CN110060793B - A kind of preparation method of X-ray zone plate - Google Patents

Abstract

The invention discloses a preparation method of an X-ray zone plate, which comprises the following steps: fixing a filament plated with an X-ray zone plate multilayer film structure on a copper sheet, wherein the side surface of the filament is in contact with the copper sheet; fixing the copper sheet on a substrate; cutting the integrated structure of the filaments and the copper sheet into thin sheets; cutting the part of the sheet, which is in contact with the substrate, so that the sheet is completely separated from the substrate; moving and fixing the sheet to a metal carrier web; polishing the thin sheet on the metal carrier net to a required thickness. The invention can ensure that the zone plate is firmly fixed on the metal carrier net and can effectively prevent the zone plate from falling off from the metal carrier net.

Description

A kind of preparation method of X-ray zone plate

technical field

The invention relates to the field of zone plate preparation, in particular to a preparation method of an X-ray zone plate.

Background technique

The X-ray wavelength is between 0.01-10 nm, and the microscopy technology using the X-ray band can be used for non-destructive testing and three-dimensional microscopic imaging of substances, and has the potential to perform nano-resolution imaging of thick samples.

The zone plate is the core component of X-ray microscopy imaging technology. At present, there is a technology for preparing X-ray zone plates by the multilayer film method, that is, two materials are alternately deposited on the rotating filament by sputtering, and then the It is cut into thin slices, which are polished and thinned to the desired thickness. The X-ray zone plate prepared by this process is a circular slice with a diameter of several microns to several hundreds of microns and a thickness of generally sub-10 microns. The zone plate is fixed with the carrier net and the like. However, due to the circular structure of the zone plate, the zone plate is only in contact with the tangent part of the carrier network, the contact surface is very small, the adhesion after fixing is weak, and it is difficult to resist slightly stronger impact force. can easily be damaged or lost.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a preparation method of an X-ray zone plate, which can enhance the adhesion between the zone plate and the metal carrier net, so that the wave zone plate can be placed on the metal carrier net very stably, and the wave The ability of the strap to resist impact forces.

For achieving the above object, the present invention provides the following scheme:

A preparation method of an X-ray zone plate, comprising:

Fixing the filament coated with the multi-layer film structure of the X-ray zone plate on the copper skin, and the side surface of the filament is in contact with the copper skin;

fixing the copper skin carrying the filaments on the substrate;

cutting the integrated structure of the filament and the copper skin into thin slices;

cutting the part of the sheet in contact with the substrate, so that the sheet is completely separated from the substrate;

moving and securing the sheet to the metal carrier grid;

The flakes on the metal carrier are polished to the desired thickness.

Optionally, the filaments are fixed on the copper skin by liquid carbon glue.

Optionally, the thickness of the copper skin is less than 10 microns.

Optionally, the copper skin is fixed on the substrate by conductive glue.

Optionally, a focused ion beam is used to cut the integrated structure of the filament and the copper skin into thin slices.

Optionally, a focused ion beam is used to cut the portion of the sheet in contact with the substrate, so that the sheet is completely separated from the substrate.

Optionally, a robotic arm is fixed on the outer surface of the sheet and a focused ion beam is used to cut the portion of the sheet in contact with the substrate, so that the sheet is completely separated from the substrate.

Optionally, a robotic arm is used to move the sheet onto the metal carrier, the sheet is fixed on the metal carrier by a focused ion beam deposition technique, and then the robotic arm is removed.

Optionally, a focused ion beam is used to polish the flakes on the metal carrier to a desired thickness.

According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

In the invention, the zonal sheet and the copper skin are bonded by liquid carbon glue, and the bonding area and the bonding force are much larger than the direct connection between the zonal sheet and the metal carrier net, and the contact between the copper sheet and the metal carrier net is plane contact, The contact area is large, so that the zone plate can be placed on the metal carrier network firmly and can resist strong impact. Moving and installing by means of macro can effectively improve installation efficiency and installation accuracy.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the present invention. In the embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative labor.

Fig. 1 is a working flow diagram of a method for preparing an X-ray zone plate according to an embodiment of the present invention;

2 is a schematic structural diagram of a zone plate obtained by a method for preparing an X-ray zone plate according to an embodiment of the present invention;

1- Metal carrier net, 2- Zone plate, 3- Liquid carbon glue, 4- Copper skin.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The purpose of the present invention is to provide a preparation method of an X-ray zone plate, which can enhance the adhesion between the zone plate and the metal carrier net, so that the wave zone plate can be placed on the metal carrier net very stably, and the wave The ability of the strap to resist impact forces.

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a working flowchart of an embodiment of the present invention. As shown in Fig. 1, a preparation method of an X-ray zone plate includes:

101 Fix the filament coated with the multi-layer film structure of the X-ray zone plate on the copper skin, and the side surface of the filament is in contact with the copper skin;

102 fixing the copper skin carrying the filament on the substrate;

103 cutting the integrated structure of the filament and the copper skin into thin slices;

104 cutting the part of the sheet in contact with the substrate, so that the sheet is completely separated from the substrate;

105 moving and securing the sheet to the metal carrier grid;

106 The flakes on the metal carrier are polished to the desired thickness.

Wherein, the filament is fixed on the copper skin by liquid carbon glue, and the diameter of the filament is several microns to several hundreds of microns; both ends of the copper skin are fixed on the substrate by conductive glue, and the copper skin is The thickness is generally less than 10 microns; the substrate material can be any smooth-surfaced conductor or semiconductor sheet material.

Specifically, the method uses a focused ion beam (FIB) to cut the integrated structure of the filament and the copper skin into a thin sheet with a thickness slightly larger than the required thickness; then the robotic arm is fixed on the outer surface of the thin sheet and the focused ion beam is used to cut The part of the sheet in contact with the substrate enables the sheet to be completely separated from the substrate; then use a robotic arm to move the sheet to the metal carrier net, and use the focused ion beam deposition technology to fix the sheet on the metal carrier Then, the robotic arm is removed; finally, a focused ion beam is used to polish the sheet on the metal carrier net to a desired thickness, wherein the desired thickness is generally sub-10 microns.

FIG. 2 is a schematic structural diagram of a zone plate obtained by a method for preparing an X-ray zone plate according to an embodiment of the present invention, as shown in FIG. 2 , wherein the zone plate 2 is fixed on a copper skin 4 by a liquid carbon glue 3 Above, the copper skin 4 is fixed on the metal carrier mesh 1 by the focused ion beam deposition technology.

The present invention also discloses the following technical effects:

1. The present invention bonds between the wave zone sheet and the copper skin through the liquid carbon glue, and the bonding area and the adhesive force are far greater than the direct connection between the wave zone sheet and the carrier screen; and the contact between the copper sheet and the carrier screen is a plane contact, The large contact area enables the zone plate to be placed on the carrier network very stably, can resist strong impact force, and can effectively prevent the zone plate from falling off the metal carrier network.

2. The size of the wave zone plate with copper skin in the present invention is already in the order of several millimeters, and it can be moved and installed by means of macroscopic methods, which can effectively improve the installation efficiency and installation accuracy.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other.

In this paper, specific examples are used to illustrate the principles and implementations of the present invention. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the present invention; meanwhile, for those skilled in the art, according to the present invention There will be changes in the specific implementation and application scope. In conclusion, the contents of this specification should not be construed as limiting the present invention.

Claims (5)

1. A method of making an X-ray zone plate, comprising:

fixing a filament plated with an X-ray zone plate multilayer film structure on a copper sheet through liquid carbon gel, wherein the side surface of the filament is in contact with the copper sheet;

fixing two ends of the copper sheet carrying the filaments on a substrate through conductive adhesive;

cutting the integrated structure of the filaments and the copper sheets into thin sheets by adopting a focused ion beam;

cutting the part of the thin sheet, which is contacted with the substrate, by using a focused ion beam to ensure that the thin sheet is completely separated from the substrate;

moving the thin sheet and fixing the thin sheet on a metal carrying net by adopting a focused ion beam deposition technology;

polishing the thin sheet on the metal carrier net to a required thickness.

2. A method of manufacturing an X-ray zone plate according to claim 1, wherein the copper sheet is less than 10 microns thick.

3. A method of manufacturing an X-ray zone plate according to claim 1, wherein a robotic arm is fixed to the outer surface of the lamella.

4. A method of manufacturing an X-ray zone plate according to claim 1, wherein the wafer is moved onto a metal carrier using a robot arm, the wafer is fixed onto the metal carrier using a focused ion beam deposition technique, and the robot arm is removed.

5. A method of manufacturing an X-ray zone plate according to claim 1, wherein the sheet on the metal carrier mesh is polished to a desired thickness using a focused ion beam.

Images