CN110190033B - Chip fixing device for electronic product - Google Patents
Chip fixing device for electronic product Download PDFInfo
- Publication number
- CN110190033B CN110190033B CN201910337044.6A CN201910337044A CN110190033B CN 110190033 B CN110190033 B CN 110190033B CN 201910337044 A CN201910337044 A CN 201910337044A CN 110190033 B CN110190033 B CN 110190033B
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- shell
- supporting plate
- plate
- heat
- connecting rod
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- 238000013016 damping Methods 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims abstract description 9
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000035939 shock Effects 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a chip fixing device for an electronic product, which comprises a shell, wherein a sliding groove is formed in the shell, a supporting plate is connected in the sliding groove in a sliding manner, first contact pieces are arranged at the bottom of the supporting plate in a matrix manner, a connecting plate is embedded at the bottom of the shell, a second contact piece is arranged at the top of the connecting plate, pins are fixedly installed at the bottom of the connecting plate, limiting devices are installed on two sides of the shell, mounting lugs are welded on the front side and the rear side of the bottom end of the shell, damping springs are symmetrically installed at the bottom end of the shell, a pressing plate is fixedly connected to the bottom end of each damping spring, heat conducting pieces are embedded in the surface of the pressing plate, a heat dissipation fan is embedded in the top of the shell, and heat dissipation fins are installed. The heat dissipation device is simple and reasonable in structural design, convenient to operate, convenient to disassemble, assemble and fix, good in heat dissipation effect, safe, stable, wide in application range and beneficial to popularization.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a chip fixing device for an electronic product.
Background
The electronic product is a related product based on electric energy, and mainly comprises: watches, smart phones, telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, radio cassettes, combination speakers, compact disc players (CD), computers, games, mobile communication products, and the like. The early products were named electronic products mainly based on electronic tubes. As long as the management and control element is still control chip in electronic product's inside, the most fixed encapsulation of current control chip is on electronic product's mainboard, and this kind of mode is not convenient for the dismouting change on the one hand, and on the other hand is not good to the radiating effect of chip, has reduced the life of chip, is unfavorable for extensive popularization and popularization.
Disclosure of Invention
The invention aims to provide a chip fixing device for an electronic product, which aims to solve the problems that the chip fixing package in the prior art is inconvenient to disassemble, assemble and replace and has poor heat dissipation effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip fixing device for electronic products comprises a shell, a sliding groove is arranged in the shell, and the inside of the sliding chute is connected with a supporting plate which penetrates through the front surface of the shell in a sliding way, the bottom of the supporting plate is provided with first contact pieces in a matrix arrangement, the bottom of the shell is embedded with a connecting plate, the top of the connecting plate is provided with second contact pieces which are arranged in one-to-one correspondence with the first contact pieces, the bottom of the connecting plate is fixedly provided with pins which are communicated with the second contact pieces one to one, both sides of the shell are provided with limiting devices for fixing the supporting plate, and the front and back sides of the bottom ends of the two sides of the shell are respectively welded with a mounting lug, the bottom end of the interior of the shell is symmetrically provided with four groups of damping springs, and damping spring's bottom fixedly connected with clamp plate, the surface mosaic of clamp plate has the conducting strip, the top of shell is located the conducting strip and inlays and be equipped with cooling fan directly over, and cooling fan's outside surface mounting has radiating fin.
Preferably, the both sides of shell are located the side of spout and all are equipped with the installation cavity, and stop device includes and articulates connecting rod and the slider of sliding connection on the installation cavity inner wall in the installation cavity through the round pin axle, the one end integral type of connecting rod is connected with the flange that stretches into in the shell, and fixed mounting has the return spring between the other end of connecting rod and the lateral wall of installation cavity, one side fixedly connected with of slider stretches out the handrail of shell, and the dog of the opposite side tip fixedly connected with and the connecting rod laminating of slider, the inside wall of shell is equipped with the through-hole with the installation cavity intercommunication with the flange junction, and the lateral wall of shell is equipped with the spacing opening with the installation cavity intercommunication with the handrail junction.
Preferably, the top of layer board is equipped with the mounting groove, and the tank bottom department of mounting groove is densely covered and is inlayed the metal slot that has and first contact one-to-one intercommunication, the top of layer board is located the both sides front and back end of mounting groove and all installs the elasticity cardboard, and the both sides of layer board all are equipped with and are used for the spacing recess of layer board.
Preferably, the bottom shape of first contact is the semicircle type, and the bottom of first contact and the top laminating of second contact are connected.
Preferably, the top end of the heat radiation fan is movably clamped with a dustproof filter screen, and one side of the heat radiation fan is connected with a power line.
Preferably, the surface of the mounting lug is provided with a threaded hole, and the bottom of the mounting lug is stuck with a damping rubber gasket.
Preferably, the shell and the supporting plate are both base bodies made of polyethylene, and the front end of the supporting plate is provided with a drawing groove.
The invention has the technical effects and advantages that: compared with the prior art, the chip fixing device for the electronic product has the following advantages that:
1. the chip can be conveniently installed through the installation groove with the metal slot on the supporting plate, and meanwhile, the chip can be effectively and fixedly clamped through the elastic clamping plate on the supporting plate and the pressing plate connected with the bottom end inside the shell through the damping spring;
2. the pins of the chip can be effectively communicated with a circuit board or other elements of an electronic product by utilizing the first contact piece communicated with the metal slot to be matched with the second contact piece communicated with the pins on the connecting plate, so that the chip is not influenced to be disassembled and assembled;
3. when the handrail is pushed to slide in the limiting opening, the stop block at the end part of the sliding block is contacted and attached with the connecting rod, and one end of the connecting rod is driven to rotate, so that the convex block at the other end of the connecting rod is contained in the mounting cavity, the handrail is loosened, or the handrail is pushed to return to the original position, the convex plate stretches into the shell again under the action of the return spring, and the convex plate in the limiting device can be ensured to stretch out to be spliced with the grooves at the two sides of the supporting plate, the mounting position of the supporting plate is limited, and the supporting plate is convenient to pull and take out;
4. the heat conducting fins on the surface of the pressing plate conduct heat generated by chip working to the top of the pressing plate, then the heat is dissipated out of the shell by the heat dissipation fan, and finally the heat dissipated out of the shell is uniformly dispersed by the heat dissipation fins, so that the heat of the chip is effectively dissipated.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is a top view of the pallet of the present invention;
fig. 4 is a cross-sectional view of the spacing device of the present invention.
In the figure: the heat dissipation device comprises a shell 1, a mounting chamber 101, a through hole 102, a limiting opening 103, a sliding groove 2, a supporting plate 3, a mounting groove 301, a metal slot 302, an elastic clamping plate 303, a groove 304, a first contact piece 4, a connecting plate 5, a second contact piece 6, a pin 7, a limiting device 8, a connecting rod 801, a return spring 802, a convex plate 803, an armrest 804, a sliding block 805, a stop block 806, a damping spring 9, a pressing plate 10, a heat conducting sheet 11, a heat dissipation fan 12, a heat dissipation fin 13 and a mounting lug 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a chip fixing device for electronic products as shown in figures 1-4, which comprises a shell 1, wherein a chute 2 is arranged inside the shell 1, a supporting plate 3 penetrating through the front surface of the shell 1 is slidably connected inside the chute 2, first contact blades 4 are arranged at the bottom of the supporting plate 3 in a matrix manner, a connecting plate 5 is embedded at the bottom of the shell 1, second contact blades 6 which are arranged in one-to-one correspondence with the first contact blades 4 are arranged at the top of the connecting plate 5, pins 7 which are communicated with the second contact blades 6 in one-to-one manner are fixedly arranged at the bottom of the connecting plate 5, limiting devices 8 for fixing the supporting plate 3 are arranged at both sides of the shell 1, mounting lugs 14 are welded at the front side and the rear side of the bottom end at both sides of the shell 1, four groups of damping springs 9 are symmetrically arranged at the bottom end of the shell 1, a pressing plate 10 is fixedly connected with the bottom end of the damping, the top of the housing 1 is positioned at the right upper end of the heat conducting fin 11 and is embedded with a heat radiation fan 12, and the outer side surface of the heat radiation fan 12 is provided with a heat radiation fin 13.
Preferably, the side surfaces of the sliding groove 2 on both sides of the housing 1 are provided with the mounting chamber 101, the limiting device 8 includes a connecting rod 801 hinged in the mounting chamber 101 through a pin and a sliding block 805 slidably connected to the inner wall of the mounting chamber 101, one end of the connecting rod 801 is integrally connected with a convex plate 803 extending into the housing 1, a return spring 802 is fixedly mounted between the other end of the connecting rod 801 and the side wall of the mounting chamber 101, one side of the sliding block 805 is fixedly connected with a handrail 804 extending out of the housing 1, the other side end of the sliding block 805 is fixedly connected with a stopper 806 attached to the connecting rod 801, a through hole 102 communicated with the mounting chamber 101 is formed at the joint of the inner side wall of the housing 1 and the convex plate 803, and a limiting opening 103 communicated with the mounting chamber 101 is formed at the joint of the outer side wall of the.
Through adopting above-mentioned technical scheme, when promoting handrail 804 to slide in spacing opening 103, realize dog 806 and the contact laminating of connecting rod 801 of slider 805 tip, and drive the one end of connecting rod 801 and rotate, thereby make the lug 803 of the other end of connecting rod 801 income installation cavity 101, loosen handrail 804, or when promoting handrail 804 to get back to the normal position, realize under the effect of return spring 802 that lug 803 stretches into in the shell 1 again, thereby can guarantee that lug 803 among this stop device 8 stretches out and pegs graft with the recess 304 of layer board 3 both sides, the mounted position to layer board 3 is injectd, make things convenient for layer board 3 pull to take out simultaneously.
Preferably, the top of layer board 3 is equipped with mounting groove 301, and the tank bottom department of mounting groove 301 gathers to inlay has the metal slot 302 with first contact 4 intercommunication one by one, the top of layer board 3 is located the both sides front and back end of mounting groove 301 and all installs elasticity cardboard 303, and the both sides of layer board 3 all are equipped with and are used for the spacing recess 304 of layer board 3.
Through adopting above-mentioned technical scheme, mounting groove 301 cooperation elasticity cardboard 303 can be convenient for the chip to fix on layer board 3, thereby the stitch that simultaneously and first contact 4 one-to-one communicate can be convenient for the chip is inserted and is realized putting through with first contact 4, utilizes recess 304 cooperation stop device 8 can be effectual carry out spacing fixedly to the mounted position of layer board 3.
Preferably, the bottom end of the first contact piece 4 is shaped like a semi-sphere, and the bottom of the first contact piece 4 is attached to the top of the second contact piece 6.
Through adopting above-mentioned technical scheme, first contact 4 that the bottom is the hemisphere type can prevent when the layer board removes that first contact 4 blocks when contacting with second contact 6, guarantees the contact effect between first contact 4 and the corresponding second contact 6 simultaneously.
Preferably, the top end of the heat dissipation fan 12 is movably clamped with a dustproof filter screen, and one side of the heat dissipation fan 12 is connected with a power line.
Through adopting above-mentioned technical scheme, the dustproof filter screen of activity joint can effectually play dustproof effect, and it is also convenient to change the washing.
Preferably, the surface of the mounting ear 14 is provided with a threaded hole, and a shock-absorbing rubber gasket is adhered to the bottom of the mounting ear 14.
Through adopting above-mentioned technical scheme, the setting of screw hole can be convenient for installation ear 14 cooperation external bolt fastening on the mainboard or other mounted position of electronic product, and the stability and the shock-absorbing capacity of 14 installations of installation ear can be improved to the yielding rubber gasket simultaneously.
Preferably, the housing 1 and the supporting plate 3 are both base bodies made of polyethylene, and the front end of the supporting plate 3 is provided with a drawing groove.
Through adopting above-mentioned technical scheme, shell 1 and layer board 3 that the polyethylene was made all have fine insulating heat-proof quality and anticorrosive heat-resisting ability, and the setting of pull groove can be convenient for to layer board 3 pull propelling movement to the installation of layer board 3 of being convenient for is taken out.
The working principle is as follows: firstly, the shell 1 is mounted on a circuit board of an electronic product or a position where a chip is required to be mounted by using the mounting lugs 14 and external bolts, meanwhile, pins 7 on the connecting plate 5 are packaged or communicated with the circuit board or other elements, then the mounting groove 301 on the chip mounting supporting plate 3 is clamped by an elastic clamping plate 303, at the moment, the metal pins of the chip are inserted in the metal slots 302, then the supporting plate 3 is integrally inserted into the sliding groove 2 in the shell 1, the mounting position of the supporting plate 3 is limited by the insertion of the convex block 803 in the limiting device 9 and the grooves 304 at the two sides of the supporting plate 3, at the moment, the first contact pieces 4 and the second contact pieces 6 are correspondingly contacted one by one, the connection of the metal pins of the chip and the circuit board or other elements of the electronic product is realized, meanwhile, the pressing plate 10 presses on the top of the chip, and the heat-conducting fins 11 on the pressing plate 10 are matched with the heat-radiating fan 12 with the heat-radiating fins 13, so that the chip can be effectively subjected to heat-radiating operation.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (4)
1. A chip fixing device for electronic products, includes shell (1), its characterized in that: the novel shock absorber is characterized in that a sliding groove (2) is arranged in the shell (1), a supporting plate (3) penetrating through the front face of the shell (1) is connected to the sliding groove (2) in a sliding mode, first contact pieces (4) are arranged at the bottom of the supporting plate (3) in a matrix mode, a connecting plate (5) is embedded into the bottom of the shell (1), second contact pieces (6) which correspond to the first contact pieces (4) in a one-to-one mode are arranged at the top of the connecting plate (5), pins (7) which are communicated with the second contact pieces (6) in a one-to-one mode are fixedly installed at the bottom of the connecting plate (5), limiting devices (8) used for fixing the supporting plate (3) are installed on the two sides of the shell (1), installation lugs (14) are welded on the front side and the rear side of the bottom of the two sides of the shell (1), four groups of shock absorbing springs (9) are, the surface of the pressing plate (10) is embedded with a heat-conducting fin (11), the top of the shell (1) is positioned at the right upper end of the heat-conducting fin (11) and is embedded with a heat-radiating fan (12), the outer side surface of the heat-radiating fan (12) is provided with a heat-radiating fin (13), the two sides of the shell (1) are positioned on the side surfaces of the sliding grooves (2) and are respectively provided with an installation cavity (101), a limiting device (8) comprises a connecting rod (801) hinged in the installation cavity (101) through a pin shaft and a sliding block (805) connected on the inner wall of the installation cavity (101) in a sliding manner, one end of the connecting rod (801) is integrally connected with a convex plate (803) extending into the shell (1), a return spring (802) is fixedly installed between the other end of the connecting rod (801) and the inner side wall of the shell of the installation cavity (101), one side of the, a stop block (806) attached to the connecting rod (801) is fixedly connected to the end portion of the other side of the sliding block (805), a through hole (102) communicated with the installation cavity (101) is formed in the joint of the inner side wall of the shell (1) and the convex plate (803), a limiting opening (103) communicated with the installation cavity (101) is formed in the joint of the outer side wall of the shell (1) and the handrail (804), an installation groove (301) is formed in the top of the supporting plate (3), metal slots (302) communicated with the first contact pieces (4) one by one are densely distributed and embedded in the groove bottom of the installation groove (301), elastic clamping plates (303) are installed at the front and rear ends of the top of the supporting plate (3) positioned at the two sides of the installation groove (301), grooves (304) used for limiting the supporting plate (3) are formed in the two sides of the supporting plate (3), the handrail (804) slides in the limiting opening (103), and a stop block (806) at the end portion of the, the one end that drives connecting rod (801) rotates, just in flange (803) the income installation cavity (101) of connecting rod (801) other end, loosen handrail (804) or promote when handrail (804) get back to the normal position under the effect of return spring (802), flange (803) stretch into again in shell (1), can guarantee flange (803) in stop device (8) stretch out with recess (304) grafting of layer board (3) both sides, it is right the mounted position of layer board (3) is injectd, and makes things convenient for layer board (3) pull to take out, shell (1) and layer board (3) are the base member that the polyethylene made, and the front end of layer board (3) is equipped with the pull groove.
2. The chip fixing device for electronic product according to claim 1, wherein: the bottom end of the first contact piece (4) is in a semi-sphere shape, and the bottom of the first contact piece (4) is attached to the top of the second contact piece (6).
3. The chip fixing device for electronic product according to claim 1, wherein: the top end of the heat radiation fan (12) is movably clamped with a dustproof filter screen, and one side of the heat radiation fan (12) is connected with a power line.
4. The chip fixing device for electronic product according to claim 1, wherein: the surface of the mounting lug (14) is provided with a threaded hole, and the bottom of the mounting lug (14) is stuck with a damping rubber gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910337044.6A CN110190033B (en) | 2019-04-25 | 2019-04-25 | Chip fixing device for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910337044.6A CN110190033B (en) | 2019-04-25 | 2019-04-25 | Chip fixing device for electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110190033A CN110190033A (en) | 2019-08-30 |
| CN110190033B true CN110190033B (en) | 2021-05-25 |
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ID=67714880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910337044.6A Active CN110190033B (en) | 2019-04-25 | 2019-04-25 | Chip fixing device for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110190033B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12302528B2 (en) | 2020-11-18 | 2025-05-13 | New Focus Lighting & Power Technology (Shanghai) Co., Ltd. | Cooling apparatus |
| CN113109357B (en) * | 2021-04-09 | 2021-11-23 | 徐州盛科半导体科技有限公司 | Detachable semiconductor analysis device |
| CN116614945A (en) * | 2023-06-26 | 2023-08-18 | 常州工学院 | Chip plugging structure and method |
| CN116631950B (en) * | 2023-07-20 | 2023-10-17 | 弘润半导体(苏州)有限公司 | Semiconductor chip packaging box |
| CN117594455B (en) * | 2024-01-19 | 2024-04-16 | 凯瑞电子(诸城)有限公司 | Microelectronic chip shell interference-free mounting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208235051U (en) * | 2018-04-27 | 2018-12-14 | 江苏菲拉凯恋新材料科技股份有限公司 | A kind of yarn recoverable apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1257209A (en) * | 1998-11-17 | 2000-06-21 | 埃皮技术公司 | Small interval contactor |
| JP2006253348A (en) * | 2005-03-10 | 2006-09-21 | Tyco Electronics Amp Kk | Ic package, ic socket, and ic socket assembly |
| CN208622704U (en) * | 2018-07-17 | 2019-03-19 | 江西意科斯光电科技有限公司 | A kind of ic chip package structure |
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2019
- 2019-04-25 CN CN201910337044.6A patent/CN110190033B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208235051U (en) * | 2018-04-27 | 2018-12-14 | 江苏菲拉凯恋新材料科技股份有限公司 | A kind of yarn recoverable apparatus |
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| Publication number | Publication date |
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| CN110190033A (en) | 2019-08-30 |
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Effective date of registration: 20210510 Address after: 101500 room 106-566, building 2, courtyard 8, Xingsheng South Road, Miyun District, Beijing Applicant after: VACCINE AND HEALTH INSTITUTE Address before: 416000 No.61, Xihu Township, Longshan County, Xiangxi Tujia and Miao Autonomous Prefecture, Hunan Province Applicant before: Huang Jinping |
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Effective date of registration: 20221118 Address after: 311200 room 602, 6th floor, building 1, No.111, Hongxing Road, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Zhongyi (Hangzhou) Pharmaceutical Technology Co.,Ltd. Address before: 101500 room 106-566, building 2, courtyard 8, Xingsheng South Road, Miyun District, Beijing Patentee before: VACCINE AND HEALTH INSTITUTE |
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