CN1195283C - Non-contact cards producing method and non-contact cards thereby - Google Patents
Non-contact cards producing method and non-contact cards thereby Download PDFInfo
- Publication number
- CN1195283C CN1195283C CN 02157667 CN02157667A CN1195283C CN 1195283 C CN1195283 C CN 1195283C CN 02157667 CN02157667 CN 02157667 CN 02157667 A CN02157667 A CN 02157667A CN 1195283 C CN1195283 C CN 1195283C
- Authority
- CN
- China
- Prior art keywords
- module
- coil
- mylar
- corrosion
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 238000005260 corrosion Methods 0.000 claims abstract description 21
- 230000007797 corrosion Effects 0.000 claims abstract description 21
- 239000003990 capacitor Substances 0.000 claims abstract description 10
- 239000010409 thin film Substances 0.000 claims abstract description 9
- 238000003475 lamination Methods 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 3
- 229920002799 BoPET Polymers 0.000 claims description 20
- 239000005041 Mylar™ Substances 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000013461 design Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000003518 caustics Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 239000000206 moulding compound Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000010079 rubber tapping Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 229920006267 polyester film Polymers 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Credit Cards Or The Like (AREA)
Abstract
The present invention discloses a non-contact card manufacturing method and a non-contact card manufactured by using the method, which belongs to the technical field of smart card application. The manufacturing method comprises the following steps: module encapsulation, corrosion coil manufacture, combined processing of a corrosion coil and the module, and card manufacture and lamination. The non-contact card manufactured by utilizing the method comprises a radio-frequency module, a module soldering pan, a polyester film, PVC card substrate, and a coil and a thin-film capacitor which are manufactured by the corrosion method, wherein the coil and the thin-film capacitor are electrically connected with the radio-frequency module on the polyester film. The present invention has the advantages that because the manufacturing method of the corrosion coil is adopted, the manufacturing method is simpler than the prior art in the respect of manufacturing technology, and the product performance is more stable and reliable than that of the prior art. The present invention has the advantages of high consistency and obviously reduced manufacturing cost and is suitable for large-scale manufacture processing.
Description
Technical field
The invention belongs to field of intelligent cards, relate in particular to the method for making of non-contact card.
Background technology
Now, non-contact card, become indispensable consumption instrument in people's life as transportation card, consumption recreation card etc. with its simple and practical advantage that is difficult to substitute, yet we also know, the conventional method taked when making antenna of the non-contact card of Chu Xianing is the enameled wire coiling in the market, and this mode of production is because of being subjected to the apparatus factor restriction greatly, the production capacity of equipment is very low, production can't realize producing in enormous quantities, if drop into large number quipments, can increase cost again.Moreover influence because of being subjected to human factor with the coil that winding mode is made, coil has modification slightly, will influence the frequency of operation deviation of card, thereby causes the card job insecurity.
Summary of the invention
One of technical issues that need to address of the present invention provide a kind of method of making non-contact card, to overcome low and the defective that manufacturing cost is high of prior art production efficiency.
Another technical matters that the present invention need solve provides the non-contact card that the following method of a kind of usefulness is made.
For solving above-mentioned first technical matters, technical scheme of the present invention may further comprise the steps:
One, module package
Two, corrosion coil is made
Three, the combination of corrosion coil and module processing
Four, fabrication lamination
The non-contact card that another technical matters that the present invention will solve promptly utilizes said method to make, it comprises radio-frequency module, the module pad, mylar, PVC card base, also comprise coil and the thin film capacitor made by caustic solution, coil and thin film capacitor and radio-frequency module are electrically connected on the mylar.
Process of the present invention compared with prior art has following beneficial effect, owing to adopted the method for making of corrosion coil, make it simpler and more direct than prior art on manufacturing process, properties of product are more reliable and more stable than prior art, consistance is higher, manufacturing cost obviously reduces, and is more suitable for big production and processing.
Description of drawings
Fig. 1 is the structural representation of non-contact card of the present invention
Embodiment
Below in conjunction with specific embodiment the present invention is elaborated.
As Fig. 1, non-contact card involved in the present invention comprises radio-frequency module 1, module pad 4, mylar 5, PVC card base 6, also comprises coil 3 and the thin film capacitor of being made by caustic solution 2 that coil and thin film capacitor and radio-frequency module are electrically connected on the mylar.
Method involved in the present invention is made non-contact card,
First step operation is a module package.
At first, cut again disk chip thinning to 0.15～0.18mm; Chip after will cutting with machine combines with band with the silver slurry, reaches tangential thrust standard＞500g/mm
2For after semi-manufacture after finishing carry out gold ball bonding, with spun gold the solder joint of chip and band are coupled together, go into a path, and test reaches following standard: vertical direction is broken spun gold, and pulling force need reach standard＞4g; With the black moulding compound chip and spun gold are partly sealed fully, promptly module package must guarantee that the spun gold lead-in wire is intact again.The smooth nothing of module external form cavity, and package area 5.0*4.8MM; Package thickness 0.4MM.Last coding carries out 100% test to the electrical property of module, rejects failed module, utilizes die cutting device die-cut down qualified module.
The second step operation is that corrosion coil is made.
At first carry out the design of corrosion coil, promptly require to calculate antenna equivalent electric sensibility reciprocal according to the module series capacitance, computing formula is L=1/4 Л
2f
2C, f are the modular design optimum resonant frequency; C is a module equivalent series resonant capacitance amount; Parameters such as the size design wire circle of inductance value on request, and the sectional area of definite coil again, live width, line-spacing, thickness.Reserve module in the relevant position by the dress hole, so that the two-layer PVC in the outside can strong bonded in the follow-up lamination.Electric capacity can be according to capacitor design value in the chip generally about tens PF, and the Card Reader of actual card distance adjusts, to reach best Card Reader distance.If optimum resonant frequency is 15-19MHz, the about 3000-5000mm of the sectional area of coil
2The number of turns: 3-6 circle; Live width 1-2mm; Line-spacing 0.2-0.8mm; Begin the manufacturing of corrosion coil then, choose the mylar of thickness from 0.02 to 0.1mm, the conductive coil of the silver-colored material of corrosion on mylar then also can corrode the conductive coil of copper or aluminium material, and the corrosion thickness of conductive coil requires 0.02-0.05mm.Shaping under the 140-150 celsius temperature afterwards.The gross thickness of mylar coil like this, promptly the mylar layer thickness is 0.05 to 0.15mm after adding the corrosion thickness of conductive coil.Next be to make resonance coupling thin-film capacitor, the conducting surface of in parallel one suitable big small size at radio-frequency module electrode two ends, the material of conducting surface is consistent with the material of corrosion coil, overlap to form equivalent capacity at the mylar pros and cons, the size of electric capacity is directly proportional with overlapping area, is inversely proportional to the distance of faying surface.Amount of capacity requires design according to actual chips, to reach best matching effect.
Three-procedure is the combination processing of corrosion coil and module
Printing conductive bonding agent on mylar corrosion coil pad at first, the die-cut module pressing that gets off is being scribbled the mylar of electrically conducting adhesive, be on the film antenna base material, partly (black sealing is after chip is finished the spun gold welding the black sealing of module again, be encapsulated in a kind of protection plastic packaging material of chip outside) embed. the mylar tapping, module weld zone and coil pad join; Through 200-260 degree centigrade of wave-soldering welding module and coil hot setting are coupled together effectively.The product of finishing so can be used as intelligent label, corrodes powerful bonded adhesives as single face, can directly be attached on the article, as intelligent label.
The 4th step operation is the fabrication lamination.
The sandwich layer of above-mentioned the 3rd product finished of step as non-contact card, according to the thickness calibration of card, choose suitable PVC and can be attached to the sandwich layer both sides to PVC in the above by the demand printed text, with laminating machine three sample thing hot pressings are got up, the gross thickness of blocking behind the lamination requires 0.76-0.84mm.The temperature of laminating machine can be set in 130 ℃-140 ℃, and pressure can be set in 8-10Mpa, and pressing is later on again through the die-cut non-contact card that just can become standard.
Claims (4)
1. the method for making of a non-contact card is characterized in that may further comprise the steps:
The A module package may further comprise the steps:
A), and cut disk chip thinning to 0.15～0.18mm;
B) chip after will cutting with machine combines with band with the silver slurry;
C) with spun gold the solder joint of chip and band are coupled together, go into a path, and test spun gold pulling force;
D) with the black moulding compound chip and spun gold are sealed fully package area 5.0 * 4.8mm; Package thickness 0.4 mm;
E) coding carries out 100% test to the electrical property of module, rejects failed module, utilizes die cutting device die-cut down qualified module.
The B corrosion coil is made, and may further comprise the steps:
A) require to calculate antenna equivalent electric sensibility reciprocal according to the module series capacitance, computing formula is L=1/4. π
2f
2C on request, f is the modular design optimum resonant frequency; C is a module equivalent series resonant capacitance amount, according to the size design wire circle of inductance value, and parameters such as the sectional area of definite coil, live width, line-spacing, thickness, reserve the module mounting hole in the relevant position;
B) chooses mylar, corrode conductive coil in the above, and high temperature 140-150 degree centigrade of following shaping, conductive coil thickness is 0.02-0.05mm that mylar thickness is 0.02-0.1mm.
C) at radio-frequency module electrode two ends in parallel one conducting surface consistent with the material of corrosion coil to overlap to form equivalent capacity at the mylar pros and cons.
The combination processing of C corrosion coil and module may further comprise the steps:
A) printing conductive bonding agent on mylar corrosion coil pad;
B) the die-cut module pressing that gets off is being scribbled the mylar of electrically conducting adhesive, the more black sealing of module is partly being embedded the mylar tapping, module weld zone and coil pad join;
C) through 200-260 degree centigrade of wave soldering module and coil hot setting are coupled together effectively;
D fabrication lamination may further comprise the steps:
A) the sandwich layer of the above-mentioned product of finishing as non-contact card, according to the thickness calibration of card, choose suitable Polyvinylchloride (PVC), and in the above by the demand printed text;
B) Polyvinylchloride (PVC) is attached to the sandwich layer both sides, uses the laminating machine hot pressing, the temperature of laminating machine can be set in 130 ℃-140 ℃, and pressure can be set in 8-10Mpa;
C) pressing is later on again through the die-cut non-contact card that just can become standard.
2. method for making as claimed in claim 1 is characterized in that: corrosion coil is silver, copper or aluminium.
3. non-contact card, comprise radio-frequency module (1), module pad (4), mylar (5), PVC card base (6), it is characterized in that: also comprise multi-turn coil (3) and the thin film capacitor (2) made by caustic solution, coil and thin film capacitor and radio-frequency module are electrically connected on the mylar.
4. non-contact card as claimed in claim 3 is characterized in that: the material of coil (3) is silver, aluminium or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02157667 CN1195283C (en) | 2002-12-20 | 2002-12-20 | Non-contact cards producing method and non-contact cards thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02157667 CN1195283C (en) | 2002-12-20 | 2002-12-20 | Non-contact cards producing method and non-contact cards thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1424699A CN1424699A (en) | 2003-06-18 |
| CN1195283C true CN1195283C (en) | 2005-03-30 |
Family
ID=4752965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02157667 Expired - Fee Related CN1195283C (en) | 2002-12-20 | 2002-12-20 | Non-contact cards producing method and non-contact cards thereby |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1195283C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322467C (en) * | 2003-12-30 | 2007-06-20 | 上海东方磁卡工程有限公司 | Manufacturing method of non contact type intelligent low frequency card |
| GB0405883D0 (en) * | 2004-03-16 | 2004-04-21 | Dupont Teijin Films Us Ltd | Polymeric film substrate |
| EP3509162A1 (en) * | 2008-05-28 | 2019-07-10 | Murata Manufacturing Co., Ltd. | Wireless ic device and component for a wireless ic device |
| CN106503784A (en) * | 2016-10-10 | 2017-03-15 | 杭州潮盛科技有限公司 | RFID label tag and its manufacture craft |
-
2002
- 2002-12-20 CN CN 02157667 patent/CN1195283C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1424699A (en) | 2003-06-18 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050330 Termination date: 20141220 |
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| EXPY | Termination of patent right or utility model |