CN119818179B - Integrated macro-microstructure design method for skull patch with bionic vibration isolation function - Google Patents
Integrated macro-microstructure design method for skull patch with bionic vibration isolation functionInfo
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- CN119818179B CN119818179B CN202411618400.9A CN202411618400A CN119818179B CN 119818179 B CN119818179 B CN 119818179B CN 202411618400 A CN202411618400 A CN 202411618400A CN 119818179 B CN119818179 B CN 119818179B
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Abstract
The invention provides a skull patch macro-micro structure integrated design method with a bionic vibration isolation function, which comprises the steps of reconstructing a skull three-dimensional model based on CT data, designing the geometry of a skull patch according to a defect area in the skull three-dimensional model, establishing a finite element analysis model, designing the overall structure of the skull patch based on a topology optimization method to obtain an overall truss structure of the skull patch and through holes between the truss structures, filling the through holes between the truss structures by using the bionic vibration isolation structure, and filling the bionic vibration isolation structure by using a lattice structure to obtain the skull patch macro-micro structure with the bionic vibration isolation function. After the skull patch designed by the invention is implanted into a human body, the skull patch has a good vibration isolation function, thereby protecting the tissue in the brain.
Description
Technical Field
The invention relates to the technical field of medical appliances, in particular to a skull patch macro-micro structure integrated design method with a bionic vibration isolation function.
Background
The skull is an important bony structure of the human body. When the skull is damaged or missing, the patient may be faced with problems of brain exposure to the external environment, intracranial pressure imbalance, aesthetics, etc. Therefore, the integrity of the skull is critical. However, after a craniectomy such as trauma, tumor resection, congenital defect, infection, or reduced pressure, the skull may be partially or completely missing. In these cases, the physician typically uses a cranioplasty to repair the integrity of the skull by implanting a skull patch. The skull patch not only can restore the structure and function of the skull, protect brain soft tissues, avoid the risk of wound and infection, improve the head metabolism and the nerve function, but also can improve the head appearance of a patient, reduce psychological burden and improve the life quality of the patient.
The cranial patch material typically includes autogenous bone, allograft bone, and synthetic material. Although autologous bone has better biocompatibility, the bone shape and size are more limited and the bone taking position can be influenced negatively, and the use of allogeneic bone and xenogeneic bone is gradually reduced due to the high risk of infection, rejection and absorption reaction. The existing skull patch is mostly made of engineering materials with excellent biocompatibility and mechanical strength, such as titanium alloy and polyether ether ketone (PEEK) which are most widely used.
However, titanium alloys and polyetheretherketone still have some disadvantages in practical applications. The titanium alloy is used as a metal material, and can generate artifacts during CT and MRI imaging to influence the definition and accuracy of postoperative imaging examination, and in addition, the titanium alloy has strong thermal conductivity and is easy to cause discomfort of patients when the ambient temperature changes. And PEEK is used as a high polymer material, has a modulus of elasticity closer to that of bones, does not generate artifacts during imaging, and overcomes the disadvantages of titanium alloy in terms of heat conduction. However, due to the lack of biomechanical analysis of the PEEK patch in the existing design, the PEEK patch lacks a design of lattice structure on macro-micro structure compared to the titanium alloy patch, so that the PEEK patch is larger in volume, and poor in osseointegration capability and adhesion capability of soft tissue on the patch, resulting in generation of subcutaneous effusion. Meanwhile, due to the high crystallinity of the PEEK material, a newly deposited layer can rapidly cool and shrink in the Fused Deposition Modeling (FDM) process, so that residual stress and warping occur.
The existing skull patch design lacks consideration of vibration isolation structures, and one of the main functions of the skull is to protect the brain from external impact or vibration. Therefore, in order to recover the vibration isolation function of the skull when filling the skull defect, the influence of external vibration on brain tissues is reduced, so that a patient faces the risk of external physical vibration better after operation, and the skull patch should have certain vibration isolation capability.
In summary, optimizing the macroscopic structure of the skull patch on the premise of maintaining strength and structural integrity, realizing the design of vibration isolation lattice structure on the microscopic structure, improving the growth fusion capability of the skull patch with the skull and soft tissues, and manufacturing the skull patch by using materials with higher printing controllability has become a current urgent problem to be solved.
Disclosure of Invention
In view of the above, the present invention provides a method for designing a macro-micro structure of a skull patch with bionic vibration isolation function, so as to solve the above problems.
The invention provides a skull patch macro-micro structure integrated design method with a bionic vibration isolation function, which comprises the steps of reconstructing a skull three-dimensional model based on CT data, designing the geometry of a skull patch according to a defect area in the skull three-dimensional model, establishing a finite element analysis model, designing the overall structure of the skull patch based on a topology optimization method to obtain an overall truss structure of the skull patch and through holes between the truss structures, filling the through holes between the truss structures by using the bionic vibration isolation structure, and filling the bionic vibration isolation structure by using a lattice structure to obtain the skull patch macro-micro structure with the bionic vibration isolation function.
In another aspect, the method further comprises the steps of taking the minimized strain energy of the skull patch as a target, taking the volume fraction of the volume of the skull patch after optimization relative to the volume of the original skull patch as a constraint condition, designing the skull patch in a lightweight mode, distributing the whole truss structure formed by the skull patch after optimization along the direction of load transmission force lines born by the skull patch, and forming through holes between the truss structures.
In another aspect of the invention, the volume fraction of the optimized skull patch volume relative to the original patch volume is between 50-90%.
In another aspect of the invention, the minimum width of the overall truss structure is between 10 and 30mm, and the distance between the through holes of the truss structures and the edge of the skull patch is between 10 and 15 mm.
In another aspect of the present invention, the bionic vibration isolation structure is a polygonal hole, the polygonal hole includes one or more of a regular polygon and an irregular polygon, the side length is 5-15 mm, and the minimum distance between the side lengths is 2-5 mm.
In another aspect of the invention, the pore diameter of the lattice structure is 600-1000 μm, and the filament diameter of the lattice structure is adjusted to be larger than 0.1mm according to the printing capability.
The invention also discloses a method for manufacturing the skull patch with the bionic vibration isolation function, which comprises the steps of exporting the skull patch macro-micro structure with the bionic vibration isolation function in a stereo lithography format, and manufacturing the skull patch with the bionic vibration isolation function by using a fused deposition molding or powder bed-based laser selective sintering process according to a file in the stereo lithography format and using polyether ketone as a raw material.
In another aspect of the invention, the method further comprises the step of implanting the skull patch by an embedded method, and connecting the skull patch with surrounding corresponding bone tissue by using screws or connecting sheets.
According to the integrated design method of the skull patch macro-micro structure with the bionic vibration isolation function, the designed skull patch is provided with the bionic vibration isolation structure, polygonal holes with vibration isolation effects are designed through venation arrangement of bionic dragonfly wings, influences of external vibration on intracranial tissues are effectively reduced, the skull patch can provide better shock absorption and protection when bearing external impact or daily activities, impact on the brain is reduced, comfort and safety after operation are improved, risks of postoperative complications are reduced, meanwhile, the integrated design of the macro-micro structure is adopted, enough mechanical strength can be guaranteed on the macro structure, light-weight design is achieved, internal tissues of the skull are protected, integration of the skull and soft tissues and the skull patch is promoted through the design of the microstructure, and recovery time of a patient is shortened.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described, and advantages and benefits in the solutions will become apparent to those skilled in the art from reading the detailed description of the embodiments below. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention.
In the drawings:
fig. 1 is a flow chart of a method for integrally designing a macro-micro structure of a skull patch with a bionic vibration isolation function according to an embodiment of the invention.
Fig. 2 is a schematic illustration of a cranial patch of steps S102 to S104 according to one embodiment of the present invention.
Fig. 3 is a schematic diagram of a lattice structure design according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of an embodiment 1 of the present invention.
Fig. 5 is a schematic diagram of an embodiment 2 of the present invention.
Detailed Description
In order to make the technical solutions in the embodiments of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly and specifically described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the present invention, shall fall within the scope of protection of the embodiments of the present invention.
Fig. 1 is a flow chart of a method for integrally designing a macro-micro structure of a skull patch with a bionic vibration isolation function according to an embodiment of the present invention, as shown in fig. 1, the embodiment mainly includes the following steps:
s101, reconstructing a skull three-dimensional model based on CT data.
S102, designing the geometric shape of the skull patch according to the defect area in the skull three-dimensional model.
Illustratively, as shown in fig. 2, the thickness of the skull patch is between 2 and 5mm, the skull patch is provided with an inner curved surface and an outer curved surface, the inner curved surface and the outer curved surface are provided with physiological curvature, the radian of the curved surface is between 0 and 180 degrees, and the edge of the skull patch is well matched with the defect area.
S103, establishing a finite element analysis model, and designing the whole structure of the skull patch based on a topology optimization method to obtain the whole truss structure of the skull patch and through holes between the truss structures.
By way of example, the topology optimization design method comprehensively considers the stress conditions of the skull under various working conditions, such as intracranial pressure, impact loads in different directions and the like.
S104, filling through holes among truss structures by utilizing the bionic vibration isolation structure.
S105, filling the bionic vibration isolation structure by using a lattice structure to obtain the skull patch macro-micro structure with the bionic vibration isolation function.
Illustratively, when filling the polygonal holes with the lattice structure, the lattice structure may fill the polygonal holes completely, i.e. occupy the inner space of the polygonal holes, in a space-filling or completely-filling manner.
According to the integrated design method of the skull patch macro-micro structure with the bionic vibration isolation function, the designed skull patch is provided with the bionic vibration isolation structure, polygonal holes with vibration isolation effects are designed through venation arrangement of bionic dragonfly wings, influences of external vibration on intracranial tissues are effectively reduced, the skull patch can provide better shock absorption and protection when bearing external impact or daily activities, impact on the brain is reduced, comfort and safety after operation are improved, risks of postoperative complications are reduced, meanwhile, the integrated design of the macro-micro structure is adopted, enough mechanical strength can be guaranteed on the macro structure, light-weight design is achieved, internal tissues of the skull are protected, integration of the skull and soft tissues and the skull patch is promoted through the design of the microstructure, and recovery time of a patient is shortened.
In another aspect, the method further comprises the steps of taking the minimized strain energy of the skull patch as a target, taking the volume fraction of the volume of the skull patch after optimization relative to the volume of the original skull patch as a constraint condition, designing the skull patch in a lightweight mode, distributing the whole truss structure formed by the skull patch after optimization along the direction of load transmission force lines born by the skull patch, and forming through holes between the truss structures.
In another aspect of the invention, the volume fraction of the optimized skull patch volume relative to the original patch volume is between 50-90%.
In another aspect of the invention, the minimum width of the overall truss structure is between 10 and 30mm, and the distance between the through holes of the truss structures and the edge of the skull patch is between 10 and 15 mm.
In another aspect of the present invention, the bionic vibration isolation structure is a polygonal hole, the polygonal hole includes one or more of a regular polygon and an irregular polygon, the side length is 5-15 mm, and the minimum distance between the side lengths is 2-5 mm.
Illustratively, regular polygons such as quadrilaterals, pentagons, hexagons, and the like.
In another aspect of the invention, the pore diameter of the lattice structure is 600-1000 μm, and the filament diameter of the lattice structure is adjusted to be larger than 0.1mm according to the printing capability.
Preferably, as shown in fig. 3, microscopic lattice structures can be defined and varied according to size and strength requirements, including but not limited to three-dimensional periodic minimum curved structures, such as Gyroid structures, crystalline structures, including simple cubic structures, body-centered cubic structures, face-centered cubic structures, complex geometric structures, including diamond structures, fluorite structures, wil Fei Lan structures, polyhedral structures, including truncated cubes, truncated octahedra, honeycomb structures, truss structures, including equiaxed truss structures, octahedral truss structures, reentrant structures, and Voronoi filling structures.
The length and the width of the three-dimensional periodic minimum curved surface structural unit are 600-3000 mu m, the height is 2-15 mm, and the wire diameter is 0.4-1.4 mm.
The dot spacing of the Voronoi filling structural unit is between 0.6 and 5mm, and the wire diameter is between 0.3 and 1 mm.
The length and width of other structural units are between 0.6 and 10mm, the height is between 1 and 5mm, and the wire diameter is between 0.5 and 1.5 mm.
The invention also discloses a method for manufacturing the skull patch with the bionic vibration isolation function, which comprises the steps of exporting the skull patch macro-micro structure with the bionic vibration isolation function in a stereo lithography format, and manufacturing the skull patch with the bionic vibration isolation function by using a fused deposition modeling or powder bed-based laser selective sintering process according to a file of the stereo lithography format (STL) and using polyetherketoneketone as a raw material.
Preferably, the polyether ketone (PEKK) and the PEEK belong to polyaryletherketone materials, have the advantage of PEEK materials, but the crystallinity of PEKK is lower than that of PEEK, the crystallization speed is slower in the printing process, and the printing is more uniform, so that the polyether ketone (PEKK) and the PEEK have better interlayer bonding force, and no obvious anisotropy in Y and Z directions caused by printing stacking exists.
The patch is made of a polyether-ketone material, provides excellent mechanical property and biocompatibility for the patch, has similar elastic modulus to bone tissue, can reduce stress shielding effect, promote natural growth and healing of the bone tissue, overcomes the disadvantages of high thermal conductivity of the titanium alloy material patch and artifacts in medical imaging, has stronger interlayer binding force in the FDM printing process, is not easy to warp in the printing process compared with the same polyether-ether-ketone, improves the controllability of the printing process and the quality of a printed piece, is integrally formed by 3D printing, directly produces complex geometric shape without additional processing or assembly, ensures perfect fitting of the patch and skull of a patient, and reduces production period and cost.
In another aspect of the invention, the method further comprises the step of implanting the skull patch by an embedded method, and connecting the skull patch with surrounding corresponding bone tissue by using screws or connecting sheets.
Example 1, as shown in fig. 4:
S1, reconstructing a three-dimensional model of the skull based on CT data, and designing the shape of the skull patch at the defect position so that the edge of the skull patch is well matched with the defect part. The designed patch has a thickness of 3mm, and is provided with an inner curved surface and an outer curved surface, wherein the inner curved surface and the outer curved surface have physiological curvature, and the radian of the curved surface is 0-180 degrees.
S2, establishing a finite element analysis model for the forehead part of the skull and the skull patch, and simulating the stress condition of the skull patch under the condition of intracranial pressure or impact load. And the optimized volume of the skull patch is 80 percent of the volume fraction of the original patch volume by taking the minimized strain energy of the skull patch as a target, and the macrostructure of the skull patch is optimally designed. The truss structures are distributed along the direction of the load transmission force lines born by the skull patch, and through holes are formed between the truss structures. The minimum width of the truss structure is 15.6mm, and the through holes are 10.6mm away from the edge of the skull patch.
S3, filling through holes among truss structures by utilizing pentagon holes, so that the skull patch has a bionic vibration isolation function, the side length of the pentagon is 5.8mm, and the minimum distance between the pentagons is 2mm.
S4, filling the through hole areas at intervals by using a face-centered cubic lattice structure, wherein the length, the width and the height of the structural unit are 3mm respectively, and the wire diameter is 0.5mm, so that the skull patch can be better fused with surrounding bones and soft tissues after implantation.
The integrated design of the macro-micro structure of the skull patch with the bionic vibration isolation function is completed, a design file is exported in an STL format, polyetherketoneketone is used as a raw material, the skull patch is manufactured by using a fused deposition modeling 3D printing process, the skull patch is implanted to a corresponding position by adopting an embedded method, and the skull patch is connected with surrounding corresponding bone tissues by using a connecting sheet.
Example 2, as shown in fig. 5:
S1, a skull defect of a patient is positioned on an upper parietal bone, a skull three-dimensional model is reconstructed based on CT data, and a skull patch shape is designed at the defect position, so that the edge of the skull patch is well matched with the defect part. The designed patch has a thickness of 3mm, and is provided with an inner curved surface and an outer curved surface, wherein the inner curved surface and the outer curved surface have physiological curvature, and the radian of the curved surface is 0-180 degrees.
S2, establishing a finite element analysis model for the parietal bone part above the skull and the skull patch, and simulating the stress condition of the skull patch under the condition of intracranial pressure or impact load. And the optimized volume of the skull patch is 70 percent of the volume fraction of the original patch volume by taking the minimized strain energy of the skull patch as a target, and the macrostructure of the skull patch is optimally designed. The truss structures are distributed along the direction of the load transmission force lines born by the skull patch, and through holes are formed between the truss structures. The minimum width of the truss structure is 10.8mm, and the through holes are 10mm away from the edge of the skull patch.
S3, filling through holes among truss structures by utilizing the hexagonal holes, so that the skull patch has a bionic vibration isolation function. The sides of the hexagons are 5mm long and the minimum spacing between the hexagons is 2mm.
S4, filling the through hole areas at intervals by utilizing a Voronoi lattice structure, wherein the point spacing of the structural units is 1.5mm, and the wire diameter is 0.5mm, so that the skull patch can be better fused with surrounding bones and soft tissues after implantation.
The integrated design of the macro-micro structure of the skull patch with the bionic vibration isolation function is completed, a design file is exported in an STL format, polyetherketoneketone is used as a raw material, the skull patch is manufactured by using a laser selective sintering process based on a powder bed, the skull patch is implanted to a corresponding position by adopting an embedded method, and the skull patch is connected with surrounding corresponding bone tissues by using screws.
The skull patch designed by the invention has the characteristics of individuation, integration and light weight on the premise of ensuring the mechanical property, has good vibration isolation function after being implanted into a human body, thereby protecting the internal tissues of the brain, can be better fused with autologous bones and soft tissues, thereby achieving the effect of reducing subcutaneous effusion, has simpler manufacturing process, and has more accurate and controllable 3D printing patch form due to PEKK material and better interlayer bonding force.
In another aspect of the invention, an electronic device includes a processor, a memory, and a communication bus, a communication interface (Communications Interface).
Wherein:
the processor, the memory and the communication interface are used for completing the communication among each other through the communication bus.
And the communication interface is used for communicating with other electronic devices or servers.
The processor is used for executing a program, and can specifically execute the steps of the skull patch macro-micro structure integrated design method with the bionic vibration isolation function in any one of the above embodiments.
In particular, the program may include program code including computer-operating instructions.
The processor may be a central processing unit, CPU, or an Application specific integrated Circuit, ASIC (Application SPECIFIC INTEGRATED circuits), or one or more integrated circuits configured to implement embodiments of the present application. The one or more processors included in the smart device may be the same type of processor, such as one or more CPUs, or different types of processors, such as one or more CPUs and one or more ASICs.
And the memory is used for storing programs. The memory may comprise high-speed RAM memory or may further comprise non-volatile memory, such as at least one disk memory.
The program may be specifically used to cause a processor to execute the steps of the method for designing the integrated macro-micro structure of the skull patch with the bionic vibration isolation function according to any one of the embodiments described in the foregoing. Specific implementation of each step in the program can be referred to the corresponding description in the steps and units executed by the skull patch macro-micro structure integrated design method with bionic vibration isolation function in any of the above steps, and is not repeated here. It will be apparent to those skilled in the art that for convenience and brevity of description, the specific operation of the apparatus and modules described above may be described with reference to corresponding processes in the foregoing method embodiments.
The exemplary embodiments of the present application also provide a non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform the methods of the embodiments of the present application.
The above-described methods according to embodiments of the present invention may be implemented in hardware, firmware, or as software or computer code storable in a recording medium such as a CD ROM, RAM, floppy disk, hard disk, or magneto-optical disk, or as computer code originally stored in a remote recording medium or a non-transitory machine-readable medium and to be stored in a local recording medium downloaded through a network, so that the methods described herein may be stored on such software processes on a recording medium using a general purpose computer, special purpose processor, or programmable or special purpose hardware such as an ASIC or FPGA. It is understood that a computer, processor, microprocessor controller, or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code that, when accessed and executed by a computer, processor, or hardware, performs the methods described herein. Furthermore, when a general purpose computer accesses code for implementing the methods illustrated herein, execution of the code converts the general purpose computer into a special purpose computer for performing the methods illustrated herein.
Thus, specific embodiments of the present invention have been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may be advantageous.
It should be noted that all directional indications (such as up, down, left, right, and back.) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a certain specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.
In the description of the present invention, the terms "first," "second," and the like are used merely for convenience in describing the various components or names, and are not to be construed as indicating or implying a sequential relationship, relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
It should be noted that, although specific embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention should not be construed as limiting the scope of the present invention. Various modifications and variations which may be made by those skilled in the art without the creative effort fall within the protection scope of the present invention within the scope described in the claims.
Examples of embodiments of the present invention are intended to briefly illustrate technical features of embodiments of the present invention so that those skilled in the art may intuitively understand the technical features of the embodiments of the present invention, and are not meant to be undue limitations of the embodiments of the present invention.
It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiments of the present invention.
Claims (5)
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| CN116442476A (en) * | 2023-05-04 | 2023-07-18 | 西安康拓医疗技术股份有限公司 | Porous structure skull prosthesis manufacturing method based on 3D printing and injection molding technology |
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| US8343225B2 (en) * | 2009-06-05 | 2013-01-01 | Linares Medical Devices, Llc | Skull patch with durable plastic construction and undercut mount to existing skull perimeter |
| TWI549011B (en) * | 2011-10-19 | 2016-09-11 | 財團法人國家實驗研究院 | Method and computer for aiding determination of strength of patch in craniofacial surgery |
| CN102973334A (en) * | 2012-12-24 | 2013-03-20 | 天津大学 | Bionic design method of skull tissue engineering scaffold |
| CN209136989U (en) * | 2018-10-31 | 2019-07-23 | 广州迈普再生医学科技股份有限公司 | A kind of skull reparation sticking patch with groove structure |
| CN112754734B (en) * | 2020-12-29 | 2024-02-23 | 西安康拓医疗技术股份有限公司 | A PEEK bone plate generation system for splicing |
| CN116098743A (en) * | 2022-11-07 | 2023-05-12 | 深圳大洲医学科技有限公司 | Bionic skull repairing patch and preparation method thereof |
| CN115715716B (en) * | 2022-11-21 | 2025-05-13 | 大博医疗科技股份有限公司 | A skull implant and a method for preparing the same |
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| CN116442476A (en) * | 2023-05-04 | 2023-07-18 | 西安康拓医疗技术股份有限公司 | Porous structure skull prosthesis manufacturing method based on 3D printing and injection molding technology |
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