CN119368913B - Device and method for detecting curved laser processing light path - Google Patents
Device and method for detecting curved laser processing light path Download PDFInfo
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- CN119368913B CN119368913B CN202411968107.5A CN202411968107A CN119368913B CN 119368913 B CN119368913 B CN 119368913B CN 202411968107 A CN202411968107 A CN 202411968107A CN 119368913 B CN119368913 B CN 119368913B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/71—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited
- G01N21/718—Laser microanalysis, i.e. with formation of sample plasma
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Abstract
The invention discloses a device and a method for detecting a curved laser processing light path, which can realize that a light path always enters a three-dimensional galvanometer unit in the moving process of a three-dimensional motion platform, and a laser focus recognition function in the curved surface processing process is realized by combining a laser displacement sensor, and a Z-axis moving mechanism is timely adjusted.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a device and a method for detecting a curved surface laser processing light path.
Background
The complex curved surface is used as a difficult point of laser processing, and the laser head facula is required to be adjusted in real time according to the change of the curved surface due to the change of the height of the curved surface in the processing process, so that the processing quality is ensured.
The complex curved surface laser processing system at the present stage has more researches on multi-axis processing, but lacks real-time detection and analysis on the quality of the processed surface and the focal spot of laser processing, and is difficult to quickly judge whether the quality characteristics of the curved surface meet the process requirements while processing. The multi-light source, multi-functional, multi-axis laser processing head and equipment disclosed in the patent CN106563880B, although the processing mode of the above scheme is flexible, the feedback function to the processing element and the processing laser is lacking, when the curvature of the processed curved surface is large, the processing dimensional accuracy and quality are easily affected due to the lack of real-time monitoring to the processing process, so the improvement is needed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a device and a method for detecting a curved laser processing light path, which ensure the incidence of the light path to a vibrating mirror by adopting a plurality of mobile platforms and special designs of a plurality of light paths, and further adopt a laser-induced breakdown spectroscopy technology and a displacement sensor to monitor the surface of an element in real time in the processing process so as to generate a feedback control signal and improve the curved laser processing efficiency.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a device for detecting a curved laser processing optical path, comprising:
the first moving platform is used for bearing the element and driving the element to move along the Y axis;
the second moving platform is provided with a vibrating mirror machining head module and is used for driving the vibrating mirror machining module to move along the Z axis;
the third mobile platform is connected with the second mobile platform and is used for driving the second mobile platform to move along the X axis;
The laser beam shaping transmission module comprises a laser and a piezoelectric deflection mirror, wherein the laser is used for emitting picosecond pulse laser, the piezoelectric deflection mirror is arranged above the vibrating mirror machining head module and is fixed with the third moving platform, a first optical path is formed between the laser and the piezoelectric deflection mirror, the first optical path is parallel to the moving direction of the third moving platform, a second optical path is formed between the piezoelectric deflection mirror and the vibrating mirror machining head module, and the second optical path is parallel to the moving direction of the second moving platform;
The vibrating mirror machining head module is provided with a laser displacement sensor, and the laser displacement sensor is used for detecting the element machining surface.
The invention further provides a spectrum analysis module, which comprises a spectrometer, an optical fiber coupler and a dichroic mirror, wherein the spectrometer is connected with the optical fiber coupler through an optical fiber, the dichroic mirror is arranged corresponding to the second optical path, and the dichroic mirror is used for receiving radiation light generated by the processing of the element and reflecting the radiation light to the optical fiber coupler.
The laser beam shaping transmission module is connected with the piezoelectric deflection mirror through the piezoelectric controller, and the calculation module deflects and adjusts the table boards in the X direction and the Y direction of the piezoelectric deflection mirror through the piezoelectric controller according to the spectrum information.
As a further improvement of the invention, the output end of the laser is sequentially provided with a beam expander, a diffraction optical element and a reflecting mirror group, and laser sequentially passes through the beam expander, the diffraction optical element and the reflecting mirror group to the piezoelectric deflection mirror.
As a further improvement of the invention, the galvanometer processing head module comprises a galvanometer scanning head, wherein the input end of the galvanometer scanning head is provided with a dynamic focusing unit, and the output end of the galvanometer is provided with a field lens.
As a further improvement of the invention, the second moving platform is provided with an end reflector corresponding to the end of the second light path, and the end reflector is used for reflecting the second light path to the dynamic focusing unit.
A method for detecting a curved laser processing light path by using the device comprises the following steps:
S1, dividing the area of the curved surface of the element, and planning a path according to the respective areas;
S2, turning on a laser, reflecting a light beam to a piezoelectric deflection mirror through a beam expander, a diffraction optical element and a reflecting mirror group, reflecting the light beam to a galvanometer processing head module through the piezoelectric deflection mirror, and carrying out laser processing on the surface of the element through the galvanometer processing head module;
s3, radiation light generated by the element in the processing process is reflected to a dichroic mirror through a galvanometer processing head module, reflected to an optical fiber coupler through the dichroic mirror, and transmitted to a spectrometer through the optical fiber coupler;
s4, extracting an optical signal by the spectrometer to obtain spectral information, transmitting the spectral information to a calculation module, transmitting a signal to a piezoelectric controller by the calculation module according to the spectral information, and controlling a piezoelectric deflection mirror X and Y-direction table top to perform deflection adjustment by the piezoelectric controller so as to complete deflection compensation control;
s5, detecting the machining surface of the element by the laser displacement sensor, and repeating the steps S2-S4 when the machining quality standard is not met;
S6, processing the next area after the processing quality standard is met, so as to finish the processing of all the processing areas.
Step S1 includes the following steps for the element curved surface region division:
S11, obtaining geometric information of a curved surface element model, wherein the geometric information comprises the spatial position of a point, a normal vector and the curvature radius of a curved surface;
S12, defining an included angle between the laser beam direction and the normal vector direction of the curved surface position as a laser incident angle, and dividing the curved surface into a plurality of pieces after analyzing and calculating discrete point information based on a dividing algorithm and a scanning breadth range of a galvanometer;
s13, layering each processing area based on the focus floating range of the galvanometer processing laser.
The invention has the beneficial effects that:
1. The first moving platform, the second moving platform and the third moving platform are adopted, and the first optical path and the second optical path are matched to meet the requirement that laser always shoots into the vibrating mirror processing head module in the processing process;
2. The laser displacement sensor is adopted to detect the processing quality in real time so as to track the laser processing focus and adjust the Z axis in time, thereby being beneficial to the processing of complex curved surfaces with large curvature;
3. The change of the appearance of the processed surface is obtained through the evolution processes of the spectral intensity, linear motion, stability and the like of the processed surface of the element analyzed by the spectrometer, and the timely adjustment of the laser parameters in the system is realized. The piezoelectric deflection mirror is controlled in real time, so that disturbance of beam movement is compensated, the stability of the system and laser is improved, and meanwhile, precise machining of complex curved surface elements is realized.
Drawings
FIG. 1 is a schematic view of the overall optical path of the present invention;
FIG. 2 is a schematic view of the overall installation of the present invention;
FIG. 3 is a flow chart of a method for processing an optical path according to the present invention.
Reference numeral 1, a laser; 2, a beam expander, 3, a diffraction optical element, 4, a first reflector, 5, a second reflector, 6, a third reflector, 7, a piezoelectric deflector, 8, a third moving platform, 9, a third moving mechanism, 10, a second moving platform, 11, a second moving mechanism, 12, a dichroic mirror, 13, a terminal reflector, 14, a dynamic focusing unit, 15, a galvanometer scanning head, 16, a field lens, 17, a first moving platform, 18, a first moving mechanism, 19, an element, 20, an optical fiber coupler, 21, an optical fiber, 22, a spectrometer, 23, a piezoelectric controller, 24, a computing module, 25 and a laser displacement sensor.
Detailed Description
The invention will now be described in further detail with reference to the drawings and examples. Wherein like parts are designated by like reference numerals.
As shown in fig. 1-2, a device for detecting a curved laser processing light path includes a first moving platform 17, where the first moving platform 17 is used for receiving an element 19, and during processing, the element 19 is placed on the first moving platform 17, and drives the element 19 to move along a Y axis through the first moving platform 17.
Specifically, the first moving platform 17 is provided with a first moving mechanism 18, where the first moving mechanism 18 is any linear moving device in the prior art, specifically, a rail-slider in this embodiment, and in another embodiment, a motor chain or a gear driving manner may also be adopted.
Preferably, the device comprises a frame body and further comprises a second moving platform 10, a second moving mechanism 11 is arranged on the second moving platform 10, the second moving mechanism 11 is connected with the second moving platform 10 and drives the second moving platform 10 to move along the Z axis, a vibrating mirror machining head module is arranged on the second moving platform 10, and the second moving mechanism 11 drives the vibrating mirror machining head module to move along the Z axis through the second moving platform 10.
Further, a third moving mechanism 9 is arranged on the frame body and is connected with a third moving platform 8 through the third moving mechanism 9, the third moving mechanism 9 is used for driving the third moving platform 8 to move along the X axis, a second moving platform 10 is positioned at the lower end of the third moving platform 8, and a second moving mechanism 11 is connected with the third moving platform 8.
In the use process, the third moving mechanism 9 is used for driving the third moving platform 8, the second moving mechanism 11 and the second moving platform 10 to move along the X axis, and the second moving mechanism 11 is used for driving the second moving platform 10 to move along the Z axis.
Specifically, in this embodiment, the second moving mechanism 11 is an air cylinder, the air cylinder is fixedly connected with the third moving platform 8, and the output end of the air cylinder is fixed with the second moving platform 10, and the third moving mechanism 9 may be a linear driving mechanism such as a motor or a rail slider, which is not limited herein.
The laser beam shaping and transmitting device is characterized by further comprising a laser beam shaping and transmitting module, wherein the laser beam shaping and transmitting module comprises a laser 1 and a piezoelectric deflection mirror 7, the laser 1 is used for emitting picosecond pulse laser, the piezoelectric deflection mirror 7 is arranged above the vibrating mirror machining head module and is fixed with a third moving platform 8, a first light path is formed between the laser 1 and the piezoelectric deflection mirror 7, the first light path is parallel to the moving direction of the third moving platform 8, and therefore when the third moving platform 8 drives a second to move for X-axis movement, light beams can be always kept to be shot.
Further, a second optical path is formed between the piezoelectric deflection mirror 7 and the galvanometer processing head module, and the second optical path is parallel to the moving direction of the second moving platform 10, so that when the second moving platform 10 moves along the Z axis, the beam can be always kept to be shot into the galvanometer processing head module.
Preferably, the galvanometer processing head module is provided with a laser displacement sensor 25, and the laser displacement sensor 25 is used for detecting the processing surface of the element 19 so as to adjust the Z axis in time.
The device also comprises a spectrum analysis module, wherein the spectrum analysis module comprises a spectrometer 22, an optical fiber coupler 20 and a dichroic mirror 12, the spectrometer 22 is connected with the optical fiber coupler 20 through an optical fiber 21, the dichroic mirror 12 is arranged corresponding to a second optical path, and the dichroic mirror 12 is used for receiving radiation light generated by processing the element 19 and reflecting the radiation light to the optical fiber coupler 20.
Since the element 19 generates a certain amount of plasma during processing, it emits radiation light with a specific wavelength, and the radiation light energy is naturally reflected along the laser processing light path, so that the radiation light energy is sifted and reflected by the dichroic mirror 12 to the optical fiber coupler 20, and the input end of the optical fiber coupler 20 contains a lens, so that the light beam can be focused into a light spot with a smaller diameter, and the light spot is beaten on the end face of the optical fiber 21, so that the light beam is ensured to be transmitted in the optical fiber 21. The beam is then transmitted into the spectrometer 22 and spectral information is extracted by the spectrometer 22.
The laser beam shaping transmission module also comprises a calculation module 24, wherein the calculation module 24 is specifically a computer, the calculation module 24 is used for receiving and processing the spectrum information extracted by the spectrometer 22, the laser beam shaping transmission module also comprises a piezoelectric controller 23, the calculation module 24 is connected with the piezoelectric deflection mirror 7 through the piezoelectric controller 23, and the calculation module 24 carries out deflection adjustment on the table boards in the X and Y directions of the piezoelectric deflection mirror through the piezoelectric controller 23 according to the spectrum information.
After the spectrum information is extracted, the spectrometer 22 transmits the information to a computer for processing, and after screening the effective spectrum information, the spectral line intensity, spectral line shift and other characteristic changes are analyzed, so that the change condition of the workpiece surface quality characteristic is obtained through analysis.
In addition, in order to prevent the interference of the laser beam after passing through the plurality of optical elements 19 and the influence of the jitter on the processing effect caused by the movement of the system moving mechanism, during the operation of the galvanometer processing head, the calculation module 24 may apply a feedback signal to the piezoelectric controller 23 according to the detection quality, and then send an adjustment signal to the piezoelectric deflection mirror 7, where the piezoelectric deflection mirror 7 may implement the table deflection in the X and Y directions on the surface thereof, so as to implement the adjustment of the angle of the reflected beam, compensate the deviation of the beam caused during the system transmission, so as to implement the ultra-high precision processing requirement, and the deflection resolution may be lower than 0.01 μrad.
Preferably, the output end of the laser 1 is sequentially provided with a beam expander 2, a diffraction optical element 3 and a reflector group, laser sequentially passes through the beam expander 2, the diffraction optical element 3 and the reflector group to the piezoelectric deflector 7, in this embodiment, the reflector group comprises a first reflector 4, a second reflector 5 and a third reflector 6, the beam sequentially passes through the first reflector 4, the second reflector 5 and the third reflector 6 and is reflected to the piezoelectric deflector 7, wherein a first light path is a beam between the third reflector 6 and the piezoelectric deflector 7, the beam emitted by the laser 1 can be adjusted to correspond to the position of the piezoelectric deflector through the first reflector 4, the second reflector 5 and the third reflector 6, the beam direction is the X-axis moving direction, meanwhile, the beam expander 2 is a variable-magnification beam expander 2, the Gaussian beam emitted by the laser 1 is a flat-top beam with uniform energy distribution through the beam expander 2 and the diffraction optical element 3, and particularly the laser 1 emits picosecond pulses, the variable-magnification beam 2 is changed according to the diameter of the laser beam, the variable-magnification beam is optimized, and the beam with uniform energy distribution of the diffraction element is formed after the light beam passes through the light beam has the diffraction element with the uniform flat-top.
Preferably, the galvanometer processing head module includes a galvanometer scanning head 15, the input end of the galvanometer scanning head 15 is provided with a dynamic focusing unit 14, the dynamic focusing unit 14 is specifically a dynamic focusing mirror in the prior art, and the details are not repeated here, and the output end of the galvanometer is provided with a field lens 16.
Preferably, the second moving platform 10 is provided with an end mirror 13 corresponding to the end of the second optical path, the end mirror 13 is used for reflecting the second optical path to the dynamic focusing unit 14, and the installation of the galvanometer scanning head 15 is adapted through the arrangement of the end mirror 13 so as to ensure that the light beam enters the dynamic focusing unit 14.
As shown in fig. 3, a method for detecting a curved laser processing optical path by using the device comprises the following steps:
S1, dividing the curved surface of the element 19 into areas, and planning paths according to the areas.
S2, the laser 1 is turned on, the light beam is reflected to the piezoelectric deflection mirror 7 through the beam expander 2, the diffraction optical element 3 and the reflecting mirror group, is reflected to the galvanometer processing head module through the piezoelectric deflection mirror 7, and is subjected to laser processing on the surface of the element 19 through the galvanometer processing head module.
And S3, radiation light generated by the element 19 in the processing process is reflected to the dichroic mirror 12 through the galvanometer processing head module, reflected to the optical fiber 21 coupler 20 through the dichroic mirror 12, and transmitted to the spectrometer 22 through the optical fiber 21 coupler 20.
S4, extracting the optical signal by the spectrometer 22 to obtain spectral information, transmitting the spectral information to the calculation module 24, transmitting the signal to the piezoelectric controller 23 by the calculation module 24 according to the spectral information, and controlling the piezoelectric deflection mirrors X and Y to perform deflection adjustment by the piezoelectric controller 23 so as to complete deflection compensation control.
S5, detecting the machining surface of the element 19 by the laser displacement sensor 25, and repeating the steps S2-S4 when the machining quality standard is not met.
S6, processing the next area after the processing quality standard is met, so as to finish the processing of all the processing areas.
Wherein step S1 includes the following steps for the curved surface area division of the element 19:
S11, obtaining geometric information of the curved surface element model, wherein the geometric information comprises the spatial position of points, a normal vector and the curvature radius of the curved surface.
S12, defining an included angle between the laser beam direction and the normal vector direction of the curved surface position as a laser incident angle, and dividing the curved surface into a plurality of pieces after analyzing and calculating discrete point information based on a dividing algorithm and a scanning breadth range of the galvanometer.
S13, layering processing is carried out on each processing area based on the focus floating range of the galvanometer processing laser so as to ensure layer-by-layer processing of the element with the complex curved surface height.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (6)
1. A device for detecting a curved laser processing optical path, comprising:
The first moving platform (17) is used for bearing the element (19) and driving the element (19) to move along the Y axis;
the second moving platform (10) is provided with a galvanometer machining head module, and the second moving platform (10) is used for driving the galvanometer machining module to move along the Z axis;
The third mobile platform (8) is connected with the second mobile platform (10) and is used for driving the second mobile platform (10) to move along the X axis;
The laser beam shaping transmission module comprises a laser (1) and a piezoelectric deflection mirror (7), wherein the laser (1) is used for emitting picosecond pulse laser, the piezoelectric deflection mirror (7) is arranged above the vibrating mirror machining head module and is fixed with a third moving platform (8), a first optical path is formed between the laser (1) and the piezoelectric deflection mirror (7), the first optical path is parallel to the moving direction of the third moving platform (8), and a second optical path is formed between the piezoelectric deflection mirror (7) and the vibrating mirror machining head module, and the second optical path is parallel to the moving direction of the second moving platform (10);
The vibrating mirror machining head module is provided with a laser displacement sensor (25), and the laser displacement sensor (25) is used for detecting the machining surface of the element (19);
The device also comprises a spectrum analysis module, wherein the spectrum analysis module comprises a spectrometer (22), an optical fiber coupler (20) and a dichroic mirror (12), the spectrometer (22) is connected with the optical fiber coupler (20) through an optical fiber (21), the dichroic mirror (12) is arranged corresponding to the second optical path, and the dichroic mirror (12) is used for receiving radiation light generated by processing of the element (19) and reflecting the radiation light to the optical fiber coupler (20);
the laser beam shaping transmission module is characterized by further comprising a calculation module (24), wherein the calculation module (24) is used for receiving and processing spectral information extracted by the spectrometer (22), the laser beam shaping transmission module further comprises a piezoelectric controller (23), the calculation module (24) is connected with the piezoelectric deflection mirror (7) through the piezoelectric controller (23), and the calculation module (24) deflects and adjusts the table boards in the X and Y directions of the piezoelectric deflection mirror (7) through the piezoelectric controller (23) according to the spectral information.
2. The curved surface laser processing light path device according to claim 1, wherein the output end of the laser (1) is sequentially provided with a beam expander (2), a diffraction optical element (3) and a reflecting mirror group, and the laser sequentially passes through the beam expander (2), the diffraction optical element (3) and the reflecting mirror group to the piezoelectric deflection mirror (7).
3. The curved surface laser processing light path device according to claim 2, wherein the galvanometer processing head module comprises a galvanometer scanning head (15), a dynamic focusing unit (14) is arranged at an input end of the galvanometer scanning head (15), and a field lens (16) is arranged at an output end of the galvanometer.
4. A curved laser processing light path device according to claim 3, wherein the second moving platform (10) is provided with a terminal reflecting mirror (13) corresponding to the terminal of the second light path, and the terminal reflecting mirror (13) is used for reflecting the second light path to the dynamic focusing unit (14).
5. A method of detecting a curved laser processing optical path using the apparatus of claim 4, comprising the steps of:
s1, dividing the curved surface of an element (19) into areas, and planning paths according to the areas;
S2, turning on the laser (1), reflecting the light beam to the piezoelectric deflection mirror (7) through the beam expander (2), the diffraction optical element (3) and the reflecting mirror group, reflecting the light beam to the galvanometer processing head module through the piezoelectric deflection mirror (7), and carrying out laser processing on the surface of the element (19) through the galvanometer processing head module;
s3, radiation light generated by the element (19) in the processing process is reflected to the dichroic mirror (12) through the galvanometer processing head module, reflected to the optical fiber coupler (20) through the dichroic mirror (12), and an optical signal is transmitted to the spectrometer (22) through the optical fiber coupler (20);
S4, extracting an optical signal by a spectrometer (22) to obtain spectrum information, transmitting the spectrum information to a calculation module (24), transmitting a signal to a piezoelectric controller (23) by the calculation module (24) according to the spectrum information, and controlling a piezoelectric deflection mirror (7) to deflect and adjust an X-direction table surface and a Y-direction table surface by the piezoelectric controller (23) so as to complete deflection compensation control;
s5, detecting the machining surface of the element (19) by the laser displacement sensor (25), and repeating the steps S2-S4 when the machining quality standard is not met;
S6, processing the next area after the processing quality standard is met, so as to finish the processing of all the processing areas.
6. The method for detecting a curved laser processing optical path according to claim 5, wherein the step S1 for dividing the curved surface area of the element (19) comprises the steps of:
S11, obtaining geometric information of a curved surface element model, wherein the geometric information comprises the spatial position of a point, a normal vector and the curvature radius of a curved surface;
S12, defining an included angle between the laser beam direction and the normal vector direction of the curved surface position as a laser incident angle, and dividing the curved surface into a plurality of pieces after analyzing and calculating discrete point information based on a dividing algorithm and a scanning breadth range of a galvanometer;
s13, layering each processing area based on the focus floating range of the galvanometer processing laser.
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