CN119815735A - Electronic device housing and electronic device - Google Patents

Abstract

The present application provides a housing of an electronic device and an electronic device. The housing is a multi-layer composite structure, including at least one high thermal conductivity film layer, at least one high modulus film layer is provided on both sides of the high thermal conductivity film layer, the high thermal conductivity film layer and the high modulus film layer are stacked, the thermal conductivity of the high thermal conductivity film layer is ≥100W/m*K, and the elastic modulus of the high modulus film layer is ≥70GPa. The housing can make the shell of the electronic device have high rigidity and high thermal conductivity, so as to quickly conduct the internal heat of the electronic device to the outside of the electronic device.

Description

Electronic equipment's casing and electronic equipment

Technical Field

The application relates to the field of electronic equipment, in particular to a shell of electronic equipment and the electronic equipment.

Background

Along with the improvement of the performance of the mobile phone and the extremely light and thin design, the internal space is smaller and smaller, and the heat dissipation requirement of the product is higher and higher. In order to improve the heat dissipation capacity of the mobile phone, the mobile phone is internally dissipated by arranging a vacuum cavity (vaporchamber, VC) vapor chamber, a graphite sheet, a graphene sheet, heat-conducting silicone grease and the like as heat dissipation plates. The heat dissipation mode only solves the problem that heat is uniformly dispersed in the interior, and if the heat dissipation of the mobile phone rear cover is poor, the heat in the interior lacks a guiding-out channel from inside to outside, so that the mobile phone can generate serious heat. The accumulation of heat affects the life of the battery and results in a decrease in the operating speed of the mobile phone. Materials commonly used for making the back cover of the mobile phone are plastics, metals, plain leather, glass, ceramics and the like. In order to pursue texture, the rear cover of each terminal mobile phone is made of glass as a main stream material, and meanwhile, materials such as ceramics, plain leather and the like are also used, so that no good heat dissipation effect exists. The rear cover made of metal has good heat dissipation effect, but is easy to deform and oxidize, and meanwhile, signals are influenced. The plastic rear cover has the advantages of light weight, difficult fragmentation and the like, but has poor rigidity, easy deformation and poor heat dissipation performance. Therefore, at present, a mobile phone rear shell with high heat conduction and high rigidity for rapidly guiding out internal heat to an external environment and improving the heat dissipation capacity of a mobile phone is still lacking.

Disclosure of Invention

The application provides a shell of an electronic device and the electronic device, so that the shell of the electronic device has high rigidity and high heat conduction capacity, and internal heat of the electronic device is rapidly conducted to the outside of the electronic device.

In a first aspect, the application provides a casing of an electronic device, the casing is a multi-layer composite structure, and comprises at least one layer of high heat conduction film layer, at least one layer of high modulus film layer is respectively arranged on two sides of the high heat conduction film layer, the high heat conduction film layer and the high modulus film layer are arranged in a layer-by-layer manner, the heat conduction coefficient of the high heat conduction film layer is more than or equal to 100W/m x K, and the elastic modulus of the high modulus film layer is more than or equal to 70GPa.

The shell of the electronic equipment provided by the application is of a multi-layer composite structure and comprises at least one high-heat-conductivity film layer. The heat conductivity coefficient of the high heat conduction film layer is more than or equal to 100W/m K. Wherein, both sides of the high heat conduction film layer are respectively provided with at least one layer of high modulus film layer, the high modulus film layer and the high heat conduction film layer are arranged layer by layer, and the elastic modulus of the high modulus film layer is more than or equal to 70GPa. The shell utilizes the high heat conduction film layer to realize quick heat conduction, and utilizes the high modulus film layer to improve the rigidity of the shell, so that the shell has higher deformation resistance. Therefore, the shell provided by the application has high rigidity and high heat conduction capacity, so that the internal heat of the electronic equipment can be rapidly conducted to the outside of the electronic equipment.

In an alternative implementation, the thermal conductivity of the high modulus film layer is also greater than or equal to 100W/mK, and the high thermal conductivity film layer is also greater than or equal to 70GPa. In the mode, the high heat conduction module and the high modulus film layer have the characteristics of high heat conduction and high modulus at the same time, and the heat conduction performance and rigidity of the shell are further improved.

In an alternative implementation, the high thermal conductivity film layer and the high modulus film layer may be formed from the same material, which may simplify the material composition and manufacturing process.

In an alternative implementation manner, the thickness of the single-layer high-heat-conductivity film layer is 0.01-0.3 mm, and the thickness of the single-layer high-modulus film layer is 0.01-0.3 mm. The thickness of the single-layer high heat conduction film layer and the single-layer high modulus film layer is too low to achieve the effects of high heat conduction and high rigidity. The thickness of the single high thermal conductivity film layer and the single high modulus film layer are too thick, which results in an increase in the overall thickness of the housing.

In an optional implementation manner, the number of layers of the high-thermal-conductivity film layer is one, and the number of layers of the high-modulus film layer on any side of the high-thermal-conductivity film layer is greater than or equal to 2. The number of layers of the high-modulus film layer is increased, so that the rigidity of the shell can be improved, and the deformation quantity of the shell can be reduced.

In an alternative implementation, the high thermal conductivity film layer includes at least one of a graphene film layer, a graphite film layer, a boron nitride film layer, a nano silver layer, an asphalt-based carbon fiber film layer, a carbon/carbon composite material film layer, a carbon/ceramic composite material film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer. In an alternative implementation, the high modulus film layer includes at least one of a glass fiber film layer, a PAN-based carbon fiber film layer, a ceramic fiber film layer, an aramid fiber film layer, a polyimide fiber film layer, an asphalt-based carbon fiber film layer, a carbon/carbon composite film layer, a carbon/ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer. Any one of the asphalt-based carbon fiber film layer, the carbon/carbon composite material film layer, the carbon/ceramic composite material film layer, the diamond film layer, the silicon carbide film layer, the boron oxide film layer and the aluminum nitride film layer can be used as a high-heat-conductivity film layer or a high-modulus film layer.

In an alternative implementation manner, when the high heat conduction film layer and the high modulus film layer contain fibers, the fibers in any layer are unidirectional laid fibers, and the laying direction of the fibers in any two adjacent layers is set at an included angle of 90 degrees. Through staggered paving, the shell can be endowed with high heat conduction and high modulus in different directions, and the heat conduction performance and rigidity of the shell can be further improved.

In an alternative implementation manner, the shell includes a signal enhancement region, and the materials of the high-thermal-conductivity film layer and the high-modulus film layer corresponding to the signal enhancement region are insulating materials. By arranging the signal enhancement region in a specific region of the housing, the housing can be prevented from influencing signal transmission.

In a second aspect, the present application provides an electronic device comprising a housing according to each possible implementation of the first aspect of the present application.

The technical effects that can be achieved by the second aspect may be described with reference to the corresponding effects in the first aspect, and the detailed description is not repeated here.

The data in the above possible implementations of the present application, such as the thermal conductivity of the high thermal conductivity film layer, the elastic modulus of the high modulus film layer, the thickness of the high thermal conductivity film layer, the thickness of the high modulus film layer, and the like, should be understood as values within the scope of engineering measurement errors during measurement.

Drawings

Fig. 1 is a schematic structural diagram of a mobile phone casing according to an embodiment;

FIG. 2 is a schematic view of a housing of another embodiment;

FIG. 3 is a schematic view showing a thickness direction structure of a housing according to an embodiment of the present application;

Fig. 4 is a schematic structural view of a shell according to another embodiment of the present application in a thickness direction;

FIG. 5 is a schematic view of a housing of another embodiment;

Fig. 6 is a schematic view of a structure in a thickness direction of a housing according to an embodiment of the present application;

Fig. 7 is a schematic view of a structure in a thickness direction of a housing according to an embodiment of the present application;

fig. 8 is a schematic view of a structure in a thickness direction of a housing according to an embodiment of the present application;

fig. 9 is a schematic view of a structure in a thickness direction of a housing according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a thickness direction of a housing corresponding to a signal enhancement region according to an embodiment of the present application.

Reference numerals:

10-shell, 01-avoiding hole, 02-signal enhancement region, 11-high heat conduction film layer, 12-high modulus film layer and 13-appearance layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings.

The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Electronic devices, such as cell phones, tablet computers, notebook computers, watches, etc., typically include components such as a display screen, a processing chip, a battery, and a housing. The display screen and the shell are assembled to form an accommodating space, and the processing chip, the battery and other electrical components are arranged in the accommodating space. The processing chip and the battery generate a lot of heat during operation, which needs to be transferred to the outside of the electronic device through the housing. Fig. 1 is a schematic structural diagram of a mobile phone casing according to an embodiment. As shown in fig. 1, the housing 10 is a back cover of a cellular phone. The housing 10 may be provided with a relief hole 01 at a portion where the camera is provided so that the camera is exposed. Fig. 2 is a schematic structural view of a housing 10 according to another embodiment. As shown in fig. 2, the housing 10 is different from the housing 10 shown in fig. 1 in that a signal enhancement region 02 is provided in addition to the escape hole 01. The signal enhancement region 02 is used for improving the transmittance of signals and reducing the signal loss. The specific arrangement of the signal enhancement region 02 will be described later.

Fig. 3 is a schematic view of a thickness direction structure of a housing 10 according to an embodiment of the present application. As shown in fig. 3, the case 10 of this embodiment includes a high thermal conductive film layer 11 and a high modulus film layer 12. Wherein the high heat conduction film layer 11 is at least one layer. At least one high-modulus film layer 12 is respectively arranged on two sides of the high-heat-conductivity film layer 11. Referring to fig. 3, the number of layers of the high thermal conductive film 11 is one, and two sides of the high thermal conductive film 11 are respectively provided with a high modulus film 12. The high thermal conductivity film 11 and the high modulus film 12 are laminated.

The thermal conductivity of the high thermal conductivity film 11 is greater than or equal to 100W/m K, such as greater than or equal to 120W/m K, and further such as greater than or equal to 150W/m K. The high heat conduction film 11 with the heat conduction coefficient not less than 100W/m x K can realize the rapid conduction of heat, so that the heat in the shell 10 is rapidly transmitted outwards through the high heat conduction film 11, and the heat dissipation is realized.

The number of layers of the high thermal conductive film layer 11 may be one. The thickness of the single-layer high heat conduction film layer 11 can be 0.01-0.3 mm. The layer thickness of the high heat conduction film layer 11 is too small to achieve a good heat conduction effect. The excessive thickness of the high thermal conductivity film 11 affects the overall thickness of the housing 10, and thus the volume and weight of the electronic device.

The high thermal conductive film 11 may be at least one selected from a graphene film, a graphite film, a boron nitride film, and a nano silver film. Meanwhile, the high thermal conductive film 11 may be formed of a material with high thermal conductivity and high modulus, for example, the high thermal conductive film 11 may be at least one of an asphalt-based carbon fiber film, a carbon/carbon composite film, a carbon/ceramic composite film, a diamond film, a silicon carbide film, a boron oxide film, and an aluminum nitride film.

Exemplary, the thickness of the asphalt-based carbon fiber film layer can be 0.01-0.3 mm, the modulus is more than or equal to 400GPa, and the heat conductivity is more than or equal to 400W/m. The pitch-based carbon fiber film layer may be formed into a prepreg by a prepreg resin that may be used for hot pressing or autoclave molding. The resin for pre-soaking can be thermosetting resin such as epoxy resin, phenolic resin, bismaleimide, thermoplastic resin such as polyphenylene sulfide, polyether ether ketone, polycarbonate, etc. The mass fraction of the resin in the prepreg is adjustable from 20 to 60 percent.

The carbon/carbon composite material film layer, the carbon/ceramic composite material film layer, the diamond film layer, the silicon carbide film layer, the boron oxide film layer and the aluminum nitride film layer are sheet heat conduction film layers, the thickness of the sheet heat conduction film layers is 0.01-0.3 mm, the elastic modulus is more than or equal to 150GPa, the heat conduction coefficient is more than or equal to 100W/m K, and the characteristics of high heat conduction and high modulus can be simultaneously realized.

With continued reference to FIG. 3, the high modulus film layer 12 has an elastic modulus of 70GPa or more, such as 100GPa or more, and further such as 120GPa or more. The thickness of the single high modulus film layer 12 is 0.01-0.3 mm. When the elastic modulus of the high-modulus film layer 12 is more than or equal to 70GPa, the shell 10 can have higher rigidity, and the deformation of the shell 10 is prevented.

The high modulus film 12 may be selected from a material film having a low thermal conductivity and a high elastic modulus such as a glass fiber film, a PAN-based carbon fiber film, a ceramic fiber film, an aramid fiber film, a polyimide fiber film, or a material film having both a high thermal conductivity and a high elastic modulus, and the high thermal conductivity film 11 may be at least one of an asphalt-based carbon fiber film, a carbon/carbon composite film, a carbon/ceramic composite film, a diamond film, a silicon carbide film, a boron oxide film, and an aluminum nitride film.

The high modulus film 12 such as glass fiber film, polypropylene cyanide (poIyacrylonitril, PAN) based carbon fiber film, ceramic fiber film, aramid fiber film, polyimide fiber film, etc. can be prepared by pre-impregnating the fibers with a pre-impregnating resin to form a formable prepreg. The resin for the prepreg may be a thermosetting resin such as epoxy resin, phenolic resin, bismaleimide. Thermoplastic resins such as polyphenylene sulfide, polyether ether ketone, polycarbonate, and the like are also possible. The mass fraction of the resin in the prepreg is adjustable from 20 to 60 percent. When the high thermal conductivity film 11 and the high modulus film 12 are both formed by using a fibrous film, the fibers in either layer may be laid unidirectionally. The direction of the fibers between adjacent high thermal conductivity film layers 11 and high modulus film layers 12 may be at a 90 ° angle.

Fig. 4 is a schematic view of a thickness direction structure of a housing 10 according to another embodiment of the present application. As shown in fig. 4, this embodiment differs from the embodiment shown in fig. 3 in that in this embodiment, the number of layers of the high modulus film layer 12 is two on either side of the high thermal conductivity film layer 11. When the high thermal conductivity film 11 and the high modulus film 12 are formed by using the fiber film, the laying direction of the fibers between the adjacent high modulus films 12 may be at an angle of 90 °. By staggered laying, the high heat conduction and high modulus performance of the shell 10 can be given to the shell 10 in different directions, and the heat conduction performance and rigidity of the shell 10 can be further improved. When in preparation, the fibers in each film layer can be paved according to the design angle, placed in a die, and then subjected to certain temperature and pressure forming through equipment such as a hot press, an autoclave and the like, so that the shell 10 with high heat conductivity is obtained.

Referring to fig. 3 and fig. 4 together, in an alternative embodiment, the thermal conductivity coefficients of the high thermal conductive film 11 and the high modulus film 12 may be equal to or greater than 100W/m×k, and the elastic moduli of the high thermal conductive film 11 and the high modulus film 12 may be equal to or greater than 70GPa. That is, the high thermal conductive film layer 11 and the high modulus film layer 12 both have the characteristics of high thermal conductivity and high modulus. For example, each of the high thermal conductive film 11 and the high modulus film 12 may be formed by using at least one of an asphalt-based carbon fiber film, a carbon/carbon composite film, a carbon/ceramic composite film, a diamond film, a silicon carbide film, a boron oxide film, and an aluminum nitride film. The high thermal conductive film 11 and the high modulus film 12 may be made of different materials or made of the same material.

Referring to fig. 2, when the signal enhancement region 02 is provided in the case 10, the material of the signal enhancement region 02 may be prepared from an insulating material. For example, the materials of the high thermal conductive film layer 11 and the high modulus film layer 12 corresponding to the signal enhancement region 02 are both insulating materials, and each film layer of the signal enhancement region 02 may be made of glass fiber, ceramic fiber, aramid fiber, silicon nitride, aluminum oxide, or aluminum nitride, for example.

Fig. 5 is a schematic structural view of a housing 10 according to another embodiment. As shown in fig. 5, the case 10 may be provided with an exterior layer 13 in addition to the high thermal conductive film layer 11 and the high modulus film layer 12. The appearance layer 13 may be provided on a side of the high modulus film layer 12 facing away from the high thermal conductivity layer 11. The appearance layer 13 can be a plating layer, a chemical vapor deposition layer, a spray coating layer, an in-mold transfer printing layer, a woven carbon fiber cloth layer, and the appearance layer 13 can be used for manufacturing various patterns or marks.

The housing 10 of the present embodiment will be described in further detail below in connection with specific materials and specific structures.

Example 1

This embodiment is a case 10, and a schematic structure in the thickness direction thereof is shown in fig. 6. Referring to fig. 6, the housing 10 of this embodiment includes a high thermal conductivity film layer 11, and two high modulus film layers 12 are provided on both sides of the high thermal conductivity film layer 11. Wherein the outer surface of the high modulus film layer 12 located at the outermost layer is provided with an appearance layer 13. Wherein, the high heat conduction film layer 11 and the high modulus film layer 12 are both asphalt base fiber film layers. The thickness of each asphalt-based fiber film layer is 0.1mm. The laying direction of the fibers in each asphalt-based fiber film layer is unidirectional. The fiber laying direction in the asphalt-based fiber film layer as the high thermal conductive film layer 11 is 0 °. The direction of laying the fibers in the high modulus film layer 12 bonded to the high thermal conductive film layer 11 is 90 °. I.e. the direction of the lay-out of the fibres in the high thermal conductivity film 11 is perpendicular to the lay-out direction of the fibres in the adjacent high modulus film 12. In addition, the fiber laying direction in two adjacent high modulus film layers 12 is also vertical and is arranged at an included angle of 90 degrees.

The heat conductivity coefficient of the fibers in the asphalt-based fiber film layer is more than or equal to 600W/m.times.K, and the elastic modulus is more than or equal to 600GPa. The pre-impregnated resin in the preparation process of the asphalt-based fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%. 5 layers of asphalt-based fiber prepreg cloth are paved according to the sequence of 0 degree, 90 degree, 0 degree, 90 degree and 0 degree, hot press molding is carried out through a die, and after molding, avoiding holes 01 are machined for installing cameras. The exterior layer 13 may be processed on one side surface of the outermost layer by plating, PVD, spray coating, in-mold transfer printing, or braiding carbon fiber cloth.

The symmetrical composite structure of the multi-layer asphalt-based fiber membrane layer has heat conduction performance of each layer, and can endow the material with high heat conduction performance and high rigidity in two directions of 0 DEG and 90 deg. Wherein the heat conductivity coefficient in the 0-degree direction is more than or equal to 200W/m K, and the heat conductivity coefficient in the 90-degree direction is more than or equal to 100W/m K. The elastic modulus in the 0 degree direction is more than or equal to 200GPa and 90 the elastic modulus in the degree direction is more than or equal to 100GPa.

Example 2

This embodiment is a case 10, and a schematic structure in the thickness direction thereof is shown in fig. 7. Referring to fig. 7, the housing 10 of this embodiment includes a high thermal conductivity film layer 11, and two high modulus film layers 12 are provided on both sides of the high thermal conductivity film layer 11. Wherein the outer surface of the outermost high modulus film layer 12 is provided with an appearance layer 13. The high heat conduction film 11 is an asphalt base fiber film, two high modulus films 12 attached to the high heat conduction film 11 are asphalt base fiber films, and the other two high modulus films 12 are glass fiber films.

The thickness of each asphalt-based fiber film layer was 0.1mm. The laying direction of the fibers in each asphalt-based fiber film layer and each glass fiber film layer is unidirectional. The fiber laying direction in the asphalt-based fiber film layer as the high thermal conductive film layer 11 is 0 °. The direction of laying the fibers in the high modulus film layer 12 bonded to the high thermal conductive film layer 11 is 90 °. I.e. the direction of the lay-out of the fibres in the high thermal conductivity film 11 is perpendicular to the lay-out direction of the fibres in the adjacent high modulus film 12. In addition, the fiber laying direction in two adjacent high modulus film layers 12 is also vertical and is arranged at an included angle of 90 degrees.

The heat conductivity coefficient of the fibers in the asphalt-based fiber film layer is more than or equal to 600W/m.times.K, and the elastic modulus is more than or equal to 600GPa. The pre-impregnated resin in the preparation process of the asphalt-based fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%. In the glass fiber film layer, the elastic modulus of the glass fiber is more than or equal to 50GPa. The prepreg resin forming the glass fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%.

In the case 10 of this embodiment, the thermal conductivity in the 0 ° direction is equal to or greater than 50W/m×k, and the thermal conductivity in the 90 ° direction is equal to or greater than 100W/m×k. The elastic modulus in the 0 degree direction is more than or equal to 50GPa and 90 the elastic modulus in the degree direction is more than or equal to 100GPa.

Example 3

This embodiment is a case 10, and a schematic structure in the thickness direction thereof is shown in fig. 8. The difference from the embodiment shown in fig. 7 is that the outermost high modulus film layer 12 is a PAN carbon fiber film layer.

In the PAN carbon fiber film layer, the elastic modulus of the carbon fiber is more than or equal to 200GPa. The prepreg resin forming the glass fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%.

In the case 10 of this embodiment, the thermal conductivity in the 0 ° direction is equal to or greater than 50W/m×k, and the thermal conductivity in the 90 ° direction is equal to or greater than 100W/m×k. The elastic modulus in the 0 degree direction is more than or equal to 80GPa and 90 the elastic modulus in the degree direction is more than or equal to 100GPa.

Example 4

This embodiment is a case 10, and a schematic structure in the thickness direction thereof is shown in fig. 9. The difference from the housing 10 shown in fig. 6 is that the high thermal conductivity film 11 is a layer and is a carbon/ceramic composite film. The high modulus film layer 12 is four layers, and two sides of the high heat conduction film layer 11 are respectively provided with two sides of the high modulus film layer 12. The high modulus film layers 12 are all PAN carbon fiber film layers.

The thickness of the PAN carbon fiber film layer is 0.1mm, and the elastic modulus of the carbon fiber is more than or equal to 200GPa. The prepreg resin forming the glass fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%. The direction of lay-up of the fibers in the PAN carbon fiber layer is laid at an angle according to the embodiment shown in fig. 6.

The thickness of the carbon/ceramic composite material film layer is 0.1mm, the elastic modulus is more than or equal to 200GPa, and the heat conductivity coefficient is more than or equal to 400W/m.

In the case 10 of this embodiment, the thermal conductivity in the 0 ° direction is equal to or greater than 50W/m×k, and the thermal conductivity in the 90 ° direction is equal to or greater than 50W/m×k. The elastic modulus in the 0 degree direction is more than or equal to 50GPa and 90 the elastic modulus in the degree direction is more than or equal to 50GPa.

Example 5

This embodiment is a housing 10 having an external structure as shown in fig. 2. The housing 10 of this embodiment is provided with a signal enhancement zone 02. A schematic structural diagram of the thickness direction of the housing 10 corresponding to the signal enhancement region 02 is shown in fig. 10. The difference from the embodiment shown in fig. 1 is that the material of the signal enhancement region 02 of the present application is changed, and the material composition of the housing 10 before the signal enhancement region 02 is the same as that of embodiment 1.

In the case 10 of the embodiment of the present application, the high thermal conductive film 11 and the high modulus film 12 of the signal enhancement region 02 are both glass fiber films. The direction of the fibers in the glass fiber film layer is the same as the direction of the fibers before the signal enhancement zone 02. The glass fiber is characterized by non-conduction, no eddy current is generated on the signal, and the weakening risk of the signal is reduced.

Based on the same technical purpose, the application further provides electronic equipment, and the electronic equipment comprises the shell. The shell can be used as a rear cover of the electronic equipment. The electronic device may also include a display screen, a processing chip, a battery, and the like. The processing chip, the battery and the like can be packaged by the display screen and the shell. The heat generated by the processing chip and the battery can be dissipated outwards through the shell.

The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims (10)

1. The shell of the electronic equipment is characterized by being of a multi-layer composite structure and comprising at least one layer of high heat conduction film layer, wherein at least one layer of high modulus film layer is arranged on two sides of the high heat conduction film layer respectively, the high heat conduction film layer and the high modulus film layer are arranged in a layer-by-layer mode, the heat conduction coefficient of the high heat conduction film layer is more than or equal to 100W/m K, and the elastic modulus of the high modulus film layer is more than or equal to 70GPa.

2. The housing of claim 1, wherein the high modulus film has a thermal conductivity of greater than or equal to 100W/m x K and an elastic modulus of greater than or equal to 70GPa.

3. The housing of claim 2, wherein the high thermal conductivity film and the high modulus film are formed from the same material.

4. A housing according to any one of claims 1 to 3, wherein the thickness of a single layer of the high thermal conductive film layer is 0.01 to 0.3mm, and the thickness of a single layer of the high modulus film layer is 0.01 to 0.3mm.

5. The housing of any one of claims 1-4, wherein the number of layers of the high thermal conductivity film is one, and the number of layers of the high modulus film on either side of the high thermal conductivity film is greater than or equal to two.

6. The housing of any one of claims 1-5, wherein the high thermal conductivity film comprises at least one of a graphene film, a graphite film, a boron nitride film, a nano silver film, an asphalt-based carbon fiber film, a carbon/carbon composite film, a carbon/ceramic composite film, a diamond film, a silicon carbide film, a boron oxide film, an aluminum nitride film.

7. The housing of any one of claims 1-6, wherein the high modulus film layer comprises at least one of a glass fiber film layer, PAN-based carbon fiber film layer, ceramic fiber film layer, aramid fiber film layer, polyimide fiber film layer, pitch-based carbon fiber film layer, carbon/carbon composite film layer, carbon/ceramic composite film layer, diamond film layer, silicon carbide film layer, boron oxide film layer, aluminum nitride film layer.

8. The housing of any one of claims 1-7, wherein when the high thermal conductivity film layer and the high modulus film layer contain fibers, the fibers in any one layer are unidirectional laid fibers, and the laying direction of the fibers in any two adjacent layers is set at an included angle of 90 °.

9. The housing of any one of claims 1-8, wherein the housing comprises a signal enhancement region, and wherein the material of the high thermal conductivity film layer and the high modulus film layer corresponding to the signal enhancement region is an insulating material.

10. An electronic device comprising a housing as claimed in any one of claims 1-9.