CN110176258A - A kind of mobile electronic information-storing device - Google Patents

Abstract

The present invention relates to the technical field of electronic information storage, in particular to a mobile electronic information storage, comprising a box body, one side of the box body is provided with a SATA interface, a USB interface and a power supply interface, and both sides of the inner wall of the box are provided with L A circuit board is fixedly installed on the upper surface of the two L-shaped boards, and a heat dissipation net is fixedly installed on both sides of the bottom of the box body. The upper surface of the insulating layer on the surface is bonded with a protective layer, the upper surface of the protective layer is bonded with a signal layer, the lower surface of the insulating layer located on the lower surface of the metal substrate is bonded with a reinforcement layer, and the lower surface of the reinforcement layer is bonded with a heat conduction layer, and the heat conduction layer The lower surface is fixedly provided with a heat dissipation mechanism. The mobile electronic information storage can play the role of shock absorption and protection for the circuit board, and has the performances of efficient heat dissipation, high support strength, high temperature resistance and high tensile strength.

Description

A mobile electronic information storage

technical field

The invention relates to the technical field of electronic information storage, in particular to a mobile electronic information storage.

Background technique

Memory is a device that is used to store electronic information in a portable way, that is, it is used for people to store electronic files, photos and video files on a daily basis. With the continuous emphasis on and investment in memory, the various devices of memory have been improved to a certain extent, which can facilitate users to store information, but there are still some deficiencies in existing memory. There are certain disadvantages when using it. When the memory is accidentally dropped, it cannot absorb the shock well, which will cause the memory to drop and damage the internal circuit board, and the electronic file will be damaged and cannot be opened. Moreover, the heat dissipation effect of the existing memory is poor. Poor, unable to quickly dissipate the heat generated by the operation of the circuit board, which will increase the loss of the circuit board, and even cause damage to the circuit board, making the electronic files unavailable, which has brought a certain impact in the actual use process. Therefore, for the above-mentioned problems, it needs to be innovated and improved.

Contents of the invention

The purpose of the present invention is to solve the shortcomings in the prior art, and propose a mobile electronic information storage.

In order to achieve the above object, the present invention adopts the following technical solutions:

Design a mobile electronic information storage, including a box body, one side of the box body is provided with a SATA interface, a USB interface and a power interface, and the USB interface is located between the SATA interface and the power interface, and the upper end of the box body is fixed A cover plate is installed, and both sides of the inner wall of the box are provided with L-shaped plates through a sliding mechanism, and the lower surface of the L-shaped plate is fixedly provided with a buffer layer, and the buffer layer is fixedly arranged at the bottom of the box body, and the two L-shaped plates A circuit board is fixedly installed on the upper surface, and a positioning mechanism is arranged between the lower surface of the circuit board and the upper surfaces of the two L-shaped boards, and a cooling net is fixedly installed on both sides of the bottom of the box body, and the cover plate The middle part of the lower surface is bonded with an antistatic layer, and the lower surface of the antistatic layer is in contact with the upper surface of the circuit board. The circuit board includes a metal substrate fixedly installed on the upper surface of the two L-shaped boards. Both the surface and the lower surface are bonded with an insulating layer, the upper surface of the insulating layer located on the upper surface of the metal substrate is bonded with a protective layer, and the upper surface of the protective layer is bonded with a signal layer, which is located under the insulating layer on the lower surface of the metal substrate A reinforcement layer is bonded on the surface, a heat conduction layer is bonded to the lower surface of the reinforcement layer, and a heat dissipation mechanism is fixedly arranged on the lower surface of the heat conduction layer.

Preferably, the sliding mechanism includes a chute set on one side of the inner wall of the box and a slider fixedly installed on one side of the L-shaped plate, the slider is slidably arranged in the chute, and the lower end of the slider is fixed A first spring is installed, and the lower end of the first spring is fixedly connected to the inner wall of the chute.

Preferably, the buffer layer includes a first buffer plate fixedly installed on the lower surface of the L-shaped plate and a second buffer plate fixedly installed on the bottom of the box body, and the gap between the second buffer plate and the first buffer plate is uniform. A plurality of second springs are fixedly installed.

Preferably, the positioning mechanism includes a positioning slot opened on the lower surface of the circuit board and a positioning post fixedly installed on the upper side of the L-shaped board, and the positioning post is clamped in the positioning slot.

Preferably, the reinforcement layer includes two high-temperature-resistant layers bonded to the lower surface of the insulating layer and the upper surface of the heat-conducting layer respectively, the inner surfaces of the high-temperature-resistant layers are bonded with a stretch-resistant layer, and the two tensile-resistant layers A plurality of supporting steels are fixedly arranged at equal intervals between the extension layers.

Preferably, the heat dissipation mechanism includes a graphene sheet bonded in the middle of the lower surface of the heat conduction layer, the lower surface of the graphene sheet is bonded to a heat dissipation bottom plate, and a plurality of heat dissipation scales are fixedly installed on the lower surface of the heat dissipation bottom plate at equal intervals.

Preferably, the upper ends of the L-shaped plates are fixedly provided with shock absorbing pads.

Preferably, the anti-static layer includes a first anti-static plate and a second anti-static plate bonded to the middle of the lower surface of the cover, and an anti-static plate is filled between the first anti-static plate and the second anti-static plate. Static filling material, the second antistatic plate is in contact with the circuit board.

A kind of mobile electronic information memory that the present invention proposes, beneficial effect is:

1. The mobile electronic information storage is designed with a sliding mechanism and a buffer layer. Through the design of the first buffer plate, the second buffer plate and the second spring, a certain buffer force can be generated, and through the slider, the chute and the second With the cooperation of a spring, it can effectively play the role of shock absorption and protection of the circuit board, and can play the role of anti-falling.

2. The mobile electronic information memory is designed with a strengthening layer, through the design of supporting steel, tensile layer and high temperature resistant layer, so as to enhance the supporting strength, tensile strength and high temperature resistance of the circuit board in the memory, and support The steel is designed as an I-shaped structure. Through this design, not only can the support strength be 1.5 times higher than that of the structure with the same height and width, but also can save more materials while improving the support strength, so that Reduced production costs.

3. The mobile electronic information storage is designed with a heat dissipation mechanism. Under the action of various heat dissipation structures such as graphene sheet, heat dissipation bottom plate and heat dissipation scales, and under the action of heat conduction of the heat conduction layer, the circuit board can be efficiently and quickly The heat generated during operation is dissipated, so that the circuit board has the performance of efficient heat dissipation, which can effectively reduce its loss, thereby prolonging its service life.

Description of drawings

Fig. 1 is a front view of a mobile electronic information storage proposed by the present invention.

Fig. 2 is a front view of the internal structure of a mobile electronic information storage proposed by the present invention.

Fig. 3 is a structural top view of a mobile electronic information storage proposed by the present invention.

Fig. 4 is an enlarged schematic diagram of the structure of part A of a mobile electronic information storage proposed by the present invention.

Fig. 5 is a schematic diagram of the connection structure between the circuit board and the L-shaped board of a mobile electronic information storage proposed by the present invention.

FIG. 6 is a schematic structural diagram of a circuit board of a mobile electronic information storage proposed by the present invention.

FIG. 7 is a schematic structural diagram of a strengthening layer of a mobile electronic information storage proposed by the present invention.

FIG. 8 is a schematic structural diagram of a buffer layer of a mobile electronic information storage proposed by the present invention.

FIG. 9 is a schematic structural diagram of an antistatic layer of a mobile electronic information storage proposed by the present invention.

In the figure: box body 1, cover plate 2, SATA interface 3, USB interface 4, power interface 5, L-shaped board 6, circuit board 7, buffer layer 8, cooling net 9, shock absorbing pad 10, chute 11, sliding Block 12, first spring 13, positioning groove 14, positioning column 15, signal layer 16, protective layer 17, insulating layer 18, metal substrate 19, reinforcement layer 20, heat conduction layer 21, heat dissipation scales 22, heat dissipation bottom plate 23, graphene Sheet 24, supporting steel 25, tensile layer 26, high temperature resistant layer 27, first buffer plate 28, second spring 29, second buffer plate 30, antistatic layer 31, first antistatic plate 32, antistatic filling Material 33 , second antistatic plate 34 .

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

Referring to Figures 1-8, a mobile electronic information storage device includes a box body 1, and one side of the box body 1 is provided with a SATA interface 3, a USB interface 4, and a power interface 5, and the USB interface 4 is located between the SATA interface 3 and the power interface 5. In between, the upper end of the box body 1 is fixedly equipped with a cover plate 2, and both sides of the inner wall of the box body 1 are provided with L-shaped plates 6 through a sliding mechanism. The slider 12 on one side of the L-shaped plate 6, the slider 12 is slidably arranged in the chute 11, the lower end of the slider 12 is fixedly equipped with a first spring 13, and the lower end of the first spring 13 is fixedly connected on the inner wall of the chute 11, through With the design of the slider 12 , the chute 11 and the first spring 13 , the slider 12 can slide up and down along the axial direction in the chute 11 , and under the action of the first spring 13 , a certain buffering force can be generated.

The lower surface of the L-shaped plate 6 is fixedly provided with a buffer layer 8, and the buffer layer 8 is fixedly arranged at the inner bottom of the box body 1. The buffer layer 8 includes a first buffer plate 28 fixedly installed on the lower surface of the L-shaped plate 6 and a first buffer plate 28 fixedly installed in the box body. The second buffer plate 30 at the bottom of the body 1, a plurality of second springs 29 are evenly fixed between the second buffer plate 30 and the first buffer plate 28, and the upper end of the L-shaped plate 6 is fixedly equipped with a shock absorber 10, through The design of the first buffer plate 28, the second buffer plate 30 and the second spring 29 can generate a certain buffer force, and through the cooperation of the sliding mechanism, it can effectively play the role of shock absorption and protection for the circuit board 7 , can play the role of anti-fall.

The upper surfaces of the two L-shaped plates 6 are fixedly equipped with circuit boards 7, and a positioning mechanism is arranged between the lower surface of the circuit boards 7 and the upper surface of the two L-shaped plates 6. The positioning groove 14 and the positioning column 15 fixedly installed on one side of the upper surface of the L-shaped board 6, the positioning column 15 is clamped in the positioning groove 14, and the positioning column 15 is clamped in the positioning groove 14, thereby enabling the circuit board 7 is installed and positioned more precisely, which not only facilitates the installation process of the circuit board 7, but also helps to improve the stability and firmness of its installation structure.

Both sides of the inner bottom of the box body 1 are fixedly installed with heat dissipation nets 9 , and the middle part of the lower surface of the cover plate 2 is bonded with an antistatic layer 31 , and the lower surface of the antistatic layer 31 is in contact with the upper surface of the circuit board 7 , and the antistatic layer 31 It includes a first antistatic plate 32 and a second antistatic plate 34 bonded to the middle part of the lower surface of the cover plate 2, and an antistatic filling material 33 is filled between the first antistatic plate 32 and the second antistatic plate 34. The antistatic plate 34 is in contact with the circuit board 7 . Through the design of the first antistatic plate 32 , the second antistatic plate 34 and the antistatic filling material 33 , the memory can be provided with antistatic capability.

The circuit board 7 includes a metal substrate 19 fixedly mounted on the upper surfaces of the two L-shaped boards 6. The upper surface and the lower surface of the metal substrate 19 are bonded with an insulating layer 18, and the upper surface of the insulating layer 18 on the upper surface of the metal substrate 19 is bonded. There is a protective layer 17, and the protective layer 17 is mainly used to ensure that the places on the circuit board that do not need to be tinned are not tinned, so as to ensure the reliability of the circuit board operation.

The upper surface of the protective layer 17 is bonded with the signal layer 16, and the lower surface of the insulating layer 18 located on the lower surface of the metal substrate 19 is bonded with a strengthening layer 20. Two high-temperature-resistant layers 27, the inner surfaces of the high-temperature-resistant layers 27 are all bonded with stretch-resistant layers 26, and a plurality of support steels 25 are fixedly arranged at equal intervals between the two stretch-resistant layers 26, and the high-temperature resistant layers 27 are specifically Silicon carbide layer, so that the circuit board 7 can be equipped with high temperature resistance, the tensile layer 26 is specifically a carbon nanotube fiber layer, so that the tensile strength of the circuit board 7 can be improved, and the supporting steel 25 is designed as an I-shaped structure. Through this design, not only can the supporting strength be 1.5 times higher than that of the structure with the same height and the same width, but also can save more materials while improving the supporting strength, thereby reducing the production cost.

The lower surface of the reinforcement layer 20 is bonded with a thermally conductive layer 21, and the lower surface of the thermally conductive layer 21 is fixedly provided with a heat dissipation mechanism. The heat dissipation bottom plate 23, the lower surface of the heat dissipation bottom plate 23 is fixedly equipped with a plurality of heat dissipation scales 22 at equal intervals, under the action of multiple heat dissipation structures of the graphene sheet 24, the heat dissipation bottom plate 23 and the heat dissipation scales 22, and under the heat conduction of the heat conduction layer 21 Under the action, the heat generated during the operation of the circuit board 7 can be dissipated efficiently and quickly, so that the circuit board 7 has the performance of efficient heat dissipation, which can effectively reduce its loss, thereby prolonging its service life.

The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, any person familiar with the technical field within the technical scope disclosed in the present invention, according to the technical solution of the present invention Any equivalent replacement or change of the inventive concepts thereof shall fall within the protection scope of the present invention.

Claims (8)

1. A mobile electronic information storage, comprising a box body (1), characterized in that, one side of the box body (1) is provided with a SATA interface (3), a USB interface (4) and a power interface (5), And the USB interface (4) is located between the SATA interface (3) and the power interface (5), the upper end of the box body (1) is fixed with a cover plate (2), and the inner wall of the box body (1) on both sides Both are provided with an L-shaped plate (6) through a sliding mechanism, and the lower surface of the L-shaped plate (6) is fixedly provided with a buffer layer (8), and the buffer layer (8) is fixedly arranged on the inner bottom of the box body (1). A circuit board (7) is fixedly installed on the upper surface of the L-shaped board (6), and a positioning mechanism is arranged between the lower surface of the circuit board (7) and the upper surfaces of the two L-shaped boards (6). Both sides of the inner bottom of the body (1) are fixedly installed with cooling nets (9), and the middle part of the lower surface of the cover plate (2) is bonded with an antistatic layer (31), and the lower surface of the antistatic layer (31) is connected to the circuit The upper surfaces of the boards (7) are in contact with each other, the circuit board (7) includes a metal substrate (19) fixedly installed on the upper surfaces of the two L-shaped boards (6), the upper surface and the lower surface of the metal substrate (19) are The surface is bonded with an insulating layer (18), the upper surface of the insulating layer (18) located on the upper surface of the metal substrate (19) is bonded with a protective layer (17), and the upper surface of the protective layer (17) is bonded with a signal layer (16), the lower surface of the insulating layer (18) located on the lower surface of the metal substrate (19) is bonded with a reinforcement layer (20), and the lower surface of the reinforcement layer (20) is bonded with a heat conduction layer (21), and the heat conduction layer ( 21) The lower surface is fixed with a heat dissipation mechanism. 2. A mobile electronic information storage device according to claim 1, characterized in that the sliding mechanism includes a chute (11) set on one side of the inner wall of the box body (1) and fixedly installed on the L-shaped plate ( 6) The slider (12) on one side, the slider (12) is slidably set in the chute (11), the lower end of the slider (12) is fixedly installed with the first spring (13), and the second A spring (13) lower end is fixedly connected on the inner wall of the chute (11). 3. A mobile electronic information storage according to claim 1, characterized in that, the buffer layer (8) includes a first buffer plate (28) fixedly installed on the lower surface of the L-shaped plate (6) and a fixed The second buffer plate (30) installed on the inner bottom of the box body (1), and a plurality of second springs (29) are uniformly fixed and installed between the second buffer plate (30) and the first buffer plate (28) ). 4. A mobile electronic information storage device according to claim 1, characterized in that the positioning mechanism includes a positioning groove (14) opened on the lower surface side of the circuit board (7) and fixedly installed on the L-shaped board. (6) A positioning column (15) on one side of the upper surface, the positioning column (15) is clamped in the positioning groove (14). 5. A mobile electronic information storage device according to claim 1, characterized in that, the strengthening layer (20) comprises two layers respectively bonded to the lower surface of the insulating layer (18) and the upper surface of the heat conducting layer (21). a high-temperature-resistant layer (27), the inner surface of the high-temperature-resistant layer (27) is bonded with a stretch-resistant layer (26), and a plurality of Support steel (25). 6. A mobile electronic information storage according to claim 1, characterized in that the heat dissipation mechanism comprises a graphene sheet (24) bonded to the middle of the lower surface of the heat conduction layer (21), and the graphene sheet (24) A heat dissipation bottom plate (23) is bonded to the lower surface, and a plurality of heat dissipation scales (22) are fixedly installed on the lower surface of the heat dissipation bottom plate (23) at equal intervals. 7. A mobile electronic information storage device according to claim 1, characterized in that shock absorbing pads (10) are fixedly arranged on the upper ends of the L-shaped plates (6). 8. A mobile electronic information storage according to claim 1, characterized in that the antistatic layer (31) includes a first antistatic plate (32) bonded to the middle of the lower surface of the cover plate (2) And the second antistatic plate (34), the antistatic filling material (33) is filled between the first antistatic plate (32) and the second antistatic plate (34), and the second antistatic plate (34) is in contact with the circuit board (7).