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CN110168020A - 树脂组合物以及导通检查用部件 - Google Patents

树脂组合物以及导通检查用部件 Download PDF

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Publication number
CN110168020A
CN110168020A CN201880005477.5A CN201880005477A CN110168020A CN 110168020 A CN110168020 A CN 110168020A CN 201880005477 A CN201880005477 A CN 201880005477A CN 110168020 A CN110168020 A CN 110168020A
Authority
CN
China
Prior art keywords
particle
particles
conductive
substrate
durometer hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880005477.5A
Other languages
English (en)
Chinese (zh)
Inventor
真原茂雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN110168020A publication Critical patent/CN110168020A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
  • Measuring Leads Or Probes (AREA)
CN201880005477.5A 2017-05-31 2018-05-31 树脂组合物以及导通检查用部件 Pending CN110168020A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017107868 2017-05-31
JP2017-107868 2017-05-31
PCT/JP2018/020915 WO2018221640A1 (fr) 2017-05-31 2018-05-31 Composition de résine et élément pour test de conduction

Publications (1)

Publication Number Publication Date
CN110168020A true CN110168020A (zh) 2019-08-23

Family

ID=64455863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880005477.5A Pending CN110168020A (zh) 2017-05-31 2018-05-31 树脂组合物以及导通检查用部件

Country Status (5)

Country Link
JP (1) JPWO2018221640A1 (fr)
KR (1) KR20200013628A (fr)
CN (1) CN110168020A (fr)
TW (1) TW201903786A (fr)
WO (1) WO2018221640A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7447605B2 (ja) * 2020-03-25 2024-03-12 日油株式会社 熱硬化性樹脂組成物及びその硬化膜を備えるカラーフィルター

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133422A (ja) * 1988-11-14 1990-05-22 Mitsubishi Heavy Ind Ltd エポキシ樹脂用硬化剤
JPH0384078A (ja) * 1989-08-29 1991-04-09 Toray Ind Inc 導電性接着剤
JP4893104B2 (ja) * 2005-06-08 2012-03-07 日立化成工業株式会社 導電ペーストおよびそれを用いた電子部品搭載基板
CN102859797B (zh) * 2010-04-22 2015-05-20 积水化学工业株式会社 各向异性导电材料及连接结构体
JP2013161553A (ja) 2012-02-02 2013-08-19 Hioki Ee Corp 導電性シートおよび基板検査装置
JP6470518B2 (ja) * 2013-07-16 2019-02-13 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6203783B2 (ja) * 2015-05-29 2017-09-27 株式会社タムラ製作所 導電性接着剤および電子基板の製造方法

Also Published As

Publication number Publication date
JPWO2018221640A1 (ja) 2020-04-02
TW201903786A (zh) 2019-01-16
KR20200013628A (ko) 2020-02-07
WO2018221640A1 (fr) 2018-12-06

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Legal Events

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PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190823