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CN119210614B - An on-chip automatic calibration system for local oscillator leakage and I/Q imbalance - Google Patents

An on-chip automatic calibration system for local oscillator leakage and I/Q imbalance Download PDF

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Publication number
CN119210614B
CN119210614B CN202411310532.5A CN202411310532A CN119210614B CN 119210614 B CN119210614 B CN 119210614B CN 202411310532 A CN202411310532 A CN 202411310532A CN 119210614 B CN119210614 B CN 119210614B
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transistor
resistor
twenty
gate
capacitor
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CN119210614A (en
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柴远
万恒至
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Nanjing Huijun Semiconductor Technology Co ltd
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Nanjing Huijun Semiconductor Technology Co ltd
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03DDEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
    • H03D7/00Transference of modulation from one carrier to another, e.g. frequency-changing
    • H03D7/16Multiple-frequency-changing
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/66Digital/analogue converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/50Circuits using different frequencies for the two directions of communication
    • H04B1/52Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
    • H04B1/525Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa with means for reducing leakage of transmitter signal into the receiver
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B17/00Monitoring; Testing
    • H04B17/10Monitoring; Testing of transmitters
    • H04B17/11Monitoring; Testing of transmitters for calibration

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Transmitters (AREA)

Abstract

The invention discloses an on-chip automatic calibration system for local oscillation leakage and I/Q imbalance, which comprises a first partial circuit used as a mixer, a second partial circuit used as a local oscillation leakage and image frequency detection circuit and a third partial circuit used as a digital control circuit; the invention detects the local oscillation leakage and the image frequency signal of the output port of the transmitter by a self-mixing method, realizes the detection of the local oscillation leakage and the I/Q imbalance, automatically adjusts the output current of the current type DAC in the transconductance stage of the mixer according to the detection result by using the on-chip digital circuit, and realizes the automatic calibration of the integrated local oscillation leakage and the I/Q imbalance on the chip.

Description

Local oscillator leakage and I/Q imbalance on-chip automatic calibration system
Technical Field
The invention relates to the technical field of power electronic design, in particular to an on-chip automatic calibration system for local oscillator leakage and I/Q imbalance.
Background
In the variable frequency transmitter, local oscillator leakage and I/Q imbalance are the two most important indexes, and excessive local oscillator leakage and I/Q imbalance can affect the constellation diagram of the transmitted signal, so that the constellation diagram generates displacement in the horizontal or vertical direction. Therefore, when designing a transmitter, the reduction of local oscillation leakage and I/Q imbalance needs to be considered, the local oscillation leakage and I/Q imbalance can be improved by optimizing the selection of the transistor size of the mixer and the symmetry of the layout, the main factor of the local oscillation leakage is caused by the inconsistent currents of two differential paths in the transconductance stage I path or the transconductance stage Q path, the main factor of the I/Q imbalance is caused by the inconsistent currents of the transconductance stage I path and the transconductance stage Q path, and the local oscillation leakage and I/Q imbalance can be improved by adjusting the bias voltage of each path transconductance of an actual chip mixer.
The traditional method for calibrating the local oscillation leakage and the I/Q imbalance of the transmitter is to read the local oscillation leakage and the image signal output by the transmitter through a vector network analyzer, and manually adjust the offset voltage of the transconductance stage of the mixer to minimize the output local oscillation leakage and the image signal. This method requires expensive equipment, requires a long time for calibration, and after a certain period of operation of the chip, the environment inside the chip may change, and the result of the original calibration is no longer an optimal value.
Disclosure of Invention
Aiming at three important concerns of local oscillation leakage, I/Q imbalance and on-chip incapability of accurately and automatically calibrating in the prior art, the invention discloses an on-chip automatic calibration system for local oscillation leakage and I/Q imbalance, which is added with a local oscillation leakage and I/Q imbalance calibration circuit based on a traditional frequency converter, and a broadband local oscillation leakage and image frequency signal detection circuit and an on-chip digital control circuit, so that signal reading and automatic calibration are realized under the condition of no need of external instruments and manual adjustment.
The technical scheme is that the following technical scheme is adopted to achieve the technical purpose.
An on-chip automatic calibration system for local oscillation leakage and I/Q imbalance includes a first partial circuit 1000 functioning as a mixer, a second partial circuit 2000 functioning as a local oscillation leakage and image frequency detection circuit, and a third partial circuit 3000 functioning as a digital control circuit;
The first partial circuit 1000 includes a I, Q mixer formed by two gilbert units, the input of which is a quadrature intermediate frequency signal provided by the outside, including IF_I+, IF_I-, IF_Q+, IF_Q-, and quadrature local oscillator signals including LO_I+, LO_I-, LO_Q+, LO_Q-, the output of which is a radio frequency differential signal including RF+ and RF-, the radio frequency differential signal is amplified by a power amplifier and then coupled into a single-ended radio frequency signal RF at the radio frequency output end of the transmitter, and the total four transconductance stages of positive and negative paths of the I, Q mixer are controlled by current-mode DACs respectively, thereby realizing that local oscillator leakage and I/Q imbalance can be calibrated;
The second partial circuit 2000 is configured to perform local oscillation leakage and image detection on the single-ended radio frequency signal RF, and finally convert the local oscillation leakage and the image signal into a digital signal proportional to the power thereof;
The output end of the third partial circuit 3000 is connected to the current DAC in the first partial circuit 1000, and is configured to obtain the current local oscillation leakage and the image frequency by reading the digital signal generated by the second partial circuit 2000, so as to find the IDAC output with the least local oscillation leakage and the image frequency by using a traversing method.
The method has the advantages that local oscillator leakage and image frequency signals of the output port of the transmitter are detected through a self-mixing method, local oscillator leakage and I/Q imbalance detection is achieved, an on-chip digital circuit is used for automatically adjusting output current of a current type DAC in the transconductance stage of the mixer according to detection results, and automatic calibration of on-chip integrated local oscillator leakage and I/Q imbalance is achieved.
Drawings
FIG. 1 is a schematic diagram of an on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a first circuit configuration of an on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a second part of an on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a third control logic portion of an on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to an embodiment of the present application;
FIG. 5 is a graph of local oscillator leakage rejection test results for a transmitter with an on-chip auto-calibration system with local oscillator leakage and I/Q imbalance;
Fig. 6 is a graph of image rejection test results for a transmitter with an on-chip auto-calibration system with local oscillator leakage and I/Q imbalance.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings.
Examples
As shown in fig. 1, an on-chip automatic calibration system for local oscillation leakage and I/Q imbalance of the present embodiment is suitable for a transmitter, and includes a first partial circuit 1000 serving as a mixer, a second partial circuit 2000 serving as a local oscillation leakage and image frequency detection circuit, and a third partial circuit 3000 serving as a digital control circuit;
The first partial circuit 1000 comprises I, Q mixers composed of two Gilbert units, wherein the inputs of the I, Q mixers are quadrature intermediate frequency signals provided by the outside, the quadrature intermediate frequency signals comprise IF_I+, IF_I-, IF_Q+, IF_Q-, and quadrature local oscillation signals, the quadrature local oscillation signals comprise LO_I+, LO_I-, LO_Q+, LO_Q-, and the output of the quadrature local oscillation signals are radio frequency differential signals, the RF differential signals comprise RF+ and RF-, the radio frequency differential signals are amplified by a power amplifier and are coupled into single-ended radio frequency signals RF at the radio frequency output end of a transmitter, and the plus and minus four transconductance stages of the I, Q mixers are respectively controlled by a current type DAC, so that local oscillation leakage and I/Q imbalance can be calibrated;
The second partial circuit 2000 is configured to perform local oscillation leakage and image detection on the single-ended radio frequency signal RF, and finally convert the local oscillation leakage and the image signal into a digital signal proportional to the power thereof;
The output end of the third partial circuit 3000 is connected to the current DAC in the first partial circuit 1000, and is used for obtaining the current local oscillation leakage and the image frequency by reading the digital signal generated by the second partial circuit 2000, so as to find the IDAC output that minimizes the local oscillation leakage and the image frequency by using a traversal method.
As shown in fig. 2, the first partial circuit 1000 includes an I-way mixer switching stage, an I Lu Hunpin transconductance stage, and a series inductance between the two stages, a Q-way mixer switching stage, a Q Lu Hunpin transconductance stage, and a series inductance between the two stages, a current-type DAC connected to the I Lu Hunpin transconductance stage and the Q Lu Hunpin transconductance stage for controlling the four-way mixer, and a transconductance stage bias resistor connected to the I Lu Hunpin transconductance stage and the Q Lu Hunpin transconductance stage;
The I-path mixer switching stage is connected with the I-path mixer transconductance stage through a series inductor, the Q-path mixer switching stage is connected with the Q-path mixer transconductance stage through a series inductor, the input signals of the I-path mixer switching stage are LOI+ and LOI-, the input signals of the Q-path mixer switching stage are LOQ+ and LOQ-, LOI-, LOQ+ and LOQ-are quadrature local oscillation signals, the mixer output signals are RF+ and RF-, namely radio frequency differential output signals, the input signals connected with the I Lu Hunpin transconductance stage are IF I+ and IF_I-, the input signals connected with the Q Lu Hunpin transconductance stage are IF_Q+ and IF_Q-, IF_Q+ and IF_Q-are quadrature local oscillation signals after buffer amplification;
The I-channel mixer switching stage is used as a switching stage of a Gilbert unit and comprises a first transistor 1021, a second transistor 1022, a third transistor 1023 and a fourth transistor 1024, wherein the source electrode of the first transistor 1021 is connected with the source electrode of the second transistor 1022, the source electrode of the third transistor 1023 is connected with the source electrode of the fourth transistor 1024, the drain electrode of the first transistor 1021 is connected with the drain electrode of the third transistor 1023, the drain electrode of the second transistor 1022 is connected with the drain electrode of the fourth transistor 1024 and is used as an output end of the I-channel mixer, the grid electrodes of the first transistor 1021 and the fourth transistor 1024 are connected as a positive input end of a local oscillation signal I channel, the grid electrodes of the second transistor 1022 and the third transistor 1023 are connected as a negative input end of a local oscillation signal I channel, and an input signal LO I-;
Similarly, the Q-channel mixer switching stage, which is used as a switching stage of a Gilbert cell, comprises a fifth transistor 1025, a sixth transistor 1026, a seventh transistor 1027 and an eighth transistor 1028, wherein the sources of the fifth transistor 1025 and the sixth transistor 1026 are connected, the sources of the seventh transistor 1027 and the eighth transistor 1028 are connected, the drains of the fifth transistor 1025 and the seventh transistor 1027 are connected, the drains of the sixth transistor 1026 and the eighth transistor 1028 are connected and used as an output end of the Q-channel mixer, the gates of the fifth transistor 1025 and the eighth transistor 1028 are connected and used as a positive input end of a local oscillation signal Q channel, the gates of the input signal LO_Q+ and the sixth transistor 1026 and the seventh transistor 1027 are connected and used as a negative input end of the local oscillation signal Q channel, and the input signal LO_Q-;
After the output ends of the two paths of mixers, namely the I path mixer and the Q path mixer, are connected, the residual sidebands are counteracted, and the single sidebands are added to obtain single sideband output, and output signals RF+ and RF-, namely radio frequency differential output signals.
The I-way mixer transconductance stage comprises a ninth transistor 1002, a tenth transistor 1004, an eleventh transistor 1005, a twelfth transistor 1007, the q Lu Hunpin transconductance stage comprises a thirteenth transistor 1010, a fourteenth transistor 1012, a fifteenth transistor 1013, a sixteenth transistor 1015, the current-mode DAC controlling the four-way mixer comprises a first IDAC1001, a second IDAC1008, a third IDAC1009, a fourth IDAC1016, and the transconductance stage bias resistor comprises a first resistor 1003, a second resistor 1006, a third resistor 1011, and a fourth resistor 1014;
I. the positive and negative total four paths of transconductance stages of the Q mixer are respectively controlled by a current-mode DAC, so that local oscillation leakage and I/Q imbalance can be calibrated, a ninth transistor 1002, a twelfth transistor 1007, a thirteenth transistor 1010 and a sixteenth transistor 1015 form a transconductance-stage current mirror, the gates of all the transistors in the current mirror are connected with the drain, the source is grounded, the drain of the ninth transistor 1002 is connected with a first IDAC1001, the drain of the twelfth transistor 1007 is connected with a second IDAC1008, the drain of the thirteenth transistor 1010 is connected with a third IDAC1009, the drain of the sixteenth transistor 1015 is connected with a fourth IDAC1016, and each IDAC can be controlled by a digital circuit, namely a third partial circuit 3000 to control the output size of current, and the control amplitude is 60 mu A; the invention adopts the current type DAC to control the four-way current at the offset position of the four-way transconductance of the mixer, thereby realizing the calibration of local oscillation leakage and I/Q imbalance.
A gate of the ninth transistor 1002 and a gate of the tenth transistor 1004 in the I-channel mixer transconductance stage are connected through a first resistor 1003, a gate of the eleventh transistor 1005 and a gate of the twelfth transistor 1007 are connected through a second resistor 1006, sources of the tenth transistor 1004 and the eleventh transistor 1005 are grounded, a gate of the thirteenth transistor 1010 and a gate of the fourteenth transistor 1012 in the Q-channel mixer transconductance stage are connected through a third resistor 1011, a gate of the fifteenth transistor 1013 and a gate of the sixteenth transistor 1015 are connected through a fourth resistor 1014, and sources of the fourteenth transistor 1012 and the fifteenth transistor 1013 are grounded.
The series inductance between the mixer switching stage and the transconductance stage comprises a first inductance 1017, a second inductance 1018, a third inductance 1019, a fourth inductance 1020, the drain of a tenth transistor 1004 in the I-channel mixer transconductance stage is connected with the sources of a first transistor 1021 and a second transistor 1022 in the I-channel mixer switching stage through the first inductance 1017, the drain of an eleventh transistor 1005 in the I-channel mixer transconductance stage is connected with the sources of a third transistor 1023 and a fourth transistor 1024 in the I-channel mixer switching stage through the second inductance 1018, the drain of a fourteenth transistor 1012 in the Q-channel mixer transconductance stage is connected with the sources of a fifth transistor 1025 and a sixth transistor 1026 in the Q-channel mixer switching stage through the third inductance 1019, and the drain of a fifteenth transistor 1013 in the Q-channel mixer transconductance stage is connected with the sources of a seventh transistor 1027 and an eighth transistor 1028 in the Q-channel mixer switching stage through the fourth inductance 1020.
The first transistor 1021, the second transistor 1022, the third transistor 1023, the fourth transistor 1024, the fifth transistor 1025, the sixth transistor 1026, the seventh transistor 1027, and the eighth transistor 1028 are the same in size, the ninth transistor 1002, the twelfth transistor 1007, the thirteenth transistor 1010, and the sixteenth transistor 1015 are the same in size, the tenth transistor 1004, the eleventh transistor 1005, the fourteenth transistor 1012, and the fifteenth transistor 1013 are the same in size, the first IDAC1001, the second IDAC1008, the third IDAC1009, and the fourth IDAC1016 have the same current output range, the first resistor 1003, the second resistor 1006, the third resistor 1011, and the fourth resistor 1014 have the same resistance value, and the first inductor 1017, the second inductor 1018, the third inductor 1019, and the fourth inductor 1020 have the same inductance value.
As shown in fig. 3, the second partial circuit 2000 includes an input coupling transformer 2100, a self-mixer 2200, a low-pass filter 2300, a voltage amplifier 2400, an envelope detector 2500 and an ADC2600, where the input coupling transformer 2100 is a first-stage input, the self-mixer 2200, the low-pass filter 2300, the voltage amplifier 2400 and the envelope detector 2500 are cascaded in sequence, and two outputs of the envelope detector 2500 are respectively connected to two inputs of the ADC2600, and finally the local oscillation leakage and the image signal are converted into a digital signal proportional to the power thereof, and the digital signal is input to the third partial circuit 3000;
The input coupling transformer 2100 is formed by coupling a primary coil and a secondary coil, so that a T model function formed by serially connecting and parallelly connecting inductors is realized, the chip area is reduced, and the function of coupling a transmitter output signal RF to the second partial circuit 2000 under the condition that the transmitting power is hardly influenced is realized;
The self-mixer 2200 is a one-stage self-mixer, and comprises a seventeenth transistor 2203, an eighteenth transistor 2204, a nineteenth transistor 2207, a twentieth transistor 2208, a fifth resistor 2201, a sixth resistor 2202, a seventh resistor 2209, an eighth resistor 2210, a ninth resistor 2211, a first capacitor 2205 and a second capacitor 2206, wherein the input end of the self-mixer 2200 is in+ and IN-, and the output end is OUT;
The drain of the seventeenth transistor 2203 is connected to the source of the nineteenth transistor 2207, the drain of the eighteenth transistor 2204 is connected to the source of the twentieth transistor 2208, the gate of the seventeenth transistor 2203 is connected to the positive input terminal in+, the gate of the eighteenth transistor 2204 is connected to the negative input terminal IN-, the seventeenth transistor 2203 is grounded to the source of the eighteenth transistor 2204, the gates of the nineteenth transistor 2207 and the twentieth transistor 2208 are connected to the bias voltage Vb2, the drains of the nineteenth transistor 2207 and the twentieth transistor 2208 are connected to the output terminal OUT, the output terminal OUT is connected to the power supply through the fifth resistor 2201, the output terminal OUT is connected to the gate of the seventeenth transistor 2203 through the eighth resistor 2210, the second capacitor 2206 is connected to the gate of the eighteenth transistor 2204 IN sequence, the gate of the seventeenth transistor 2203 is connected to the bias voltage Vb1 through the fifth resistor 2201, the output terminal OUT is connected to the output terminal 2300 through the sixth resistor 2300;
The seventeenth transistor 2203 has the same size as the eighteenth transistor 2204, the nineteenth transistor 2207 has the same size as the twentieth transistor 2208, the fifth resistor 2201 has the same resistance as the sixth resistor 2202, the seventh resistor 2209 has the same resistance as the eighth resistor 2210, and the first capacitor 2205 has the same capacitance as the second capacitor 2206;
the self-mixer 2200 mixes the radio frequency and local oscillator leakage coupled by the input coupling transformer 2100 with the image frequency signal, and outputs components such as a double intermediate frequency, a radio frequency and a radio frequency third harmonic, wherein the double intermediate frequency is a product of mixing the radio frequency and the local oscillator leakage, and the double intermediate frequency is a product of mixing the radio frequency and the image frequency, and the values of the local oscillator leakage and the image frequency in the original signal are respectively represented;
The low-pass filter 2300 is a first-stage low-pass filter and comprises a fifth inductor 2301, a third capacitor 2302 and a fourth capacitor 2303, wherein the input end of the low-pass filter is IN, and the output end of the low-pass filter is OUT, the fifth inductor 2301 is connected with the third capacitor 2302 IN parallel, one end of the fifth inductor is connected with IN, the other end of the fifth inductor is connected with OUT, one end of the fourth capacitor 2303 is connected with OUT, the other end of the fourth capacitor is connected with the ground, and the output end OUT is connected with the input end of the voltage amplifier 2400;
The voltage amplifier 2400 is a two-stage voltage amplifier, and includes a twenty-first transistor 2402, a twenty-second transistor 2403, a twenty-third transistor 2412, a twenty-fourth transistor 2411, a fifth capacitor 2401, a sixth capacitor 2407, a seventh capacitor 2408, an eighth capacitor 2410, a ninth capacitor 2414, a sixth inductor 2404, a seventh inductor 2406, a tenth resistor 2405, an eleventh resistor 2409, a twelfth resistor 2413, and a thirteenth resistor 2415, where an input terminal of the voltage amplifier 2400 is IN, and an output terminal is OUT;
A gate of the twenty-first transistor 2402 is connected to the input terminal IN through a fifth capacitor 2401, a source of the twenty-first transistor 2402 is grounded, a gate of the twenty-first transistor 2402 is connected to the voltage bias Vb1, a drain of the twenty-first transistor 2402 is connected to a source of the twenty-first transistor 2403, a gate of the second transistor 2403 is connected to the bias voltage Vb2, a drain of the twenty-first transistor 2403 is connected to the power supply by sequentially connecting a sixth inductor 2404 and a tenth resistor 2405 IN series, a seventh inductor 2406 is connected IN parallel with a sixth capacitor 2407, one end is connected to a drain of the second transistor 2403, the other end is connected to a gate of the twenty-third transistor 2412 through an eighth capacitor 2410, a drain of the twenty-first transistor 2403 is connected to a gate of the twenty-first transistor 2402 by sequentially connecting a seventh capacitor 2408 and an eleventh resistor 2409 IN series, and the sixth inductor 2404 is coupled to the seventh inductor 2406; the drain of the twenty-third transistor 2412 is connected to the source of the twenty-fourth transistor 2411, the gate of the twenty-third transistor 2412 is connected to the bias voltage Vb3, the source of the twenty-fourth transistor 2412 is grounded, the gate of the twenty-fourth transistor 2411 is connected to the bias voltage Vb4, the drain of the twenty-fourth transistor 2411 is connected to the power supply through a twelfth resistor 2413, the drain of the twenty-fourth transistor 2411 is connected to the output terminal OUT, and the output terminal OUT is connected to the gate of the twenty-third transistor 2412 by sequentially connecting the ninth capacitor 2414 and the thirteenth resistor 2415 IN series;
The voltage amplifier 2400 is used for amplifying the voltage of the signal with the intermediate frequency and the signal with the intermediate frequency, which are output from the mixer 2200, and filtering the interference component with the intermediate frequency and the signal with the intermediate frequency, and the low-pass filter 2300 and the voltage amplifier 2400 cooperate to filter the interference component with the intermediate frequency and the signal with the intermediate frequency more thoroughly.
The envelope detector 2500 is a one-stage envelope detector including a twenty-fifth transistor 2503, a twenty-sixth transistor 2504, a twenty-seventh transistor 2508, a twenty-eighth transistor 2509, a twenty-ninth transistor 2510, a thirty-first transistor 2513, a thirty-first transistor 2514, a tenth capacitor 2501, an eleventh capacitor 2506, a twelfth capacitor 2512, a thirteenth capacitor 2515, a fourteenth capacitor 2507, a fourteenth resistor 2502, a fifteenth resistor 2505, a sixteenth resistor 2511, an input terminal of the envelope detector being IN, and output terminals being OUT1 and OUT2;
A gate of the twenty-fifth transistor 2503 is connected to the input terminal IN through a tenth capacitor 2501, a gate of the twenty-fifth transistor 2503 is connected to the bias voltage Vb1 through a fourteenth resistor 2502, a source of the twenty-fifth transistor 2503 is grounded, a gate of the twenty-sixth transistor 2504 is connected to the ground through an eleventh capacitor 2506, a gate of the twenty-sixth transistor 2504 is connected to the bias voltage Vb1 through a fifteenth resistor 2505, a drain of the twenty-fifth transistor 2503 is connected to a drain of the twenty-sixth transistor 2504, an output terminal OUT2 is connected to the drain of the twenty-ninth transistor 2510, an output terminal OUT2 is grounded through a fourteenth capacitor 2512, a source of the twenty-ninth transistor 2510 is connected to the power supply through a twelfth capacitor 2512, a gate of the twenty-eighth transistor 2510 is connected to the drain of the twenty-eighth transistor 2509, a source of the twenty-eighth transistor 2509 is connected to the power supply source, a drain of the twenty-eighth transistor 2509 is connected to the drain of the twenty-eighth transistor, a drain of the output transistor 2509 is connected to the drain of the output transistor OUT2 through a thirteenth capacitor 2508, a drain of the output terminal OUT2 is connected to the drain of the thirty-eighth transistor 2511 is connected to the drain of the thirty-eighth transistor, a drain of the output transistor 2512 is connected to the drain of the thirty-eighth capacitor, a drain of the output transistor 2512 is connected to the drain of the thirty-eighth transistor 2512 is connected to the drain voltage source, a drain of the drain transistor is connected to the thirty-eighth capacitor, the drain transistor 2512 is connected to the drain source of the drain is connected to the drain source of the thirty-eighth capacitor, and the drain is connected to the drain source of the drain transistor junction drain source of the drain transistor, and the drain is connected to the twenty-eighth source is connected to the source, and source of the drain source is connected;
The twenty-fifth transistor 2503 has the same size as the twenty-sixth transistor 2504, the fourteenth resistor 2502 has the same resistance as the fifteenth resistor 2505, and the tenth capacitor 2501 has the same capacitance as the eleventh capacitor 2506.
The envelope detector 2500 is used for converting the one-time intermediate frequency signal and the two-time intermediate frequency signal into direct current components, wherein the level output by the output end OUT1 is positively correlated with the voltage of the input signal, and the level output by the output end OUT2 is more sensitive when the voltage of the input signal is smaller, and the level output by the output end OUT2 is negatively correlated with the voltage of the input signal, and the level output by the output end OUT2 is more sensitive when the voltage of the input signal is larger;
The ADC2600 includes two dc level input ports, a digital control port for switching the read port, and a digital bus output port, where the two dc level input ports are respectively connected to the output terminal OUT1 and the output terminal OUT2 of the envelope detector 2500, and the digital bus output port is connected to the third partial circuit 3000, where the level range of the ADC sampling is 0-1V, and the sampling precision is 10 bits;
The ADC2600 converts the input dc level into a digital signal, and outputs the digital signal to the third partial circuit 3000 through the bus, so that the digital control circuit can obtain the local oscillator leakage of the transmitter and the power of the image component, and perform automatic calibration according to the local oscillator leakage and the power of the image component.
Local oscillator leakage and image frequency generated by the I/Q mixer are coupled into RF signals at the output end of the transmitter and input into the detection circuit, the local oscillator and the image frequency are respectively converted into a double intermediate frequency and a double intermediate frequency through the self-mixer, filtered and amplified and then converted into direct current level, and the direct current level is transmitted to the third partial circuit after being sampled by the ADC.
The third partial circuit 3000 is a digital control circuit for automatically generating Verilog codes, and comprises a digital bus input port, a calibration signal input port, a calibration end signal output port, and four digital bus output ports, where the digital bus output ports are respectively connected with the first IDAC1001, the second IDAC1008, the third IDAC1009, and the fourth IDAC1016, and are used for controlling the current output by the DAC;
The signal flow process of this embodiment is:
The first part circuit 1000 inputs quadrature intermediate frequency signals provided for the outside, including IF i+, IF I-, if_q+, if_q-, and quadrature local oscillation signals including lo_i+, lo_i-, lo_q+, lo_q-, and outputs radio frequency differential signals including rf+ and RF-, which are amplified by a power amplifier and become single-ended radio frequency signals RF at a radio frequency output port, the second part circuit 2000 inputs radio frequency signals RF and outputs digital bus signals, the third part circuit 3000 inputs including digital bus signals from the second part circuit 2000 and a calibration start signal and outputs a calibration end signal and four digital bus outputs, the digital bus outputs being connected to the first IDAC1001, the second IDAC1008, the third IDAC1009, the fourth IDAC1016 in the first part circuit 1000, respectively, thereby forming a closed loop control loop.
The local oscillator leakage and I/Q imbalance calibration process in this embodiment is that, due to the difference in chip process manufacturing, the sizes of the transconductance stage transistors, that is, the tenth transistor 1004, the eleventh transistor 1005, the fourteenth transistor 1012, and the fifteenth transistor 1013 may be different, which may cause imbalance of the direct current of the transconductance stage transistors, and imbalance of the current of the transconductance stage transistors may cause that the local oscillator signal or the image frequency of the output port cannot be completely offset, one local oscillator signal or the image frequency output amplitude with larger current is larger, so as to generate larger local oscillator leakage or image frequency. In order to realize on-chip automation of the calibration process, the invention adds the local oscillator leakage and image frequency detection circuit at the output port of the transmitter, converts the components to be detected into digital signals and outputs the digital signals to the on-chip digital control circuit, and the digital control circuit obtains the IDAC control code when the local oscillator leakage and the image frequency are minimum in a traversing way after receiving the calibration starting signals, thereby realizing the calibration of the local oscillator leakage and the I/Q imbalance.
As shown in fig. 4, the control logic of the third partial circuit 3000 of the system in the present invention includes a main flow and three sub-flows, namely, sub-flow 3100a, sub-flow 3100b and sub-flow 3100c, wherein when the main flow starts automatic calibration, the system first executes step 3001, the third partial circuit 3000 receives a calibration signal from the calibration signal input port and enters into sub-flow 3100a, and in sub-flow 3100a, the system calibrates local oscillation leakage of path I, namely, calibrates the first IDAC1001, wherein the step of 3100a is consistent with 3100, the modified IDAC register is the control register corresponding to the first IDAC1001, and enters into sub-flow 3100b after the end;
In the sub-flow 3100, the circuit firstly enters a step 3101 to set the control register value of the corresponding IDAC to 0, then enters a step 3102 to add 1 to the register value, then enters a step 3103, a third partial circuit reads the values of the output end OUT1 and the output end OUT2 read by the ADC2600 through a digital bus input port and calculates the values to obtain OUT1-OUT2, then enters a step 3104, if the values of OUT1-OUT2 are smaller than the previous reading, the values of OUT1-OUT2 are stored, and a step 3105 is triggered, the current register value is stored, after the step 3104 is finished, the step 3106 is entered, whether the register value reaches the upper limit is judged, if the upper limit is not reached, the step 3102 is returned, if the upper limit is reached, the step 3107 is entered, the register is set to the optimal offset value obtained in the loop, and the sub-flow 3100 is ended;
In the sub-flow 3100b, the system calibrates local oscillation leakage of Q paths, that is, calibrates the fourth IDAC1016, wherein the step of 3100b is consistent with 3100, the modified IDAC register is a control register corresponding to the fourth IDAC1016, and enters the sub-flow 3100c after the end;
In the sub-process 3100c, the circuit performs calibration on the unbalance of two paths I, Q, namely, the first IDAC1001 and the second IDAC1008 are calibrated at the same time, at the moment, a step 3102 in the sub-process becomes to add 1 to the register values controlling the first IDAC1001 and the second IDAC1008 at the same time, namely, the difference value between the registers is kept constant, a step 3106 in the sub-process becomes to judge whether the value of the first IDAC1001 or the second IDAC1008 reaches the upper limit, if one of the values reaches the upper limit, a step 3107 is entered, the other steps are consistent, and the step 3002 is entered after the end, in the step 3002, since the calibration of local oscillation leakage and the calibration of the I/Q unbalance are mutually influenced, the step 3003 is entered when the value of the current register is the same as the value of the upper-round register, if the value is not the same, the calibration is not converged, the step 3004 is entered when the value is the same, the iteration number of times is judged to be reached, if the iteration number of the upper limit is not reached in the step 3003, the step 3100a is returned, and if the step 3004 is reached, the calibration signal is automatically completed through the end of the circuit in the step 3004;
The digital control circuit realizes automatic local oscillation leakage and I/Q imbalance calibration by automatically traversing the register value of the output current of the IDAC and combining the digital signal input by the detection circuit.
The invention adopts an I/Q frequency mixing architecture, and is provided with two mixers, namely an I-path mixer and a Q-path mixer, which are respectively used for inputting orthogonal intermediate frequency signals and orthogonal local oscillation signals, wherein one of two sidebands obtained by the I-path mixer and the Q-path mixer has the same phase, the other phase is opposite, the required sidebands are reserved finally, and the residual sidebands are counteracted, so that single-sided sideband frequency conversion is realized. The mixer output matching network realizes the sideband selection, specifically, the sidebands can be switched by changing the connection mode of the I-path mixer and the Q-path mixer output, wherein the positive end of the I-path output is connected with the positive end of the Q-path output, the negative end is connected with the negative end, the upper sidebands are selected, the positive end of the I-path output is connected with the negative end of the Q-path output, and the negative end is connected with the positive end, the lower sidebands are selected.
The invention adds a local oscillator leakage and I/Q imbalance calibration circuit based on the traditional frequency converter, namely a first partial circuit comprising a current type DAC, and adds a broadband local oscillator leakage and image frequency signal detection circuit and an on-chip digital control circuit, thus realizing signal reading and automatic calibration under the conditions of no need of external instruments such as an external vector network analyzer and manual adjustment, detecting the local oscillator leakage and image frequency signal output by a transmitter by using the on-chip circuit, and automatically adjusting the offset voltage of a transconductance stage of the frequency mixer to an optimal value by using the on-chip digital control circuit.
As shown in fig. 5, this is a comparison schematic diagram of the situations before and after the local oscillation leakage suppression calibration in the test of this example, where the abscissa in the figure is the intermediate frequency and the ordinate is the local oscillation leakage suppression ratio, and it can be seen from fig. 5 that in the range of the intermediate frequency signal being 2.4-7.5GHz, the local oscillation leakage suppression of the transmitter is improved by at least 20dBc after the automatic calibration, and in the required radio frequency range, the local oscillation leakage suppression ratio of the transmitter is greater than 40dBc.
As shown in fig. 6, this is a comparison schematic diagram of the situations before and after the image rejection calibration in the test of this example, the abscissa in fig. 6 is the intermediate frequency, and the ordinate is the image rejection ratio, and it can be seen from fig. 6 that in the range of the intermediate frequency signal being 2.4-7.5GHz, the image rejection of the transmitter is raised by at least 8dBc after the automatic calibration, and in the required radio frequency range, the image rejection ratio of the transmitter is greater than 40dBc.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (12)

1.一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于,包括用作混频器的第一部分电路(1000)、用作本振泄露与镜频检测电路的第二部分电路(2000)和用作数字控制电路的第三部分电路(3000);1. An on-chip automatic calibration system for local oscillator leakage and I/Q imbalance, characterized in that it comprises a first circuit section (1000) used as a mixer, a second circuit section (2000) used as a local oscillator leakage and image frequency detection circuit, and a third circuit section (3000) used as a digital control circuit; 所述第一部分电路(1000)包括两个吉尔伯特单元构成的I、Q混频器,输入为外部提供的正交中频信号,包括IF_I+、IF_I-、IF_Q+、IF_Q-,以及正交本振信号,包括LO_I+、LO_I-、LO_Q+、LO_Q-;输出为射频差分信号,包括RF+与RF-;射频差分信号经过功率放大器放大后,在发射机的射频输出端处耦合为单端射频信号RF;I、Q混频器的正负总共四路跨导级分别由电流型DAC控制,从而实现本振泄露与I/Q不平衡可校准;The first circuit (1000) comprises an I, Q mixer composed of two Gilbert units, the input of which is an orthogonal intermediate frequency signal provided externally, including IF_I+, IF_I-, IF_Q+, IF_Q-, and an orthogonal local oscillator signal, including LO_I+, LO_I-, LO_Q+, LO_Q-; the output is a radio frequency differential signal, including RF+ and RF-; the radio frequency differential signal is amplified by a power amplifier and coupled to a single-ended radio frequency signal RF at the radio frequency output end of the transmitter; the positive and negative transconductance stages of the I, Q mixer are respectively controlled by current-type DACs, so that local oscillator leakage and I/Q imbalance can be calibrated; 所述第二部分电路(2000)用于对单端射频信号RF进行本振泄露与镜频检测,最终将本振泄露与镜频信号转换为与其功率成正比的数字信号;所述数字信号输入至第三部分电路(3000);The second circuit (2000) is used to perform local oscillator leakage and image frequency detection on the single-ended radio frequency signal RF, and finally convert the local oscillator leakage and image frequency signals into digital signals proportional to their powers; the digital signals are input into the third circuit (3000); 所述第三部分电路(3000)输出端与第一部分电路(1000)中的电流型DAC相连,用于通过读取第二部分电路(2000)所产生的数字信号来获取当前本振泄露与镜频的大小,从而利用遍历的方法寻找到使本振泄露与镜频最少的IDAC输出;所述第三部分电路(3000)为数字控制电路,包含一个数字总线输入端口、一个校准信号输入端口、一个校准结束信号输出端口、四个数字总线输出端口,数字总线输出端口分别与第一部分电路(1000)中的电流型DAC,即第一IDAC(1001)、第二IDAC(1008)、第三IDAC(1009)、第四IDAC(1016)连接,用于控制DAC输出的电流大小;The output end of the third circuit (3000) is connected to the current-mode DAC in the first circuit (1000), and is used to obtain the magnitude of the current local oscillator leakage and the image frequency by reading the digital signal generated by the second circuit (2000), so as to find the IDAC output that minimizes the local oscillator leakage and the image frequency by using the traversal method; the third circuit (3000) is a digital control circuit, comprising a digital bus input port, a calibration signal input port, a calibration end signal output port, and four digital bus output ports, the digital bus output ports being respectively connected to the current-mode DACs in the first circuit (1000), namely the first IDAC (1001), the second IDAC (1008), the third IDAC (1009), and the fourth IDAC (1016), and being used to control the magnitude of the current output by the DAC; 第三部分电路(3000)的控制逻辑包括一个主流程和三个子流程,即子流程3100(a)、子流程3100(b)、子流程3100(c);主流程为:开始自动校准时,系统首先执行步骤3001,从校准信号输入端口接收到校准信号,并进入子流程3100(a);在子流程3100(a)中,电路对第一IDAC(1001)进行校准,修改的IDAC寄存器为第一IDAC(1001)对应的控制寄存器,结束后进入子流程3100(b);在子流程3100(b)中,电路对第四IDAC(1016)进行校准,修改的IDAC寄存器为第四IDAC(1016)对应的控制寄存器,结束后进入子流程3100(c);在子流程3100(c)中,电路对第一IDAC(1001)和第二IDAC(1008)同时进行校准,此时子流程中的步骤3102变为将控制第一IDAC(1001)和第二IDAC(1008)的寄存器数值同时加1,即保持两者寄存器的差值恒定,子流程中的步骤3106变为判断第一IDAC(1001)或第二IDAC(1008)寄存器的数值是否达到上限,如有一方达到即进入步骤3107,其余步骤一致,结束后进入步骤3002;在步骤3002中,判断当前寄存器的数值是否与上一轮寄存器的数值相同,如果不相同,则进入步骤3003,如果相同,则进入步骤3004;在步骤3003中,判断是否达到迭代次数上限,如果没有达到迭代次数上限,则返回子流程3100(a),如果已经达到迭代次数上限,则进入步骤3004;在步骤3004中,电路通过校准信号输入端口发送校准结束信号,完成自动校准。The control logic of the third part of the circuit (3000) includes a main process and three sub-processes, namely, sub-process 3100 (a), sub-process 3100 (b), and sub-process 3100 (c); the main process is: when starting automatic calibration, the system first executes step 3001, receives a calibration signal from the calibration signal input port, and enters sub-process 3100 (a); in sub-process 3100 (a), the circuit calibrates the first IDAC (1001), and the modified IDAC register is the control register corresponding to the first IDAC (1001), and after the end, it enters sub-process 3100 (b); in sub-process 3100 (b), the circuit calibrates the fourth IDAC (1016), and the modified IDAC register is the control register corresponding to the fourth IDAC (1016), and after the end, it enters sub-process 3100 (c); in sub-process 3100 (c), the circuit calibrates the first IDAC (1001) and the second IDAC (1008) at the same time , at this time, step 3102 in the sub-process becomes to add 1 to the register values controlling the first IDAC (1001) and the second IDAC (1008), that is, to keep the difference between the two registers constant, and step 3106 in the sub-process becomes to determine whether the value of the first IDAC (1001) or the second IDAC (1008) register has reached the upper limit. If one of them has reached it, it enters step 3107, and the other steps are the same. After the end, it enters step 3002; in step 3002, it is determined whether the value of the current register is the same as the value of the register in the previous round. If not, it enters step 3003. If the same, it enters step 3004; in step 3003, it is determined whether the upper limit of the number of iterations has been reached. If not, it returns to sub-process 3100 (a). If it has reached the upper limit of the number of iterations, it enters step 3004; in step 3004, the circuit sends a calibration end signal through the calibration signal input port to complete the automatic calibration. 2.根据权利要求1所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述第一部分电路(1000)包括构成I混频器的I路混频器开关级、I路混频器跨导级和两级之间的串联电感,构成Q混频器的Q路混频器开关级、Q路混频器跨导级和两级之间的串联电感,与I路混频器跨导级、Q路混频器跨导级相连接的控制四路混频器的电流型DAC,与I路混频器跨导级、Q路混频器跨导级相连接的跨导级偏置电阻;2. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 1, characterized in that: the first circuit (1000) comprises an I-channel mixer switch stage, an I-channel mixer transconductance stage and a series inductor between the two stages constituting an I mixer, a Q-channel mixer switch stage, a Q-channel mixer transconductance stage and a series inductor between the two stages constituting a Q mixer, a current-mode DAC for controlling four mixers connected to the I-channel mixer transconductance stage and the Q-channel mixer transconductance stage, and a transconductance stage bias resistor connected to the I-channel mixer transconductance stage and the Q-channel mixer transconductance stage; I路混频器开关级通过一个串联电感和I路混频器跨导级相连接,Q路混频器开关级通过一个串联电感和Q路混频器跨导级相连接,I路混频器开关级的输入信号为LOI+和LOI-;Q路混频器开关级的输入信号为LOQ+和LOQ-;LOI+、LOI-、LOQ+和LOQ-为正交本振信号;混频器输出信号为RF+和RF-,即射频差分输出信号;与I路混频器跨导级相连接的输入信号为IF_I+和IF_I-,与Q路混频器跨导级相连接的输入信号为IF_Q+和IF_Q-;IF_I+、IF_I-、IF_Q+和IF_Q-为经过缓冲放大后的正交本振信号。The I-channel mixer switch stage is connected to the I-channel mixer transconductance stage through a series inductor, and the Q-channel mixer switch stage is connected to the Q-channel mixer transconductance stage through a series inductor. The input signal of the I-channel mixer switch stage is LOI+ and LOI-; the input signal of the Q-channel mixer switch stage is LOQ+ and LOQ-; LOI+, LOI-, LOQ+ and LOQ- are orthogonal local oscillator signals; the mixer output signal is RF+ and RF-, that is, the RF differential output signal; the input signal connected to the I-channel mixer transconductance stage is IF_I+ and IF_I-, and the input signal connected to the Q-channel mixer transconductance stage is IF_Q+ and IF_Q-; IF_I+, IF_I-, IF_Q+ and IF_Q- are orthogonal local oscillator signals after buffering and amplification. 3.根据权利要求2所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述I路混频器开关级,作为一个吉尔伯特单元的开关级,包括第一晶体管(1021)、第二晶体管(1022)、第三晶体管(1023)、第四晶体管(1024);第一晶体管(1021)和第二晶体管(1022)的源极相连,第三晶体管(1023)和第四晶体管(1024)的源极相连,第一晶体管(1021)和第三晶体管(1023)的漏极相连,第二晶体管(1022)和第四晶体管(1024)的漏极相连,作为I路混频器的输出端,第一晶体管(1021)和第四晶体管(1024)的栅极相连,作为本振信号I路正输入端,输入信号LO_I+,第二晶体管(1022)和第三晶体管(1023)的栅极相连,作为本振信号I路负输入端,输入信号LO_I-;3. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 2, characterized in that: the I-channel mixer switch stage, as a switch stage of a Gilbert unit, comprises a first transistor (1021), a second transistor (1022), a third transistor (1023), and a fourth transistor (1024); the source electrodes of the first transistor (1021) and the second transistor (1022) are connected, and the source electrodes of the third transistor (1023) and the fourth transistor (1024) are connected. , the drains of the first transistor (1021) and the third transistor (1023) are connected, the drains of the second transistor (1022) and the fourth transistor (1024) are connected, serving as the output end of the I-channel mixer, the gates of the first transistor (1021) and the fourth transistor (1024) are connected, serving as the positive input end of the local oscillator signal I-channel, the input signal LO_I+, the gates of the second transistor (1022) and the third transistor (1023) are connected, serving as the negative input end of the local oscillator signal I-channel, the input signal LO_I-; Q路混频器开关级,作为一个吉尔伯特单元的开关级,包括第五晶体管(1025)、第六晶体管(1026)、第七晶体管(1027)、第八晶体管(1028);第五晶体管(1025)和第六晶体管(1026)的源极相连,第七晶体管(1027)和第八晶体管(1028)的源极相连,第五晶体管(1025)和第七晶体管(1027)的漏极相连,第六晶体管(1026)和第八晶体管(1028)的漏极相连,作为Q路混频器的输出端,第五晶体管(1025)和第八晶体管(1028)的栅极相连,作为本振信号Q路正输入端,输入信号LO_Q+,第六晶体管(1026)和第七晶体管(1027)的栅极相连,作为本振信号Q路负输入端,输入信号LO_Q-;A Q-channel mixer switch stage, as a switch stage of a Gilbert unit, comprises a fifth transistor (1025), a sixth transistor (1026), a seventh transistor (1027), and an eighth transistor (1028); the source electrodes of the fifth transistor (1025) and the sixth transistor (1026) are connected, the source electrodes of the seventh transistor (1027) and the eighth transistor (1028) are connected, the drain electrodes of the fifth transistor (1025) and the seventh transistor (1027) are connected, the drain electrodes of the sixth transistor ( 1026 ) and the eighth transistor (1028) are connected, serving as an output end of the Q-channel mixer, the gate electrodes of the fifth transistor ( 1025 ) and the eighth transistor (1028) are connected, serving as a positive input end of a local oscillator signal Q-channel, serving as an input signal LO_Q+, the gate electrodes of the sixth transistor (1026) and the seventh transistor (1027) are connected, serving as a negative input end of a local oscillator signal Q-channel, serving as an input signal LO_Q-; 第一晶体管(1021)、第二晶体管(1022)、第三晶体管(1023)、第四晶体管(1024)、第五晶体管(1025)、第六晶体管(1026)、第七晶体管(1027)、第八晶体管(1028)尺寸相同。The first transistor (1021), the second transistor (1022), the third transistor (1023), the fourth transistor ( 1024 ), the fifth transistor (1025), the sixth transistor (1026), the seventh transistor (1027), and the eighth transistor ( 1028 ) have the same size. 4.根据权利要求2所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述I路混频器跨导级包括第九晶体管(1002)、第十晶体管(1004)、第十一晶体管(1005)、第十二晶体管(1007),Q路混频器跨导级包括第十三晶体管(1010)、第十四晶体管(1012)、第十五晶体管(1013)、第十六晶体管(1015),控制四路混频器的电流型DAC包括第一IDAC(1001)、第二IDAC(1008)、第三IDAC(1009)、第四IDAC(1016),跨导级偏置电阻包括第一电阻(1003)、第二电阻(1006)、第三电阻(1011)、第四电阻(1014);4. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 2, characterized in that: the I-channel mixer transconductance stage comprises a ninth transistor (1002), a tenth transistor ( 1004 ), an eleventh transistor (1005), and a twelfth transistor (1007); the Q-channel mixer transconductance stage comprises a thirteenth transistor ( 1010 ), a fourteenth transistor (1012), a fifteenth transistor (1013), and a sixteenth transistor ( 1015 ); the current-mode DAC for controlling the four-channel mixer comprises a first IDAC (1001), a second IDAC (1008), a third IDAC ( 1009 ), and a fourth IDAC (1016); and the transconductance stage bias resistor comprises a first resistor (1003), a second resistor ( 1006 ), a third resistor (1011), and a fourth resistor (1014); 第九晶体管(1002)、第十二晶体管(1007)、第十三晶体管(1010)、第十六晶体管(1015)尺寸相同;第十晶体管(1004)、第十一晶体管(1005)、第十四晶体管(1012)、第十五晶体管(1013)尺寸相同;第一IDAC(1001)、第二IDAC(1008)、第三IDAC(1009)、第四IDAC(1016)电流输出范围相同;第一电阻(1003)、第二电阻(1006)、第三电阻(1011)、第四电阻(1014)电阻值相同;The ninth transistor (1002), the twelfth transistor (1007), the thirteenth transistor (1010), and the sixteenth transistor (1015) have the same size; the tenth transistor (1004), the eleventh transistor (1005), the fourteenth transistor ( 1012 ), and the fifteenth transistor (1013) have the same size; the first IDAC (1001), the second IDAC ( 1008 ), the third IDAC (1009), and the fourth IDAC (1016) have the same current output range; the first resistor (1003), the second resistor ( 1006 ), the third resistor (1011), and the fourth resistor (1014) have the same resistance value; I、Q混频器的正负总共四路跨导级分别由电流型DAC控制,从而实现本振泄露与I/Q不平衡可校准,第九晶体管(1002)、第十二晶体管(1007)、第十三晶体管(1010)、第十六晶体管(1015)构成跨导级的电流镜,栅极与漏极相连,第九晶体管(1002)的漏极和第一IDAC(1001)相连,第十二晶体管(1007)的漏极和第二IDAC(1008)相连,第十三晶体管(1010)的漏极和第三IDAC(1009)相连,第十六晶体管(1015)的漏极和第四IDAC(1016)相连,每个IDAC均可由数字电路控制电流的输出大小,控制幅度为60μA;A total of four positive and negative transconductance stages of the I and Q mixers are controlled by current-type DACs, respectively, so that local oscillator leakage and I/Q imbalance can be calibrated. The ninth transistor (1002), the twelfth transistor (1007), the thirteenth transistor ( 1010 ), and the sixteenth transistor (1015) form a current mirror of the transconductance stage, and the gate is connected to the drain. The drain of the ninth transistor ( 1002 ) is connected to the first IDAC (1001), the drain of the twelfth transistor (1007) is connected to the second IDAC ( 1008 ), the drain of the thirteenth transistor (1010) is connected to the third IDAC (1009), and the drain of the sixteenth transistor ( 1015 ) is connected to the fourth IDAC (1016). The output size of the current of each IDAC can be controlled by a digital circuit, and the control amplitude is 60μA. I路混频器跨导级中的第九晶体管(1002)的栅极与第十晶体管(1004)的栅极通过第一电阻(1003)连接,第十一晶体管(1005)的栅极与第十二晶体管(1007)的栅极通过第二电阻(1006)连接,第十晶体管(1004)、第十一晶体管(1005)的源极接地,Q路混频器跨导级的第十三晶体管(1010)的栅极与第十四晶体管(1012)的栅极通过第三电阻(1011)连接,第十五晶体管(1013)的栅极与第十六晶体管(1015)的栅极通过第四电阻(1014)连接,第十四晶体管(1012)、第十五晶体管(1013)的源极接地。The gate of the ninth transistor (1002) in the I-channel mixer transconductance stage is connected to the gate of the tenth transistor ( 1004 ) through a first resistor (1003), the gate of the eleventh transistor (1005) is connected to the gate of the twelfth transistor ( 1007 ) through a second resistor (1006), the sources of the tenth transistor (1004) and the eleventh transistor (1005) are grounded, the gate of the thirteenth transistor (1010) in the Q-channel mixer transconductance stage is connected to the gate of the fourteenth transistor (1012) through a third resistor (1011), the gate of the fifteenth transistor (1013) is connected to the gate of the sixteenth transistor (1015) through a fourth resistor (1014), and the sources of the fourteenth transistor (1012) and the fifteenth transistor (1013) are grounded. 5.根据权利要求4所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述混频器开关级与跨导级之间的串联电感包括第一电感(1017)、第二电感(1018)、第三电感(1019)、第四电感(1020),第一电感(1017)、第二电感(1018)、第三电感(1019)、第四电感(1020)的电感值相同;I路混频器跨导级中的第十晶体管(1004)的漏极与开关级中的第一晶体管(1021)和第二晶体管(1022)的源极通过第一电感(1017)连接,跨导级中的第十一晶体管(1005)的漏极与开关级中的第三晶体管(1023)和第四晶体管(1024)的源极通过第二电感(1018)连接,Q路混频器跨导级中的第十四晶体管(1012)的漏极与开关级中的第五晶体管(1025)和第六晶体管(1026)的源极通过第三电感(1019)连接,跨导级中的第十五晶体管(1013)的漏极与开关级中的第七晶体管(1027)和第八晶体管(1028)的源极通过第四电感(1020)连接。5. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 4, characterized in that: the series inductance between the mixer switch stage and the transconductance stage comprises a first inductor (1017), a second inductor (1018), a third inductor (1019), and a fourth inductor (1020), and the inductance values of the first inductor (1017), the second inductor (1018), the third inductor (1019), and the fourth inductor (1020) are the same; the drain of the tenth transistor (1004) in the I-channel mixer transconductance stage is connected to the source of the first transistor (1021) and the second transistor (1022) in the switch stage through the first The first transistor (1005) in the transconductance stage is connected to the source of the third transistor (1023) and the fourth transistor (1024) in the switch stage through a second inductor (1018), the second transistor (1012) in the Q-channel mixer transconductance stage is connected to the source of the fifth transistor (1025) and the sixth transistor (1026) in the switch stage through a third inductor (1019), and the third transistor (1013) in the transconductance stage is connected to the source of the seventh transistor (1027) and the eighth transistor (1028) in the switch stage through a fourth inductor (1020). 6.根据权利要求1所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述第二部分电路(2000)包括输入耦合变压器(2100)、自混频器(2200)、低通滤波器(2300)、电压放大器(2400)、包络检测器(2500)和ADC(2600);输入耦合变压器(2100)为第一级输入,自混频器(2200)、低通滤波器(2300)、电压放大器(2400)、包络检测器(2500)依次级联,包络检测器(2500)的两路输出分别接入ADC(2600)的两路输入,最终将本振泄露与镜频信号转换为与其功率成正比的数字信号。6. An on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 1, characterized in that: the second circuit part (2000) comprises an input coupling transformer (2100), a self-mixer (2200), a low-pass filter (2300), a voltage amplifier (2400), an envelope detector (2500) and an ADC (2600); the input coupling transformer (2100) is the first-stage input, the self-mixer (2200), the low-pass filter (2300), the voltage amplifier (2400) and the envelope detector (2500) are cascaded in sequence, and the two outputs of the envelope detector (2500) are respectively connected to the two inputs of the ADC (2600), so that the local oscillator leakage and the image frequency signal are finally converted into a digital signal proportional to its power. 7.根据权利要求6所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述自混频器(2200)包括第十七晶体管(2203)、第十八晶体管(2204)、第十九晶体管(2207)、第二十晶体管(2208)、第五电阻(2201)、第六电阻(2202)、第七电阻(2209)、第八电阻(2210)、第九电阻(2211)、第一电容(2205)、第二电容(2206),自混频器输入端为IN+与IN-,输出端为OUT;7. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 6, characterized in that: the self-mixer (2200) comprises a seventeenth transistor (2203), an eighteenth transistor (2204), a nineteenth transistor (2207), a twentieth transistor (2208), a fifth resistor (2201), a sixth resistor (2202), a seventh resistor (2209), an eighth resistor (2210), a ninth resistor (2211), a first capacitor (2205), and a second capacitor (2206), the input terminals of the self-mixer are IN+ and IN-, and the output terminal is OUT; 其中第十七晶体管(2203)的漏极与第十九晶体管(2207)的源极连接,第十八晶体管(2204)的漏极与第二十晶体管(2208)的源极连接,第十七晶体管(2203)的栅极与正输入端IN+连接,第十八晶体管(2204)的栅极与负输入端连接IN-连接,第十七晶体管(2203)与第十八晶体管(2204)的源极接地,第十九晶体管(2207)、第二十晶体管(2208)的栅极与偏置电压Vb2连接,第十九晶体管(2207)、第二十晶体管(2208)的漏极与输出端OUT连接,输出端通过第五电阻(2201)与电源连接,输出端通过依次串联第七电阻(2209)、第一电容(2205)与第十七晶体管(2203)的栅极连接形成负反馈,输出端通过依次串联第八电阻(2210)、第二电容(2206)与第十八晶体管(2204)的栅极连接形成负反馈,第十七晶体管(2203)的栅极通过第五电阻(2201)与偏置电压Vb1连接,第十八晶体管(2204)的栅极通过第六电阻(2202)与偏置电压Vb1连接,输出端OUT与低通滤波器(2300)的输入端连接;第十七晶体管(2203)与第十八晶体管(2204)的尺寸相同,第十九晶体管(2207)与第二十晶体管(2208)的尺寸相同,第五电阻(2201)与第六电阻(2202)的电阻值相同,第七电阻(2209)与第八电阻(2210)的电阻值相同,第一电容(2205)与第二电容(2206)的电容值相同。The drain of the seventeenth transistor (2203) is connected to the source of the nineteenth transistor (2207), the drain of the eighteenth transistor (2204) is connected to the source of the twentieth transistor (2208), the gate of the seventeenth transistor (2203) is connected to the positive input terminal IN+, the gate of the eighteenth transistor (2204) is connected to the negative input terminal IN-, the sources of the seventeenth transistor (2203) and the eighteenth transistor (2204) are grounded, the gates of the nineteenth transistor (2207) and the twentieth transistor (2208) are connected to the bias voltage Vb2, the drains of the nineteenth transistor (2207) and the twentieth transistor (2208) are connected to the output terminal OUT, the output terminal is connected to the power supply through the fifth resistor (2201), and the output terminal is connected to the gate of the seventeenth transistor (2203) by sequentially connecting the seventh resistor (2209) and the first capacitor (2205) in series to form a negative The output terminal is connected to the gate of the eighteenth transistor (2204) by sequentially connecting an eighth resistor (2210) and a second capacitor (2206) in series to form a negative feedback; the gate of the seventeenth transistor (2203) is connected to the bias voltage Vb1 through a fifth resistor (2201); the gate of the eighteenth transistor (2204) is connected to the bias voltage Vb1 through a sixth resistor (2202); the output terminal OUT is connected to the input terminal of the low-pass filter (2300); the seventeenth transistor (2203) and the eighteenth transistor (2204) have the same size; the nineteenth transistor (2207) and the twentieth transistor (2208) have the same size; the fifth resistor (2201) and the sixth resistor (2202) have the same resistance value; the seventh resistor (2209) and the eighth resistor (2210) have the same resistance value; and the first capacitor (2205) and the second capacitor (2206) have the same capacitance value. 8.根据权利要求6所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述低通滤波器(2300)包括第五电感(2301)、第三电容(2302)、第四电容(2303),低通滤波器输入端为IN,输出端为OUT;其中第五电感(2301)与第三电容(2302)并联,一端与IN连接,另一端与OUT连接,第四电容(2303)一端与OUT连接,另一端与地连接,输出端OUT与电压放大器(2400)的输入端连接。8. An on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 6, characterized in that: the low-pass filter (2300) includes a fifth inductor (2301), a third capacitor (2302), and a fourth capacitor (2303), the input end of the low-pass filter is IN, and the output end is OUT; wherein the fifth inductor (2301) is connected in parallel with the third capacitor (2302), one end of which is connected to IN and the other end of which is connected to OUT, the fourth capacitor (2303) has one end connected to OUT and the other end connected to ground, and the output end OUT is connected to the input end of the voltage amplifier (2400). 9.根据权利要求6所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述电压放大器(2400)包括第二十一晶体管(2402)、第二十二晶体管(2403)、第二十三晶体管(2412)、第二十四晶体管(2411)、第五电容(2401)、第六电容(2407)、第七电容(2408)、第八电容(2410)、第九电容(2414)、第六电感(2404)、第七电感(2406)、第十电阻(2405)、第十一电阻(2409)、第十二电阻(2413)、第十三电阻(2415),电压放大器的输入端为IN,输出端为OUT;9. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 6, characterized in that: the voltage amplifier (2400) comprises a twenty-first transistor (2402), a twenty-second transistor (2403), a twenty-third transistor (2412), a twenty-fourth transistor (2411), a fifth capacitor (2401), a sixth capacitor (2407), a seventh capacitor (2408), an eighth capacitor (2410), a ninth capacitor (2414), a sixth inductor (2404), a seventh inductor (2406), a tenth resistor (2405), an eleventh resistor (2409), a twelfth resistor (2413), and a thirteenth resistor (2415), and the input terminal of the voltage amplifier is IN, and the output terminal is OUT; 其中第二十一晶体管(2402)的栅极通过第五电容(2401)与输入端IN连接,第二十一晶体管(2402)的源极接地,第二十一晶体管(2402)的栅极与电压偏置Vb1连接,第二十一晶体管(2402)的漏极与第二十二晶体管(2403)的源极连接,第二十二晶体管(2403)的栅极与偏置电压Vb2连接,第二十二晶体管(2403)的漏极通过依次串联第六电感(2404)、第十电阻(2405)与电源连接,第七电感(2406)与第六电容(2407)并联,一端与第二十二晶体管(2403)的漏极连接,另一端通过第八电容(2410)与第二十三晶体管(2412)的栅极连接,第二十二晶体管(2403)的漏极通过依次串联第七电容(2408)、第十一电阻(2409)与第二十一晶体管(2402)的栅极连接,第六电感(2404)与第七电感(2406)相互耦合,第二十三晶体管(2412)的漏极与第二十四晶体管(2411)的源极连接,第二十三晶体管(2412)的栅极与偏置电压Vb3连接,第二十三晶体管(2412)的源极接地,第二十四晶体管(2411)的栅极与偏置电压Vb4连接,第二十四晶体管(2411)的漏极通过第十二电阻(2413)与电源连接,第二十四晶体管(2411)的漏极与输出端OUT连接,输出端OUT通过依次串联第九电容(2414)、第十三电阻(2415)与第二十三晶体管(2412)的栅极连接,输出端OUT与包络检测器(2500)的输入端连接。The gate of the twenty-first transistor (2402) is connected to the input terminal IN through the fifth capacitor (2401), the source of the twenty-first transistor (2402) is grounded, the gate of the twenty-first transistor (2402) is connected to the voltage bias Vb1, the drain of the twenty-first transistor (2402) is connected to the source of the twenty-second transistor (2403), the gate of the twenty-second transistor (2403) is connected to the bias voltage Vb2, the drain of the twenty-second transistor (2403) is connected to the power supply through the sixth inductor (2404) and the tenth resistor (2405) connected in series, the seventh inductor (2406) is connected in parallel with the sixth capacitor (2407), one end of the seventh inductor (2406) is connected to the drain of the twenty-second transistor (2403), and the other end is connected to the gate of the twenty-third transistor (2412) through the eighth capacitor (2410), the drain of the twenty-second transistor (2403) is connected to the seventh capacitor (2404) and the tenth resistor (2405) connected in series, 8), an eleventh resistor (2409) is connected to the gate of the twenty-first transistor (2402), the sixth inductor (2404) and the seventh inductor (2406) are coupled to each other, the drain of the twenty-third transistor (2412) is connected to the source of the twenty-fourth transistor (2411), the gate of the twenty-third transistor (2412) is connected to the bias voltage Vb3, the source of the twenty-third transistor (2412) is grounded, the gate of the twenty-fourth transistor (2411) is connected to the bias voltage Vb4, the drain of the twenty-fourth transistor (2411) is connected to the power supply through the twelfth resistor (2413), the drain of the twenty-fourth transistor (2411) is connected to the output terminal OUT, the output terminal OUT is connected to the gate of the twenty-third transistor (2412) through the ninth capacitor (2414) and the thirteenth resistor (2415) connected in series in sequence, and the output terminal OUT is connected to the input terminal of the envelope detector (2500). 10.根据权利要求6所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述包络检测器(2500)包括第二十五晶体管(2503)、第二十六晶体管(2504)、第二十七晶体管(2508)、第二十八晶体管(2509)、第二十九晶体管(2510)、第三十晶体管(2513)、第三十一晶体管(2514)、第十电容(2501)、第十一电容(2506)、第十二电容(2512)、第十三电容(2515)、第十四电容(2507)、第十四电阻(2502)、第十五电阻(2505)、第十六电阻(2511),包络检测器的输入端为IN,输出端为OUT1和OUT2;10. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 6, characterized in that: the envelope detector (2500) comprises a twenty-fifth transistor (2503), a twenty-sixth transistor (2504), a twenty-seventh transistor (2508), a twenty-eighth transistor (2509), a twenty-ninth transistor (2510), a thirtieth transistor (2513), a thirty-first transistor (2514), a tenth capacitor (2501), an eleventh capacitor (2506), a twelfth capacitor (2512), a thirteenth capacitor (2515), a fourteenth capacitor (2507), a fourteenth resistor (2502), a fifteenth resistor (2505), and a sixteenth resistor (2511), the input end of the envelope detector is IN, and the output ends are OUT1 and OUT2; 其中第二十五晶体管(2503)的栅极通过第十电容(2501)与输入端IN连接,第二十五晶体管(2503)的栅极通过第十四电阻(2502)与偏置电压Vb1连接,第二十五晶体管(2503)的源极接地,第二十六晶体管(2504)的栅极通过第十一电容(2506)与地连接,第二十六晶体管(2504)的栅极通过第十五电阻(2505)与偏置电压Vb1连接,第二十五晶体管(2503)的漏极与第二十六晶体管(2504)的漏极、第二十九晶体管(2510)的漏极和输出端OUT2连接,输出端OUT2通过第十四电容(2507)与地连接,第二十九晶体管(2510)的漏极通过第十二电容(2512)与地连接,第二十九晶体管(2510)的源极与电源连接,第二十九晶体管(2510)的栅极与第二十八晶体管(2509)的栅极连接,第二十八晶体管(2509)的栅极与自身的漏极连接,第二十八晶体管(2509)的源极与电源连接,第二十八晶体管(2509)的漏极与第二十七晶体管(2508)的漏极连接,第二十七晶体管(2508)的栅极与偏置电压Vb2连接,第二十七晶体管(2508)的源极接地,第二十九晶体管(2510)的漏极通过第十六电阻(2511)与第三十晶体管(2513)的栅极连接,第三十晶体管(2513)的源极与电源连接,第三十晶体管(2513)的漏极与第三十一晶体管(2514)的漏极和输出端OUT1连接,第三十一晶体管(2514)的栅极与偏置电压Vb3连接,第三十一晶体管(2514)的源极接地,输出端OUT1通过第十三电容(2515)与地连接,输出端OUT1与OUT2与ADC(2600)连接;第二十五晶体管(2503)与第二十六晶体管(2504)的尺寸相同,第十四电阻(2502)与第十五电阻(2505)的电阻值相同,第十电容(2501)与第十一电容(2506)的电容值相同。The gate of the twenty-fifth transistor (2503) is connected to the input terminal IN through the tenth capacitor (2501), the gate of the twenty-fifth transistor (2503) is connected to the bias voltage Vb1 through the fourteenth resistor (2502), the source of the twenty-fifth transistor (2503) is grounded, the gate of the twenty-sixth transistor (2504) is connected to the ground through the eleventh capacitor (2506), the gate of the twenty-sixth transistor (2504) is connected to the bias voltage Vb1 through the fifteenth resistor (2505), the drain of the twenty-fifth transistor (2503) is connected to the twenty-sixth transistor (2504). The drain of the transistor (2504), the drain of the twenty-ninth transistor (2510) and the output terminal OUT2 are connected, the output terminal OUT2 is connected to the ground via the fourteenth capacitor (2507), the drain of the twenty-ninth transistor (2510) is connected to the ground via the twelfth capacitor (2512), the source of the twenty-ninth transistor (2510) is connected to the power supply, the gate of the twenty-ninth transistor (2510) is connected to the gate of the twenty-eighth transistor (2509), the gate of the twenty-eighth transistor (2509) is connected to its own drain, and the gate of the twenty-eighth transistor (2509) is connected to the power supply. The source of the 28th transistor (2509) is connected to the drain of the 27th transistor (2508), the gate of the 27th transistor (2508) is connected to the bias voltage Vb2, the source of the 27th transistor (2508) is grounded, the drain of the 29th transistor (2510) is connected to the gate of the 30th transistor (2513) through the 16th resistor (2511), the source of the 30th transistor (2513) is connected to the power supply, the drain of the 30th transistor (2513) is connected to the drain of the 31st transistor (2514) and the output terminal The output terminal OUT1 is connected, the gate of the thirty-first transistor (2514) is connected to the bias voltage Vb3, the source of the thirty-first transistor (2514) is grounded, the output terminal OUT1 is connected to the ground through the thirteenth capacitor (2515), and the output terminals OUT1 and OUT2 are connected to the ADC (2600); the size of the twenty-fifth transistor (2503) and the twenty-sixth transistor (2504) are the same, the resistance value of the fourteenth resistor (2502) and the fifteenth resistor (2505) are the same, and the capacitance value of the tenth capacitor (2501) and the eleventh capacitor (2506) are the same. 11.根据权利要求6所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:所述ADC(2600)包括两个直流电平输入端口、一个用于切换读取端口的数字控制端口、一个数字总线输出端口,两个直流电平输入端口分别与包络检测器(2500)的输出端OUT1、输出端OUT2连接,数字总线输出端口与第三部分电路(3000)连接。11. An on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 6, characterized in that: the ADC (2600) includes two DC level input ports, a digital control port for switching the read port, and a digital bus output port, the two DC level input ports are respectively connected to the output terminal OUT1 and the output terminal OUT2 of the envelope detector (2500), and the digital bus output port is connected to the third part circuit (3000). 12.根据权利要求11所述的一种本振泄露和I/Q不平衡的片上自动校准系统,其特征在于:子流程3100(a)、子流程3100(b)、子流程3100(c)均执行相同的流程,即子流程(3100);在子流程(3100)中,电路首先进入步骤3101,将对应IDAC的控制寄存器值置为0,然后进入步骤3102,将寄存器的数值加1,接着进入步骤3103,通过数字总线输入端口读取ADC读取的OUT1与OUT2的数值,并计算得到OUT1-OUT2的数值,然后进入步骤3104,若此时OUT1-OUT2的数值小于之前的读数,则存储该OUT1-OUT2的数值,并触发步骤3105,存储当前寄存器的数值,步骤3104结束后,进入步骤3106,判断寄存器的数值是否达到上限,如果未达到上限,则返回至步骤3102,如果已经达到上限,则进入步骤3107,将寄存器置为循环中得到的最佳偏置值,并结束子流程(3100)。12. The on-chip automatic calibration system for local oscillator leakage and I/Q imbalance according to claim 11, characterized in that: sub-process 3100(a), sub-process 3100(b), and sub-process 3100(c) all execute the same process, namely, sub-process (3100); in sub-process (3100), the circuit first enters step 3101, sets the control register value of the corresponding IDAC to 0, then enters step 3102, adds 1 to the register value, and then enters step 3103, reads OUT1 and OUT2 read by the ADC through the digital bus input port The value of OUT1-OUT2 is calculated, and then step 3104 is entered. If the value of OUT1-OUT2 is less than the previous reading at this time, the value of OUT1-OUT2 is stored, and step 3105 is triggered to store the value of the current register. After step 3104 is completed, step 3106 is entered to determine whether the value of the register has reached the upper limit. If it has not reached the upper limit, it returns to step 3102. If it has reached the upper limit, it enters step 3107, sets the register to the best bias value obtained in the loop, and ends the sub-process (3100).
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