CN110197814A - A kind of Micro LED display panel and preparation method thereof, display device - Google Patents

Abstract

The invention discloses a Micro LED display panel, a preparation method thereof, and a display device, which are used to solve the problem that electrodes of Micro LED chips need to be identified during mass transfer and the transfer efficiency is low. The Micro LED display panel of the present invention includes a substrate and Micro LED chips distributed in an array on the substrate. The Micro LED chip includes a body, a first electrode, and a second electrode. A raised portion is formed on one side of the body to form a stepped structure. The first electrode is arranged on the stepped surface of the stepped structure, and the second electrode is arranged on the top surface of the protrusion; a groove is formed on one surface of the substrate, and a depression is formed on the bottom surface of the groove; a first electrode is formed on the bottom surface of the groove. As for the metal layer, a second metal layer is formed on the bottom surface of the depression; the raised part of the Micro LED chip is embedded in the depression of the substrate, and the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode.

Description

A kind of Micro LED display panel and its preparation method, display device

technical field

The present invention relates to the field of display technology, in particular to a Micro LED display panel, a preparation method thereof, and a display device.

Background technique

Micro LED (Micro Light Emitting Diode) technology refers to LED technology with a light-emitting chip area of less than 100 μm. Generally, a high-density LED array is formed on the substrate. Each pixel on the LED display can be customized and individually driven to light up. The pixel distance is reduced from millimeter level to micron level. The advantages of Micro LED are obvious. It inherits the characteristics of high efficiency, high brightness, high reliability and fast response time of inorganic LED, and has the characteristics of self-illumination and no need for backlight. Small, thin and other advantages.

Compared with OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode), Micro LED is easier to adjust the color, has a longer luminous life, and has better material stability, long life, and no image burn-in. The brightness and color saturation of Micro LED are better than OLED and LCD (Liquid Crystal Display, liquid crystal display), and the operating voltage is lower than that of OLED. Because the current density of its light-emitting area can reach 10-20A/cm ² , the aperture ratio is very small, which can Realize the integration of transparent display and various sensors.

The biggest difference between Micro LED and traditional LED is the "mass transfer" technology. Hundreds of thousands or even millions of sub-pixel LED particles are precisely positioned and "welded" to the appropriate position of the driver board through high-precision engineering transfer technology. . As shown in Figure 1, Micro LED chips are divided into P (Positive, positive) electrodes and N (Negative, negative) electrodes. counterpoint. When the number of chip bonding increases to tens of thousands or millions, the transfer efficiency will be seriously reduced.

Contents of the invention

The present invention provides a Micro LED display panel, a preparation method thereof, and a display device, which are used to solve the problems in the prior art that the electrodes of the Micro LED chips need to be identified during the mass transfer process and the transfer efficiency is low.

To achieve the above object, the present invention provides the following technical solutions:

In the first aspect, an embodiment of the present invention provides a Micro LED display panel, including a substrate and micro LED chips formed on the substrate in an array, wherein:

The Micro LED chip includes a body, a first electrode, and a second electrode, wherein a raised portion is formed on one side of the body to form a stepped structure, and the first electrode is disposed on a stepped surface of the stepped structure , the second electrode is disposed on the top surface of the protrusion:

A groove is formed on one surface of the substrate, the groove corresponds to the Micro LED chip, and a depression is formed on the bottom surface of the groove; wherein a first metal layer is formed on the bottom surface of the groove, the A second metal layer is formed on the bottom surface of the depression;

In the Micro LED chip, the protrusion is embedded in the recess, the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode.

The above-mentioned Micro LED display panel includes a substrate and Micro LED chips formed in an array on the substrate, wherein: the Micro LED chip includes a body, a first electrode, and a second electrode, wherein one side of the body is formed with a convex raised part to form a stepped structure, the first electrode is set on the stepped surface of the stepped structure, and the second electrode is set on the top surface of the raised part: a groove is formed on one surface of the substrate, and the groove corresponds to the Micro LED chip, and the bottom surface of the groove is formed with a depression; wherein the bottom surface of the groove is formed with a first metal layer, and the bottom surface of the depression is formed with a second metal layer; in the MicroLED chip, the protrusion is embedded in the depression, and the first metal The metal layer is attached to the first electrode, and the second metal layer is attached to the second electrode. In this display panel, the protruding part of the Micro LED chip is embedded in the depression of the substrate, and the first metal layer formed on the bottom surface of the groove of the substrate is attached to the first electrode provided on the stepped surface of the Micro LED chip. The second metal layer formed on the bottom surface of the recess of the micro LED chip is bonded to the second electrode set on the top surface of the raised part of the Micro LED chip, so that there is no need to identify the P and N electrodes of the Micro LED chip during the mass transfer process, and the transfer efficiency is improved .

Preferably, the substrate is provided with a plurality of grooves, the grooves extend along the row direction, and the plurality of grooves are arranged along the column direction, the grooves correspond to the row of Micro LED chips, and the grooves The bottom surface of the groove is formed with a depression corresponding to the raised portion of the Micro LED chip in the row; or

The substrate is provided with a plurality of grooves, the grooves extend along the column direction, and the plurality of grooves are arranged along the row direction, the grooves correspond to the columns of Micro LED chips, and the bottom surface of each groove is A depression corresponding to the raised portion of the Micro LED chip in the row of Micro LED chips is formed.

In the above-mentioned Micro LED display panel, since the substrate is provided with a plurality of grooves, the grooves extend along the row direction, and the plurality of grooves are arranged along the column direction, and each of the grooves corresponds to a row of Micro LED chips, so The bottom surface of the groove is formed with a depression corresponding to the raised part of the Micro LED chip in the row of Micro LED chips; or the substrate is provided with a plurality of grooves, the grooves extend along the column direction, and the plurality of grooves extend along the Arranged in the row direction, the grooves correspond to the Micro LED chips in the column, and the bottom surface of the groove forms a depression corresponding to the raised part of the Micro LED chip in the column, so that there is no need to identify the P, The N electrode can be precisely positioned while improving the transfer efficiency.

Preferably, one side of the main body is formed with a raised portion, and the raised portion is formed at the center of the side.

Preferably, a first electrode conductive layer is provided inside the body;

A second electrode conductive layer and a quantum well layer are arranged inside the protrusion, and the second electrode conductive layer is arranged between the first electrode and the quantum well layer.

Preferably, the first electrode is an N-type electrode, and the second electrode is a P-type electrode; or

The first electrode is a P-type electrode, and the second electrode is an N-type electrode.

Preferably, the first metal layer is attached to the first electrode, including:

The first metal layer is attached to the first electrode through a conductive adhesive;

The second metal layer is attached to the second electrode, including:

The second metal layer is attached to the second electrode through a conductive adhesive.

Preferably, the top view of the chip is rectangular or circular in shape.

In a second aspect, an embodiment of the present invention provides a display device, and the display device includes the display panel provided in the technical solution of the first aspect.

Since the above-mentioned display device includes the display panel in the first aspect, there is no need to identify the P and N electrodes of the Micro LED chip during the mass transfer process, thereby improving the transfer efficiency.

In a third aspect, an embodiment of the present invention provides a method for preparing a Micro LED display panel, the method comprising:

The Micro LED chips arranged in an array are transferred to the substrate by a mass transfer method, wherein the Micro LED chip includes a body, a first electrode, and a second electrode, and a raised portion is formed on one side of the body to form a stepped structure , the first electrode is disposed on the stepped surface of the stepped structure, the second electrode is disposed on the top surface of the protrusion; a groove is formed on a surface of the substrate, and the groove corresponds to The Micro LED chip, and the bottom surface of the groove is formed with a depression; wherein the bottom surface of the groove is formed with a first metal layer, and the bottom surface of the depression is formed with a second metal layer;

Press the surface of the Micro LED chips arranged in the array so that the surface of the Micro LED chips arranged in the array is on the same plane as the surface of the substrate, wherein, in the Micro LED chip, the raised portion is embedded in In the depression, the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode.

In the above method, firstly, the Micro LED chips arranged in an array are transferred to the substrate by a mass transfer method, and then the surface of the Micro LED chips arranged in the array is pressed, so that the surface of the Micro LED chips arranged in the array is aligned with the surface of the Micro LED chips arranged in the array. The substrate surfaces are on the same plane. Since the Micro LED chip includes a body, a first electrode, and a second electrode, a raised portion is formed on one side of the body to form a stepped structure, the first electrode is arranged on a stepped surface of the stepped structure, and the The second electrode is disposed on the top surface of the protrusion; a groove is formed on one surface of the substrate, the groove corresponds to the Micro LED chip, and a depression is formed on the bottom surface of the groove; wherein the A first metal layer is formed on the bottom surface of the groove, and a second metal layer is formed on the bottom surface of the depression; in the Micro LED chip, the protrusion is embedded in the depression, and the first metal layer It is bonded to the first electrode, and the second metal layer is bonded to the second electrode, so that there is no need to identify the P and N electrodes of the Micro LED chip during the mass transfer process, which improves the transfer efficiency while reducing the Counterpoint difficulty.

Preferably, before transferring the Micro LED chips arranged in an array onto the substrate by the mass transfer method, it also includes:

A conductive adhesive is filled on the first metal layer and the second metal layer.

In the above method, since the Micro LED chip is embedded in the recess of the substrate, in order to weld the Micro LED chip and the substrate together, conductive adhesive can be filled on the first metal layer and the second metal layer.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of an existing Micro LED chip and substrate provided by the background technology;

Fig. 2 is a schematic structural diagram of a Micro LED display panel provided by an embodiment of the present invention;

Fig. 3 is a schematic diagram of two protrusions 23 formed on one side of the body 20 of a Micro LED chip 2 provided by an embodiment of the present invention;

Fig. 4 is a schematic diagram of three protrusions 23 formed on one side of the body 20 of a Micro LED chip 2 provided by an embodiment of the present invention;

FIG. 5 is a schematic diagram of two depressions 11 formed on the bottom surface of a groove 10 provided by an embodiment of the present invention;

FIG. 6 is a schematic diagram of three depressions 11 formed on the bottom surface of a groove 10 provided by an embodiment of the present invention;

Fig. 7 is a cross-sectional view of a substrate 1 provided by an embodiment of the present invention for setting a Micro LED chip 2 with a groove 10 formed on its surface;

Fig. 8 is a top view of a groove 10 formed on the surface of a substrate 1 provided by an embodiment of the present invention for setting a Micro LED chip 2;

Fig. 9 is a cross-sectional view of a Micro LED chip 2 embedded in a substrate 1 provided by an embodiment of the present invention to form a groove;

FIG. 10 is a cross-sectional view of a first type of substrate 1 provided with a plurality of grooves 10 according to an embodiment of the present invention;

Fig. 11 is a top view of a first substrate 1 provided with a plurality of grooves 10 according to an embodiment of the present invention;

Fig. 12 is a cross-sectional view of the first Micro LED chip 2 embedded in the substrate 1 provided with a plurality of grooves 10 provided by the embodiment of the present invention;

Fig. 13 is a cross-sectional view of a second type of substrate 1 provided with a plurality of grooves 10 according to an embodiment of the present invention;

Fig. 14 is a top view of a second type of substrate 1 provided with a plurality of grooves 10 according to an embodiment of the present invention;

Fig. 15 is a cross-sectional view of a second Micro LED chip 2 embedded in a substrate 1 provided with a plurality of grooves 10 according to an embodiment of the present invention;

Fig. 16 is a cross-sectional view of a one-to-one correspondence between a groove 10 formed on the surface of a substrate 1 for setting a Micro LED chip 2 and a Micro LED chip 2 according to an embodiment of the present invention;

Fig. 17 is a top view of a one-to-one correspondence between a groove 10 formed on the surface of a substrate 1 for setting a Micro LED chip 2 and a Micro LED chip 2 according to an embodiment of the present invention;

Fig. 18 is a cross-sectional view of a Micro LED chip 2 embedded in the groove 10 of the substrate 1 provided by the embodiment of the present invention;

FIG. 19 is a schematic diagram of the internal structure of a Micro LED chip 2 provided by an embodiment of the present invention;

Fig. 20 is a cylindrical top view of a protrusion 23 and a body 20 provided by an embodiment of the present invention;

Fig. 21 is a cylindrical top view of a groove 10 and a depression 11 provided by an embodiment of the present invention;

Fig. 22 is a schematic diagram of the size of a Micro LED chip 2 provided by an embodiment of the present invention;

Fig. 23 is a schematic flowchart of a method for preparing a Micro LED display panel provided by an embodiment of the present invention;

Fig. 24 is a schematic diagram of a press-bonded Micro LED chip and substrate provided by an embodiment of the present invention.

Icons: 1-substrate; 2-Micro LED chip; 10-groove; 11-depression; 12-first metal layer; 13-second metal layer; 20-body; 21-first electrode; 22-second electrode ; 23-protrusion; 24-second electrode layer; 25-quantum well layer; 26-first electrode layer.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Micro LED is a new generation of display technology, which has higher brightness, better luminous efficiency and lower power consumption than the existing OLED technology. Micro LED can precisely position and solder hundreds of thousands or even millions of sub-pixel LED particles to the proper position of the driver board through high-precision engineering transfer technology. Since the Micro LED chip is divided into P electrodes and N electrodes, during the transfer process, it is necessary to identify the P electrodes and N electrodes of the Micro LED chips and precisely position them with the electrodes of the substrate. If there is no need to identify the P and N electrodes of the Micro LED chip during the transfer process, the transfer efficiency can be improved.

The Micro LED chip can have a raised portion formed on one side of the body to form a stepped structure, a first electrode is arranged on the stepped surface of the stepped structure, a second electrode is arranged on the top surface of the raised portion, and a surface of the substrate is formed with A groove, the groove corresponds to the Micro LED chip, and a depression is formed on the bottom surface of the groove, a first metal layer is formed on the bottom surface of the groove, a second metal layer is formed on the bottom surface of the depression, and the protrusion of the Micro LED chip The rising part is embedded in the depression of the substrate, and the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode. Since the first electrode is arranged on the step surface of the step structure of the Micro LED chip, the protrusion The second electrode is set on the top surface of the substrate, and the protrusion of the Micro LED chip is embedded in the depression of the substrate, so there is no need to identify the P electrode and N electrode of the Micro LED chip during the mass transfer process.

The application scenarios described in the embodiments of this application are to illustrate the technical solutions of the embodiments of the application more clearly, and do not constitute limitations on the technical solutions provided by the embodiments of the application. Those of ordinary skill in the art know that with the development of new application scenarios It appears that the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

In view of the above scenario, a schematic structural diagram of a Micro LED display panel provided by this application is shown in Figure 2. The display panel includes:

The substrate 1 and the micro light-emitting diode Micro LED chips 2 formed in an array on the substrate 1, wherein:

The Micro LED chip 2 includes a body 20, a first electrode 21, and a second electrode 22, wherein a raised portion 23 is formed on one side of the body 20 to form a stepped structure, and the first electrode 21 is disposed on the On the stepped surface of the stepped structure, the second electrode 22 is arranged on the top surface of the raised portion 23:

A groove 10 is formed on one surface of the substrate 1, the groove 10 corresponds to the Micro LED chip 2, and a depression 11 is formed on the bottom surface of the groove 10; wherein a first metal layer is formed on the bottom surface of the groove 10 12. A second metal layer 13 is formed on the bottom surface of the depression;

In the Micro LED chip 2, the raised portion 23 is embedded in the recess 11, and the first metal layer 12 is bonded to the first electrode 21, and the second metal layer 13 is bonded to the The second electrode 22 is bonded together.

In the above-mentioned Micro LED display panel, since the raised portion 23 of the Micro LED chip 2 in the display panel is embedded in the recess 11 of the substrate 1, the first metal layer 12 formed on the bottom surface of the groove 10 of the substrate 1 and the first metal layer 12 formed on the bottom surface of the Micro LED chip 2 The first electrode 21 provided on the stepped surface of the substrate 1 is bonded, and the second metal layer 13 formed on the bottom surface of the recess 11 of the substrate 1 is bonded to the second electrode 22 provided on the top surface of the raised portion 23 of the Micro LED chip 2, so that In the mass transfer process, there is no need to identify the P electrode and N electrode of the Micro LED chip, which improves the transfer efficiency.

Wherein, the raised portion 23 formed on one side of the body 20 of the Micro LED chip 2 may have one or more, as shown in FIG. 2 , the raised portion formed on one side of the body 20 of the Micro LED chip 2 23 has one, as shown in Figure 3, the raised part 23 formed on one side of the body 20 of the Micro LED chip 2 has two, as shown in Figure 4, the raised part 23 formed on one side of the body 20 of the Micro LED chip 2 Section 23 has three.

Specifically, the number of raised portions 23 formed on one side of the main body 20 of the Micro LED chip 2 can be set according to actual needs, and is not limited in the embodiment of the present invention.

Since in the Micro LED chip 2, the raised portion 23 of the main body 20 is embedded in the recess 11, the raised portion 23 corresponds to the recess 11 one by one, that is to say, the Micro LED chip 2 has several raised portions 23, The substrate 1 corresponds to several depressions 11 .

As shown in FIG. 5 , two depressions 11 are formed for the bottom surface of the groove 10 . The substrate 1 shown in FIG. 5 corresponds to the Micro LED chip 2 shown in FIG. 3 , and the two protrusions 23 of the Micro LED chip 2 are embedded in the two recesses 11 of the substrate 1 .

As shown in FIG. 6 , three depressions 11 are formed for the bottom of the groove 10 . The substrate 1 shown in FIG. 6 corresponds to the Micro LED chip 2 shown in FIG. 4 , and the three protrusions 23 of the Micro LED chip 2 are embedded in the three recesses 11 of the substrate 1 .

Specifically, the number of depressions 11 formed at the bottom of the groove 10 of the substrate 1 can be set according to actual needs, and is not limited in the embodiment of the present invention.

In practice, a groove 10 is formed on the surface of the substrate 1 for setting the Micro LED chip 2 , and the number of the groove 10 may be one or more. Different situations are described below.

The embodiment of the present invention is described by taking the Micro LED chip 2 having a raised portion 23 as an example.

Case 1: A groove 10 is formed on one surface of the substrate 1 .

As shown in FIG. 7 , it is a cross-sectional view in which one groove 10 is formed on one surface of the substrate 1 . In FIG. 7 , three depressions 11 are formed on the bottom surface of the groove 10 , and the protrusion 23 of each Micro LED chip 2 among the three Micro LED chips 2 can be embedded in each depression 11 .

As shown in FIG. 8 , it is a top view of a groove 10 formed on one surface of the substrate 1 . It can be seen from FIG. 8 that a groove 10 is formed on one surface of the substrate 1 , and nine depressions 11 are formed on the bottom surface of the groove 10 .

As shown in FIG. 9 , it is a cross-sectional view of the Micro LED chip 2 embedded in the substrate 1 to form a groove. In FIG. 9 , a groove 10 is formed on one surface of the substrate 1 , and a plurality of depressions 11 are formed on the bottom surface of the groove 10 , and the protrusion 23 of each Micro LED chip 2 is embedded in each depression 11 .

Case 2: There are multiple grooves 10 provided on the substrate 1, the grooves 10 extend along the row direction, and the plurality of grooves 10 are arranged along the column direction, the grooves 10 correspond to the Micro LED chips 2 in the row, so The bottom surface of the groove 10 forms a depression 11 corresponding to the raised portion 23 of the Micro LED chip 2 in the row of Micro LED chips 2 .

As shown in FIG. 10 , it is a cross-sectional view of a first type of substrate 1 provided with a plurality of grooves 10 . It can be seen from FIG. 10 that the groove 10 extends along the row direction, and three depressions 11 are formed on the bottom surface of the groove 10 , and the protrusion 23 of each Micro LED chip 2 can be embedded in each depression 11 .

As shown in FIG. 11 , it is a top view of a first type of substrate 1 provided with a plurality of grooves 10 . It can be seen from Fig. 11 that the substrate 1 is provided with three grooves 10, the grooves 10 extend along the row direction, and the three grooves 10 are arranged along the column direction, the grooves 10 correspond to the row Micro LED chips 2, the grooves 10 The bottom surface of the corresponding row of Micro LED chips 2 forms the recesses 11 of the raised portions 23 of the Micro LED chips 2 .

Wherein, the number of the grooves 10 and the number of the depressions 11 can be set according to actual needs, which are not limited in the embodiment of the present invention.

As shown in FIG. 12 , it is a cross-sectional view of a first type of Micro LED chip 2 embedded in a substrate 1 provided with a plurality of grooves 10 according to an embodiment of the present invention. It can be seen from FIG. 12 that three depressions 11 are formed on the bottom surface of one groove, and the protrusion 23 of each Micro LED chip 2 is embedded in each depression 11 .

Situation 3: There are multiple grooves 10 provided on the substrate 1, the grooves 10 extend along the column direction, and the multiple grooves 10 are arranged along the row direction, the grooves 10 correspond to the Micro LED chips 2 in the column, so The bottom surface of the groove 10 is formed with a depression 11 corresponding to the raised portion 23 of the Micro LED chip 2 in the row of Micro LED chips 2 .

As shown in FIG. 13 , it is a cross-sectional view of a second type of substrate 1 provided with a plurality of grooves 10 . It can be seen from FIG. 13 that the substrate 1 is provided with three grooves 10, and the grooves 10 extend along the row direction.

As shown in FIG. 14 , it is a top view of the second type of substrate 1 provided with a plurality of grooves 10 . It can be seen from FIG. 14 that the substrate 1 is provided with three grooves 10, and three grooves 11 are formed at the bottom of the grooves 10. The three grooves 10 are arranged along the row direction. The grooves 10 correspond to the columns of MicroLED chips 2. The bottom surface of the groove 10 is formed with a recess 11 corresponding to the raised portion 23 of the Micro LED chip 2 in the row of Micro LED chips 2 .

Wherein, the number of the grooves 10 and the number of the depressions 11 can be set according to actual needs, which are not limited in the embodiment of the present invention.

As shown in FIG. 15 , a cross-sectional view of a second type of Micro LED chip 2 embedded in a substrate 1 provided with a plurality of grooves 10 provided by the embodiment of the present invention. It can be seen from FIG. 15 that three grooves 10 are formed on one surface of the substrate 1 , and the raised portion 23 of the Micro LED chip 2 is embedded in each of the grooves 11 .

Situation 4: The grooves formed on one surface of the substrate 1 correspond to the Micro LED chips one by one.

As shown in FIG. 16 , it is a cross-sectional view showing a one-to-one correspondence between the grooves 10 formed on one surface of the substrate 1 and the Micro LED chips 2 . In FIG. 16 , a depression 11 is formed on the bottom surface of each groove 10 of the substrate 1 .

As shown in FIG. 17 , it is a top view of the one-to-one correspondence between the grooves 10 formed on the surface of the substrate 1 for setting the Micro LED chips 2 and the Micro LED chips 2 . It can be seen from FIG. 17 that three grooves 10 are formed on one surface of the substrate 1 along the column direction of the array, and three depressions 11 are formed on the bottom surface of each groove 10 .

Wherein, the number of the grooves 10 and the number of the depressions 11 can be set according to actual needs, which are not limited in the embodiment of the present invention.

As shown in FIG. 18 , it is a cross-sectional view of the Micro LED chip 2 embedded in the groove 10 of the substrate 1 . It can be seen from FIG. 15 that the protrusion 23 of each Micro LED chip 2 is embedded in each recess 11 .

In practice, the first electrode conductive layer is arranged inside the main body, and the second electrode conductive layer and the quantum well layer are arranged inside the protrusion.

For example, taking the Micro LED chip 2 has a raised portion 23, and the raised portion 23 is formed at the center of the side of the main body 20 as an example, as shown in FIG. 19, the second electrode layer below the second electrode 22 24 , the first electrode layer 26 is below the first electrode 21 , and the quantum well layer 25 is between the first electrode layer 25 and the second electrode layer 23 .

Specifically, the first electrode 21 may be a P-type electrode or an N-type electrode, and the second electrode 22 may also be a P-type electrode or an N-type electrode. If the first electrode 21 is a P-type electrode, then the second electrode 22 is an N-type electrode, and if the first electrode 21 is an N-type electrode, then the second electrode 22 is a P-type electrode.

Correspondingly, if the first electrode 21 is a P-type electrode, then the first electrode layer 26 is a P-type electrode layer; if the first electrode 21 is an N-type electrode, then the first electrode layer 26 is an N-type electrode layer. If the second electrode 22 is a P-type electrode, then the second electrode layer 26 is a P-type electrode layer; if the second electrode 22 is an N-type electrode, then the second electrode layer 26 is an N-type electrode layer.

In practice, when the first metal layer 12 and the first electrode 21 are bonded together, they can be bonded by a conductive adhesive to enable conduction between the first metal layer 12 and the first electrode 21; similarly, the second metal layer 13 When bonding with the second electrode 22 , a conductive adhesive may be used for bonding to enable conduction between the second metal layer 13 and the second electrode 22 .

The above descriptions are based on the fact that the raised portion of the Micro LED chip 2 and the top view of the main body are rectangular. The shape of the raised portion 23 of the Micro LED chip 2 and the top view of the main body 20 can also be other shapes, such as a circle, That is to say, the protrusion 23 is cylindrical, and the body 20 is also cylindrical. An example is given below.

As shown in FIG. 20 , it is a top view in which the protrusion 23 and the body 20 are cylindrical. It can be seen from FIG. 20 that the top view of the raised portion 23 of the Micro LED chip 2 is circular, and the top view of the main body 20 is also circular.

Because the first electrode 21 on the body 20 of the Micro LED chip 2 is attached to the first metal layer 12 formed on the bottom surface of the groove 10 of the substrate, the shape of the groove 10 can be the same as the shape of the body 20. When the body 20 is When the groove 10 is cylindrical, the groove 10 may also be cylindrical; since the protrusion 23 needs to be embedded in the recess 11 of the substrate 1 , when the protrusion 23 is cylindrical, the recess 11 may also be cylindrical.

As shown in FIG. 21 , it is a top view in which the groove 10 and the depression 11 are cylindrical. It can be seen from FIG. 21 that each Micro LED chip 2 corresponds to a groove 10 on the substrate 1 . The top view shape of the groove 10 of the substrate 1 is circular, and the top view shape of the depression 11 is also circular.

It should be noted that the shape of the raised portion 23 of the Micro LED chip 2 and the shape of the body 20 can be freely combined, for example, the raised portion 23 is cylindrical, and the body 20 is a cuboid; the raised portion 23 is a cuboid, and the body 20 is Cylindrical; the convex part 23 is cylindrical, and the body 20 is a cube, etc. The specific shape of the convex part 23 and the shape of the body 20 can be set according to actual needs, and the embodiment of the present invention does not limit it.

In the embodiment of the present invention, the size of the protrusion 23 of the Micro LED chip 2 can be 20 μm (micrometer), as shown in FIG. 22 , for example, if the shape of the protrusion 23 is a cube, the length of the cube is 20 μm; if The shape of the protrusion 23 is cylindrical, and the diameter of the cylindrical shape is 20 μm;

The size of the body 20 of the Micro LED chip 2 can be about 60 μm (micrometer), as shown in Figure 22, for example, if the shape of the body 10 is a cube, the height of the cube is 20 μm; if the shape of the body 20 is a cylinder, then The height of the cylinder is 20 μm;

The size from the bottom to the top of the Micro LED chip 2 may be 100 μm. As shown in FIG. 22 , the height of the body 20 and the height of the raised portion 23 are 100 μm in total.

Based on the same inventive concept, an embodiment of the present invention also provides a display device. Since the display device corresponds to the display panel of the embodiment of the present invention, and the problem-solving principle of the display device is similar to that of the display panel, the display device's For implementation, reference may be made to the implementation of the display panel, and repeated descriptions will not be repeated.

Based on the same inventive concept, an embodiment of the present invention also provides a method for preparing a Micro LED display panel, as shown in FIG. 23 , the method includes:

S2300. Transfer the Micro LED chips arranged in an array onto the substrate by mass transfer method, wherein the Micro LED chip includes a body, a first electrode, and a second electrode, and a protrusion is formed on one side of the body part to form a stepped structure, the first electrode is arranged on the stepped surface of the stepped structure, and the second electrode is arranged on the top surface of the raised part; a groove is formed on one surface of the substrate, so The groove corresponds to the Micro LED chip, and a depression is formed on the bottom surface of the groove; wherein a first metal layer is formed on the bottom surface of the groove, and a second metal layer is formed on the bottom surface of the depression;

S2301. Press the surface of the Micro LED chip arranged in the array, so that the surface of the Micro LED chip arranged in the array is on the same plane as the surface of the substrate, wherein, in the Micro LED chip, the raised portion embedded in the depression, and the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode.

In the embodiment of the present invention, the Micro LED chips arranged in an array are first transferred to the substrate by a mass transfer method, and then the surface of the Micro LED chips arranged in an array is pressed, so that the surface of the Micro LED chips arranged in an array is aligned with the substrate. The substrate surfaces are on the same plane. Since the Micro LED chip includes a body, a first electrode, and a second electrode, a raised portion is formed on one side of the body to form a stepped structure, and the first electrode is arranged on the stepped surface of the stepped structure, the The second electrode is disposed on the top surface of the protrusion; a groove is formed on a surface of the substrate, and a depression is formed on the bottom surface of the groove; wherein a first metal layer is formed on the bottom surface of the groove, A second metal layer is formed on the bottom surface of the depression; in the Micro LED chip, the protrusion is embedded in the depression, and the first metal layer is bonded to the first electrode, and the first The two metal layers are attached to the second electrode, so that during the mass transfer process, there is no need to identify the P and N electrodes of the Micro LED chip, which improves the transfer efficiency and reduces the difficulty of alignment.

In practice, in order to make the Micro LED chip and the substrate bond better, it is necessary to press the Micro LED chip and the substrate. In the embodiment of the present invention, the surface of the Micro LED chip can be pressed to make the surface of the Micro LED chip and The surface of the substrate is on the same plane, and the pressing is stopped at this time. Since the surface of the Micro LED chip and the surface of the substrate are on the same plane, the pressing force is fixed and controllable during the pressing process, which can reduce the micro Damage rate of LED chips.

As shown in Figure 24, it is a schematic diagram of lamination of Micro LED chips and substrates. In Figure 24, a flat plate can be used to press the Micro LED chip. After pressing, the surface of the Micro LED chip and the surface of the substrate are on the same plane.

Since the Micro LED chips and the substrate need to be soldered together, before transferring the arrayed Micro LED chips to the substrate by the method of mass transfer, it also includes: filling the conductive adhesive on the first metal layer and the second metal layer mixture.

A conductive adhesive is present between the first metal layer and the first electrode, a conductive adhesive is present between the second metal layer and the second electrode, and the conductive adhesive solders the first metal layer and the first electrode together , welding the second metal layer and the second electrode together, so that the Micro LED display panel can be lighted up after electrification.

The present application is described above with reference to block diagrams and/or flowcharts illustrating methods, apparatus (systems) and/or computer program products according to embodiments of the present application. It will be understood that one block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, a special purpose computer and/or other programmable data processing apparatus to produce a machine such that instructions executed via the computer processor and/or other programmable data processing apparatus create a means of implementing the functions/acts specified in the block diagrams and/or flowchart blocks.

Accordingly, the present application may also be implemented in hardware and/or software (including firmware, resident software, microcode, etc.). Still further, the present application may take the form of a computer program product on a computer-usable or computer-readable storage medium having computer-usable or computer-readable program code embodied in the medium for use by an instruction execution system or Used in conjunction with command execution systems. In the context of this application, a computer-usable or computer-readable medium may be any medium that may contain, store, communicate, transmit, or convey a program for use by, or in connection with, an instruction execution system, apparatus, or device device or equipment used.

Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (10)

1. A Micro LED display panel, characterized in that it comprises a substrate and micro LED chips formed in an array on the substrate, wherein: The Micro LED chip includes a body, a first electrode, and a second electrode, wherein a raised portion is formed on one side of the body to form a stepped structure, and the first electrode is disposed on a stepped surface of the stepped structure , the second electrode is disposed on the top surface of the protrusion: A groove is formed on one surface of the substrate, the groove corresponds to the Micro LED chip, and a depression is formed on the bottom surface of the groove; wherein a first metal layer is formed on the bottom surface of the groove, the A second metal layer is formed on the bottom surface of the depression; In the Micro LED chip, the protrusion is embedded in the recess, the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode. 2. The display panel according to claim 1, wherein the substrate is provided with a plurality of grooves, the grooves extend along the row direction, and a plurality of the grooves are arranged along the column direction, so The groove corresponds to the row of Micro LED chips, and the bottom surface of the groove is formed with a depression corresponding to the raised part of the Micro LED chip in the row of Micro LED chips; or The substrate is provided with a plurality of grooves, the grooves extend along the column direction, and the plurality of grooves are arranged along the row direction, the grooves correspond to the columns of Micro LED chips, and the bottom surface of the grooves Concaves corresponding to the protruding portions of the Micro LED chips in the row of Micro LED chips are formed. 3. The display panel according to claim 1, wherein a raised portion is formed on one side of the main body, and the raised portion is formed at a central position of the side. 4. The display panel according to claim 1, wherein a first electrode conductive layer is disposed inside the body; A second electrode conductive layer and a quantum well layer are arranged inside the protrusion, and the second electrode conductive layer is arranged between the first electrode and the quantum well layer. 5. The display panel according to claim 4, wherein the first electrode is an N-type electrode, and the second electrode is a P-type electrode; or The first electrode is a P-type electrode, and the second electrode is an N-type electrode. 6. The display panel according to claim 1, wherein the first metal layer is bonded to the first electrode, comprising: The first metal layer is attached to the first electrode through a conductive adhesive; The second metal layer is attached to the second electrode, including: The second metal layer is attached to the second electrode through a conductive adhesive. 7. The display panel according to any one of claims 1-6, wherein the shape of the Micro LED chip in a top view is a rectangle or a circle. 8. A display device, characterized in that the display device comprises: The display panel according to any one of claims 1-7. 9. A method for preparing a Micro LED display panel, characterized in that the method comprises: The Micro LED chips arranged in an array are transferred to the substrate by a mass transfer method, wherein the Micro LED chip includes a body, a first electrode, and a second electrode, and a raised portion is formed on one side of the body to form a Step structure, the first electrode is arranged on the step surface of the step structure, the second electrode is arranged on the top surface of the protrusion; a groove is formed on a surface of the substrate, and the groove Corresponding to the Micro LED chip, and a depression is formed on the bottom surface of the groove; wherein a first metal layer is formed on the bottom surface of the groove, and a second metal layer is formed on the bottom surface of the depression; Press the surface of the Micro LED chips arranged in the array so that the surface of the Micro LED chips arranged in the array is on the same plane as the surface of the substrate, wherein, in the Micro LED chip, the raised portion is embedded in In the depression, the first metal layer is bonded to the first electrode, and the second metal layer is bonded to the second electrode. 10. The preparation method according to claim 9, further comprising: A conductive adhesive is filled on the first metal layer and the second metal layer.