CN119201616A - Circuit boards and computing devices - Google Patents
Circuit boards and computing devices Download PDFInfo
- Publication number
- CN119201616A CN119201616A CN202411288875.6A CN202411288875A CN119201616A CN 119201616 A CN119201616 A CN 119201616A CN 202411288875 A CN202411288875 A CN 202411288875A CN 119201616 A CN119201616 A CN 119201616A
- Authority
- CN
- China
- Prior art keywords
- circuit
- monitoring
- sampling resistor
- circuit board
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3031—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a motherboard or an expansion card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
- G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
- G06F15/7803—System on board, i.e. computer system on one or more PCB, e.g. motherboards, daughterboards or blades
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Embodiments of the present disclosure provide a circuit board and a computing device. The circuit board comprises a carrier board, a temperature monitoring loop, a detection circuit and a control circuit, wherein the temperature monitoring loop comprises a monitoring wiring, an extraction wiring and a sampling resistor, the monitoring wiring is arranged in a monitoring area of the carrier board, the sampling resistor is arranged in a control area of the carrier board, the extraction wiring is connected in series between the monitoring wiring and the sampling resistor, the monitoring wiring is configured to have a preset thermal resistance range, the sampling resistor has a given resistance, the thermal resistance and the given resistance in the preset thermal resistance range are both higher than the circuit resistance of the extraction wiring, the detection circuit is arranged in the control area and is used for detecting voltages at two ends of the sampling resistor to obtain detection voltages, the detection voltages change inversely to the temperature change of the monitoring area, and the control circuit is arranged in the control area and is connected with the detection circuit and is used for judging the temperature state of the monitoring area based on the detection voltages.
Description
Technical Field
Embodiments of the present disclosure relate to the field of electronic and electrical technology, and more particularly, to a circuit board and a computing device.
Background
A computing device such as a server has a circuit board mounted therein, and the circuit board is integrated with devices such as a processor and peripheral circuits as core components of the computing device to perform computing power of the computing device. For example, the circuit board may be a printed circuit board (Printed Circuit Board, PCB) that typically integrates critical electronic components such as processors, memory, input/output interfaces, etc., and performs the important tasks of data transmission and processing.
In general, stability of a circuit board is critical to performance of a computing device, especially a server deployed in a data center, and once the circuit board has a fault such as burnout or short circuit, normal operation of the computing device is directly affected, and development progress delay or service interruption may be caused, so that loss is brought to a user. Thus, ensuring reliability and durability of circuit boards is critical to computing device design and maintenance.
At present, a plurality of solutions for guaranteeing the temperature reliability of a circuit board are more, and a more effective way is to use a specific position of the circuit board as a temperature monitoring area, arrange a temperature sensor or a thermal imaging device and other thermal sensing elements in the temperature monitoring area to monitor the whole board temperature of the circuit board, trigger an alarm or execute a power-off operation when the temperature is abnormal, however, the thermal sensing elements have higher requirements on the arrangement position on the circuit board, so that the flexibility is poor, for example, the whole board of the circuit board cannot be monitored in temperature.
Disclosure of Invention
In view of the foregoing, embodiments of the present disclosure provide a circuit board and a computing device to solve the above-mentioned problems.
According to a first aspect of the embodiment of the disclosure, a circuit board is provided, and the circuit board comprises a carrier board, a temperature monitoring loop, a detection circuit and a control circuit, wherein the monitoring loop comprises a monitoring wire, an extraction wire and a sampling resistor, the monitoring wire is arranged in a monitoring area of the carrier board, the sampling resistor is arranged in a control area of the carrier board, the extraction wire is connected in series between the monitoring wire and the sampling resistor, the monitoring wire is configured to have a preset thermal resistance value range, the sampling resistor has a given resistance value, the thermal resistance value in the preset thermal resistance value range and the given resistance value are higher than the line resistance value of the extraction wire, the detection circuit is arranged in the control area and used for detecting voltages at two ends of the sampling resistor to obtain detection voltages, the fluctuation of the detection voltages is inversely related to the temperature fluctuation of the monitoring area, and the control circuit is arranged in the control area and connected with the detection circuit and used for judging the temperature monitoring state of the area based on the detection voltages.
According to a second aspect of embodiments of the present disclosure, there is provided a circuit board comprising a carrier plate; the temperature monitoring circuit comprises a monitoring wiring, an outgoing wiring, a first sampling resistor and a second sampling resistor, wherein the monitoring wiring is arranged in a monitoring area of the carrier plate, the first sampling resistor and the second sampling resistor are arranged in a control area of the carrier plate, the outgoing wiring is connected in series among the monitoring wiring, the first sampling resistor and the second sampling resistor, the monitoring wiring is configured to have a preset thermosensitive resistance range, the first sampling resistor has a first given resistance value, the second sampling resistor has a second given resistance value, the thermosensitive resistance value in the preset thermosensitive resistance range, the first given resistance value and the second given resistance value are higher than the line resistance value of the outgoing wiring, a first detection circuit is arranged in the control area and used for detecting voltages at two ends of the first sampling resistor to obtain a first detection voltage, the first detection voltage is in a temperature fluctuation range, the second sampling resistor has a second given resistance value, the thermosensitive resistance value in the preset thermosensitive resistance value range, the first detection circuit and the second given resistance value are higher than the line resistance value of the outgoing wiring, the first detection circuit is arranged in the control area, the first detection circuit is used for detecting voltages at two ends of the first detection voltage, the first detection circuit is used for detecting voltages, the first detection circuit is in the temperature fluctuation range is related to the temperature fluctuation range, the first detection circuit is used for detecting voltage, and is in the temperature fluctuation range, and is used for detecting circuit is in the control circuit, and is used for detecting voltage, and is in control circuit, and is connected with the circuit.
According to a third aspect of embodiments of the present disclosure, there is provided a computing device including a chassis and the circuit board of the first or second aspect.
In the scheme of the embodiment of the disclosure, the detection circuit and the control circuit can be arranged in the control area of the carrier plate, and the control area and the monitoring area can be electrically connected through the outgoing wires, so that dependence of the arrangement positions of the detection circuit and the control circuit on the arrangement positions of the monitoring wires is avoided. In addition, monitoring
The [ P-137600-CN-PRI-1] [ HS2411085CCN ] wiring, the lead-out wiring and the sampling resistor form a temperature monitoring loop, in the temperature monitoring loop, the voltage at two ends of the sampling resistor is detected by the detection circuit, and the temperature change of the monitoring area is accurately acquired by the change of the detection voltage inversely related to the temperature change of the monitoring area through the thermosensitive characteristic of the monitoring wiring. In addition, the monitoring wiring is arranged in a monitoring area of the carrier plate, the monitoring wiring is configured to have a preset thermal resistance value range, compared with circuit elements such as a thermistor, the monitoring wiring can be flexibly arranged in any monitoring area on the carrier plate, the flexibility of temperature monitoring is improved, and then the whole-plate temperature monitoring of the circuit board can be realized.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following description will briefly introduce the drawings that are required to be used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments described in the embodiments of the present disclosure, and other drawings may also be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic block diagram of a circuit board of some embodiments of the present disclosure.
Fig. 2 is a side view of a circuit board of some examples of the embodiment of fig. 1.
Fig. 3 is a schematic circuit diagram of some examples of on-board circuits of the embodiment of fig. 1.
Fig. 4 is a schematic block diagram of a circuit board of other embodiments of the present disclosure.
Fig. 5 is a schematic circuit diagram of some examples of on-board circuits of the embodiment of fig. 4.
Fig. 6 is a schematic block diagram of a computing device of further embodiments of the present disclosure.
Detailed Description
In order to better understand the technical solutions in the embodiments of the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments, which are derived by a person skilled in the art from the embodiments according to the present disclosure, shall fall within the scope of protection of the embodiments according to the present disclosure.
Embodiments of the present disclosure are further described below with reference to the drawings of embodiments of the present disclosure.
Temperature monitoring on a circuit board, such as a PCB board, is critical to ensuring performance and security of a computing device. As the density of electrical components in computing devices increases and the power density increases, the temperature on the circuit board may rise to levels that may lead to performance degradation or permanent damage. Temperature monitoring on circuit board
The [ P-137600-CN-PRI-1] [ HS2411085CCN ] measurement can help identify areas of overheating, thereby taking precautions, such as enhancing heat dissipation or adjusting equipment load. In addition, temperature data of the circuit board is critical to optimizing system design, improving energy efficiency, and extending equipment life. In computing devices such as servers, industrial control systems, or automotive electronics that have high operational stability and reliability requirements, temperature monitoring is particularly necessary, and by continuously monitoring the temperature, it is ensured that the computing device is operating within a specified temperature range, thereby reducing failure rates and improving system stability and reliability.
At present, a plurality of solutions for guaranteeing the temperature reliability of a circuit board are more, and a more effective way is to use a specific position of the circuit board as a temperature monitoring area, arrange a temperature sensor or a thermal imaging instrument and other thermal sensing elements in the temperature monitoring area to monitor the whole board temperature of the circuit board, trigger an alarm or execute a power-off operation when the temperature is abnormal, however, the thermal sensing elements have higher requirements on the arrangement position on the circuit board, for example, the space of the on-board circuit is required to be enough for arranging the thermal sensing elements, so that the electrical isolation between the on-board circuit and the on-board circuit is realized. The flexibility of such temperature monitoring scheme is poor, and the whole board of the circuit board can not be monitored in temperature. For this reason, the embodiments of the present disclosure provide a series of schemes that increase flexibility of temperature monitoring, thereby enabling whole board temperature monitoring of a circuit board.
Specifically, fig. 1 illustrates a circuit board of some embodiments. The circuit board 100 of fig. 1 includes a carrier board 10, a temperature monitoring circuit 20, a detection circuit 30, and a control circuit 40. The temperature monitoring circuit 20, the detection circuit 30 and the control circuit 40 may be collectively referred to as an on-board circuit.
Specifically, the temperature monitoring circuit 20 includes a monitoring trace 21, an extraction trace 22, and a sampling resistor 23. The monitoring trace 21 is arranged in a monitoring area (shown by a left dotted line) of the carrier plate, the sampling resistor 23 is arranged in a control area (shown by a right dotted line) of the carrier plate, and the lead-out trace 22 is connected in series between the monitoring trace 21 and the sampling resistor 23.
In some examples, the outgoing traces have flexibility in routing, the control region may be remote from the monitoring region, e.g., the monitoring region may be a circuit-densely routed location where temperature monitoring is performed, which is not suitable for placement of other circuit devices or other traces, such that other circuit devices or other traces may be placed in the control region. That is, the position separation of the monitoring area from the control area is achieved by the outgoing track.
In other examples, the lead-out traces have flexibility of routing, and the control region may be closer to the monitoring region, such that the control region may correspond to different ones of the monitoring regions on the reduced circuit board
Other circuits and wiring of [ P-137600-CN-PRI-1] [ HS2411085CCN ] optimize the wiring layout on the circuit board.
In addition, the monitoring wire is configured to have a preset thermal resistance range, the sampling resistor has a given resistance, and the thermal resistance and the given resistance in the preset thermal resistance range are higher than the circuit resistance of the lead-out wire. It should be appreciated that the monitor trace may be a metal wire such as a copper wire. For example, the resistance r=ρl/a of the wire, where ρ (T) is the resistivity of the material of the wire, which is positively correlated with the temperature T of the wire, i.e., the wire acts as a positive temperature coefficient (Positive Temperature Coefficient, NTC) thermistor, L is the conductor length of the wire, and a is the conductor cross-sectional area of the wire. That is, the monitoring trace is configured to have a preset thermal resistance range r=ρ (T) L/a.
In some examples, the resistance of the sampling resistor and the preset thermal resistance range may be quite numerical, e.g., both may be of the same order of magnitude, i.e., the resistance of the sampling resistor is not less than 1/10 of the lower limit of the preset thermal resistance range and not more than 10 times the upper limit of the preset thermal resistance range.
In addition, the line resistance of the lead-out wire may be an order of magnitude smaller than the resistance of the sampling resistor and the preset thermal resistance range, for example, the line resistance of the lead-out wire is smaller than 1/10 of the lower limit of the preset thermal resistance range.
Further, the sampling resistor is configured to have a given resistance value, and the thermal coefficient of the sampling resistor is smaller than the thermal coefficient of the monitoring trace. Preferably, the sample resistor has a minimal coefficient of thermal sensitivity, i.e., the sample resistor is a non-thermistor.
It should be understood that the temperature monitoring circuit further includes a voltage source connected in series in the temperature monitoring circuit, and a power supply voltage provided to the temperature monitoring circuit by the voltage source, wherein the monitoring trace, the lead-out trace and the sampling resistor satisfy a resistive voltage division relationship of the power supply voltage based on the voltage source. Under the condition of the above-mentioned resistance value relation, the lead-out wiring has wiring flexibility, and the voltage obtained by the lead-out wiring is negligible compared with the sampling resistor and the monitoring wiring, and cannot influence the voltage obtained by the monitoring wiring. It will be appreciated that if the line resistance of the outgoing trace is sufficiently small, it will not affect the voltage divided by the monitoring trace, even in the case where the outgoing trace may have thermal characteristics (i.e., a larger thermal coefficient).
In other words, given a supply voltage, the temperature has little effect on the resistance of the sampling resistor, and the factors affecting the voltage divided by the sampling resistor are mainly the resistance of the sampling resistor and the temperature of the monitoring trace.
In addition, a detection circuit and a control circuit are arranged in the control area, and the detection circuit is used for sampling
And detecting the voltage at two ends of the [ P-137600-CN-PRI-1] [ HS2411085CCN ] resistor to obtain detection voltage. The control circuit is connected with the detection circuit and is used for judging the temperature state of the monitoring area based on the detection voltage. It should be understood that, based on the above-described resistance partial pressure relationship, the variation of the detection voltage of the sampling resistor is inversely related to the temperature variation of the monitoring region given the resistance value of the sampling resistor.
In addition, the circuit board 100 may further include a power supply circuit 50 disposed on the carrier board 10 for supplying power to other circuits on the carrier board 10.
In some examples, the control circuit 40 may be configured to issue an alarm when the temperature condition indicates that the circuit board 100 is in an abnormal condition. In other examples, the control circuit 40 may also shut off the power supply circuit 50 when the temperature condition indicates that the circuit board is in an abnormal condition. For example, the power supply circuit 50 may be a power switching circuit, such as a DC-DC circuit. That is, when the temperature state indicates that the circuit board is in an abnormal state, the power supply circuit is turned off, so that the over-temperature protection of the circuit board is realized, that is, the burn-out prevention effect of the circuit board is realized. In addition, the voltage source may be connected to the power supply circuit to directly obtain the power supply voltage of the temperature monitoring circuit, or to step down or step up the voltage obtained from the power supply circuit to obtain the power supply voltage of the temperature monitoring circuit.
In the scheme of the embodiment of the disclosure, the detection circuit and the control circuit can be arranged in the control area of the carrier plate, and the control area and the monitoring area can be electrically connected through the outgoing wires, so that dependence of the arrangement positions of the detection circuit and the control circuit on the arrangement positions of the monitoring wires is avoided. In addition, the monitoring wiring, the leading-out wiring and the sampling resistor form a temperature monitoring loop, in the temperature monitoring loop, the detection circuit detects the voltage at two ends of the sampling resistor, and the temperature change of the monitoring area is accurately acquired by inversely correlating the change of the detection voltage with the temperature change of the monitoring area through the thermosensitive characteristic of the monitoring wiring. In addition, the monitoring wiring is arranged in a monitoring area of the carrier plate, the monitoring wiring is configured to have a preset thermal resistance value range, compared with circuit elements such as a thermistor, the monitoring wiring can be flexibly arranged in any monitoring area on the carrier plate, the flexibility of temperature monitoring is improved, and then the whole-plate temperature monitoring of the circuit board can be realized.
In other embodiments, the carrier is a multilayer substrate, as shown in fig. 2, and an exemplary multilayer substrate includes a ply L1, a ply L2, and a ply L3. The monitor trace 21 is arranged between the board layer 21 and the board layer 22, i.e. an inner substrate region of the multilayer substrate. The sampling resistor is disposed on the ply L3, i.e., the outer layer substrate region of the multilayer substrate. The extraction trace 22 is connected from the monitoring trace 21 to the sampling resistor 23 via the lamina L2 and lamina L3 (e.g. via a via in lamina). Without loss of generality, the monitored area is
The control area is an outer substrate area of the multilayer substrate, the leading-out wire is connected with the monitoring wire and the sampling resistor through at least one through hole in the multilayer substrate, the sampling resistor is arranged in the control area, and the monitoring wire is arranged in the inner substrate area under the condition that circuit elements are difficult to arrange in the inner substrate area of the multilayer substrate, so that the arrangement range of the monitoring area is enlarged.
In other embodiments, the lead-out traces have flexibility in routing, the monitoring area may be a location where the circuit routing is dense, such location may be temperature monitored, and such location may not be suitable for placement of other circuit devices or other traces, such that other circuit devices or other traces may be placed in the control area. That is, the circuit wiring density of the monitoring area may be greater than that of the control area, so that the temperature monitoring can be performed with the area where the wiring density is greater as the monitoring area.
Furthermore, the shape of the monitoring area may be different for a given monitoring area. For example, in the case where the monitoring area is relatively long and narrow, the trace track of the monitoring trace may generally conform to the shape of the monitoring area. For another example, the monitoring trace may be provided as a meandering trace or a convoluted trace within the monitoring region, which may increase the actual length of the monitoring trace, thereby increasing the thermal coefficient of the monitoring trace. Without loss of generality, the monitoring area is formed by a circuit wiring void, and the monitoring trace is disposed at a predetermined electrical isolation distance from an edge of the monitoring area. That is, when the monitoring area is formed by the circuit wiring gap, the monitoring wiring can be arranged in the monitoring area, monitoring of the area with high wiring density is realized, the monitoring wiring is arranged to have a preset electrical isolation distance from the edge of the monitoring area, and the influence on the electrical performance of the circuit wiring is avoided.
In other embodiments, as shown in FIG. 3, the temperature monitoring loop in circuit board 100 includes a monitoring trace, an extraction trace, a sampling resistor, and a voltage source. The monitoring trace comprises a resistor R1 with a preset thermosensitive resistance range. The voltage source provides a supply voltage VCC. The outgoing wirings comprise a first outgoing wiring and a second outgoing wiring, the first outgoing wiring is connected between one end of the sampling resistor and the monitoring wiring, and the second outgoing wiring is connected between the other end of the sampling resistor and the monitoring wiring. The first outgoing trace is configured as a first equivalent thermistor R2 and the second outgoing trace is configured as a second equivalent thermistor R3. The sampling resistor is configured to have a given resistance value R4, and R4 may be constant with temperature variation of the sampling resistor. Further, the circuit board 100 includes an amplifier U1 as an example of the detection circuit 30, and includes a comparator U2 as an example of the control circuit 40.
In the case of the detection circuit being an amplifier, the first input of the amplifier is connected to one end of the sampling resistor, the second input of the amplifier is connected to the other end of the sampling resistor, and the output of the amplifier is connected to
And the [ P-137600-CN-PRI-1] [ HS2411085CCN ] control circuit is used for amplifying the sampling voltage of the sampling resistor to obtain a detection voltage, and outputting the detection voltage to the control circuit through an output end. That is, by amplifying the voltages at both ends of the sampling resistor to obtain the detection voltage, the temperature variation of the monitoring area can be more significantly judged, and the requirement on the thermal coefficient of the monitoring trace is reduced. In some examples, as shown in fig. 3, the negative electrode of the voltage source is connected to one end of the sampling resistor and to the ground, and the positive side of the voltage source is connected to the drain trace, i.e., the first input of the amplifier is connected to the ground, in order to save static power consumption of the amplifier.
Specifically, when the temperature of the monitoring area is T1, the monitoring trace R1 (T1) is within the preset thermistor resistance range, the resistance of the first equivalent thermistor is R2 (T1), and the resistance of the second equivalent thermistor is R3 (T1). Accordingly, the voltage VR4 (T1) =vcc/(R1 (T1) +r2 (T1) +r3 (T1) +r4) at both ends of the sampling resistor detected by the detection circuit 30 is r4≡vcc/(R1 (T1) +r4) R4. Alternatively, in the example in which the detection circuit 30 is an amplifier U1, the amplifier has a gain coefficient G, and the detection voltage VD (T1) =vr4 (T1) ×g.
For another example, when the temperature of the monitoring area is T2, the monitoring trace R1 (T2) is within the preset thermistor range, the resistance of the first equivalent thermistor is R2 (T2), and the resistance of the second equivalent thermistor is R3 (T2). Accordingly, the voltage VR 4=vcc/(R1 (T2) +r2 (T2) +r3 (T2) +r4) across the sampling resistor detected by the detection circuit 30 is r4≡vcc/(R1 (T2) +r4) R4. Alternatively, in the example in which the detection circuit 30 is an amplifier U1, the amplifier has a gain coefficient G, and the detection voltage VD (T2) =vr4 (T2) ×g.
In the case that the control circuit 40 is a comparator U2, a first input terminal of the comparator U2 is connected to an output terminal of the amplifier, for receiving the detection voltage, a second input terminal of the comparator U2 receives a preset voltage threshold, and the comparator U2 is configured to compare the detection voltage with the preset voltage threshold and output a control signal indicating a comparison result.
Specifically, for the case where the temperature of the monitored area is T, the detection voltage is VD (T) =vr4 (T) ×g≡vcc×g/(R1 (T) +r4) ×r4, tth may be empirically or custom set as the upper temperature limit of the monitored area, and it is considered that the circuit board is in an abnormal state when the monitored area exceeds the upper temperature limit, for example, the circuit board has a risk of burning.
In this example, R1 (T) is positively correlated with T and VD (T) is inversely correlated with R1 (T), i.e., VD (T)
[ P-137600-CN-PRI-1] [ HS2411085CCN ] is inversely related to T. Accordingly, VD (Tth) may be set as a lower limit threshold of the detection voltage, that is, a preset voltage threshold. When the detected voltage is larger than a preset voltage threshold, the comparison result output by the comparator U2 indicates that the circuit board is in a normal state. When the detected voltage is smaller than the preset voltage threshold, the comparison result output by the comparator U2 indicates that the circuit board is in an abnormal state.
That is, the accurate comparison of the preset voltage threshold value and the detection voltage is realized through the simple circuit configuration of the comparator, and the temperature state of the monitoring area is accurately judged.
Without loss of generality, the control circuit may be configured as an analog circuit that determines that the temperature state of the monitored area indicates that the circuit board is in an abnormal state when the detected voltage is less than a preset voltage threshold. The fluctuation of the detection voltage is inversely related to the temperature fluctuation of the monitoring area, and the detection voltage being smaller than the preset voltage threshold value indicates that the voltage at two ends of the monitoring wiring is larger, that is, the temperature of the monitoring area where the monitoring wiring is located is higher, in this case, by setting the preset voltage threshold value, it can be judged that the temperature state of the monitoring area indicates that the circuit board is in an abnormal state. Alternatively, it may be determined that the temperature state of the monitoring area is in a normal state when the detected voltage is greater than the preset voltage threshold.
In addition, the preset voltage threshold value can be provided by a voltage dividing circuit formed by a plurality of series resistors, and different preset voltage threshold values can be output from different series nodes among the plurality of series resistors, so that the preset voltage threshold value is adjusted. For example, the voltage divider circuit may be connected between the ground terminal and a voltage source of the temperature monitoring circuit, or between the ground terminal and a power supply terminal of the power supply circuit.
Further embodiments of the circuit board of the present disclosure will be described in detail below in conjunction with fig. 4. The circuit board of fig. 4 includes a carrier board 10, a temperature monitoring circuit 20, a first detection circuit 31, a second detection circuit 32, and a control circuit 60.
Specifically, the temperature monitoring circuit 20 includes a monitoring trace 21, an outgoing trace 22, a first sampling resistor 231 and a second sampling resistor 232, where the monitoring trace 21 is disposed in a monitoring area (shown by a left dotted line) of the carrier 10, the first sampling resistor 231 and the second sampling resistor 232 are disposed in a control area (shown by a right dotted line) of the carrier 10, and the outgoing trace 22 is connected in series among the monitoring trace 21, the first sampling resistor 231 and the second sampling resistor 232.
In addition, the monitoring trace 21 is configured to have a preset thermal resistance range, the first sampling resistor 231 has a first given resistance value, and the second sampling resistor 232 has a second given resistance value. The thermal resistance value, the first given resistance value and the second given resistance value in the preset thermal resistance value range are all higher than the leading value
[ P-137600-CN-PRI-1] [ HS2411085CCN ] is the line resistance of the trace 22.
The first detection circuit 231 is disposed in the control area, and the first detection circuit 231 is configured to detect voltages across the first sampling resistor 231 to obtain a first detection voltage. The first detection circuit 232 is disposed in the control region, and the second detection circuit 232 is configured to detect voltages across the second sampling resistor 232 to obtain a second detection voltage. The variation of the second detection voltage is inversely related to the temperature variation of the monitoring area.
The control circuit 60 is provided in the control region, and the control circuit 60 is connected to the first detection circuit 31 and the second detection circuit 32 for judging the temperature state of the monitoring region based on the first detection voltage and the second detection voltage.
It should be understood that the above explanation and description of similar technical concepts and corresponding elements may be referred to the explanation and description based on the circuit board 100.
In the scheme of the embodiment of the disclosure, the monitoring wire is arranged in the monitoring area of the carrier plate, the monitoring wire is configured to have a preset thermal resistance range, and compared with circuit elements such as a thermistor, the monitoring wire can be flexibly arranged in any monitoring area on the carrier plate, so that the flexibility of temperature monitoring is improved, and the whole-plate temperature monitoring of the circuit board can be realized.
In addition, the first detection circuit, the second detection circuit and the control circuit can be arranged in the control area of the carrier plate, and the control area and the monitoring area can be electrically connected through the outgoing wires, so that dependence of the arrangement positions of the first detection circuit, the second detection circuit and the control circuit on the arrangement positions of the monitoring wires is avoided. In addition, the monitoring wiring, the leading-out wiring, the first sampling resistor and the second sampling resistor form a temperature monitoring loop, in the temperature monitoring loop, the first detection circuit detects the voltages at two ends of the first sampling resistor, the second detection circuit detects the voltages at two ends of the second sampling resistor, the fluctuation of the first detection voltage and the second detection voltage is inversely related to the temperature fluctuation of the monitoring area through the thermosensitive characteristic of the monitoring wiring, and the temperature fluctuation of the monitoring area is accurately acquired through comprehensively judging the first detection voltage and the second detection voltage.
In other embodiments, the monitoring area is an inner substrate area of the multilayer substrate, the control area is an outer substrate area of the multilayer substrate, the extraction trace connects the monitoring trace with the first sampling resistor and the second sampling resistor through at least one through hole in the multilayer substrate, and the first sampling resistor and the second sampling resistor are disposed in the control area. The inner substrate region of the multilayer substrate is difficult to arrange circuit elements by monitoring the wiring
The [ P-137600-CN-PRI-1] [ HS2411085CCN ] is arranged in the inner substrate area, so that the arrangement range of the monitoring area is enlarged.
In other embodiments, as shown in fig. 5, the first detection resistor 231 is R41, the second detection resistor is R42, and the control circuit 60 includes a first comparator U12, a second comparator U22, and a logic or gate U3, where an output terminal of the first comparator U12 is connected to a first input terminal of the logic or gate U3, and an output terminal of the second comparator U22 is connected to a second input terminal of the logic or gate U3.
In addition, a first input terminal of the first comparator U12 is connected to the first detection circuit for receiving the first detection voltage, a second input terminal of the first comparator U12 is connected to a first preset voltage threshold, the first comparator U12 is used for comparing the first detection voltage with the first preset voltage threshold, and a first high level is output when the first detection voltage is smaller than the first preset voltage threshold. The first input end of the second comparator U22 is connected to the second detection circuit and is configured to receive a second detection voltage, the second input end of the second comparator U22 is connected to a second preset voltage threshold, the second comparator U22 is configured to compare the second detection voltage with the second preset voltage threshold, and output a second high level when the second detection voltage is less than the second preset voltage threshold.
Further, in the example of fig. 5, the first detection circuit 31 may be the amplifier U11, and the second detection circuit may be the U21. Specifically, when the temperature of the monitoring area is T1, the monitoring trace R1 (T1) is within the preset thermistor resistance range, the resistance of the first equivalent thermistor is R2 (T1), and the resistance of the second equivalent thermistor is R3 (T1). Accordingly, the voltage VR41 (T1) =vcc/(R1 (T1) +r2 (T1) +r3 (T1) +r41+r42) r41++vcc/(R1 (T1) +r41+r42) r41 across the sampling resistor detected by the detection circuit 31. Alternatively, in the example in which the detection circuit 31 is the amplifier U11, the amplifier has a gain coefficient G1, and the first detection voltage VD (T1) =vr41 (T1) ×g1.
Correspondingly, when the temperature of the monitoring area is T2, the monitoring wire R1 (T2) is in the preset thermistor value range, the resistance value of the first equivalent thermistor is R2 (T2), and the resistance value of the second equivalent thermistor is R3 (T2). Accordingly, the voltage VR41 (T2) =vcc/(R1 (T2) +r2 (T2) +r3 (T2) +r41+r42) r41++vcc/(R1 (T2) +r41+r42) r41 across the sampling resistor detected by the detection circuit 31. Alternatively, in the example in which the detection circuit 31 is the amplifier U11, the amplifier has a gain coefficient G1, and the first detection voltage VD1 (T2) =vr41 (T2) ×g1.
Similarly, when the temperature of the monitored area is T1, the voltage VR42 (T1) =vcc/(R1 (T1) +r2 (T1) +r3 (T1) +r41+r42) across the sampling resistor detected by the detection circuit 32 r42+_vcc/(R1 (T1) +r41+r42). Alternatively, in the example where the detection circuit 32 is the amplifier U21, the amplification is performed
The [ P-137600-CN-PRI-1] [ HS2411085CCN ] amplifier has a gain factor G2, and the second detection voltage VD2 (T1) =VR 42 (T1) ×G2.
Accordingly, when the temperature of the monitored area is T2, the voltage VR42 (T2) =vcc/(R1 (T2) +r2 (T2) +r3 (T2) +r41+r42) at the two ends of the sampling resistor detected by the detection circuit 32 r42+_vcc/(R1 (T2) +r41+r42) r42. Alternatively, in the example in which the detection circuit 32 is the amplifier U21, the amplifier has a gain coefficient G2, and the second detection voltage VD2 (T2) =vr42 (T2) ×g2.
Therefore, VD1 (T) and T are inversely related, and VD2 (T) and T are inversely related, and Tth may be empirically or custom set as the upper temperature limit of the monitoring region. For example, VD1 (Tth) is set as a lower threshold value of the first detection voltage, i.e., a first preset voltage threshold value, and VD2 (Tth) is set as a lower threshold value of the second detection voltage, i.e., a second preset voltage threshold value.
That is, when the first detection voltage is smaller than the first preset voltage threshold, if only the comparison result (e.g., high level) output by the first comparator U12 is considered, the circuit board is in an abnormal state. When the second detection voltage is smaller than the second preset voltage threshold, if only the comparison result (e.g., high level) output by the second comparator U22 is considered, the circuit board is in an abnormal state.
In this case, the output result of the comparator U11 and the output result of the comparator U21 are integrated by the logic or gate U3, and when the output signal of the output terminal of the logic or gate U3 is at a high level, the temperature state of the monitoring area indicates that the circuit board 400 is in an abnormal state, and when the output signal of the output terminal of the logic or gate U3 is at a low level, the temperature state of the monitoring area indicates that the circuit board 400 is in a normal state. That is, if the output result of at least one of the first detection circuit and the second detection circuit indicates that the circuit board is in an abnormal state, it is determined that the circuit board is in an abnormal state, so that temperature monitoring is performed more reliably. The logical or gate U3 may be connected to a power supply circuit of the circuit board, and control the power supply circuit to be turned off when the circuit board is judged to be in an abnormal state.
Further embodiments of the present disclosure provide a computing device, as shown in fig. 6, the computing device 600 includes a chassis 610 and a circuit board 620. In some examples, circuit board 620 may be circuit board 100 or circuit board 400 described above. For example, a server, as a computing device, includes a circuit board as a core component. The circuit board may integrate key electronic components required for server operation, such as a Central Processing Unit (CPU), random Access Memory (RAM), input/output interfaces, and various other support chips. The above elements cooperate together to perform processing, storage, and transmission tasks of data. The complex wiring on the circuit board interconnects the various components, ensuring that the server can efficiently handle large quantities
[ P-137600-CN-PRI-1] [ HS2411085CCN ] computing task and network request. In addition, to ensure stability of the server under long-time high-load operation, the solution of the embodiment of the disclosure may be adopted to perform temperature monitoring, and the temperature monitoring is associated with key factors such as heat dissipation management and power management.
Thus, particular embodiments of the present subject matter have been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may be advantageous.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (13)
1. A circuit board, comprising:
A carrier plate;
The temperature monitoring circuit comprises a monitoring wire, an outgoing wire and a sampling resistor, wherein the monitoring wire is arranged in a monitoring area of the carrier plate, the sampling resistor is arranged in a control area of the carrier plate, the outgoing wire is connected in series between the monitoring wire and the sampling resistor, the monitoring wire is configured to have a preset thermosensitive resistance range, the sampling resistor has a given resistance, and the thermosensitive resistance in the preset thermosensitive resistance range and the given resistance are higher than the circuit resistance of the outgoing wire;
The detection circuit is arranged in the control area and is used for detecting the voltages at two ends of the sampling resistor to obtain detection voltage, wherein the fluctuation of the detection voltage is inversely related to the temperature fluctuation of the monitoring area;
And the control circuit is arranged in the control area, is connected with the detection circuit and is used for judging the temperature state of the monitoring area based on the detection voltage.
2. The circuit board of claim 1, wherein the temperature monitoring loop further comprises a voltage source connected in series in the temperature monitoring loop, a negative electrode of the voltage source being connected to one end of the sampling resistor and to ground, a positive side of the voltage source being connected to the extraction trace.
3. The circuit board of claim 1, wherein the carrier is a multilayer substrate, the monitor region is an inner substrate region of the multilayer substrate, the control region is an outer substrate region of the multilayer substrate, and the lead-out trace connects the monitor trace and the sampling resistor through at least one via hole in the multilayer substrate.
4. The circuit board of claim 3, wherein the circuit wiring density of the monitoring area is greater than the circuit wiring density of the control area.
5. The circuit board of claim 1, wherein the control circuit is specifically configured to determine that the temperature state of the monitored area indicates that the circuit board is in an abnormal state when the detected voltage is less than a preset voltage threshold.
6. The circuit board of claim 5, wherein the circuit board includes a power supply circuit disposed on the carrier board for powering other circuits on the carrier board, the control circuit further configured to turn off the power supply circuit when the temperature condition indicates that the circuit board is in an abnormal condition.
7. The circuit board according to claim 5, wherein the detection circuit is an amplifier, a first input of the amplifier is connected to one end of a sampling resistor, a second input of the amplifier is connected to the other end of the sampling resistor, an output of the amplifier is connected to the control circuit, the amplifier is used for amplifying a sampling voltage of the sampling resistor to obtain a detection voltage, and the detection voltage is output to the control circuit through the output.
8. The circuit board of claim 7, wherein the control circuit is a comparator having a first input connected to an output of the amplifier for receiving the detection voltage, a second input receiving the preset voltage threshold, the comparator for comparing the detection voltage with the preset voltage threshold, and outputting a control signal indicating a result of the comparison.
9. The circuit board of claim 1, wherein the monitor region is formed by a circuit wiring void, the monitor trace being disposed a predetermined electrical isolation distance from an edge of the monitor region.
10. The circuit board of claim 9, wherein the monitor trace is provided as a meandering trace or a convoluted trace within the monitor region.
11. A circuit board, comprising:
A carrier plate;
The temperature monitoring circuit comprises a monitoring wire, an outgoing wire, a first sampling resistor and a second sampling resistor, wherein the monitoring wire is arranged in a monitoring area of the carrier plate, the first sampling resistor and the second sampling resistor are arranged in a control area of the carrier plate, the outgoing wire is connected in series among the monitoring wire, the first sampling resistor and the second sampling resistor, the monitoring wire is configured to have a preset thermosensitive resistance range, the first sampling resistor has a first given resistance value, the second sampling resistor has a second given resistance value, and the thermosensitive resistance value, the first given resistance value and the second given resistance value in the preset thermosensitive resistance value range are all higher than the circuit resistance value of the outgoing wire;
the first detection circuit is arranged in the control area and is used for detecting the voltages at two ends of the first sampling resistor to obtain a first detection voltage, wherein the variation of the first detection voltage is inversely related to the temperature variation of the monitoring area;
The second detection circuit is arranged in the control area and is used for detecting the voltages at two ends of the second sampling resistor to obtain a second detection voltage, and the fluctuation of the second detection voltage is inversely related to the temperature fluctuation of the monitoring area;
and the control circuit is arranged in the control area, is connected with the first detection circuit and the second detection circuit and is used for judging the temperature state of the monitoring area based on the first detection voltage and the second detection voltage.
12. The circuit board of claim 11, wherein the control circuit comprises a first comparator, a second comparator, and a logic or gate, an output of the first comparator is connected to a first input of the logic or gate, an output of the second comparator is connected to a second input of the logic or gate, a temperature state of the monitoring area indicates that the circuit board is in an abnormal state when an output signal of the output of the logic or gate is at a high level, and a temperature state of the monitoring area indicates that the circuit board is in a normal state when an output signal of the output of the logic or gate is at a low level;
the first input end of the first comparator is connected to the first detection circuit and is used for receiving the first detection voltage, the second input end of the first comparator is connected to a first preset voltage threshold, the first comparator is used for comparing the first detection voltage with the first preset voltage threshold, and a first high level is output when the first detection voltage is smaller than the first preset voltage threshold;
the first input end of the second comparator is connected to the second detection circuit and is used for receiving the second detection voltage, the second input end of the second comparator is connected to a second preset voltage threshold, the second comparator is used for comparing the second detection voltage with the second preset voltage threshold, and a second high level is output when the second detection voltage is smaller than the second preset voltage threshold.
13. A computing device, comprising:
A chassis;
The circuit board according to any one of claims 1-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411288875.6A CN119201616A (en) | 2024-09-13 | 2024-09-13 | Circuit boards and computing devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411288875.6A CN119201616A (en) | 2024-09-13 | 2024-09-13 | Circuit boards and computing devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119201616A true CN119201616A (en) | 2024-12-27 |
Family
ID=94053916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411288875.6A Pending CN119201616A (en) | 2024-09-13 | 2024-09-13 | Circuit boards and computing devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119201616A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119902115A (en) * | 2025-03-28 | 2025-04-29 | 苏州元脑智能科技有限公司 | Power supply detection component, monitoring circuit, method, electronic device, product and medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101419369A (en) * | 2007-10-22 | 2009-04-29 | 精工爱普生株式会社 | Electrooptical device |
| CN108650782A (en) * | 2018-06-25 | 2018-10-12 | 维沃移动通信有限公司 | Flexible Circuit Boards and End Devices |
| CN109375670A (en) * | 2018-08-30 | 2019-02-22 | 佛山市宇森医疗器械有限公司 | Closed loop thermal control system and closed loop thermal control method without temperature sensor |
| CN109642828A (en) * | 2016-08-24 | 2019-04-16 | 高通股份有限公司 | Technique middle-end (MOL) metal resistor temperature sensor for the local temperature sensing of active semiconductor regions in integrated circuit (IC) |
| CN111737077A (en) * | 2020-04-23 | 2020-10-02 | 苏州浪潮智能科技有限公司 | A monitoring system for anti-burning board of server board |
| CN112229537A (en) * | 2020-09-17 | 2021-01-15 | 电子科技大学 | A Zoned Test System for Detecting Fuel Cell Current and Temperature Distribution |
-
2024
- 2024-09-13 CN CN202411288875.6A patent/CN119201616A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101419369A (en) * | 2007-10-22 | 2009-04-29 | 精工爱普生株式会社 | Electrooptical device |
| CN109642828A (en) * | 2016-08-24 | 2019-04-16 | 高通股份有限公司 | Technique middle-end (MOL) metal resistor temperature sensor for the local temperature sensing of active semiconductor regions in integrated circuit (IC) |
| CN108650782A (en) * | 2018-06-25 | 2018-10-12 | 维沃移动通信有限公司 | Flexible Circuit Boards and End Devices |
| CN109375670A (en) * | 2018-08-30 | 2019-02-22 | 佛山市宇森医疗器械有限公司 | Closed loop thermal control system and closed loop thermal control method without temperature sensor |
| CN111737077A (en) * | 2020-04-23 | 2020-10-02 | 苏州浪潮智能科技有限公司 | A monitoring system for anti-burning board of server board |
| CN112229537A (en) * | 2020-09-17 | 2021-01-15 | 电子科技大学 | A Zoned Test System for Detecting Fuel Cell Current and Temperature Distribution |
Non-Patent Citations (1)
| Title |
|---|
| 史飞雪: "模拟电子技术实验与实践指导 第2版", 30 September 2021, 机械工业出版社 , pages: 73 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119902115A (en) * | 2025-03-28 | 2025-04-29 | 苏州元脑智能科技有限公司 | Power supply detection component, monitoring circuit, method, electronic device, product and medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20110210703A1 (en) | Thermal Sensor Device With Average Temperature And Hot Spot Feedback | |
| KR20210042679A (en) | Battery system and control method thereof | |
| JP2000235050A (en) | Current monitoring method, current monitoring system and current monitoring apparatus in current supply system | |
| CN119201616A (en) | Circuit boards and computing devices | |
| US7109722B2 (en) | Apparatus and method for PCB smoke and burn detection and prevention | |
| KR100685000B1 (en) | Temperature sensing device and computer containing same | |
| CN113448422A (en) | Server BIOS flash memory chip protection circuit and server | |
| US12117351B2 (en) | Computing systems with power protection using infrared sensors | |
| US11251603B2 (en) | Power backplane with distributed hotspot detection grid | |
| US11908621B2 (en) | Inductive-load control circuit | |
| US6768624B2 (en) | Fan protection | |
| US8040642B2 (en) | Smart capacitor | |
| EP3782863B1 (en) | Humidity sensing module, hydrolysis prevention module and humidity sensor comprising humidity sensing module | |
| CN120129150A (en) | Circuit arrangement having a circuit board and a temperature sensor arranged on the circuit board | |
| CN221553531U (en) | Circuit board and electronic equipment | |
| JP2004208449A (en) | Electronic equipment control device | |
| KR20210117706A (en) | Diagnostic circuit board and method of diagnosing the same | |
| JPH04317365A (en) | Semiconductor integrated circuits and data processing systems containing them | |
| US20070074897A1 (en) | Thermal event detection on printed wire boards | |
| KR102518752B1 (en) | Circuit for detecting ips current in vehicle and design apparatus thereof | |
| US12454234B2 (en) | In-vehicle device | |
| US12046775B2 (en) | Battery module flex circuit | |
| US20080265669A1 (en) | Printed Circuit Which Can Detect Accidental Heating | |
| JP2013205293A (en) | Temperature detector and temperature detection method | |
| CN112865016B (en) | Mainboard protection circuit, method and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |