[go: up one dir, main page]

CN119907569A - Display panel, method for manufacturing display panel, and electronic device - Google Patents

Display panel, method for manufacturing display panel, and electronic device Download PDF

Info

Publication number
CN119907569A
CN119907569A CN202410742240.2A CN202410742240A CN119907569A CN 119907569 A CN119907569 A CN 119907569A CN 202410742240 A CN202410742240 A CN 202410742240A CN 119907569 A CN119907569 A CN 119907569A
Authority
CN
China
Prior art keywords
array substrate
encapsulation
isolation
away
sublayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410742240.2A
Other languages
Chinese (zh)
Inventor
付雨婷
林政毅
曾振助
蔡瑞阳
侯翔殷
赖宜佑
黄维儒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Visionox Technology Co Ltd
Original Assignee
Hefei Visionox Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Visionox Technology Co Ltd filed Critical Hefei Visionox Technology Co Ltd
Priority to CN202410742240.2A priority Critical patent/CN119907569A/en
Publication of CN119907569A publication Critical patent/CN119907569A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请实施例提供的一种显示面板、显示面板的制备方法及电子设备，涉及显示技术领域，显示面板包括阵列基板、隔离结构、发光单元和第一封装层。隔离结构设有隔离开口；第一封装层位于发光单元远离阵列基板的一侧，第一封装层包括多个间隔设置的封装单元，至少部分封装单元从隔离结构的侧面延伸至隔离结构远离阵列基板的一侧；封装单元包括位于隔离结构远离阵列基板一侧的包边部，包边部远离阵列基板的部分在阵列基板上的正投影位于包边部靠近阵列基板的部分在阵列基板上的正投影内。本申请可以对前置制程的发光单元进行更好地保护，进而可以提高该显示面板的显示效果。

A display panel, a method for preparing a display panel, and an electronic device provided in an embodiment of the present application relate to the field of display technology, wherein the display panel includes an array substrate, an isolation structure, a light-emitting unit, and a first packaging layer. The isolation structure is provided with an isolation opening; the first packaging layer is located on a side of the light-emitting unit away from the array substrate, and the first packaging layer includes a plurality of packaging units arranged at intervals, and at least some of the packaging units extend from the side of the isolation structure to the side of the isolation structure away from the array substrate; the packaging unit includes a edging portion located on a side of the isolation structure away from the array substrate, and the orthographic projection of the portion of the edging portion away from the array substrate on the array substrate is located within the orthographic projection of the portion of the edging portion close to the array substrate on the array substrate. The present application can better protect the light-emitting unit of the previous process, thereby improving the display effect of the display panel.

Description

Display panel, preparation method of display panel and electronic equipment
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and electronic equipment.
Background
Organic LIGHT EMITTING (OLED) and flat display devices based on light emitting Diode (LIGHT EMITTING) technology have been widely used in various consumer electronic products such as mobile phones, televisions, notebook computers, and desktop computers, as they have advantages of high image quality, power saving, thin body, and wide application range.
However, there are still some problems of the display panel that need to be solved.
Disclosure of Invention
In order to overcome the technical problems mentioned in the background of the application, embodiments of the present application provide a display panel, including:
An array substrate;
The isolation structure is positioned at one side of the array substrate and is provided with an isolation opening;
a light emitting unit at least partially within the isolation opening;
The first packaging layer is positioned on one side of the light-emitting unit far away from the array substrate and comprises a plurality of packaging units which are arranged at intervals, at least part of the packaging units extend from the side face of the isolation structure to one side of the isolation structure far away from the array substrate, and the side face of the isolation structure is the face of the isolation structure facing the isolation opening;
the packaging unit comprises an edge wrapping portion which is located at one side, far away from the array substrate, of the isolation structure, and the orthographic projection of the portion, far away from the array substrate, of the edge wrapping portion on the array substrate does not exceed the orthographic projection of the portion, close to the array substrate, of the edge wrapping portion on the array substrate.
In some possible embodiments, the packaging unit includes a first packaging sub-layer along a direction away from the array substrate, and the first packaging sub-layer is located at a part of the isolation structure away from one side of the array substrate and is obliquely arranged away from a side surface of the isolation opening;
Preferably, the packaging unit further comprises a second packaging sub-layer located at one side of the first packaging sub-layer away from the array substrate, and the second packaging sub-layer is located at a part of the isolation structure away from one side of the array substrate and is obliquely arranged at a side surface away from the isolation opening;
Preferably, the orthographic projection of the second packaging sub-layer on the array substrate is positioned in the orthographic projection of the first packaging sub-layer on the array substrate;
Preferably, the packaging unit further comprises a third packaging sub-layer located at one side of the second packaging sub-layer away from the array substrate, and the third packaging sub-layer is located at a part of the isolation structure away from one side of the array substrate and is obliquely arranged at a side surface away from the isolation opening;
Preferably, the orthographic projection of the third packaging sub-layer on the array substrate is positioned in the orthographic projection of the second packaging sub-layer on the array substrate;
Preferably, the edge wrapping portion is obliquely arranged away from the side surface of the isolation opening;
preferably, the side surface of the edge covering portion away from the isolation opening includes a stepped surface.
In some possible embodiments, the edge covering portion of the packaging unit includes a first packaging sub-layer and a second packaging sub-layer along a direction away from the array substrate, and sides of the first packaging sub-layer and the second packaging sub-layer away from the isolation opening are stepped;
Preferably, the edge wrapping portion of the packaging unit further includes a third packaging sub-layer located at a side, far away from the array substrate, of the second packaging sub-layer, and the side, far away from the isolation opening, of the second packaging sub-layer and the third packaging sub-layer is stepped.
In some possible embodiments, the etching rates of the first encapsulation sub-layer, the second encapsulation sub-layer, and the third encapsulation sub-layer are sequentially increased.
In some possible embodiments, the light transmittance of both the first and second encapsulation sublayers is greater than the light transmittance of the third encapsulation sublayer;
Preferably, the light transmittance of the first encapsulation sub-layer is greater than the light transmittance of the second encapsulation sub-layer.
In some possible embodiments, the thickness of the third encapsulation sub-layer is smaller than the thickness of the first encapsulation sub-layer along a direction perpendicular to the array substrate;
preferably, the thickness of the third encapsulation sub-layer is smaller than the thickness of the second encapsulation sub-layer along the direction perpendicular to the array substrate;
Preferably, the ratio of the thickness of the third packaging sub-layer to the thickness of the first packaging sub-layer is 1:6-1:4 along the direction perpendicular to the array substrate;
Preferably, the ratio of the thickness of the third packaging sub-layer to the thickness of the second packaging sub-layer is 1:5-1:3 along the direction perpendicular to the array substrate;
Preferably, the thickness of the second encapsulation sub-layer is smaller than the thickness of the first encapsulation sub-layer along the direction perpendicular to the array substrate;
preferably, the ratio of the thickness of the second encapsulation sub-layer to the thickness of the first encapsulation sub-layer is 1:2-5:6 along the direction perpendicular to the array substrate.
In some possible embodiments, the material of the first encapsulation sub-layer comprises silicon oxide;
Preferably, the material of the second encapsulation sub-layer comprises silicon oxynitride;
preferably, the material of the third encapsulation sub-layer comprises silicon nitride.
In some possible embodiments, a gap is formed between a side of the edge-wrapping portion close to the array substrate and a side of the isolation structure away from the array substrate;
preferably, adjacent packaging units are arranged at intervals on one side of the isolation structure away from the array substrate;
preferably, the orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate.
In some possible embodiments, the light emitting unit includes a first electrode, a light emitting part, and a second electrode, which are at least partially located in the isolation opening and are sequentially stacked in a direction away from the array substrate, and the second electrode is electrically connected to the isolation structure;
the display panel further comprises a pixel defining layer, wherein the pixel defining layer is positioned on one side of the first electrode away from the array substrate, and the isolation structure is positioned on one side of the pixel defining layer away from the array substrate;
preferably, the orthographic projection of the pixel opening on the array substrate is located in the orthographic projection of the isolation opening on the array substrate.
In some possible embodiments, the display panel further includes a second encapsulation layer located at a side of the first encapsulation layer away from the array substrate;
preferably, the display panel further includes a third encapsulation layer located at a side of the second encapsulation layer away from the array substrate;
Preferably, the materials of the first encapsulation layer and the third encapsulation layer each comprise an inorganic material;
preferably, the second encapsulation layer comprises an organic material.
In some possible embodiments, the isolation structure includes a first isolation portion and a second isolation portion that are sequentially stacked along a direction away from the array substrate, and an orthographic projection of a side of the first isolation portion away from the array substrate on the array substrate is located in an orthographic projection of the second isolation portion on the array substrate.
In some possible embodiments, the second electrode of the light emitting unit is electrically connected with the first isolation part, and/or the isolation structure further comprises a third isolation part positioned at one side of the first isolation part facing the array substrate, wherein the second electrode of the light emitting unit is electrically connected with the third isolation part;
preferably, the material of the third isolation part comprises molybdenum metal, and/or the material of the first isolation part comprises aluminum metal, and/or the material of the second isolation part comprises titanium metal.
In some possible embodiments, the present application also provides a display panel including:
An array substrate;
The isolation structure is positioned at one side of the array substrate and is provided with an isolation opening;
a light emitting unit at least partially within the isolation opening;
The first packaging layer is positioned on one side of the light-emitting unit far away from the array substrate and comprises a plurality of packaging units which are arranged at intervals, at least part of the packaging units extend from the side face of the isolation structure to one side of the isolation structure far away from the array substrate, and the side face of the isolation structure is the face of the isolation structure facing the isolation opening;
The packaging unit comprises a plurality of layers of packaging sublayers which are sequentially stacked along the direction far away from the array substrate, and the etching rate of the layers of packaging sublayers is sequentially increased along the direction far away from the array substrate.
In some possible embodiments, the packaging unit includes a first packaging sub-layer and a second packaging sub-layer which are sequentially stacked along a direction away from the array substrate;
Preferably, the light transmittance of the first encapsulation sub-layer is greater than the light transmittance of the second encapsulation sub-layer;
Preferably, the packaging unit further comprises a third packaging sub-layer positioned on one side of the second packaging sub-layer away from the array substrate;
the light transmittance of the first packaging sub-layer and the second packaging sub-layer is larger than that of the third packaging sub-layer;
Preferably, the thickness of the third encapsulation sub-layer is smaller than the thickness of the first encapsulation sub-layer along the direction perpendicular to the array substrate;
preferably, the thickness of the third encapsulation sub-layer is smaller than the thickness of the second encapsulation sub-layer along the direction perpendicular to the array substrate;
Preferably, the ratio of the thickness of the third packaging sub-layer to the thickness of the first packaging sub-layer is 1:6-1:4 along the direction perpendicular to the array substrate;
Preferably, the ratio of the thickness of the third packaging sub-layer to the thickness of the second packaging sub-layer is 1:5-1:3 along the direction perpendicular to the array substrate;
Preferably, the thickness of the second encapsulation sub-layer is smaller than the thickness of the first encapsulation sub-layer along the direction perpendicular to the array substrate;
preferably, the ratio of the thickness of the second encapsulation sub-layer to the thickness of the first encapsulation sub-layer is 1:2-5:6 along the direction perpendicular to the array substrate.
In some possible embodiments, the present application further provides a method for preparing a display panel, the method comprising:
providing an array substrate;
forming an isolation structure on one side of the array substrate, wherein the isolation structure is provided with an isolation opening;
preparing a light emitting unit, wherein at least part of the light emitting unit is positioned in the isolation opening;
The light-emitting unit comprises a light-emitting unit, an array substrate, a first packaging layer and a second packaging layer, wherein the first packaging layer is formed on one side, far away from the array substrate, of the light-emitting unit, the first packaging layer comprises a plurality of packaging units which are arranged at intervals, at least part of the packaging units extend from the side surface of the isolation structure to one side, far away from the array substrate, of the isolation structure, the side surface of the isolation structure is the surface, facing the isolation opening, of the isolation structure, the packaging units comprise an edge-wrapping part which is positioned on one side, far away from the array substrate, of the isolation structure, and the orthographic projection of the part, far away from the array substrate, of the edge-wrapping part on the array substrate does not exceed the orthographic projection of the part, close to the array substrate, of the edge-wrapping part on the array substrate.
In some possible embodiments, the application further provides an electronic device, where the electronic device includes the display panel described in the application, or includes a display panel prepared by the method for preparing a display panel described in the application.
Compared with the prior art, the application has the following beneficial effects:
According to the display panel, the manufacturing method of the display panel and the electronic equipment, the front projection of the part, far away from the array substrate, of the edge wrapping part on the array substrate is positioned in the front projection of the part, close to the array substrate, of the edge wrapping part on the array substrate, so that the cathode of the light-emitting unit of the post-processing procedure can continuously cover the packaging unit of the light-emitting unit of the pre-processing procedure, the light-emitting unit of the pre-processing procedure can be better protected, and the display effect of the display panel can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional view of a display panel in the related art according to an embodiment of the present application during a manufacturing process;
Fig. 2 is a schematic cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 5 is a second schematic cross-sectional view of a display panel according to an embodiment of the application;
FIG. 6 is a second schematic cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 7 is a third schematic cross-sectional view of a display panel according to an embodiment of the application;
FIG. 8 is a third schematic cross-sectional view of a display panel according to an embodiment of the present application;
fig. 9 is a schematic cross-sectional view of a display panel according to an embodiment of the present application including a second encapsulation layer;
Fig. 10 is a schematic cross-sectional view of a display panel according to an embodiment of the present application including a third encapsulation layer;
FIG. 11 is a schematic cross-sectional view of an isolation structure according to an embodiment of the present application including a three-layer structure;
Fig. 12 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;
fig. 13 is a schematic cross-sectional view of forming a first electrode layer on one side of an array substrate according to an embodiment of the present application;
FIG. 14 is a schematic cross-sectional view of a pixel defining material layer formed on a side of a first electrode layer away from an array substrate according to an embodiment of the present application;
FIG. 15 is a schematic cross-sectional view of an embodiment of the present application for forming an isolation structure material layer on a side of a pixel defining material layer away from an array substrate;
FIG. 16 is a schematic cross-sectional view of an embodiment of the present application for etching an isolation structure material layer to form an isolation structure;
FIG. 17 is a schematic cross-sectional view of etching a pixel defining material layer to form a pixel defining layer according to an embodiment of the present application;
FIG. 18 is a schematic cross-sectional view of a light emitting portion formed in an isolation opening according to an embodiment of the present application;
fig. 19 is a schematic cross-sectional view of a second electrode formed in an isolation opening at a side of a light emitting portion away from an array substrate according to an embodiment of the present application.
The pixel structure comprises the following components of 1, an array substrate, 2, a pixel defining layer, 21, a pixel opening, 3, an isolation structure, 31, a first isolation part, 32, a second isolation part, 33, a third isolation part, 4, a packaging structure, 41, a first packaging film layer, 42, a second packaging film layer, 5, a first electrode, 6, a light emitting part, 7, a second electrode, 8, a light emitting unit, 81, a first light emitting unit, 82, a second light emitting unit, 9, a first packaging layer, 901, a wrapping part, 91, a first packaging sub-layer, 92, a second packaging sub-layer, 93, a third packaging sub-layer, 10, an isolation opening, 11, a first packaging layer, 12, a second packaging layer, 13, a pixel defining material layer and 14, and an isolation structure material layer.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.
Referring to fig. 1, in the process of implementing the present invention, the inventor has found that the following problems exist in the related art. The display panel in the related art includes an array substrate 1, an isolation structure 3 located at one side of the array substrate 1, a light emitting unit 8 located in an isolation opening 10 formed by the isolation structure 3, and a first encapsulation layer located at one side of the light emitting unit 8 away from the array substrate 1, where the first encapsulation layer includes an encapsulation structure 4 covering the light emitting unit 8. The package structure 4 includes a first package film layer 41 and a second package film layer 42 sequentially stacked along a direction away from the array substrate 1, where the first package film layer 41 is shrunk inwards relative to the second package film layer 42.
In the process of preparing the light emitting unit 8, for example, when preparing the second light emitting unit according to the preparation sequence of the first light emitting unit and the second light emitting unit, the cathode of the second light emitting unit may cover the side of the package structure 4 of the first light emitting unit away from the array substrate 1, and the cathode of the second light emitting unit may protect the package structure 4 of the first light emitting unit.
However, since the first encapsulation film 41 of the first light emitting unit is shrunk inwards relative to the second encapsulation film 42, the cathode of the second light emitting unit cannot continuously cover the encapsulation structure 4 of the first light emitting unit at the position where the first encapsulation film 41 is shrunk inwards relative to the second encapsulation film 42, so that the encapsulation structure 4 of the first light emitting unit cannot be completely protected, and finally the first light emitting unit cannot be completely protected.
Referring to fig. 2, in the subsequent process, the cathode of the second light emitting unit cannot completely protect the package structure 4 of the first light emitting unit, so that the first light emitting unit may be damaged, and the cathode of the first light emitting unit and the corresponding isolation structure 3 cannot be well overlapped, thereby affecting the display effect of the display panel.
In view of this, the present embodiment provides a solution that can improve the display effect of the display panel, and the solution provided in the present embodiment is described in detail below.
Referring to fig. 3, the present embodiment provides a display panel, which includes an array substrate 1, an isolation structure 3, a light emitting unit 8 and a first encapsulation layer 9.
The array substrate 1 may include a substrate and a plurality of driving units located at one side of the substrate, each of which may include one or more semiconductor switching devices. The semiconductor switching device may be formed by a plurality of film layers in the array substrate 1 in cooperation, for example, the semiconductor switching device may be a thin film transistor formed by a plurality of film layers in cooperation.
The isolation structure 3 is located at one side of the array substrate 1, and the isolation structure 3 is provided with an isolation opening 10.
The composition, preparation, etc. of the isolation structure 3 is further described in patent PCT/CN2023/134518、202310759370.2、202310740412.8、202310707209.0、202311346196.5、202311499823.9、202310731471.9、202311091555.7 for reference.
At least part of the light emitting units 8 are located in the isolation opening 10, and the light emitting units 8 may include a first light emitting unit and a second light emitting unit, where the light emitting colors of the first light emitting unit and the second light emitting unit are different, for example, the light emitting color of the first light emitting unit may be red, and the light emitting color of the second light emitting unit may be green.
The first packaging layer 9 is located at one side of the light emitting unit 8 far away from the array substrate 1, the first packaging layer 9 comprises a plurality of packaging units arranged at intervals, at least part of the packaging units extend from the side face of the isolation structure 3 to one side of the isolation structure 3 far away from the array substrate 1, and the side face of the isolation structure 3 is a face of the isolation structure 3 facing the isolation opening 10.
The packaging unit comprises an edge covering portion 901 located on one side, far away from the array substrate 1, of the isolation structure 3, and the orthographic projection of the portion, far away from the array substrate 1, of the edge covering portion 901 on the array substrate 1 does not exceed the orthographic projection of the portion, close to the array substrate 1, of the edge covering portion 901 on the array substrate 1.
Referring to fig. 4, according to the order of manufacturing the first light emitting unit 81 and the second light emitting unit 82, since the orthographic projection of the portion of the edge covering portion 901 of the packaging unit of the front process, which is far from the array substrate 1, is located in the orthographic projection of the portion of the edge covering portion 901, which is close to the array substrate 1, on the array substrate 1, that is, in the direction perpendicular to the array substrate 1, all the sections of the edge covering portion 901, which are parallel to the direction of the array substrate 1, are located in the orthographic projection of the section of the array substrate 1, which is far from one side of the array substrate 1, on the side, which is close to the array substrate 1. Therefore, the second electrode 7 of the second light emitting unit 82 in the post-process, such as the cathode, can continuously cover the packaging unit corresponding to the first light emitting unit 81 at the position of the edge wrapping portion 901, and the cathode of the second light emitting unit 82 can completely cover the packaging unit of the first light emitting unit 81, so that the first light emitting unit 81 can be completely protected. In this way, the packaging unit of the first light emitting unit 81 is not easily damaged when the second light emitting unit 82 of the post-process is prepared, so that the first light emitting unit 81 is not easily damaged, and therefore, the cathode of the first light emitting unit can be better overlapped with the corresponding isolation structure 3.
If a third light emitting unit is further disposed after the second light emitting unit 82, the second light emitting unit 82 is not easily damaged, and the cathode of the second light emitting unit 82 can be well bonded with the corresponding isolation structure 3, similar to the principle described above for the first light emitting unit 81.
If there is no third light-emitting unit in the subsequent process of the second light-emitting unit 82, the second light-emitting unit 82 is not damaged, and the cathode of the second light-emitting unit 82 can be well overlapped with the corresponding isolation structure 3. In this way, the cathodes of the light emitting units 8 of the display panel can be effectively overlapped with the corresponding isolation structures 3.
Based on the above design, in this embodiment, the front projection of the portion of the edge covering portion 901, which is far away from the array substrate 1, on the array substrate 1 is located in the front projection of the portion of the edge covering portion 901, which is close to the array substrate 1, on the array substrate 1, so that the cathode of the light emitting unit 8 in the post-process continuously covers the packaging unit of the light emitting unit 8 in the pre-process, thereby better protecting the light emitting unit 8 in the pre-process, and further improving the display effect of the display panel.
In some possible embodiments, referring to fig. 3 again, the light emitting unit 8 includes a first electrode 5, a light emitting portion 6, and a second electrode 7 at least partially located in the isolation opening 10 and sequentially stacked in a direction away from the array substrate 1, and the second electrode 7 is electrically connected to the isolation structure 3. The display panel further comprises a pixel defining layer 2 positioned on one side of the first electrode 5 away from the array substrate 1, the isolation structure 3 is positioned on one side of the pixel defining layer 2 away from the array substrate 1, the pixel defining layer 2 comprises pixel openings 21 exposing at least part of the first electrode 5, the orthographic projection of the isolation structure 3 on the array substrate 1 is positioned between the orthographic projections of two adjacent pixel openings 21 on the array substrate 1, and the orthographic projection of the pixel openings 21 on the array substrate 1 is positioned in the orthographic projection of the isolation openings 10 on the array substrate 1.
When the light-emitting functional layer is formed, the light-emitting functional layer is separated by the isolation structure 3 to form a plurality of light-emitting parts 6 arranged at intervals, and when the second electrode layer is formed, the second electrode layer is separated by the isolation structure 3 to form a plurality of second electrodes 7 arranged at intervals, the isolation structure 3 comprises a conductive material, the second electrodes 7 are electrically connected with the isolation structure 3, and one first electrode 5, one light-emitting part 6 and one second electrode 7 form one light-emitting unit 8. The first electrode 5 is an anode, and the second electrode 7 is a cathode.
In some possible embodiments, a gap is formed between a side of the edge covering portion 901, which is close to the array substrate 1, and a side of the isolation structure 3, which is far away from the array substrate 1, and adjacent packaging units are disposed at intervals on the side of the isolation structure 3, which is far away from the array substrate 1, and an orthographic projection of the packaging units on the array substrate 1 covers an orthographic projection of the isolation opening 10 on the array substrate 1.
In the patterning process of the light emitting units 8, the first encapsulation layer 9 is disconnected at the isolation structure 3 to form encapsulation units, and the encapsulation units can completely and independently encapsulate the corresponding light emitting units 8, so that the display characteristics of the display panel can be improved.
In some possible embodiments, please refer to fig. 3 and fig. 4 again, in the direction away from the array substrate 1, the packaging unit includes a first packaging sublayer 91, the first packaging sublayer 91 is disposed at a portion of the isolation structure 3 away from the side of the array substrate 1 and is disposed at an incline away from the side of the isolation opening 10, the packaging unit further includes a second packaging sublayer 92 disposed at a portion of the first packaging sublayer 91 away from the side of the array substrate 1, the second packaging sublayer 92 is disposed at a portion of the isolation structure 3 away from the side of the array substrate 1 and is disposed at an incline away from the side of the isolation opening 10, the orthographic projection of the second packaging sublayer 92 on the array substrate 1 is disposed within the orthographic projection of the first packaging sublayer 91 on the array substrate 1, the packaging unit further includes a third packaging sublayer 93 disposed at a portion of the second packaging sublayer 92 away from the side of the array substrate 1 and is disposed at an incline away from the side of the isolation opening 10, and the orthographic projection of the third packaging sublayer 93 on the array substrate 1 is disposed within the orthographic projection of the second packaging sublayer 92 on the array substrate 1.
In this way, the cathode of the second light emitting unit 82 in the post-process can more easily and continuously cover the packaging unit corresponding to the first light emitting unit 81 at the position of the edge wrapping portion 901, and the cathode of the second light emitting unit 82 can more easily and completely cover the packaging unit of the first light emitting unit 81, so that the first light emitting unit 81 can be more completely protected.
In some embodiments, referring again to fig. 3 and 4, the selvedges are disposed obliquely away from the sides of the isolation opening 10. In this embodiment, the cathode of the second light emitting unit 82 in the post-process may continuously cover the corresponding packaging unit of the first light emitting unit 81 at the position of the edge wrapping portion 901.
In other embodiments, referring to fig. 5 and 6, the side of the edge covering portion away from the isolation opening 10 includes a step surface, and the portions of the first package sub-layer 91, the second package sub-layer 92, and the third package sub-layer 93 on the side of the isolation structure 3 away from the array substrate 1 are disposed obliquely away from the side of the isolation opening 10. In this embodiment, the cathode of the second light emitting unit 82 in the post-process may continuously cover the corresponding packaging unit of the first light emitting unit 81 at the position of the edge wrapping portion 901.
In still other embodiments, referring to fig. 7 and 8, the side of the edge covering portion away from the isolation opening 10 includes a step surface, and the first package sub-layer 91, the second package sub-layer 92, and the third package sub-layer 93 are disposed vertically on the side of the isolation structure 3 away from the side of the array substrate 1 and away from the isolation opening 10. In this embodiment, the cathode of the second light emitting unit 82 in the post-process may continuously cover the corresponding packaging unit of the first light emitting unit 81 at the position of the edge wrapping portion 901.
Preferably, along the direction away from the array substrate 1, the packaging unit includes a first packaging sublayer 91, a second packaging sublayer 92 and a third packaging sublayer 93 which are sequentially stacked, and etching rates of the first packaging sublayer 91, the second packaging sublayer 92 and the third packaging sublayer 93 are sequentially increased.
Since the etching rates of the first package sub-layer 91, the second package sub-layer 92 and the third package sub-layer 93 are sequentially increased, the third package sub-layer 93 is retracted relative to the second package sub-layer 92, and the second package sub-layer 92 is retracted relative to the first package sub-layer 91 when the first package layer 9 is etched. Because the first packaging sublayer 91, the second packaging sublayer 92 and the third packaging sublayer 93 are sequentially stacked along the direction away from the array substrate 1, after the light-emitting unit 8 is prepared, the orthographic projection of the part, away from the array substrate 1, of the edge-wrapping part 901 of the packaging unit on the array substrate 1 is positioned in the orthographic projection of the part, close to the array substrate 1, of the edge-wrapping part 901 on the array substrate 1, and the side surface, away from the isolation opening 10, of the edge-wrapping part 901 is easier to form an inclined surface, so that the position of the second electrode 7, such as a cathode, of the second light-emitting unit 82 in the post-process can continuously cover the packaging unit corresponding to the first light-emitting unit 81, and the cathode of the second light-emitting unit 82 can completely cover the packaging unit of the first light-emitting unit 81, thereby completely protecting the first light-emitting unit 81. Therefore, the packaging unit of the first light-emitting unit 81 is not easy to be damaged when the second light-emitting unit 82 of the post-processing procedure is prepared, so that the cathode of the first light-emitting unit can be better overlapped with the corresponding isolation structure 3, and finally the light-emitting unit 8 of the display panel is not easy to fail.
In some possible embodiments, the light transmittance of both the first and second encapsulation sublayers 91 and 92 is greater than the light transmittance of the third encapsulation sublayer 93, and the light transmittance of the first encapsulation sublayer 91 is greater than the light transmittance of the second encapsulation sublayer 92.
The material of the encapsulation unit in the related art may be made of only the material of the third encapsulation sub-layer 93, and the light transmittance of the material of the third encapsulation sub-layer 93 is not good enough, thus affecting the optical characteristics of the display panel in the related art.
In this embodiment, since the material of the part of the packaging unit is replaced by the first packaging sublayer 91 and the second packaging sublayer 92 with better transmittance, the embodiment can better ensure the appearance of the packaging unit, so that the light emitting unit 8 is not easy to fail, the transmittance of the packaging unit can be improved, and finally the optical characteristics of the display panel can be improved.
In some possible embodiments, referring to fig. 3 again, the thickness H3 of the third encapsulation sub-layer 93 is smaller than the thickness H1 of the first encapsulation sub-layer 91 along the direction perpendicular to the array substrate 1.
Since the light transmittance of the third encapsulation sub-layer 93 is smaller than that of the first encapsulation sub-layer 91, the third encapsulation sub-layer is thinner than the first encapsulation sub-layer 91, so that the proportion of the film layer with higher light transmittance in the encapsulation unit can be increased, and the light transmittance of the encapsulation unit can be further improved.
Specifically, the ratio of the thickness H3 of the third encapsulation sub-layer 93 to the thickness H1 of the first encapsulation sub-layer 91 is 1:6-1:4, for example, the ratio of the thickness H3 to the thickness H1 may be 1:4, 1:5, or 1:6. The proportion of the thickness H3 to the thickness H1 is reasonably set, so that the light transmittance of the packaging unit can be improved under the conditions of not increasing the thickness of the packaging unit and guaranteeing the quality of the packaging unit.
Preferably, referring to fig. 3 again, the thickness H3 of the third encapsulation sub-layer 93 is smaller than the thickness H2 of the second encapsulation sub-layer 92 along the direction perpendicular to the array substrate 1.
Since the light transmittance of the third encapsulation sub-layer 93 is smaller than that of the second encapsulation sub-layer 92, the third encapsulation sub-layer is thinner than the second encapsulation sub-layer 92, so that the proportion of the film layer with higher light transmittance in the encapsulation unit can be increased, and the light transmittance of the encapsulation unit can be further improved.
Specifically, the ratio of the thickness H3 of the third encapsulation sub-layer 93 to the thickness of the second encapsulation sub-layer 92H2 is 1:5-1:3, for example, the ratio of the thickness H3 to the thickness H2 may be 1:3, 1:4, or 1:5. The proportion of the thickness H3 to the thickness H2 is reasonably set, so that the light transmittance of the packaging unit can be improved under the conditions of not increasing the thickness of the packaging unit and guaranteeing the quality of the packaging unit.
Preferably, referring to fig. 3 again, the thickness H2 of the second encapsulation sub-layer 92 is smaller than the thickness of the first encapsulation sub-layer 91H1 along the direction perpendicular to the array substrate 1.
Since the light transmittance of the second encapsulation sub-layer 92 is smaller than that of the first encapsulation sub-layer 91, the second encapsulation sub-layer is thinner than the first encapsulation sub-layer 91, so that the proportion of the film layer with higher light transmittance in the encapsulation unit can be increased, and the light transmittance of the encapsulation unit can be further improved.
Specifically, the ratio of the thickness H2 of the second encapsulation sub-layer 92 to the thickness H1 of the first encapsulation sub-layer 91 is 1:2-5:6, for example, the ratio of the thickness H2 to the thickness H1 may be 3:4, 3:5, 1:2, 4:5, 2:3, or 5:6, etc. The proportion of the thickness H2 to the thickness H1 is reasonably set, so that the light transmittance of the packaging unit can be improved under the conditions of not increasing the thickness of the packaging unit and guaranteeing the quality of the packaging unit.
Preferably, the material of the first encapsulation sublayer 91 comprises silicon oxide, the material of the second encapsulation sublayer 92 comprises silicon oxynitride, and the material of the third encapsulation sublayer 93 comprises silicon nitride. The materials of the first, second and third encapsulation sublayers 91, 92 and 93 are reasonably arranged, so that the display effect and quality of the display panel can be provided.
In some possible embodiments, referring to fig. 9 and 10, the display panel further includes a second encapsulation layer 11 located on a side of the first encapsulation layer 9 away from the array substrate 1, and a third encapsulation layer 12 located on a side of the second encapsulation layer 11 away from the array substrate 1, where materials of the first encapsulation layer 9 and the third encapsulation layer 12 each include an inorganic material, and the second encapsulation layer 11 includes an organic material.
The second encapsulation layer 11 and the third encapsulation layer 12 can have a better encapsulation effect on the light emitting unit 8, so that the encapsulation quality of the display panel can be further improved.
In some possible embodiments, please refer to fig. 10 again, the isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 that are sequentially stacked along a direction away from the array substrate 1, and an orthographic projection of a side of the first isolation portion 31 away from the array substrate 1 on the array substrate 1 is located in an orthographic projection of the second isolation portion 32 on the array substrate 1.
Since the second isolation portion 32 is located at a side of the first isolation portion 31 away from the array substrate 1, and the lateral width of the second isolation portion 32 is greater than that of the first isolation portion 31, the second isolation portion 32 may disconnect the light emitting functional layer and the second electrode layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 can make it easier to individually package the respective light emitting units 8.
In some possible embodiments, please refer to fig. 10 again, the second electrode 7 of the light emitting unit 8 is electrically connected to the first isolation portion 31, the first isolation portion 31 comprises a conductive material, and the second electrode 7 corresponding to the light emitting unit 8 extends to contact with the sidewall of the first isolation portion 31, so as to electrically connect the second electrode 7 corresponding to the light emitting unit 8 to the first isolation portion 31.
Referring to fig. 11, the isolation structure 3 further includes a third isolation portion 33 located on a side of the first isolation portion 31 facing the array substrate 1, and the second electrode 7 of the light emitting unit 8 is electrically connected to the third isolation portion 33.
The third isolation portion 33 includes a conductive material, and the second electrode 7 corresponding to the light emitting unit 8 extends to be in contact with a sidewall of the third isolation portion 33, so that the second electrode 7 corresponding to the light emitting unit 8 is electrically connected to the third isolation portion 33.
Specifically, the material of the third isolation portion 33 includes molybdenum metal, and/or the material of the first isolation portion 31 includes aluminum metal, and/or the material of the second isolation portion 32 includes titanium metal. In this way, when the isolation structure 3 breaks the second electrode layer into the second electrode 7, the second electrode 7 is more easily electrically connected to the first isolation portion 31 and/or the third isolation portion 33.
In some possible embodiments, please refer to fig. 3 and fig. 4 again, the present application further provides a display panel, which includes an array substrate 1, an isolation structure 3, a light emitting unit 8, and a first encapsulation layer 9.
The isolation structure 3 is located at one side of the array substrate 1, the isolation structure 3 is provided with an isolation opening 10, and at least part of the light emitting units 8 are located in the isolation opening 10.
The first packaging layer 9 is positioned on one side of the light-emitting unit 8 away from the array substrate 1, the first packaging layer 9 comprises a plurality of packaging units which are arranged at intervals, at least part of the packaging units extend from the side surface of the isolation structure 3 to one side of the isolation structure 3 away from the array substrate 1, and the side surface of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 10;
The packaging unit comprises a plurality of packaging sublayers which are sequentially stacked along the direction away from the array substrate 1, and the etching rate of the plurality of packaging sublayers is sequentially increased along the direction away from the array substrate 1.
The direction away from array substrate 1, the encapsulation unit is including the first encapsulation sublayer 91, second encapsulation sublayer 92 and the third encapsulation sublayer 93 of stack gradually setting, and the etching rate of first encapsulation sublayer 91, second encapsulation sublayer 92 and third encapsulation sublayer 93 increases gradually.
Since the etching rates of the first package sub-layer 91, the second package sub-layer 92 and the third package sub-layer 93 are sequentially increased, the third package sub-layer 93 is retracted relative to the second package sub-layer 92, and the second package sub-layer 92 is retracted relative to the first package sub-layer 91 when the first package layer 9 is etched. Since the first, second and third encapsulation sublayers 91, 92 and 93 are sequentially stacked in a direction away from the array substrate 1, after the light emitting unit 8 is prepared, the side surface of the encapsulation unit where the edge portion 901 faces the isolation opening 10 forms an inclined surface inclined in a direction away from the isolation opening 10.
Referring to fig. 4 again, since the edge-wrapping portion 901 of the packaging unit of the front-end process is disposed obliquely toward the side surface of the isolation opening 10, the cathode of the second light-emitting unit 82 of the rear-end process can continuously cover the corresponding packaging unit of the first light-emitting unit 81 at the position of the edge-wrapping portion 901, and the cathode of the second light-emitting unit 82 can completely cover the packaging unit of the first light-emitting unit 81, so that the packaging unit of the first light-emitting unit 81 can be completely protected. In this way, the packaging unit of the first light emitting unit 81 is not easily damaged when the second light emitting unit 82 of the post-process is prepared, so that the first light emitting unit 81 is not easily damaged, and therefore, the cathode of the first light emitting unit 81 can be better overlapped with the corresponding isolation structure 3.
If a third light emitting unit is further disposed after the second light emitting unit 82, the second light emitting unit 82 is not easily damaged, and the cathode of the second light emitting unit 82 can be well bonded with the corresponding isolation structure 3, similar to the principle described above for the first light emitting unit 81.
If there is no third light-emitting unit in the subsequent process of the second light-emitting unit 82, the second light-emitting unit 82 is not damaged, and the cathode of the second light-emitting unit 82 can be well overlapped with the corresponding isolation structure 3. Thus, the cathodes of the light emitting units 8 of the display panel can be effectively overlapped with the corresponding isolation structures 3, so that the display effect of the display panel can be improved.
In summary, by obliquely arranging the edge-wrapping portion 901 of the packaging unit towards the side surface of the isolation opening 10, the cathode of the light-emitting unit 8 in the post-process can continuously cover the light-emitting unit 8 in the pre-process, so that the light-emitting unit 8 in the pre-process can be better protected, and the display effect of the display panel can be improved.
In some possible embodiments, referring to fig. 12, the present application further provides a method for manufacturing a display panel, which includes:
s10, providing an array substrate 1.
The array substrate 1 may include a substrate and a plurality of driving units located at one side of the substrate, each of which may include one or more semiconductor switching devices. The semiconductor switching device may be formed by a plurality of film layers in the array substrate 1 in cooperation, for example, the semiconductor switching device may be a thin film transistor formed by a plurality of film layers in cooperation.
S11, forming an isolation structure 3 on one side of the array substrate 1, wherein the isolation structure 3 is provided with an isolation opening 10.
Referring to fig. 13, a first electrode layer is formed on one side of the array substrate 1, and the first electrode layer includes a plurality of first electrodes 5 disposed at intervals.
Referring to fig. 14, a pixel defining material layer 13 is formed on a side of the first electrode layer away from the array substrate 1.
Referring to fig. 15, an isolation structure material layer 14 is formed on a side of the pixel defining material layer 13 away from the array substrate 1.
Referring to fig. 16, the isolation structure material layer 14 is etched to form the isolation structure 3.
Referring to fig. 17, the pixel defining material layer 13 is etched to form a pixel defining layer 2, wherein the pixel defining layer 2 includes a pixel opening 21 exposing at least a portion of the first electrode 5, the orthographic projection of the isolation structure 3 on the array substrate 1 is located between the orthographic projections of two adjacent pixel openings 21 on the array substrate 1, and the orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 10 on the array substrate 1.
And S12, preparing the light-emitting units 8, wherein at least part of the light-emitting units 8 are positioned in the isolation openings 10.
Referring to fig. 18, the light emitting portion 6 is formed in the isolation opening 10.
The light-emitting functional layer is disconnected at the isolation structure 3, so that at least part of the light-emitting functional layer is positioned in the isolation opening 10 to form the light-emitting part 6, and the light-emitting part 6 can be prevented from contacting the isolation structure 3 by controlling the vapor deposition angle.
Referring to fig. 19, the second electrode 7 is formed in the isolation opening 10 at a side of the light emitting portion 6 away from the array substrate 1.
The second electrode layer is disconnected at the isolation structure 3, so that at least part of the second electrode layer is located in the isolation opening 10 to form a second electrode 7, and by controlling the evaporation angle, the second electrode 7 can be extended from the isolation opening 10 to be in electrical contact with the isolation structure 3, so as to connect adjacent second electrodes 7 or connect the second electrodes 7 to other circuits. Thus, the manufacturing difficulty of the display panel can be reduced.
And S13, forming a first packaging layer 9 on one side of the light-emitting unit 8 far away from the array substrate 1, wherein the first packaging layer 9 comprises a plurality of packaging units which are arranged at intervals, at least part of the packaging units extend from the side surface of the isolation structure 3 to one side of the isolation structure 3 far away from the array substrate 1, the side surface of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 10, the packaging units comprise a wrapping part 901 positioned on one side of the isolation structure 3 far away from the array substrate 1, and the orthographic projection of the part of the wrapping part 901 far away from the array substrate 1 on the array substrate 1 does not exceed the orthographic projection of the part of the wrapping part 901 near the array substrate 1 on the array substrate 1.
Referring to fig. 4 again, in the process of forming the light emitting unit 8 and the packaging unit, since the front projection of the portion of the edge covering portion 901 of the packaging unit of the front process, which is far from the array substrate 1, on the array substrate 1 does not exceed the front projection of the portion of the edge covering portion 901, which is close to the array substrate 1, on the array substrate 1, that is, in the direction perpendicular to the array substrate 1, all the sections of the edge covering portion 901, which are parallel to the direction of the array substrate 1, are in the front projection of the array substrate 1, and the section of the edge covering portion 901, which is far from the side of the array substrate 1, on the side, which is close to the array substrate 1, is in the front projection of the array substrate 1. Therefore, the second electrode 7 of the second light emitting unit 82 in the post-process, such as the cathode, can continuously cover the packaging unit corresponding to the first light emitting unit 81 at the position of the edge wrapping portion 901, and the cathode of the second light emitting unit 82 can completely cover the packaging unit of the first light emitting unit 81, so that the first light emitting unit 81 can be completely protected. In this way, the packaging unit of the first light emitting unit 81 is not easily damaged when the second light emitting unit 82 of the post-process is prepared, so that the first light emitting unit 81 is not easily damaged, and therefore, the cathode of the first light emitting unit 81 can be better overlapped with the corresponding isolation structure 3. The display panel finally formed by the above method is shown in fig. 3, and the display effect of the display panel formed by the method is shown.
In some possible embodiments, the application further provides an electronic device, which comprises the display panel disclosed by the application or the display panel prepared by the preparation method of the display panel disclosed by the application. The electronic device may include a device having image processing capabilities, such as a server, personal computer, notebook computer, or the like. Since the electronic equipment comprises the display panel, the display effect of the electronic equipment is better.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (16)

1.一种显示面板，其特征在于，所述显示面板包括：1. A display panel, characterized in that the display panel comprises: 阵列基板；An array substrate; 位于所述阵列基板一侧的隔离结构，所述隔离结构设有隔离开口；An isolation structure located at one side of the array substrate, wherein the isolation structure is provided with an isolation opening; 至少部分位于所述隔离开口内的发光单元；a light emitting unit at least partially located within the isolation opening; 位于所述发光单元远离所述阵列基板一侧的第一封装层，所述第一封装层包括多个间隔设置的封装单元；A first packaging layer located at a side of the light emitting unit away from the array substrate, the first packaging layer comprising a plurality of packaging units arranged at intervals; 其中，所述封装单元包括位于所述隔离结构远离所述阵列基板一侧的包边部，所述包边部远离所述阵列基板的部分在所述阵列基板上的正投影不超出所述包边部靠近所述阵列基板的部分在所述阵列基板上的正投影。In which, the packaging unit includes a edging portion located on the side of the isolation structure away from the array substrate, and the orthographic projection of the part of the edging portion away from the array substrate on the array substrate does not exceed the orthographic projection of the part of the edging portion close to the array substrate on the array substrate. 2.根据权利要求1所述的显示面板，其特征在于，所述封装单元包括第一封装子层，所述第一封装子层位于所述隔离结构远离所述阵列基板一侧的部分且远离所述隔离开口的侧面倾斜设置；2. The display panel according to claim 1, wherein the encapsulation unit comprises a first encapsulation sublayer, and the first encapsulation sublayer is located at a portion of the isolation structure away from the array substrate and is inclined away from the side of the isolation opening; 优选地，所述封装单元还包括位于所述第一封装子层远离所述阵列基板一侧的第二封装子层，所述第二封装子层位于所述隔离结构远离所述阵列基板一侧的部分且远离所述隔离开口的侧面倾斜设置；Preferably, the encapsulation unit further comprises a second encapsulation sublayer located on a side of the first encapsulation sublayer away from the array substrate, and the second encapsulation sublayer is located on a part of the isolation structure away from the array substrate and is arranged obliquely away from a side of the isolation opening; 优选地，所述第二封装子层在所述阵列基板上的正投影位于所述第一封装子层在所述阵列基板上的正投影内；Preferably, the orthographic projection of the second encapsulation sublayer on the array substrate is located within the orthographic projection of the first encapsulation sublayer on the array substrate; 优选地，所述封装单元还包括位于所述第二封装子层远离所述阵列基板一侧的第三封装子层，所述第三封装子层位于所述隔离结构远离所述阵列基板一侧的部分且远离所述隔离开口的侧面倾斜设置；Preferably, the encapsulation unit further comprises a third encapsulation sublayer located on a side of the second encapsulation sublayer away from the array substrate, and the third encapsulation sublayer is located on a part of the isolation structure away from the array substrate and is inclined away from a side of the isolation opening; 优选地，所述第三封装子层在所述阵列基板上的正投影位于所述第二封装子层在所述阵列基板上的正投影内；Preferably, the orthographic projection of the third encapsulation sublayer on the array substrate is located within the orthographic projection of the second encapsulation sublayer on the array substrate; 优选地，所述包边部远离所述隔离开口的侧面倾斜设置；Preferably, the edge portion is arranged obliquely away from the side of the isolation opening; 优选地，所述包边部远离所述隔离开口的侧面包括台阶面；Preferably, the side of the hemming portion away from the isolation opening comprises a step surface; 优选地，至少部分所述封装单元从所述隔离结构的侧面延伸至所述隔离结构远离所述阵列基板的一侧，所述隔离结构的侧面为所述隔离结构朝向所述隔离开口的面。Preferably, at least part of the packaging unit extends from a side surface of the isolation structure to a side of the isolation structure away from the array substrate, and the side surface of the isolation structure is a surface of the isolation structure facing the isolation opening. 3.根据权利要求1所述的显示面板，其特征在于，沿远离所述阵列基板的方向，所述封装单元的所述包边部包括第一封装子层和第二封装子层，所述第一封装子层和所述第二封装子层远离所述隔离开口的侧面呈台阶状；3. The display panel according to claim 1, characterized in that, along a direction away from the array substrate, the edge portion of the encapsulation unit comprises a first encapsulation sublayer and a second encapsulation sublayer, and the side surfaces of the first encapsulation sublayer and the second encapsulation sublayer away from the isolation opening are in a step shape; 优选地，所述封装单元的所述包边部还包括位于所述第二封装子层远离所述阵列基板一侧的第三封装子层，所述第二封装子层和所述第三封装子层远离所述隔离开口的侧面呈台阶状。Preferably, the edge-wrapping portion of the encapsulation unit further comprises a third encapsulation sublayer located on a side of the second encapsulation sublayer away from the array substrate, and the side surfaces of the second encapsulation sublayer and the third encapsulation sublayer away from the isolation opening are in a step shape. 4.根据权利要求2所述的显示面板，其特征在于，所述第一封装子层、所述第二封装子层和所述第三封装子层的刻蚀速率依次递增。4 . The display panel according to claim 2 , wherein etching rates of the first encapsulation sublayer, the second encapsulation sublayer and the third encapsulation sublayer increase in sequence. 5 . 5.根据权利要求2所述的显示面板，其特征在于，所述第一封装子层和所述第二封装子层的透光率均大于所述第三封装子层的透光率；5. The display panel according to claim 2, wherein the light transmittance of the first encapsulation sublayer and the second encapsulation sublayer are both greater than the light transmittance of the third encapsulation sublayer; 优选地，所述第一封装子层的透光率大于所述第二封装子层的透光率。Preferably, the light transmittance of the first encapsulation sublayer is greater than the light transmittance of the second encapsulation sublayer. 6.根据权利要求2-5任意一项所述的显示面板，其特征在于，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度小于所述第一封装子层的厚度；6. The display panel according to any one of claims 2 to 5, characterized in that, along a direction perpendicular to the array substrate, a thickness of the third encapsulation sublayer is less than a thickness of the first encapsulation sublayer; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度小于所述第二封装子层的厚度；Preferably, along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than the thickness of the second encapsulation sublayer; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度与所述第一封装子层的厚度之比为1:6-1:4；Preferably, along a direction perpendicular to the array substrate, a ratio of a thickness of the third encapsulation sublayer to a thickness of the first encapsulation sublayer is 1:6-1:4; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度与所述第二封装子层的厚度之比为1:5-1:3；Preferably, along a direction perpendicular to the array substrate, a ratio of a thickness of the third encapsulation sublayer to a thickness of the second encapsulation sublayer is 1:5-1:3; 优选地，沿垂直于所述阵列基板的方向，所述第二封装子层的厚度小于所述第一封装子层的厚度；Preferably, along a direction perpendicular to the array substrate, a thickness of the second encapsulation sublayer is less than a thickness of the first encapsulation sublayer; 优选地，沿垂直于所述阵列基板的方向，所述第二封装子层的厚度与所述第一封装子层的厚度之比为1:2-5:6。Preferably, along a direction perpendicular to the array substrate, a ratio of a thickness of the second encapsulation sublayer to a thickness of the first encapsulation sublayer is 1:2-5:6. 7.根据权利要求2-5中任意一项所述的显示面板，其特征在于，所述第一封装子层的材料包括氧化硅；7. The display panel according to any one of claims 2 to 5, characterized in that the material of the first encapsulation sublayer comprises silicon oxide; 优选地，所述第二封装子层的材料包括氮氧化硅；Preferably, the material of the second encapsulation sublayer includes silicon oxynitride; 优选地，所述第三封装子层的材料包括氮化硅。Preferably, the material of the third encapsulation sublayer includes silicon nitride. 8.根据权利要求1-5中任意一项所述的显示面板，其特征在于，所述包边部靠近所述阵列基板的一侧与所述隔离结构远离所述阵列基板的一侧之间具有间隙；8. The display panel according to any one of claims 1 to 5, characterized in that there is a gap between a side of the edge portion close to the array substrate and a side of the isolation structure away from the array substrate; 优选地，相邻所述封装单元在所述隔离结构远离所述阵列基板的一侧间隔设置；Preferably, adjacent packaging units are arranged at intervals on a side of the isolation structure away from the array substrate; 优选地，所述封装单元在所述阵列基板上的正投影覆盖所述隔离开口在所述阵列基板上的正投影。Preferably, the orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate. 9.根据权利要求1-5中任意一项所述的显示面板，其特征在于，所述发光单元包括至少部分位于所述隔离开口内且沿远离所述阵列基板的方向依次层叠设置的第一电极、发光部和第二电极，所述第二电极与所述隔离结构电连接；9. The display panel according to any one of claims 1 to 5, characterized in that the light-emitting unit comprises a first electrode, a light-emitting portion, and a second electrode which are at least partially located in the isolation opening and are sequentially stacked in a direction away from the array substrate, and the second electrode is electrically connected to the isolation structure; 优选地，所述显示面板还包括位于所述第一电极远离所述阵列基板一侧的像素界定层，所述隔离结构位于所述像素界定层远离所述阵列基板的一侧；所述像素界定层包括暴露出至少部分所述第一电极的像素开口，所述隔离结构在所述阵列基板上的正投影位于相邻两个所述像素开口在所述阵列基板上的正投影之间；Preferably, the display panel further comprises a pixel defining layer located on a side of the first electrode away from the array substrate, and the isolation structure is located on a side of the pixel defining layer away from the array substrate; the pixel defining layer comprises a pixel opening exposing at least a portion of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate; 优选地，所述像素开口在所述阵列基板上的正投影位于所述隔离开口在所述阵列基板上的正投影内。Preferably, the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate. 10.根据权利要求1-5中任意一项所述的显示面板，其特征在于，所述显示面板还包括位于所述第一封装层远离所述阵列基板一侧的第二封装层；10. The display panel according to any one of claims 1 to 5, characterized in that the display panel further comprises a second packaging layer located on a side of the first packaging layer away from the array substrate; 优选地，所述显示面板还包括位于所述第二封装层远离所述阵列基板一侧的第三封装层；Preferably, the display panel further comprises a third packaging layer located on a side of the second packaging layer away from the array substrate; 优选地，所述第一封装层和所述第三封装层的材料均包括无机材料；Preferably, the materials of the first encapsulation layer and the third encapsulation layer both include inorganic materials; 优选地，所述第二封装层包括有机材料。Preferably, the second encapsulation layer comprises an organic material. 11.根据权利要求1-5任意一项所述的显示面板，其特征在于，所述隔离结构包括沿远离所述阵列基板的方向依次层叠设置的第一隔离部以及第二隔离部，所述第一隔离部远离所述阵列基板的一侧在所述阵列基板上的正投影位于所述第二隔离部在所述阵列基板上的正投影内。11. The display panel according to any one of claims 1-5 is characterized in that the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the array substrate, and the orthographic projection of a side of the first isolation portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate. 12.根据权利要求11所述的显示面板，其特征在于，所述发光单元的第二电极与所述第一隔离部电连接；和/或，所述隔离结构还包括位于所述第一隔离部朝向所述阵列基板一侧的第三隔离部，所述发光单元的第二电极与所述第三隔离部电连接；12. The display panel according to claim 11, characterized in that the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and/or the isolation structure further comprises a third isolation portion located on a side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; 优选地，所述第三隔离部的材质包括钼金属；和/或，所述第一隔离部的材质包括铝金属；和/或，所述第二隔离部的材质包括钛金属。Preferably, the material of the third isolation portion includes molybdenum metal; and/or the material of the first isolation portion includes aluminum metal; and/or the material of the second isolation portion includes titanium metal. 13.一种显示面板，其特征在于，所述显示面板包括：13. A display panel, characterized in that the display panel comprises: 阵列基板；An array substrate; 位于所述阵列基板一侧的隔离结构，所述隔离结构设有隔离开口；An isolation structure located at one side of the array substrate, wherein the isolation structure is provided with an isolation opening; 至少部分位于所述隔离开口内的发光单元；a light emitting unit at least partially located within the isolation opening; 位于所述发光单元远离所述阵列基板一侧的第一封装层，所述第一封装层包括多个间隔设置的封装单元；A first packaging layer located at a side of the light emitting unit away from the array substrate, the first packaging layer comprising a plurality of packaging units arranged at intervals; 其中，沿远离所述阵列基板的方向，所述封装单元包括依次层叠设置的多层封装子层，多层所述封装子层的刻蚀速率沿远离所述阵列基板的方向依次递增。Wherein, along the direction away from the array substrate, the encapsulation unit includes a plurality of encapsulation sublayers stacked in sequence, and the etching rates of the plurality of encapsulation sublayers increase in sequence along the direction away from the array substrate. 14.根据权利要求13所述的显示面板，其特征在于，沿远离所述阵列基板的方向，所述封装单元包括依次层叠设置的第一封装子层和第二封装子层；14. The display panel according to claim 13, characterized in that, along a direction away from the array substrate, the encapsulation unit comprises a first encapsulation sublayer and a second encapsulation sublayer which are sequentially stacked; 优选地，所述第一封装子层的透光率大于所述第二封装子层的透光率；Preferably, the light transmittance of the first encapsulation sublayer is greater than the light transmittance of the second encapsulation sublayer; 优选地，所述封装单元还包括位于所述第二封装子层远离所述阵列基板一侧的第三封装子层；Preferably, the encapsulation unit further comprises a third encapsulation sublayer located on a side of the second encapsulation sublayer away from the array substrate; 优选地，所述第一封装子层和所述第二封装子层的透光率均大于所述第三封装子层的透光率；Preferably, the light transmittance of the first encapsulation sublayer and the second encapsulation sublayer are both greater than the light transmittance of the third encapsulation sublayer; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度小于所述第一封装子层的厚度；Preferably, along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than the thickness of the first encapsulation sublayer; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度小于所述第二封装子层的厚度；Preferably, along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than the thickness of the second encapsulation sublayer; 优选地，至少部分所述封装单元从所述隔离结构的侧面延伸至所述隔离结构远离所述阵列基板的一侧，所述隔离结构的侧面为所述隔离结构朝向所述隔离开口的面；Preferably, at least part of the packaging unit extends from a side surface of the isolation structure to a side of the isolation structure away from the array substrate, and the side surface of the isolation structure is a surface of the isolation structure facing the isolation opening; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度与所述第一封装子层的厚度之比为1:6-1:4；Preferably, along a direction perpendicular to the array substrate, a ratio of a thickness of the third encapsulation sublayer to a thickness of the first encapsulation sublayer is 1:6-1:4; 优选地，沿垂直于所述阵列基板的方向，所述第三封装子层的厚度与所述第二封装子层的厚度之比为1:5-1:3；Preferably, along a direction perpendicular to the array substrate, a ratio of a thickness of the third encapsulation sublayer to a thickness of the second encapsulation sublayer is 1:5-1:3; 优选地，沿垂直于所述阵列基板的方向，所述第二封装子层的厚度小于所述第一封装子层的厚度；Preferably, along a direction perpendicular to the array substrate, a thickness of the second encapsulation sublayer is less than a thickness of the first encapsulation sublayer; 优选地，沿垂直于所述阵列基板的方向，所述第二封装子层的厚度与所述第一封装子层的厚度之比为1:2-5:6。Preferably, along a direction perpendicular to the array substrate, a ratio of a thickness of the second encapsulation sublayer to a thickness of the first encapsulation sublayer is 1:2-5:6. 15.一种显示面板的制备方法，其特征在于，所述方法包括：15. A method for preparing a display panel, characterized in that the method comprises: 提供一阵列基板；Providing an array substrate; 在所述阵列基板的一侧形成隔离结构，所述隔离结构设有隔离开口；An isolation structure is formed on one side of the array substrate, wherein the isolation structure is provided with an isolation opening; 制备发光单元，至少部分发光单元位于所述隔离开口内；preparing a light-emitting unit, wherein at least part of the light-emitting unit is located in the isolation opening; 在所述发光单元远离所述阵列基板的一侧形成第一封装层，所述第一封装层包括多个间隔设置的封装单元；Forming a first encapsulation layer on a side of the light emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals; 所述封装单元包括位于所述隔离结构远离所述阵列基板一侧的包边部，所述包边部远离所述阵列基板的部分在所述阵列基板上的正投影不超过所述包边部靠近所述阵列基板的部分在所述阵列基板上的正投影。The packaging unit includes a edging portion located on a side of the isolation structure away from the array substrate, and the orthographic projection of a portion of the edging portion away from the array substrate on the array substrate does not exceed the orthographic projection of a portion of the edging portion close to the array substrate on the array substrate. 16.一种电子设备，其特征在于，所述电子设备包括权利要求1-14中任意一项所述的显示面板，或包括由权利要求15所述的显示面板的制备方法制备得到的显示面板。16. An electronic device, characterized in that the electronic device comprises the display panel according to any one of claims 1 to 14, or comprises a display panel prepared by the method for preparing a display panel according to claim 15.
CN202410742240.2A 2024-06-07 2024-06-07 Display panel, method for manufacturing display panel, and electronic device Pending CN119907569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410742240.2A CN119907569A (en) 2024-06-07 2024-06-07 Display panel, method for manufacturing display panel, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410742240.2A CN119907569A (en) 2024-06-07 2024-06-07 Display panel, method for manufacturing display panel, and electronic device

Publications (1)

Publication Number Publication Date
CN119907569A true CN119907569A (en) 2025-04-29

Family

ID=95471115

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202410742240.2A Pending CN119907569A (en) 2024-06-07 2024-06-07 Display panel, method for manufacturing display panel, and electronic device

Country Status (1)

Country Link
CN (1) CN119907569A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552091A (en) * 2016-03-09 2016-05-04 京东方科技集团股份有限公司 Array substrate, preparing method thereof and display panel
CN114678327A (en) * 2022-03-04 2022-06-28 惠科股份有限公司 Fabrication method of array substrate, display panel and display device
CN116669477A (en) * 2023-07-26 2023-08-29 合肥维信诺科技有限公司 Display panel, manufacturing method thereof and display device
CN117320514A (en) * 2022-06-28 2023-12-29 株式会社日本显示器 Display device and manufacturing method of display device
CN119096721A (en) * 2023-03-31 2024-12-06 合肥维信诺科技有限公司 Display panel, display device, and method for manufacturing display panel

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552091A (en) * 2016-03-09 2016-05-04 京东方科技集团股份有限公司 Array substrate, preparing method thereof and display panel
US20180097087A1 (en) * 2016-03-09 2018-04-05 Boe Technology Group Co., Ltd. Array substrate, manufacturing method thereof and display panel
CN114678327A (en) * 2022-03-04 2022-06-28 惠科股份有限公司 Fabrication method of array substrate, display panel and display device
CN117320514A (en) * 2022-06-28 2023-12-29 株式会社日本显示器 Display device and manufacturing method of display device
CN119096721A (en) * 2023-03-31 2024-12-06 合肥维信诺科技有限公司 Display panel, display device, and method for manufacturing display panel
CN116669477A (en) * 2023-07-26 2023-08-29 合肥维信诺科技有限公司 Display panel, manufacturing method thereof and display device

Similar Documents

Publication Publication Date Title
US10325892B2 (en) Light emitting device and manufacturing method thereof
CN119012775A (en) Display panel, preparation method of display panel and electronic equipment
CN119012776A (en) Display panel, preparation method of display panel and electronic equipment
CN119012774A (en) Display panel, preparation method of display panel and electronic equipment
CN118678767A (en) Display panel manufacturing method, display panel and display device
CN118973306A (en) Display panel, method for manufacturing display panel, and electronic device
CN119156089A (en) Display panel, preparation method thereof and display device
CN112585779B (en) Method for manufacturing a display device
CN119212482A (en) Display panel and manufacturing method thereof, and display device
CN119907511A (en) Display panel, method for manufacturing display panel, and electronic device
CN119212500A (en) Display panel and manufacturing method thereof, and display device
CN119277899A (en) Display panel and manufacturing method thereof, and display device
CN119012768A (en) Display panel and preparation method thereof
CN118678796A (en) Display panel, display device and preparation method of display panel
CN118678793A (en) Array substrate, display panel, display device and method for preparing array substrate
US20250098491A1 (en) Display panel, display apparatus, and method for manufacturing display panel
CN119907569A (en) Display panel, method for manufacturing display panel, and electronic device
CN119947424A (en) Display panel, method for manufacturing display panel, and electronic device
CN118660517A (en) Display panel manufacturing method, display panel and electronic equipment
CN118284256B (en) OLED display screen and preparation method thereof
CN120076655A (en) Display panel, preparation method of display panel and electronic equipment
CN119012779A (en) Display panel, manufacturing method of display panel and electronic equipment
CN118660503A (en) Array substrate, preparation method, display panel, preparation method and electronic equipment
CN119183333A (en) Display panel, preparation method of display panel and display device
CN114744015B (en) Display substrate and display device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination