 Ceramic defect detection system based on machine vision

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