CN119446347B - A modeling and thermal conductivity optimization method for series-parallel semi-crystalline models of polymer materials - Google Patents
A modeling and thermal conductivity optimization method for series-parallel semi-crystalline models of polymer materialsInfo
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Abstract
The invention provides a modeling and thermal conductivity optimization method for a polymer material serial-parallel semi-crystal model. Compared with a simple two-phase or three-phase series model, the method can better represent the relevant physical properties of the semi-crystalline polymer, has simple and convenient treatment and wide process applicability, and meets the design requirements of various semi-crystalline polymer models. Meanwhile, a treatment method for further improving the heat conduction performance of the semi-crystalline polymer model by utilizing an electric field is provided, and compared with the method for directly applying external force to cause the polymer to generate strain so as to improve the heat conduction performance, the method can better obtain the polymer material with excellent heat conduction performance on the premise of ensuring the mechanical property of the material force. The invention builds a polymer model under microscopic scale, reduces the experimental cost, fully utilizes the molecular dynamics method to explore the influencing factors of the heat conducting property of the polymer material, and improves the theory mechanism for preparing the high-performance radiator.
Description
Technical Field
The invention belongs to the technical field of polymer material computer simulation, and particularly relates to a modeling method and a thermal conductivity optimization method of a polymer material serial-parallel semi-crystal model.
Background
With the vigorous development of aerospace technology, electronic components of the mounted equipment are developed to be highly integrated and miniaturized. With the rapid increase of circuit density and load capacity and the reduction of geometric dimensions, the heat dissipation of the structure is more difficult, and a large amount of generated heat is accumulated, so that the working performance and stability of the instrument and equipment are seriously affected. The '10 ℃ rule' in the electronic industry indicates that the failure rate of an electronic device is increased by one order of magnitude when the working temperature of the electronic device is increased by 10 ℃, and statistics shows that the failure of the electronic product caused by poor heat dissipation reaches 55%, which puts more severe requirements on the heat conduction performance of the heat management material. The heat generated by the integrated circuit in the electronic component is firstly transferred to the thermal interface material, then is dissipated to the external environment by the radiator through the electronic packaging material, the external thermal interface material and the high thermal conductivity material in a passive or active heat dissipation mode. Its primary dissipation path can be understood as being transferred in a well insulated thermal interface material. Therefore, the thermal conductivity of thermal interface materials must be improved to address the challenges faced by high performance chip thermal management systems.
In the field of material science today, polymer materials are attracting a great deal of attention due to their unique physical and chemical properties (insulation, high toughness, low density, low price, good corrosion resistance, etc.), and their thermal conductivity is a critical material property, which is of great importance for many applications, especially where a balance between thermal conductivity and insulation is required. However, the intrinsic thermal conductivity of the polymer material is low, which is about 0.1-0.5W/(m.K) at room temperature, so that the application of the polymer in the aspect of heat dissipation of electronic equipment is severely limited, and in addition, the application of the polymer-based thermal interface material is further limited due to the low contact thermal conductivity between the thermal interface material and a metal heterogeneous interface. Therefore, it is necessary to explore the thermal conduction mechanism of the thermal interface material with the polymer as the matrix, and provide a theoretical mechanism in microcosmic aspect for preparing the thermal interface material with high thermal conductivity.
In order to fully explore the influence mechanism of the heat conduction performance of the polymer-based material, asegun Henry et al in the paper Anomalous heat conduction in polyethylenechains: theory and molecular dynamics simulations published in the journal PHYSICAL REVIEW B, research the heat conduction performance of a single polyethylene chain, find the abnormal high heat conduction performance of a polyethylene single chain along the chain direction-300W/(m.K), and the intrinsic heat conduction of a far-ultra-polymer block, but only the ideal single chain polymer molecular chain is explored based on a theoretical and simulation method, and the influence factors of the heat conduction performance of the polymer block are not further explored. While Jun Liu et al in the paper "Tuning THE THERMAL conductivity ofpolymers WITH MECHANICAL STRAINS" published in the journal PHYSICAL REVIEW B "studied the effect of strain on the heat conduction properties of bulk amorphous polyethylene, found that with ordered arrangement of molecular chains within the polymer bulk, the heat conduction properties were improved by 5 times, but the direct application of strain would seriously affect the mechanical properties of the polymer material. In addition, jixiong He et al, journal of APPLIED PHYSICS, publication "Molecular dynamics simulation ofthermal transport in semicrystalline polyethylene:Roles of strain and thecrystallineamorphous interphase region" explored the effect of inter-chain coupling of crystalline and amorphous regions of an ideal series semi-crystalline polyethylene model on thermal conductivity by using a molecular dynamics simulation method, and found that the topology of the interlayer chain determines the dependence of thermal conductivity on strain. These studies have explored a part of the influencing mechanism of the heat conducting property of the polymer material on a microscopic scale by using a molecular dynamics simulation method. In addition, a local crystallization state exists in the polymer, and the current research on a semi-crystalline polymer model still stays in a two-phase or three-phase serial model, and a polymer model with serial-parallel characteristics still needs to be further researched.
Ferroelectric polymer-polyvinylidene fluoride (PVDF), which is a thermoplastic polymer composed of-CH 2CF 2-repeat units, this simple chemical structure gives a high degree of flexibility to its molecular chains, which can assume different molecular chain conformations and crystal structures under different conditions, and which has sensitivity to electric fields due to the CF2 groups contained therein. When an electric field is applied at a strength greater than the coercive electric field, the molecular segments change, as shown in fig. 1-2, which compress in the direction of the electric field and expand in the direction perpendicular to the electric field, having an electrostrictive effect. Based on the above, we can obtain PVDF with stretched molecular chains by controlling the coupling action of an electric field, and compared with other traditional polymer PVDF, the PVDF has the advantages of high temperature resistance, ageing resistance, good insulativity, high crystallinity and the like, so that the PVDF is an ideal thermal interface material matrix, and therefore we need to explore the influencing factors of the thermal interface material with PVDF as the polymer matrix, so as to improve the theory mechanism for preparing the high-performance radiator.
The research work of heat conduction influencing factors between the high heat conduction polymer-based thermal interface material and metal is important to realize global energy conservation and emission reduction, improve the energy utilization efficiency and solve the problem of electronic heat sealing.
Disclosure of Invention
The invention aims to avoid the defects of the prior art and provides a modeling and thermal conductivity optimization method for a polymer material series-parallel semi-crystal model.
In order to achieve the purpose, the technical scheme adopted by the invention is that the modeling and thermal conductivity optimization method of the polymer material serial-parallel semi-crystal model is characterized by comprising the following steps:
step 1, firstly, establishing a full-crystal polymer model with corresponding size according to the type of a required polymer;
Step 2, selecting a crystalline region of the central part as a permanent crystalline region according to the simulation requirement, taking other regions as temporary crystalline regions, and breaking interatomic covalent bonds between the permanent crystalline region and the temporary crystalline region;
Step 3, designating the main chain atom at the end of the molecular chain of the permanent crystalline region as R1, designating the main chain atom at the end of the molecular chain of the temporary crystalline region as R2, and then randomly forming covalent bonds between the R1 and the R2 atoms according to the simulation requirement to obtain a model I with different inter-chain coupling;
Step 4, using open source software Lammps as simulation software to simulate molecular dynamics of the model I to obtain a semi-crystalline polymer model with X, Y, Z directions conforming to the serial form, which is called serial-parallel semi-crystalline polymer model IV;
step 5, taking the model IV as an initial model, exploring the influence of an equal-intensity electric field applied in the X and Y directions on the form of the serial-parallel semi-crystalline polymer, and carrying out heat transfer analysis by using a non-equilibrium molecular dynamics method (NEMD) to obtain a change curve of temperature along with the position of each layer and a change curve of heat flow along with time;
And 6, respectively performing linear fitting on a temperature change curve along with each layer position and a heat flow change curve along with time through python software to obtain a temperature gradient value and a heat flow change rate along with time, and calculating the heat conductivity coefficient of the material according to a Fourier law to obtain the influence of the change of the electric field intensity on the heat conductivity of the polymer material.
Further, the 'permanent crystalline region' in step 2 is fully surrounded by the 'temporary crystalline region' to ensure the presence of amorphous polymer chains at the ends in the inter-chain direction or chain direction of the crystalline region during subsequent simulated localized melting.
In the step 3, the model I with different inter-chain couplings is obtained, the inter-chain couplings in the model I are set according to the simulation requirement, particularly, the judgment is carried out according to the bond length of the end atomic bonding, and the connection is not carried out when the distance exceeds the bond length, so that the unreasonable structure of the model I is prevented.
In step 4, open source software Lammps is used as simulation software to simulate the molecular dynamics of model I according to the following substeps:
(1) Predicting the size of the deformed polymer according to the model I, simulating the box, setting corresponding sizes, and enabling all model atoms to be positioned in the box to obtain a model II;
(2) Rendering color of the model II according to the sequence number of the molecular chain by ovito software visualization model, observing whether the division of the molecular chain of the polymer is correct or not, and correcting the molecular chain with wrong division so as to accurately extract the sequence number of the permanent crystalline region or determine the sequence number of the molecule at the later stage and further determine the sequence number of the atom by judging the z coordinate;
(3) The molecular chain serial numbers of the permanent crystalline region without inter-chain coupling between the molecular chains of the permanent crystalline region and the temporary crystalline region are recorded, and the atomic serial numbers in the permanent crystalline region with inter-chain coupling between the molecular chains of the permanent crystalline region and the temporary crystalline region are further determined through the coordinate positions;
(4) Setting potential functions describing interactions among atoms in a model II, and setting initial simulation conditions and parameters, wherein the set temperature is required to exceed the melting point of the crystalline polymer;
(5) For the potential function, if the interaction of long Cheng Kulun forces is considered, in order to avoid errors when an initial serial-parallel semi-crystalline polymer model is obtained, firstly, setting the interaction of the forces of length elimination Cheng Kulun is taken, and only the spatial position distribution of a molecular chain is considered for a model II at the beginning;
(6) After X, Y, Z three-direction boundary conditions are set as non-periodic boundary (f) conditions, in order to prevent polymer atoms from moving out of a simulation box in the process of local melting of a model II to cause simulation errors, reflecting walls are arranged on each surface of the simulation box;
(7) Carrying out local melting simulation on the model II by adopting a regular ensemble (NVT), fixing a permanent crystalline region ' through a simulation command when the ' temporary crystalline region ' is melted at a high temperature, and obtaining a model III after 1-2ns, wherein the permanent crystalline region still maintains a crystalline conformation, and the ' temporary crystalline region ' is converted into an amorphous state;
(8) Taking a model III as a model file, setting a long Cheng Kulun force interaction in a potential function, changing X, Y, Z three-direction boundary condition setting into a periodic boundary (p) condition, canceling a reflecting wall set in the substep (6) of the step 4, canceling the setting of a fixed permanent crystalline region in the substep (7) of the step 4, setting a simulation temperature below the melting point of a crystalline polymer, and avoiding structural damage of a subsequent crystalline region;
(9) Relaxation is carried out on the model III under isothermal and isobaric ensemble (NPT), and after 1-2ns, a semi-crystalline polymer model with X, Y, Z directions conforming to a serial form is obtained, and the semi-crystalline polymer model is called serial-parallel semi-crystalline polymer model IV;
in the substep (1) of the step 4, a symmetrically distributed vacuum layer is added to the model box to prevent more amorphous chains from being concentrated on one side.
In the substep (2) of the step 4, the observation of the polymer molecular chain is specifically that a model II file is opened in a text mode, a second column of data under Atoms is observed, and whether the molecular sequence number division is correct or not is judged by taking the total number of molecules conforming to the model as a standard.
In the substep (4) of the step 4, initial simulation conditions and parameters comprise model size, atom type, unit system, boundary conditions, neighbor list radius, time step, pressure and temperature, and the melting point of the crystalline polymer is determined according to literature or determined by utilizing Lammps to simulate a polymer heating process.
The substep (8) of step 4 further comprises performing the next simulation directly if the polymer chains are distributed in the simulation box, and narrowing the vacuum layer in the model file if the polymer chain clusters in the simulation box are around the 'permanent crystalline region' and have a larger vacuum layer, thereby preventing errors due to exceeding the long Cheng Kulun force interaction range when relaxing under isothermal and isobaric ensemble (NPT).
In the step 5, when the influence of the equal-intensity electric field on the form of the serial-parallel semi-crystalline polymer is explored in the X and Y directions, the intensity of the applied electric field does not exceed the value of the breakdown electric field intensity of the polymer, the simulation temperature is set above the melting temperature of the amorphous polymer and below the melting point of the crystalline polymer, after the electric field is applied, the model is cooled to the room temperature, and then the influence of the electric field with different intensities on the heat conducting performance of the model is measured.
In the step 5, the non-equilibrium molecular dynamics method specifically comprises the steps of dividing the model into N layers along the heat conduction direction, counting and outputting the temperature gradient of each layer under the stable heat flow, and calculating the heat conductivity by utilizing the Fourier law, wherein N is dependent on the length of the model and is more than or equal to 8.
The beneficial effects of the invention are as follows:
1. The invention provides a novel and more reasonable semi-crystalline polymer modeling method based on a molecular dynamics simulation method for the first time, namely a series-parallel semi-crystalline polymer model modeling method. The invention does not need complex model conformation treatment process, has simple and convenient treatment and wide process applicability, and meets the design requirements of various semi-crystalline polymer models.
2. Compared with a simple two-phase or three-phase serial model, the serial-parallel polymer simulation unit provided by the invention can better represent the relevant physical properties of the semi-crystalline polymer, and provides a new thought for exploring the influence mechanism of the physical properties of the polymer and the composite material thereof based on a molecular dynamic method under the subsequent microscopic scale.
Compared with the treatment method for further improving the heat conduction performance of the semi-crystalline polymer model by directly applying external force to cause the polymer to generate strain so as to further improve the heat conduction performance, the method can better obtain the polymer material with excellent heat conduction performance on the premise of ensuring the mechanical property of the material force. The invention builds a polymer model under microscopic scale, reduces the experimental cost, fully utilizes the molecular dynamics method to explore the influencing factors of the heat conducting property of the polymer material, and improves the theory mechanism for preparing the high-performance radiator.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a diagram of a model of a beta-type pure crystalline PVDF in an embodiment of the invention, wherein (a) is beta-type single cell of PVDF and (b) is a model after cell expansion;
FIG. 3 is a diagram of model I in an embodiment of the invention, the middle green part being the 'permanent crystalline region' and the remainder being the 'temporary crystalline region';
FIG. 4 is a color chart of model II rendering in an embodiment of the present invention, wherein (a) is a model chart with wrong molecular serial number, (b) is a model chart with corrected molecular serial number, and (c) is a model cross-sectional view with corrected molecular serial number;
FIG. 5 is a schematic diagram of a molten temporary crystalline region according to an embodiment of the present invention, wherein (a) is a schematic diagram of a direct molten state (b) is a cross-sectional view of a molten mold, and (c) is a schematic diagram of a vacuum layer after resizing;
FIG. 6 is a graph showing total energy versus relaxation time for an embodiment of the present invention;
FIG. 7 is a schematic diagram showing the model morphology change after the electric field is applied according to the embodiment of the present invention;
FIG. 8 is a cross-sectional view of a model after applying electric fields of different strengths of 2ns in accordance with an embodiment of the present invention;
FIG. 9 is a block diagram of a method of balancing molecular dynamics (NEMD) in accordance with an embodiment of the present invention;
FIG. 10 shows an embodiment of the present invention with an electric field strength of A time series-parallel connection semi-crystalline PVDF polymer model cold and heat source heat flow time-dependent diagram;
FIG. 11 shows an embodiment of the present invention with an electric field strength of Axial temperature gradient diagram of time series-parallel semi-crystalline PVDF polymer model;
FIG. 12 is a graph showing thermal conductivity of a series-parallel semicrystalline PVDF polymer as a function of applied electric field strength in accordance with an embodiment of the present invention.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
Example 1:
Taking polyvinylidene fluoride (PVDF) as an example, crystalline polymer of the beta type.
A modeling method and a thermal conductance optimization method of a polymer material serial-parallel semi-crystal model comprise the following steps:
step 1, establishing a beta-type crystalline polymer model of polyvinylidene fluoride (PVDF):
The lattice parameter of the unit cell is The space group is Cm2m, one unit cell contains two PVDF monomers (-CH 2-CF 2-), 4 PVDF monomers respectively contain C, H, F atoms as shown in figure 2 (a), then 4, 5 and 50 PVDF monomers are respectively expanded in the X, Y, Z direction to obtain a crystalline polymer model, the periodicity is removed, and the end C atoms of each main chain are added with hydrogen atoms to obtain a pure crystalline polymer model as shown in figure 2 (b);
step 2, selecting partial atoms in the central part as a permanent crystalline region according to the crystalline mass fraction, and then completely breaking bonds between the permanent crystalline region and end atoms of the temporary crystalline region, wherein 12 molecular chains in the central part are selected as the permanent crystalline region, and each molecular chain contains 26 PVDF monomers;
Step 3, designating the main chain atom at the end of the molecular chain of the permanent crystalline region as R1, designating the main chain atom at the end of the molecular chain of the temporary crystalline region as R2, and then connecting all the R1 and R2 atoms according to the simulation requirement to form a bridge-like link to obtain a model I, as shown in figure 3;
Step 4, using open source software Lammps as simulation software, and performing molecular dynamics simulation on the model I according to the following substeps:
(1) If the model I has periodicity in the initial stage, in order to avoid the disorder of key distribution caused by directly setting a vacuum layer, the model I can display the unfolding coordinates of each atom by means of the 'Unwrap trajectories' function in the visualization software ovito and then output a model file as Lammps again, then a box is simulated according to the size of the polymer after the model I is predicted and the corresponding size of the simulated box is adjusted, so that the model atoms are all positioned in the box to obtain a model II;
(2) Rendering color according to molecular chain sequence number by ovito software visualization model, observing whether the division of polymer molecular chain is correct or not, and correcting the molecular chain with wrong division to accurately extract the molecular sequence number of permanent crystal region or determine the molecular sequence number at the later stage, and further determining the atomic sequence number by judging z coordinate, wherein the initial molecular sequence number is arranged incorrectly in this example, as shown in fig. 4 (a), wherein the color allocation of the same molecular chain is inconsistent, so that the correct model is obtained after correction by the relevant code, as shown in fig. 4 (b);
(3) The center cross-section of fig. 4 (b) is depicted as shown in fig. 4 (c). It can be seen that the 'permanent crystalline region' is distributed in the middle region of the molecular chain in the central blue portion, indicated by the black dashed box in the figure. However, in the model, because part of atoms of the permanent crystalline region and the temporary crystalline region are located in the same molecular chain, the grouping of the permanent crystalline region cannot be directly performed through the molecular chain serial numbers (in the example, the molecular serial numbers of the atoms of the crystalline region are 11-14, 19-22 and 27-30), so that all the atoms on the molecular chain where the permanent crystalline region is located are firstly extracted, and then the atomic serial numbers of the permanent crystalline region are judged and recorded according to the coordinate values (37.5 < Z < 90.19) of the atoms in the Z direction;
(4) The interaction between atoms in the model II is described by adopting PCFF potential functions, the atomic type is set to be full, the simulation unit is set to be real, the neighbor list is set to be 2.0bin, the time step is set to be 0.5fs, the pressure is set to be 0atm, then the simulation temperature is set to be 800K, and the numerical value is obtained by directly carrying out heating melting simulation on the model shown in the figure 2 by utilizing Lammps;
(5) The potential of "pair_style" in PCFF force field is "lj/class2/coul/long", wherein 'long' represents that long-range coulomb interaction is considered, so that "kspace _ STYLE PPPM 1.0.0 e-6" needs to be set, but in order to avoid error reporting beyond coulomb interaction, only the spatial distribution of atoms is considered for model II initially, namely 'long' is changed into 'cut', and setting of "kspace _ STYLE PPPM 1.0e-6" is cancelled;
(6) After X, Y, Z three-direction boundary conditions are set as non-periodic boundary (f) conditions, in order to prevent simulation errors caused by movement of polymer atoms out of a simulation box in the process of local melting of a model II, reflecting walls are arranged on each surface of the simulation box, and then atoms in a permanent crystalline region are divided into the same crystalline group according to the atomic sequence number in the step (3);
(7) Fixing the permanent crystalline region by using a 'velocity CRYSTAL SET 000,fix crystal setforce 00 0' command, performing local melting simulation on the model II under a regular ensemble (NVT), obtaining a model III after relaxation for 1ns, as shown in fig. 5 (a), and drawing a cross-section, as shown in fig. 5 (b), wherein the permanent crystalline region in the model still maintains a crystalline conformation, and the temporary crystalline region is converted into an amorphous state;
(8) After resetting the long Cheng Kulun force interaction in the potential function, changing X, Y, Z three-direction boundary condition setting to periodic boundary (p) condition, canceling the reflecting wall set in the substep (6) of the step (4), canceling the fixed setting of the substep (7) 'permanent crystalline region' of the step (4), setting the simulated temperature at 300K, and observing fig. 5 (a) to find that no vacuum layer exists in the X and Y directions and a larger vacuum layer exists in the Z direction, in order to avoid model error when considering the long Cheng Kulun force, manually adjusting the vacuum layer size to a proper position, as shown in fig. 5 (c);
(9) And (3) relaxing the model III for 1ns under isothermal and isobaric ensemble (NPT) to obtain a model IV, wherein X, Y, Z directions conform to a semi-crystalline polymer model with a serial form, and the model is called a serial-parallel semi-crystalline polymer model. When the time reaches 1ns, the total energy of the system reaches a dynamic stable state, as shown in fig. 6, further proving the rationality of the obtained model, and if other molecular dynamics simulation software is needed to perform subsequent simulation, the data file can be converted into xyz file through ovito or converted into cif file through atomsk software, and then the mutual conversion among different types of model files is performed through MATERIALS STUDIO or VMD and other visual software.
Step 5, exploring the change of the morphology of the model IV after applying an equal-intensity electric field (ex=ey) in the X and Y directions:
The simulated temperature was first set above the amorphous polymer melting temperature and below the crystalline polymer melting point, and then the application in the X and Y directions, respectively, was investigated After 2ns of the equipotential field (E x=Ey), the morphology of the series-parallel semi-crystalline polymer changes. As shown in fig. 7, which shows the model morphology change after the application of the electric field, the PVDF serial-parallel semicrystalline polymer will shrink in the X and Y directions and stretch in the Z direction after the application of the equal-strength electric field to the model. The electric field is removed after the electric field with different intensity is applied and the electric deformation is caused by 2ns, the sectional view of the model is shown in figure 8, and the 'permanent crystalline region' still keeps a better stable structure at the moment, then the temperature is reduced to 300K at room temperature, and the relaxation is respectively carried out for 2ns under NPT, NVT, NVE ensembles, so as to obtain the dynamic stable model at room temperature. And then carrying out heat transfer analysis by using an unbalanced molecular dynamics method, dividing the model into multiple layers along the heat transfer direction (Z direction), wherein the thickness of each layer is approximatelyAnd then, respectively controlling the temperature of the heat source and the heat sink by utilizing a Langevin method to ensure that the system generates heat flow until the heat flow basically keeps stable growth, counting a heat flow time change curve, as shown in figure 10, finally counting the temperature of each layer, and drawing a temperature change curve along the heat transfer direction along with the position of each layer, as shown in figure 11.
Step 6, calculating the influence of the electric field strength on the heat conduction performance of the PVDF serial-parallel semi-crystalline polymer:
The temperature gradient value and the time change rate of the heat flow are obtained by respectively carrying out linear fitting on the change curve of the temperature along with each layer position and the change curve of the heat flow along with time through python software, then the cross section size of the model is extracted, the heat conductivity coefficient of the material is calculated according to the Fourier law, and the influence of the change of the electric field strength on the heat conductivity of the polymer material is obtained, as shown in figure 12;
The foregoing is merely one of the embodiments of the present invention, and a person skilled in the art may make various modifications and follow the present invention without departing from the spirit and technical flow of the invention, so that simple modifications and equivalent changes of the invention fall within the scope of the claims of the present invention, and still fall within the technical scope of the invention.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
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| US11807760B2 (en) * | 2019-06-24 | 2023-11-07 | California Institute Of Technology | Biocomposite materials and related compositions, methods and systems |
| CN113916930B (en) * | 2021-10-09 | 2023-06-20 | 合肥工业大学 | Method for detecting the relative content of each phase in semi-crystalline polymer composites |
| CN117471248A (en) * | 2023-09-25 | 2024-01-30 | 南方科技大学 | Multi-physical field characterization method and system for dielectric breakdown failure analysis |
| CN117809772A (en) * | 2023-12-01 | 2024-04-02 | 北京理工大学 | Method, device, equipment and medium for constructing semi-crystalline polymer stress prediction model |
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| CN101657473A (en) * | 2007-03-19 | 2010-02-24 | 杂混复合塑料公司 | In nonfluorinated polymers as the fluorinated poss of alloying agents |
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