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CN119908162A - Lamp and window configuration for a substrate processing chamber - Google Patents

Lamp and window configuration for a substrate processing chamber Download PDF

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Publication number
CN119908162A
CN119908162A CN202380070757.5A CN202380070757A CN119908162A CN 119908162 A CN119908162 A CN 119908162A CN 202380070757 A CN202380070757 A CN 202380070757A CN 119908162 A CN119908162 A CN 119908162A
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CN
China
Prior art keywords
window
lamp
grooves
disposed
arcuate
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Pending
Application number
CN202380070757.5A
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Chinese (zh)
Inventor
文卡特斯瓦兰·苏巴拉曼
拉贾·穆拉利·达莫哈兰
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN119908162A publication Critical patent/CN119908162A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/0033Heating devices using lamps
    • H05B3/0038Heating devices using lamps for industrial applications
    • H05B3/0047Heating devices using lamps for industrial applications for semiconductor manufacture
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • C30B25/105Heating of the reaction chamber or the substrate by irradiation or electric discharge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/40Heating elements having the shape of rods or tubes
    • H05B3/42Heating elements having the shape of rods or tubes non-flexible
    • H10P72/0436
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032Heaters specially adapted for heating by radiation heating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

本案涉及用于处理腔室的热源(例如,灯)及窗,以及相关方法。在一或多个实施例中,适用于半导体制造的灯包括沿着弓形轮廓的至少一分段延伸的灯泡管。灯泡管界定弓形中央开口。灯包括位于弓形中央开口中的灯丝。灯丝沿着弓形轮廓的至少所述分段延伸。灯包括形成在灯泡管的外表面的第一部分上的反射涂层。

The present invention relates to heat sources (e.g., lamps) and windows for processing chambers, and related methods. In one or more embodiments, a lamp suitable for semiconductor manufacturing includes a bulb tube extending along at least a segment of an arcuate profile. The bulb tube defines an arcuate central opening. The lamp includes a filament located in the arcuate central opening. The filament extends along at least the segment of the arcuate profile. The lamp includes a reflective coating formed on a first portion of an outer surface of the bulb tube.

Description

Lamp and window arrangement for a substrate processing chamber
Technical Field
The present disclosure relates to heat sources (e.g., lamps) and windows for processing chambers, such as chambers suitable for semiconductor processing, and related methods.
Background
Semiconductor substrates are processed for a variety of applications, including the fabrication of integrated devices and micro-devices.
However, heat treatment may be limited in terms of thermal efficiency, temperature uniformity, product lifetime, yield and throughput, chamber cost, and operating cost. For example, the heating device may have a relatively short service life. As another example, the temperature on the substrate may be non-uniform during heating, such as the outer edge of the substrate being cooler than the center of the substrate. As another example, a relatively small percentage (e.g., 10%) of the heat generated in the chamber may actually be absorbed by the substrate.
Accordingly, there is a need for improved chambers and related apparatus and methods that facilitate increased yields and throughput, increased thermal efficiency, more uniformity during processing, and reduced cost.
Disclosure of Invention
The present disclosure relates to heat sources (e.g., lamps) and windows for process chambers, and related methods.
In one or more embodiments, a lamp suitable for semiconductor manufacturing includes a bulb tube extending along at least a segment of an arcuate profile. The bulb tube defines an arcuate central opening. The lamp includes a filament positioned in an arcuate central opening. The filament extends along at least the segment of the arcuate profile. The lamp includes a reflective coating formed on a first portion of an outer surface of the bulb tube.
In one or more embodiments, a window suitable for semiconductor fabrication includes an outer portion and an inner portion disposed inside the outer portion. The inner portion includes a first outer surface, a second outer surface opposite the first outer surface, and one or more grooves formed in the first outer surface.
In one or more embodiments, a process chamber suitable for semiconductor fabrication includes an interior space, and a substrate support disposed in the interior space. The substrate support includes a support surface. The processing chamber includes a window that at least partially defines a processing volume of the interior space. The window includes an outer portion and an inner portion disposed inside the outer portion and having a radial center and a radial outer edge interfacing with the outer portion. The inner portion includes a first outer surface facing away from the support surface, and a second outer surface opposite the first outer surface. The second outer surface faces the support surface. The inner portion includes one or more grooves formed in the first outer surface. The processing chamber includes a plurality of lamps received in one or more grooves of the window. The plurality of lamps is supported by the inner portion such that a distance between the lamps and the support surface has a gradient that transitions toward the support surface in a direction from the radial center to the radial outer edge.
Drawings
So that the manner in which the above recited features of the present application can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the invention, for the invention may admit to other equally effective embodiments.
Fig. 1 is a schematic side cross-sectional view of a processing chamber in accordance with one or more embodiments.
Fig. 2 is a schematic side cross-sectional view of a plurality of lamps and windows shown in fig. 1, in accordance with one or more embodiments.
Fig. 3 is a schematic top view of a plurality of lamps and windows shown in fig. 2, in accordance with one or more embodiments.
Fig. 4 is an enlarged view of a plurality of lamps and windows shown in fig. 2 in accordance with one or more embodiments.
Fig. 5 is a schematic perspective view of the window and plurality of lamps shown in fig. 1-4 in accordance with one or more embodiments.
Fig. 6 is a schematic top view of a plurality of lamps and windows shown in fig. 5, in accordance with one or more embodiments.
Fig. 7 is a schematic perspective view of a window and a plurality of lamps in accordance with one or more embodiments.
Fig. 8 is a schematic top view of a plurality of lamps and windows shown in fig. 7, in accordance with one or more embodiments.
Fig. 9 is a schematic side cross-sectional view of a plurality of lamps and windows shown in fig. 1-4 in accordance with one or more embodiments.
Fig. 10 is a schematic top view of a plurality of lamps and windows shown in fig. 9, in accordance with one or more embodiments.
Fig. 11 is a schematic perspective view of a plurality of lamps and windows shown in fig. 9, in accordance with one or more embodiments.
Fig. 12 is a schematic cross-sectional view of a plurality of lamps and windows shown in fig. 11, in accordance with one or more embodiments.
Fig. 13 is a schematic side cross-sectional view of a plurality of lamps and windows shown in fig. 9-12 in accordance with one or more embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Detailed Description
The present disclosure relates to heat sources (e.g., lamps) and windows for process chambers, and related methods.
It is contemplated that terms such as "coupled," "coupled," and "coupled" may include, but are not limited to, welding, fusing, melting together, interference fitting, and/or fastening such as through the use of bolts, threaded connections, pins, and/or screws. It is contemplated that terms such as "coupled," "coupled," and "coupled" may include, but are not limited to, integrally formed. It is contemplated that terms such as "coupled," "coupled," and "coupled" may include, but are not limited to, direct coupling and/or indirect coupling, such as via a component such as a connecting rod.
Fig. 1 is a schematic side cross-sectional view of a process chamber 100 in accordance with one or more embodiments. The process chamber 100 is a deposition chamber. In one embodiment, which may be combined with other embodiments, the process chamber 100 is an epitaxial deposition chamber. The process chamber 100 is used to grow epitaxial films on a substrate 102. The process chamber 100 creates a cross flow of precursors across the top surface 150 of the substrate 102.
The process chamber 100 includes an upper body 156, a lower body 148 disposed below the upper body 156, and a flow module 112 disposed between the upper body 156 and the lower body 148. In one or more embodiments, the upper body 156 includes an upper clamp ring and the lower body 148 includes a lower clamp ring. The upper body 156, flow module 112, and lower body 148 form a chamber body. Within the chamber body are disposed a substrate support 106, an upper window 250 (e.g., an upper dome), a lower window 110 (e.g., a lower dome), a plurality of upper lamps 210, and a plurality of lower lamps 143. As shown, the controller 120 is in communication with the process chamber 100 and is used to control the operation of the processes and methods, such as the methods described herein. The substrate support 106 has a support surface 109 that supports the substrate 102.
The substrate support 106 is disposed between the upper window 250 and the lower window 110. The substrate support 106 includes a support surface 123 that supports the substrate 102. A plurality of upper lamps 210 are disposed between the upper window and the cover 154. The plurality of upper lamps 210 form part of the upper lamp module 155. The cover 154 may include a plurality of sensors (not shown) disposed therein for measuring the temperature within the process chamber 100. In one or more embodiments, a reflective coating is formed on one or more inner surfaces 187, 188 of the cover 154. The reflective coating may be similar to or the same as one or more of the reflective coating 219 and/or the reflective coating of the reflective plate 280 described below. A plurality of lower lamps 143 are disposed between the lower window 110 and the bottom plate 152. The plurality of lower lamps 143 form part of the lower lamp module 145. The upper lamp 250 is an upper dome and is formed of an energy transmissive material (e.g., quartz). The lower lamp 110 is a lower dome and is formed of an energy transmissive material (e.g., quartz).
The process space 136 and the purge space 138 are formed between the upper window 250 and the lower window 110. The process space 136 and the purge space 138 are a portion of an interior space defined at least in part by the upper window 250, the lower window 110, and the one or more liners 163.
The interior space has a substrate support 106 disposed therein. The substrate support 106 includes a top surface on which the substrate 102 is disposed. The processing chamber includes a first support frame 198 and a second support frame 199 disposed at least partially around the first support frame 198. The second support frame 199 includes arms coupled to the substrate support 106 such that the second support frame 199 can lift and lower the substrate support 106. A plurality of lift pins 132 are suspended from the substrate support 106. Lowering of the substrate support 106 initiates contact of the lift pins 132 with the arms of the first support frame 198. Continued lowering of the substrate support 106 initiates contact of the lift pins 132 with the substrate 102 such that the lift pins 132 raise the substrate 102. The bottom region 205 of the chamber sides 201a, 201b is defined between the chamber body bottom 234 and the first and second susceptors 254a, 254 b. The rod 118 (e.g., shaft) of each support frame 198, 199 extends through the bottom of the lower body 148.
The substrate support 106 is attached to the rods 118 of the second support frame 199 by arms. The rod 118 of each support frame 198, 199 is connected to a motion assembly 121. The motion assembly 121 includes one or more actuators and/or adjustment devices that provide movement and/or adjustment of the support frames 198, 199 within the processing space 136. The substrate support 106 may include lift pin holes 107 disposed therein. The lift pin holes 107 are each sized to receive a respective one 132 of the lift pins 132 for lifting the substrate 102 from the substrate support 106 before or after performing a deposition process. The lift pins 132 may rest on the lift pin stops 134 when the substrate support 106 is lowered from the process position to the transfer position. In the implementation shown in fig. 1, the lift pins 134 are part of the arms of the first support frame 198.
The flow module 112 includes a plurality of gas inlets 114, a plurality of purge gas inlets 164, and one or more exhaust outlets 116. A plurality of gas inlets 114 and a plurality of purge gas inlets 164 are disposed on a side of the flow module 112 opposite the one or more exhaust outlets 116. One or more deflectors 117a, 117b are disposed below the plurality of gas inlets 114 and the one or more exhaust outlets 116. One or more flow directors 117a, 117b are disposed above the purge gas inlet 164. One or more liners 163 are disposed on an inner surface of the flow module 112 and protect the flow module 112 from reactive gases used during deposition operations and/or cleaning operations. The gas inlet 114 and the purge gas inlet 164 are each positioned to flow the gas parallel to the top surface 150 of the substrate 102 disposed within the process space 136. The gas inlets 114 are fluidly connected to one or more process gas sources 151 and one or more purge gas sources 153. The purge gas inlet 164 is fluidly connected to one or more purge gas sources 162. One or more exhaust outlets 116 are fluidly connected to an exhaust pump 157. The one or more process gases supplied using the one or more process gas sources 151 may include one or more reactive gases such as one or more of silicon (Si), phosphorus (P), and/or germanium (Ge) and/or one or more carrier gases such as one or more of nitrogen (N 2) and/or hydrogen (H 2). The one or more purge gases supplied using the one or more purge gas sources 162 may include one or more inert gases such as one or more of argon (Ar), helium (He), and/or nitrogen (N 2). The one or more purge gases supplied using the one or more purge gas sources 153 may include one or more of hydrogen (H) and/or chlorine (Cl). In one embodiment, which may be combined with other embodiments, the one or more process gases include silicon phosphide (SiP) and/or hydrogen phosphide (PH 3), and the one or more purge gases include hydrochloric acid (HCl).
The one or more exhaust outlets 116 are further connected to an exhaust system 178 or include the exhaust system 178. An exhaust system 178 fluidly connects one or more exhaust outlets 116 to the exhaust pump 157. The exhaust system 178 may aid in controlling deposition of layers on the substrate 102. The exhaust system 178 is disposed on an opposite side of the process chamber 100 relative to the flow module 112.
The controller 120 includes a central processing unit (Central Processing Unit; CPU), a memory containing instructions, and supporting circuitry for the CPU. The controller 120 controls various devices directly or through other computers and/or controllers. In one or more embodiments, the controller 120 is communicatively coupled to a dedicated controller, and the controller 120 acts as a central controller.
The controller 120 is any form of general-purpose computer processor for controlling various substrate processing chambers and equipment, and sub-processors thereon or therein, in an industrial environment. The memory or non-transitory computer readable medium is one or more of readily available memory such as random access memory (random access memory; RAM), dynamic random access memory (dynamic random access memory; DRAM), static random access memory (STATIC RAM; SRAM) and synchronous dynamic RAM (synchronous DYNAMIC RAM) (e.g., DDR1, DDR2, DDR3L, LPDDR3, DDR4, LPDDR4, etc.), read Only Memory (ROM), floppy disk, hard disk, flash drive, or any other form of digital storage, local or remote. The support circuits of the controller 120 are coupled to the CPU to support the CPU (processor). The support circuits include cache, power supplies, clock circuits, input/output circuits, subsystems, and the like. The operating parameters (e.g., heating power applied to the various heat sources (e.g., lamps), pressure of the process gases, process gas flow rates, and/or rotational position of the substrate support 106) and operations are stored in memory as software routines that are executed or invoked to transform the controller 120 into a dedicated controller to control the operation of the various chambers/modules described herein. The controller 120 is configured to perform any of the operations described herein. Instructions stored on the memory, when executed, cause one or more of the operations described herein to be performed.
The various operations described herein may be performed automatically using the controller 120, or may be performed automatically or manually using some of the operations performed by the user.
Fig. 2 is a schematic side cross-sectional view of a plurality of lamps 210 and windows 250 shown in fig. 1, in accordance with one or more embodiments.
Fig. 3 is a schematic top view of a plurality of lamps 210 and windows 250 shown in fig. 2, in accordance with one or more embodiments.
Fig. 4 is an enlarged view of a plurality of lamps 210 and windows 250 shown in fig. 2, in accordance with one or more embodiments.
Each lamp 210 includes a bulb tube 211 extending along at least a segment of an arcuate profile 215. In one or more embodiments, the arcuate profile 215 is a circular profile. In one or more embodiments, the bulb 211 is cylindrical. In one or more embodiments, the bulb tube 211 is arcuate (e.g., circular) in cross-section. It is contemplated that other shapes (e.g., rectangular) may be used for the cross-section of the bulb tube 211.
Each bulb tube 211 defines an arcuate central opening 212. Each lamp 210 includes a filament 213 located in an arcuate central opening 212, and the filament 213 extends along the segment of the arcuate profile. Each lamp 210 includes a reflective coating 219 formed on a first portion 216 of the outer surface of the bulb tube 211. A reflective coating 219 is formed on the first portion 216 such that the second portion 217 of the outer surface is uncoated. The reflective coating 219 has a reflectivity of 0.8 or more. In one or more embodiments, the reflective coating 219 includes one or more of gold (Au), silver (Ag), aluminum oxide (Al 2O3), and/or one or more other ceramics. Other materials are also contemplated for the reflective coating 219. For each lamp 210, a reflective coating 219 is formed on the first portion 216 at a coating angle A1 around the bulb tube 211. The coating angle A1 is at least 180 degrees. For at least one of the lamps 210, the coating angle A1 is at least 210 degrees, such as 240 degrees or higher. For the radially innermost lamp 210A, the coating angle A1 is about 180 degrees. For the radially outermost lamp 210B, the coating angle A1 is about 300 degrees. The further radially outward the lamp 210 is positioned, the greater the coating angle A1.
The reflective coating 219 facilitates directing light from the lamps 210 toward the substrate 102 being processed, thereby reducing light loss from other chamber components, thus contributing to heating efficiency and reducing power consumption.
In the implementation shown in fig. 3, seven radial positions (relative to the center of window 250) are illustrated, each having a respective arcuate profile 215. For each radial position, a plurality of bulb tubes 211 (two bulb tubes are shown for each radial position in fig. 3) are disposed along a respective arcuate profile such that an angular gap 221 is defined between the ends of adjacent bulb tubes 211. Two angular gaps 221 are shown at each radial position in fig. 3. The angular gap 221 at each radial position has a gap angle GA1 of less than 15 degrees. In one or more embodiments, the gap angle GA1 is 10 degrees or less. In one or more embodiments, the gap angles GA1 of the angular gaps 221 may be different from one another on the lamp 210. Other values of the gap angle GA1 are contemplated.
Window 250 includes an outer portion 251 and an inner portion 252 disposed inside outer portion 251. The inner portion 252 includes a first outer surface 253, a second outer surface 254 opposite the first outer surface 253, and one or more grooves 255 formed in the first outer surface 253. A plurality of grooves 255 (seven) are illustrated in the implementations of fig. 2-4, and grooves 255 are formed at each of the seven radial positions. In the implementation shown in fig. 2-4, the plurality of grooves 255 are disposed in a concentric arrangement relative to one another. The lamp 210 is received in the recess 255. Each lamp 210 of the plurality of lamps 210 is disposed in an arcuate portion 257 of a corresponding recess 255 of the plurality of recesses 255. In the implementation shown in fig. 2-4, a plurality of lamps 210 are disposed in each groove 255 (two lamps 210 are illustrated in each groove 255 in fig. 1-4). It is contemplated that a different number (e.g., eight or more, or six or less) of radial positions may be used, one or more grooves 255 may be disposed at each radial position, and one or more lamps 210 may be disposed in each groove 255.
The inner portion 252 has a radial center 261 and a radial outer edge 262 that interfaces with the outer portion 251. As shown in fig. 2 and 4, the first outer surface 253 has a gradient that transitions toward the second outer surface 254 in a direction D1 from the radial center 261 to the radial outer edge 262. In one or more embodiments, the inner portion 252 is transparent and the outer portion 251 is opaque. The inner portion 252 is configured to pass 95% or more of the infrared light, while the outer portion 251 is configured to absorb the infrared light.
The bulb tube 211 of the lamp is transparent and configured to pass 95% or more of infrared light. Each of the bulb tube 211, the inner portion 252, and/or the outer portion 251 may be formed from one or more of quartz (e.g., transparent quartz or opaque quartz), silicon carbide (SiC), and/or graphite coated with SiC and/or opaque quartz. In one or more embodiments, inner portion 252 is formed of a transparent material (e.g., transparent quartz) and outer portion 251 is formed of an opaque material (e.g., opaque quartz, siC, and/or graphite coated with SiC and/or opaque quartz).
As described above, the window 250 and the lamp 210 may be disposed in a process chamber, such as the process chamber 100 shown in fig. 1. When disposed in the processing chamber 100, the window 250 at least partially defines the processing volume 136. The first outer surface 253 faces away from the support surface 109, while the second outer surface 254 faces toward the support surface 109. The lamp 210 is seated in the recess 255 and supported by the inner portion 252 such that the distance DS1 between the lamp 210 and the support surface 109 has a gradient that transitions toward the support surface 109 in a direction D1 from the radial center 261 to the radial outer edge 262 of the inner portion 252. In one or more embodiments, the distance DS1 is less than 5.0 inches for each lamp 210. Distance DS1 facilitates more uniform heating, less power consumption, and less heating loss due to absorption of light by the chamber components. In one or more embodiments, the distance DS1 is in the range of 2.0 inches to 3.0 inches for the radially innermost lamp 210A and the distance DS1 is approximately 2.0 inches for the radially outermost lamp 210B. The farther each lamp 210 is from the radial center 261, the smaller the distance DS1 to promote center-to-edge substrate temperature uniformity and deposition uniformity.
In one or more embodiments, the inner portion 252 has a uniform thickness between the radial center 261 and the radial outer edge 262, except for the portion aligned with the groove 255. The uniform thickness facilitates reducing or eliminating the effects of thermal stress during processing.
The reflection plate 280 may be positioned above the window 250. In one or more embodiments, the reflective plate 280 is part of the cover 154 or is positioned between the cover 154 and the window 250. In one or more embodiments, the reflective plate 280 is formed of aluminum (Al) and/or coated with a reflective coating having a reflectivity of 0.8 or more. In one or more embodiments, the reflective coating includes one or more of gold (Au), silver (Ag), aluminum oxide (Al 2O3), and/or one or more other ceramics. Other materials for the reflective coating of the reflective plate 280 are contemplated. It is contemplated that the reflective plate 280 may be omitted.
In one or more embodiments, a first power is applied to an innermost group of the one or more lamps 210 at an innermost radial position (e.g., closest to the radial center 261) and a second power is applied to an outermost group of the one or more lamps 210 at an outermost radial position (e.g., closest to the radial outer edge 262). The second power is higher than the first power. In one or more embodiments, the second power is a ratio of the first power, and the ratio is at least 1.5, such as about 2.0. In one or more embodiments, the first power is less than 1.3 kW, such as about 1.0 kW. In one or more embodiments, the second power is in the range of 1.8 kW to 2.2 kW, such as about 2.0 kW.
Fig. 5 is a schematic perspective view of the window 250 and the plurality of lamps 510 shown in fig. 1-4, in accordance with one or more embodiments.
Fig. 6 is a schematic top view of a plurality of lamps 510 and windows 250 shown in fig. 5, in accordance with one or more embodiments.
The lamp 510 is similar to the lamp 210 shown in fig. 1-4 and includes one or more of the aspects, features, components, operations, and/or operations of the lamp 210.
Each lamp 510 includes a first extension tube 523 disposed near the first end 526 of the bulb tube 511 and extending to intersect the bulb tube 511. Each lamp 510 includes a second extension tube 524 disposed adjacent the second end 527 of the bulb 511 and extending to intersect the bulb 511. Each lamp 510 includes a first electrical connector 528 coupled to the first extension tube 523 and a second electrical connector 529 coupled to the second extension tube 524. The first electrical connector 528 is configured to couple to a power cord 531 and the second electrical connector 529 is configured to couple to a ground cord 532. In one or more embodiments, bulb 511 is cylindrical. In one or more embodiments, the bulb 511 is arcuate (e.g., circular) in cross-section. It is contemplated that other shapes (e.g., rectangular) may be used for the cross-section of bulb 511.
In the implementation shown in fig. 6, the bulb 511 extends along at least a portion of a segment of the arcuate profile 215 at each radial location to define an angular gap 521 between the first 526 and second 527 ends of the bulb 511. The angular gap 521 at each radial position has a gap angle GA2 of less than 45 degrees.
In the implementation shown in fig. 5 and 6, a single light 510 is disposed in each groove 255 of the window 250.
Fig. 7 is a schematic perspective view of a window 750 and a plurality of lamps 710 in accordance with one or more embodiments.
Fig. 8 is a schematic top view of a plurality of lamps 710 and windows 750 shown in fig. 7, in accordance with one or more embodiments.
The lamp 710 is similar to the lamps 210, 510 shown in fig. 1-6 and includes one or more of the aspects, features, components, operations, and/or operations of the lamps 210, 510. Window 750 is similar to window 250 shown in fig. 1-6 and includes one or more aspects, features, components, operations, and/or multiple operations of window 250.
Window 750 includes a plurality of grooves 755. The grooves 755 and the lamps 710 disposed therein are disposed in a spaced arrangement relative to each other. The spacing is non-concentric such that neither the inner nor outer diameter of each bulb tube 711 is within or overlaps the inner or outer diameter of any adjacent bulb tube 711. The spaced apart arrangement is non-concentric such that neither the inner nor outer diameter of each groove 755 is within or overlaps any adjacent groove 755 inner or outer diameter. In one or more embodiments, the bulb 711 is cylindrical. In one or more embodiments, the bulb 711 is arcuate (e.g., circular) in cross-section. It is contemplated that other shapes (e.g., rectangular) may be used for the cross-section of the bulb 711.
In the implementation shown in fig. 7 and 8, three radial positions are illustrated. In addition to the central light 710a and the central groove 755a, each groove 755 and the geometric center 726 of the light 710 are aligned with the arcuate profile 215 of one of the radial positions.
Fig. 9 is a schematic side cross-sectional view of a plurality of lamps 210 and windows 950 shown in fig. 1-4, in accordance with one or more embodiments. Window 950 is similar to window 250 shown in fig. 1-6 and includes one or more aspects, features, components, operations, and/or operations of window 250.
Fig. 10 is a schematic top view of the plurality of lamps 210 and windows 950 shown in fig. 9, in accordance with one or more embodiments.
Fig. 11 is a schematic perspective view of a plurality of lamps 210 and windows 950 shown in fig. 9, in accordance with one or more embodiments.
Fig. 12 is a schematic cross-sectional view of a plurality of lamps 210 and windows 950 shown in fig. 11, in accordance with one or more embodiments.
The window 950 includes a plurality of grooves 955, and each groove 955 includes an arcuate portion 257 and a rectangular portion 958 between the arcuate portion 257 and the first outer surface 253 such that the arcuate portion 257 is recessed from the first outer surface 253a at a distance from the first outer surface 253 a. The window 950 includes a second outer surface 954 with a plurality of protrusions 959 (e.g., ridges) formed on the second outer surface 954. The corners 956 transition the first outer surface 253 to each rectangular portion 958. It is contemplated that the corners 956 may be tapered (e.g., chamfered) or rounded. Each groove 955 is formed at a groove depth DE 1. The bulb tube 211 of each lamp 210 has an outer diameter OD1, and the groove depth DE1 is equal to or greater than the outer diameter OD1. In one or more examples, the outer diameter OD1 is about 13mm and the groove depth DE1 is equal to or greater than 13 mm.
Fig. 13 is a schematic side cross-sectional view of a plurality of lamps 210 and windows 1350 shown in fig. 9-12, in accordance with one or more embodiments. Window 1350 is similar to window 250 shown in fig. 1-6 and includes one or more aspects, features, components, operations, and/or operations of window 250.
The inner portion 1352 of the window 1350 is suspended relative to the upper surface 271 of the outer portion 251 such that the inner portion 1352 is aligned between the upper surface 271 and the lower surface 272 of the outer portion 251. In one or more embodiments, the lowermost end of inner portion 1352 is suspended a distance D1 of about 0.5 inches below upper surface 271 of outer portion 251.
Window 1350 includes a single recess 1355. The single groove 1355 is a groove around the radial center 261 of the inner portion 252. The single groove 1355 defines a concave surface 1356 having a gradient that transitions toward the second outer surface 1354 of the window 1350 in a direction D1 from the radial center 261 to the radial outer edge 262. Recessed surface 1356 is a portion of first outer surface 1353 of window 1350.
The plurality of lights 210 are received in a single groove 1355, and each of the plurality of lights 210 rests on a recessed surface 1356.
Benefits of the present disclosure include improved thermal (e.g., heating) efficiency and reduced power consumption (e.g., power for heating) in a manner that increases yield and throughput, and facilitates reducing or mitigating degradation of chamber components (e.g., seals). For example, using the lamp modules described herein (e.g., an upper lamp module including lamps 210), it is believed that higher processing temperatures may be achieved at lower (e.g., less than half, such as about 25%) lamp input power than other operations. For example, when using lower lamp input power, a larger portion of the processing space 136, which may otherwise be at 600 to 800 degrees celsius, may be at a higher processing temperature of 1000 degrees celsius or higher (e.g., about 1200 degrees celsius). In addition, for example, portions of the substrate 102 (e.g., the exterior of the substrate 102) may be heated to a higher temperature (e.g., at 1000 degrees celsius or higher), thus promoting deposition uniformity and high growth rates. As another example, the portion of the substrate support 106 aligned under the exterior of the substrate 102 may be heated to a higher temperature (e.g., 1400 degrees celsius or higher).
Benefits also include enhanced temperature uniformity and deposition uniformity (e.g., substrate center-to-edge uniformity), enhanced device performance, product lifetime, simpler components and/or reduced component count, reduced component cost, reduced chamber cost, and reduced operating cost. For example, the lamps described herein facilitate increasing the lifetime of the lamp. As another example, the windows and lamps described herein facilitate reducing heat loss (e.g., to chamber components) and an increased percentage of the generated heat is absorbed by the substrate being processed, but not other components.
It is contemplated that aspects described herein may be combined. For example, one or more features, aspects, components, operations, and/or characteristics of the process chamber 100, the window 250, the lamp 210, the lamp 510, the window 750, the lamp 710, the window 950, and/or the window 1350 may be combined. It is further contemplated that any combination may achieve the above benefits.
While the foregoing is directed to various embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (20)

1. A lamp suitable for use in semiconductor manufacturing, comprising:
a bulb extending along at least a segment of the arcuate profile, the bulb defining an arcuate central opening;
a filament positioned in the arcuate central opening, the filament extending along at least the segment of the arcuate profile, and
A reflective coating formed on a first portion of an outer surface of the bulb tube.
2. The lamp of claim 1, wherein the reflective coating is formed on the first portion such that a second portion of the outer surface is uncoated.
3. The lamp of claim 2, wherein the reflective coating comprises one or more of gold (Au), silver, aluminum oxide, and/or one or more other ceramics.
4. The lamp of claim 2, wherein the reflective coating is formed on the first portion at a coating angle around the bulb tube, and the coating angle is at least 180 degrees.
5. The lamp of claim 4, wherein the coating angle is at least 210 degrees.
6. The lamp of claim 1, wherein the bulb extends along at least the segment of the arcuate profile to define an angular gap between a first end and a second end of the bulb.
7. The lamp of claim 6, wherein the angular gap has a gap angle of less than 45 degrees.
8. The lamp of claim 6, further comprising:
A first extension pipe disposed near the first end and extending to intersect the bulb tube;
A second extension pipe disposed near the second end and extending to intersect the bulb tube;
a first electrical connector coupled to the first extension tube, the first electrical connector configured to be coupled to a power cord, and
A second electrical connector is coupled to the second extension tube, the second electrical connector configured to couple to a ground wire.
9. A window suitable for use in semiconductor fabrication, comprising:
an outer part, and
An inner portion disposed inside the outer portion, the inner portion comprising:
The first outer surface is provided with a first surface,
A second outer surface opposite to the first outer surface, and
One or more grooves formed in the first outer surface.
10. The window of claim 9, wherein the one or more grooves comprise a plurality of grooves disposed in a concentric arrangement relative to one another.
11. The window of claim 10, further comprising a plurality of lights received in the plurality of grooves, wherein each light of the plurality of lights is disposed in an arcuate portion of a respective groove of the plurality of grooves.
12. The window of claim 11, wherein the plurality of lights are disposed in each groove of the one or more grooves.
13. The window of claim 11, wherein each respective groove of the plurality of grooves further includes a rectangular portion between the arcuate portion and the first outer surface such that the arcuate portion is recessed from the first outer surface.
14. The window of claim 10, wherein the inner portion has a radial center and a radial outer edge interfacing with the outer portion, and the first outer surface has a gradient transitioning toward the second outer surface in a direction from the radial center to the radial outer edge.
15. The window of claim 14, wherein the inner portion is transparent and the outer portion is opaque.
16. The window of claim 9, wherein the one or more grooves comprise a plurality of grooves disposed in a spaced arrangement relative to one another.
17. The window of claim 16, further comprising a plurality of lights received in the one or more grooves, wherein each light of the plurality of lights is disposed in an arcuate portion of a respective groove of the plurality of grooves.
18. The window of claim 9, wherein the one or more grooves comprise a single groove, the inner portion has a radial center and a radial outer edge interfacing with the outer portion, and the single groove defines a concave surface having a gradient transitioning toward the second outer surface in a direction from the radial center to the radial outer edge.
19. The window of claim 18, wherein the window further comprises a plurality of lights received in the single groove, wherein each light of the plurality of lights rests on the recessed surface.
20. A process chamber suitable for semiconductor fabrication, comprising:
an inner space;
a substrate support disposed in the interior space, the substrate support including a support surface;
A window at least partially defining a process space of an interior space, the window comprising:
the outer portion of the outer portion,
An inner portion disposed inside the outer portion and having a radial center and a radial outer edge interfacing with the outer portion, the inner portion comprising:
A first outer surface facing away from the support surface,
A second outer surface opposite to the first outer surface, the second outer surface facing the support surface, and
One or more grooves formed in the first outer surface, and
A plurality of lamps received in the one or more grooves of the window and supported by the inner portion such that a distance between the lamps and the support surface has a gradient that transitions toward the support surface in a direction from the radial center to the radial outer edge.
CN202380070757.5A 2022-10-03 2023-09-28 Lamp and window configuration for a substrate processing chamber Pending CN119908162A (en)

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US202263412816P 2022-10-03 2022-10-03
US63/412,816 2022-10-03
PCT/US2023/034008 WO2024076493A1 (en) 2022-10-03 2023-09-28 Lamp and window configurations for substrate processing chambers

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JP4540796B2 (en) * 2000-04-21 2010-09-08 東京エレクトロン株式会社 Quartz window, reflector and heat treatment equipment
US6707011B2 (en) * 2001-04-17 2004-03-16 Mattson Technology, Inc. Rapid thermal processing system for integrated circuits
JP2008182180A (en) * 2006-12-26 2008-08-07 Epicrew Inc Heating apparatus and semiconductor manufacturing apparatus
JP2008288520A (en) * 2007-05-21 2008-11-27 Dainippon Screen Mfg Co Ltd Heat treatment equipment
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WO2024076493A8 (en) 2025-04-24

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