CN119148818A - Server modular backplane and server - Google Patents
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Abstract
本发明提供一种服务器模块化背板和服务器，涉及服务器技术领域，该服务器模块化背板包括：控制板和多个存储板；其中，存储板包括硬盘连接器，存储板通过硬盘连接器连接硬盘；控制板接入主板的电源，为存储板供电，并实现高速信号、点灯信号和内部集成电路信号中的至少一种信号的传输。本发明可以提升模块化设计程度，降低背板的布局布线难度，面对不同存储需求，避免背板的重复开发，减小工作量和开发成本，板卡损坏时可以更换对应模块，减少更换整块背板的维修成本。
The present invention provides a server modular backplane and a server, and relates to the technical field of servers. The server modular backplane includes: a control board and a plurality of storage boards; wherein the storage board includes a hard disk connector, and the storage board is connected to the hard disk through the hard disk connector; the control board is connected to the power supply of the mainboard, supplies power to the storage board, and realizes the transmission of at least one of high-speed signals, lighting signals, and internal integrated circuit signals. The present invention can improve the degree of modular design, reduce the difficulty of layout and wiring of the backplane, face different storage requirements, avoid repeated development of the backplane, reduce workload and development costs, and replace the corresponding module when the board is damaged, reducing the maintenance cost of replacing the entire backplane.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a modular back plate of a server and the server.
Background
In recent years, along with the rapid development of technologies such as cloud computing, big data, artificial intelligence and the like, informatization and intelligence are gradually covered in various fields of society, a server is used as core equipment for processing and storing data, and requirements of users on performance, energy efficiency, safety, reliability and the like are also higher and higher. Thus, hardware designers will face a number of challenges.
At present, regarding the design of serial connection of a server to a small computer system interface (SERIAL ATTACHED SCSI, SAS)/serial advanced technology interface specification (SERIAL ADVANCED Technology Attachment, SATA) back plane, taking the design of a front window back plane shown in fig. 1 as an example, as shown in fig. 2, a specific design scheme is that (1) high-speed signals are communicated with a motherboard through cables and connectors, and an uplink connector is generally selected from a 4-pin high-density and small-size connector (SlimlineX 4) or a SATA 7pin connector. The upstream connector is connected to the hard disk connector 8680 via internal wiring on the back plate. (2) Inter-INTEGRATED CIRCUIT, I2C signals communicate with the motherboard via a cable, an upstream Inter-integrated circuit connector, and an Inter-integrated circuit bus is used for communication with the IC chip on the backplane. (3) P12V electricity is taken from the main board end through the power connector and the cable, and the P12V is converted into P3V3 and P5V power supply through the power management chip at the back board end. P12V and P5V are used for hard disk power supply, and P3V3 is used for back-plate end IC chip power supply.
The back plate design scheme has the defects of 1) low modularized design degree, 2) high difficulty in layout and wiring of the back plate, 3) high workload and development cost due to the need of changing edition again in the face of different storage requirements, and 4) high maintenance cost due to the need of replacing the whole back plate when the board card is damaged.
Disclosure of Invention
The invention provides a server modularized backboard and a server, which are used for solving the defects in the prior art, realizing the purposes of improving the modularized design degree, reducing the layout and wiring difficulty of the backboard, facing different storage requirements, avoiding repeated development of the backboard, reducing the workload and the development cost, replacing corresponding modules when a board card is damaged and reducing the maintenance cost for replacing the whole backboard.
The invention provides a server modularized backboard, which comprises a control board and a plurality of storage boards, wherein the storage boards comprise hard disk connectors, the storage boards are connected with a hard disk through the hard disk connectors, the control board is connected with a power supply of a main board to supply power for the storage boards, and at least one signal of high-speed signals, lighting signals and internal integrated circuit signals is transmitted.
The invention provides a server modularized backboard, which comprises a high-speed signal connector, a plurality of male heads of golden fingers, a storage board, a plurality of hard disk array cards, a plurality of storage boards, a plurality of memory boards and a plurality of control boards, wherein the high-speed signal connector is connected with the magnetic disk array cards of the main board through cables and is connected with the male heads of the golden fingers through internal wiring, and the male heads of the golden fingers are respectively connected with the female heads of the golden fingers to form a high-speed signal link between the main board and the storage board so as to perform read-write operation on the hard disk through the high-speed signal link;
The control board further comprises a complex programmable logic device, the high-speed signal connector is connected with the complex programmable logic device through an internal wiring, the complex programmable logic device is connected with the male heads of the plurality of golden fingers through an internal wiring to form a serial general input/output signal link between the main board and the storage board, the complex programmable logic device receives serial general input/output signals sent by the disk array card of the main board through the serial general input/output signal link and analyzes the serial general input/output signals to obtain lighting signals, and the lighting signals reach a plurality of hard disks respectively connected with the plurality of storage boards through the plurality of golden fingers.
The invention provides a server modularized backboard, which comprises a plurality of male heads of golden fingers, a storage board, a plurality of high-speed signal interfaces, a plurality of control boards and a plurality of control boards, wherein the male heads of the golden fingers are connected with the high-speed signal interfaces of a main board, and the male heads of the golden fingers are respectively connected with the female heads of the golden fingers to form a high-speed signal link between the main board and the storage board so as to perform read-write operation on a hard disk through the high-speed signal link;
The control board further comprises a complex programmable logic device, the complex programmable logic device is connected with the high-speed signal interface of the main board, the complex programmable logic device is connected with the male heads of the golden fingers through internal wiring to form a serial general purpose input/output signal link between the main board and the storage board, the complex programmable logic device receives serial general purpose input/output signals sent by the high-speed signal interface of the main board through the serial general purpose input/output signal link and analyzes the serial general purpose input/output signals to obtain lighting signals, and the lighting signals reach a plurality of hard disks respectively connected with the storage boards through the golden fingers.
The server modularized backboard provided by the invention further comprises an internal integrated circuit connector and a field replaceable unit, wherein the internal integrated circuit connector is connected with an internal integrated circuit interface of the main board through a cable, and is respectively connected with the complex programmable logic device and the field replaceable unit through internal wires to form an internal integrated circuit signal link so as to transmit an internal integrated circuit signal output by the internal integrated circuit interface of the main board to the complex programmable logic device and the field replaceable unit through the internal integrated circuit signal link.
The server modularized backboard provided by the invention further comprises a 12V power connector, a first power management chip and a second power management chip, wherein the 12V power connector is connected with a 12V power interface of the mainboard and is connected with the 12V power of the mainboard, the first power management chip converts the 12V power into a 5V power, the second power management chip converts the 12V power into a 3.3V power, and the 12V power connector, the first power management chip and the second power management chip are respectively connected with the male heads of the golden fingers through internal wires so that the 12V power, the 5V power and the 3.3V power reach the storage boards through the golden fingers.
The server modularized backboard provided by the invention further comprises a 12V power connector, a 5V power connector and a 3.3V power connector, wherein the 12V power connector is connected with a 12V power interface of the mainboard and connected with the 12V power of the mainboard, the 5V power connector is connected with a 5V power interface of the mainboard and connected with the 5V power of the mainboard, the 3.3V power connector is connected with a 3.3V power interface of the mainboard and connected with the 3.3V power of the mainboard, and the 12V power connector, the 5V power connector and the 3.3V power connector are respectively connected with the male heads of the golden fingers through internal wiring so that the 12V power, the 5V power and the 3.3V power reach the storage boards through the golden fingers.
The modular back plate of the server provided by the invention further comprises a metal-oxide-semiconductor field effect transistor, wherein the metal-oxide-semiconductor field effect transistor is arranged on an internal integrated circuit signal link and is used for isolating 3.3V power supply of a main plate end and a back plate end.
The server modularized backboard provided by the invention further comprises a temperature sensor, the internal integrated circuit connector is connected with the temperature sensor through an internal wiring, and the temperature sensor collects temperature data of the backboard and sends the temperature data of the backboard to a baseboard management controller chip of the main board through the internal integrated circuit signal link.
The invention also provides a server, which comprises a main board and the server modularized backboard.
The server provided by the invention comprises a baseboard management controller chip, an internal integrated circuit interface, at least one power interface and a disk array card or a high-speed signal interface, wherein the at least one power interface comprises a 12V power interface or comprises a 12V power interface, a 5V power interface and a 3.3V power interface.
The invention provides a server modularized backboard and a server, wherein the server modularized backboard comprises a control board and a plurality of storage boards; the control board is connected to the power supply of the main board to supply power to the storage board and realize the transmission of high-speed signals, lighting signals and internal integrated circuit signals. The invention modularizes the traditional backboard into the control board and the plurality of storage boards, can improve the modularized design degree, reduce the difficulty of layout and wiring of the backboard, can replace the corresponding module when the board card is damaged, and reduce the maintenance cost of replacing the whole backboard. Because each storage board is connected with the hard disk through the hard disk connector, only the storage board can be developed in the face of different storage requirements, repeated development of the backboard can be avoided, and the workload and the development cost are reduced.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a position of a front window backboard in a chassis according to a related art.
Fig. 2 is a schematic diagram of a backplane principle topology provided by the related art.
Fig. 3 is a schematic topology diagram of a server modular backplane according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a server according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In recent years, along with the rapid development of technologies such as cloud computing, big data, artificial intelligence and the like, informatization and intelligence are gradually covered in various fields of society, a server is used as core equipment for processing and storing data, and requirements of users on performance, energy efficiency, safety, reliability and the like are also higher and higher. Thus, hardware designers will face a number of challenges.
Specifically, 1) improvement of performance requirements. With the continuous expansion of application scenes and continuous innovation of technologies, requirements of users on computing capacity, storage capacity, network bandwidth and the like of a server are higher and higher, and the requirements of the hardware design of the server can achieve higher performance and throughput.
2) Energy efficiency and energy conservation. The energy consumption of the data center becomes an important problem increasingly, and the design of server hardware needs to consider how to reduce the energy consumption and improve the energy utilization efficiency while improving the performance, so as to realize the construction of the green data center.
3) Server hardware design also needs to cope with space and heat dissipation constraints. The space of the data center is limited, and the number of servers is required to be increased continuously, so that more compact and higher-density server hardware is required to be designed, meanwhile, the problem of heat dissipation of the servers is solved, and the servers can keep stable temperature under the condition of high load.
4) In terms of safety and reliability, with the increase of network security threat, the design of server hardware needs to consider how to improve the security of hardware, prevent the hardware from being attacked or tampered, and design a hardware system with high reliability and fault tolerance, so as to ensure the security and reliability of data.
5) Flexibility and scalability are also one of the challenges facing current server hardware designs. The demands of users on the servers are more and more diversified, so that the hardware design of the servers needs to have certain flexibility and expandability, and can adapt to different application scenes and demands.
At present, regarding the design of the SAS/SATA back board of the server, for example, the design of the front window back board shown in fig. 1 is taken as an example, and as shown in fig. 2, the specific design scheme is that (1) a high-speed signal is communicated with a motherboard through a cable and a connector, and the uplink connector is generally a SlimlineX4 or SATA 7pin connector. The upstream connector is connected to the hard disk connector 8680 via internal wiring on the back plate. (2) The inter-integrated circuit signals are communicated with the motherboard via a cable, an upstream inter-integrated circuit connector, and an inter-integrated circuit bus is used for communication with the IC chip on the backplane. (3) P12V electricity is taken from the main board end through the power connector and the cable, and the P12V is converted into P3V3 and P5V power supply through the power management chip at the back board end. P12V and P5V are used for hard disk power supply, and P3V3 is used for back-plate end IC chip power supply.
In fig. 2, RAID CARD represents a disk array CARD, SCM represents software configuration management, BMC Ast2600 represents a baseboard management controller of model Ast2600, PCA9548 represents a model of an internal integrated circuit bus switch, 4pin I2C Conn represents a 4-pin I2C interface, power Conn represents a Power connector, SFF8680 conn_1 represents a hard disk connector 1 of model SFF8680, SFF8680 conn_2 represents a hard disk connector 2 of model SFF8680, SFF8680 conn_3 represents a hard disk connector 3 of model SFF8680, MOS represents a MOS transistor, FRU represents a field replaceable unit, CPLD represents a complex programmable logic device, SENSOR represents a temperature SENSOR, VR represents a Power management chip, and JTAG represents a JTAG standard interface.
The back plate design scheme has the defects of 1) low modularized design degree, 2) high difficulty in layout and wiring of the back plate, 3) high workload and development cost due to the need of changing edition again in the face of different storage requirements, and 4) high maintenance cost due to the need of replacing the whole back plate when the board card is damaged.
Based on this, the present invention provides a server modular back plate and a server, and the server modular back plate and the server of the present invention are described below with reference to fig. 3 and 4.
Referring to fig. 3, fig. 3 is a schematic topology diagram of a server modular backplane according to an embodiment of the present disclosure. As shown in fig. 3, the server modular backplane includes a control board 301 and a plurality of storage boards 302. The control board 301 is connected to the power supply of the main board 303 to supply power to the memory board 302, and to realize transmission of at least one of a high-speed signal, a lighting signal, and an internal integrated circuit signal. The memory board 302 includes a hard disk connector 3021, and the memory board 302 is connected to a hard disk through the hard disk connector 3021.
Alternatively, the hard disk connector 3021 may be a 8680 hard disk connector.
That is, the conventional backboard is modularized into the control board 301 and the plurality of storage boards 302, so that the modularized design degree can be improved, the difficulty in layout and wiring of the backboard is reduced, the corresponding module can be replaced when the board card is damaged, and the maintenance cost for replacing the whole backboard is reduced.
In addition, since each storage board 302 is connected with the hard disk through the hard disk connector, only the storage board can be developed in face of different storage requirements, repeated development of the backboard can be avoided, and workload and development cost are reduced.
The modular backboard of the server provided by the embodiment of the invention comprises a control board and a plurality of storage boards, wherein the storage boards comprise hard disk connectors, the storage boards are connected with a hard disk through the hard disk connectors, and the control board is connected with a power supply of the main board to supply power for the storage boards and realize transmission of at least one signal of high-speed signals, lighting signals and internal integrated circuit signals. According to the embodiment of the invention, the traditional backboard is modularized into the control board and the plurality of storage boards, so that the modularized design degree can be improved, the difficulty in layout and wiring of the backboard is reduced, the corresponding module can be replaced when the board card is damaged, and the maintenance cost for replacing the whole backboard is reduced. Because each storage board is connected with the hard disk through the hard disk connector, only the storage board can be developed in the face of different storage requirements, repeated development of the backboard can be avoided, and the workload and the development cost are reduced.
For a motherboard with a disk array card, in one embodiment, the control board includes a high speed signal connector and a plurality of male heads of golden fingers. The storage plate also comprises a plurality of mother heads of golden fingers. The high-speed signal connector is connected with the disk array card of the main board through a cable, the high-speed signal connector is connected with the male heads of the plurality of golden fingers through internal wiring, the male heads of the plurality of golden fingers are respectively connected with the female heads of the plurality of golden fingers, and a high-speed signal link between the main board and the storage board is formed so as to perform read-write operation on the hard disk through the high-speed signal link.
The control board also includes a complex programmable logic device (Complex Programmable Logic Device, CPLD). The high-speed signal connector is connected with the complex programmable logic device through the internal wiring, and the complex programmable logic device is connected with the male heads of the plurality of golden fingers through the internal wiring to form a serial general input/output signal link between the main board and the storage board. The complex programmable logic device receives serial general input/output signals sent by the disk array card of the main board through the serial general input/output signal link, and analyzes the serial general input/output signals to obtain lighting signals. The lighting signal reaches the hard disks respectively connected with the storage plates through the golden fingers.
As shown in fig. 3, taking a back plate supporting four trays as an example, the control board 301 includes SlimlineX connectors and male heads of golden fingers 0-3. The memory board 302 also includes the female heads of golden fingers 0-3. The SlimlineX connector is connected with the disk array card of the main board 303 through a cable, and the SlimlineX connector is connected with the male heads of the golden fingers 0-3 through internal wiring. The male head of the golden finger 1 is connected with the female head of the golden finger 1, the male head of the golden finger 2 is connected with the female head of the golden finger 2, the male head of the golden finger 3 is connected with the female head of the golden finger 3, and the male head of the golden finger 4 is connected with the female head of the golden finger 4. Thus, a high-speed signal link between the main board 303 and the storage board 302 is formed, and the four hard disks can be read and written through the high-speed signal link.
The control board 301 also includes complex programmable logic devices. The SlimlineX-4 connector is connected to a complex programmable logic device through internal wiring, and the complex programmable logic device is connected to the male heads of the golden fingers 0-3 through internal wiring, so as to form a serial general purpose input/output signal link between the motherboard 303 and the memory board 302. The complex programmable logic device receives the serial general input/output signal sent by the disk array card of the main board 303 through the serial general input/output signal link, and analyzes the serial general input/output signal to obtain the lighting signal. The lighting signal reaches the four hard disks respectively connected with the storage boards 0-3 through the golden fingers 0-3.
It should be noted that the high-speed signal connector is not limited to SlimlineX4 connectors, and the number of golden fingers and memory boards is not limited to four, but can also support more positions.
In this embodiment, for a motherboard having a disk array card, a high-speed signal link composed of a high-speed signal connector of the disk array card-control board of the motherboard, a male of a plurality of fingers of the control board, a female of a plurality of fingers of the storage board, and a plurality of hard disk connectors of the storage board is formed, and the plurality of hard disks can be read and written through the high-speed signal link. The serial general purpose input/output signal link is formed by the high-speed signal connector of the disk array card-control board of the main board-the complex programmable logic device of the control board-the serial general purpose input/output signal link formed by the plurality of hard disk connectors of the female head-storage board of the male head-storage board of the plurality of golden fingers of the golden finger of the control board, the serial general purpose input/output signal can be sent to the complex programmable logic device through the serial general purpose input/output signal link, and after the complex programmable logic device analyzes the lighting signal, the lighting signal reaches the plurality of hard disks respectively connected with the plurality of storage boards through the plurality of golden fingers.
For a motherboard without a disk array card, in another embodiment, the control board comprises a plurality of male heads of golden fingers, the storage board further comprises a plurality of female heads of golden fingers, the male heads of the golden fingers are connected with a high-speed signal interface of the motherboard, the male heads of the golden fingers are respectively connected with the female heads of the golden fingers, and a high-speed signal link between the motherboard and the storage board is formed so as to perform read-write operation on the hard disk through the high-speed signal link.
The control board further comprises a complex programmable logic device, the complex programmable logic device is connected with the high-speed signal interface of the main board, the complex programmable logic device is connected with the male heads of the plurality of golden fingers through internal wiring to form a serial general input/output signal link between the main board and the storage board, the complex programmable logic device receives serial general input/output signals sent by the high-speed signal interface of the main board through the serial general input/output signal link and analyzes the serial general input/output signals to obtain lighting signals, and the lighting signals reach a plurality of hard disks respectively connected with the plurality of storage boards through the plurality of golden fingers.
Taking a backboard supporting four positions as an example, the control board comprises male heads of golden fingers 0-3. The storage board also comprises a mother head of the golden finger 0-3. The male heads of the golden fingers 0-3 are connected with SlimlineX interfaces of the main board. The male head of the golden finger 1 is connected with the female head of the golden finger 1, the male head of the golden finger 2 is connected with the female head of the golden finger 2, the male head of the golden finger 3 is connected with the female head of the golden finger 3, and the male head of the golden finger 4 is connected with the female head of the golden finger 4. In this way, a high-speed signal link between the main board and the storage board is formed, so that the four hard disks can be read and written through the high-speed signal link.
The control board also includes a complex programmable logic device. The complex programmable logic device is connected with SlimlineX interfaces of the main board, and the complex programmable logic device is connected with the male heads of the golden fingers 0-3 through internal wiring to form a serial general input/output signal link between the main board and the storage board. The complex programmable logic device receives serial general input/output signals sent by the SlimlineX interface of the main board through the serial general input/output signal link, and analyzes the serial general input/output signals to obtain lighting signals. The lighting signal reaches the four hard disks respectively connected with the storage boards 0-3 through the golden fingers 0-3.
It should be noted that the high-speed signal interface is not limited to SlimlineX4 interfaces, and the number of golden fingers and memory boards is not limited to four, but also can support more diskettes.
In this embodiment, for a motherboard without a disk array card, a high-speed signal link composed of a high-speed signal interface of the motherboard, a male of a plurality of fingers of a control board, a female of a plurality of fingers of a storage board, and a plurality of hard disk connectors of the storage board is formed, and the plurality of hard disks can be read and written through the high-speed signal link. And a serial general purpose input/output signal link formed by the high-speed signal interface of the main board, the complex programmable logic device of the control board, the male head of the plurality of fingers of the control board, the female head of the plurality of fingers of the storage board and the plurality of hard disk connectors of the storage board is also formed, the serial general purpose input/output signal can be sent to the complex programmable logic device through the serial general purpose input/output signal link, and after the complex programmable logic device analyzes the lighting signal, the lighting signal reaches the plurality of hard disks respectively connected with the plurality of storage boards through the plurality of fingers.
In one embodiment, as shown in FIG. 3, the control board 301 further includes an inter-integrated circuit connector and a field replaceable unit. The inter-integrated circuit connector interfaces with the inter-integrated circuit of the motherboard 303 via a cable. The inter-integrated circuit connectors are connected to the complex programmable logic device and the field replaceable Unit (FIELD REPLACE Unit, FRU) through internal wirings, respectively, to form inter-integrated circuit signal links, so that inter-integrated circuit signals output from the inter-integrated circuit interface of the main board 303 are transmitted to the complex programmable logic device and the field replaceable Unit through the inter-integrated circuit signal links.
Specifically, as shown in fig. 3, since the inter-integrated circuit connector is connected to the inter-integrated circuit interface of the main board 303 by a cable, the inter-integrated circuit connector is connected to the complex programmable logic device and the field replaceable unit by internal wirings, respectively, it is possible to form an inter-integrated circuit signal link composed of the complex programmable logic device of the inter-integrated circuit connector-control board of the inter-integrated circuit interface-control board of the main board and the field replaceable unit. The inter-integrated circuit signals output from the inter-integrated circuit interface of the main board 303 can be transmitted to the complex programmable logic device and the field replaceable unit through the inter-integrated circuit signal link.
In this embodiment, an inter-integrated circuit signal link constituted by the complex programmable logic device of the inter-integrated circuit connector-control board of the inter-integrated circuit interface-control board of the main board and the field replaceable unit may be formed, and the inter-integrated circuit signal outputted from the inter-integrated circuit interface of the main board may be transmitted to the complex programmable logic device and the field replaceable unit through the inter-integrated circuit signal link.
In one embodiment, the control board further comprises a 12V power connector, a first power management chip, and a second power management chip. The 12V power connector is connected with a 12V power interface of the main board and is connected with a 12V power of the main board. The first power management chip converts the 12V power to 5V power. The second power management chip converts the 12V power to 3.3V power. The 12V power supply connector, the first power supply management chip and the second power supply management chip are respectively connected with the male heads of the plurality of golden fingers through internal wiring, so that the 12V power supply, the 5V power supply and the 3.3V power supply reach the plurality of storage plates through the plurality of golden fingers.
Specifically, since the main board has only a 12V power interface, the 12V power connector of the control board can be connected to the 12V power interface of the main board, and is connected to the 12V power of the main board. The first power management chip of the control board can convert 12V power into 5V power, and the second power management chip of the control board can convert 12V power into 3.3V power. The 12V power connector, the first power management chip and the second power management chip are respectively connected with the male heads of the plurality of golden fingers through internal wiring, the male heads of the plurality of golden fingers are respectively connected with the female heads of the plurality of golden fingers, the 12V power, the 5V power and the 3.3V power can reach the plurality of storage plates through the plurality of golden fingers, and the storage plates can supply power for the hard disk through the hard disk connector.
In this embodiment, for a motherboard with only a 12V power interface, the 12V power connector of the control board is connected to the 12V power of the motherboard through the 12V power interface of the motherboard, and the first power management chip and the second power management chip of the control board may convert the 12V power into a 5V power and a 3.3V power, respectively. Because 12V power connector, first power management chip and second power management chip are connected with the public head of a plurality of golden fingers through inside wiring respectively, the public head of a plurality of golden fingers is connected with the female head of a plurality of golden fingers respectively, can make 12V power, 5V power and 3.3V power reach a plurality of memory plates through a plurality of golden fingers, and the memory plate can be through hard disk connector for the hard disk power supply.
In another embodiment, the control board further includes a 12V power connector, a 5V power connector, and a 3.3V power connector. The 12V power connector is connected with a 12V power interface of the main board and is connected with a 12V power of the main board. The 5V power connector is connected with a 5V power interface of the main board and is connected with a 5V power of the main board. The 3.3V power connector is connected with a 3.3V power interface of the main board and is connected with a 3.3V power of the main board. The 12V power connector, the 5V power connector and the 3.3V power connector are respectively connected with the male heads of the plurality of golden fingers through internal wiring, so that the 12V power, the 5V power and the 3.3V power reach the plurality of storage plates through the plurality of golden fingers.
Specifically, the main board is provided with a 12V power interface, a 5V power interface and a 3.3V power interface, and the 12V power connector of the control board is connected with the 12V power interface of the main board and can be connected with the 12V power of the main board. The 5V power connector of the control panel is connected with the 5V power interface of the main board and can be connected with the 5V power of the main board. The 3.3V power connector of the control panel is connected with the 3.3V power interface of the main board and can be connected with the 3.3V power of the main board. The 12V power supply connector, the 5V power supply connector and the 3.3V power supply connector are respectively connected with the male heads of the plurality of golden fingers through internal wiring, the male heads of the plurality of golden fingers are respectively connected with the female heads of the plurality of golden fingers, the 12V power supply, the 5V power supply and the 3.3V power supply can reach the plurality of storage plates through the plurality of golden fingers, and the storage plates can supply power for the hard disk through the hard disk connector.
In this embodiment, for a motherboard having a 12V power interface, a 5V power interface, and a 3.3V power interface at the same time, the 12V power connector of the control board is connected to the 12V power supply of the motherboard through the 12V power interface of the motherboard, the 5V power connector of the control board is connected to the 5V power supply of the motherboard through the 5V power interface of the motherboard, and the 3.3V power connector of the control board is connected to the 3.3V power supply of the motherboard through the 3.3V power interface of the motherboard. Because 12V power connector, 5V power connector and 3.3V power connector are connected with the public head of a plurality of golden fingers through inside wiring respectively, the public head of a plurality of golden fingers is connected with the female head of a plurality of golden fingers respectively, can make 12V power, 5V power and 3.3V power reach a plurality of memory plates through a plurality of golden fingers, and the memory plate can be through hard disk connector for hard disk power supply.
In one embodiment, as shown in FIG. 3, the control board 301 further includes a metal-oxide-semiconductor field effect transistor (MOS transistor). The metal-oxide-semiconductor field effect transistor is arranged on the signal link of the internal integrated circuit and used for isolating 3.3V power supply of the main board end and the back board end, and has a protection function.
Specifically, the MOS transistor of the control board 301 is disposed on the signal link of the internal integrated circuit, and can separate 3.3V power supply from the motherboard end and the back board end, and the MOS transistor can play a role in level isolation protection.
In one embodiment, the control board 301 further includes a temperature sensor. The internal integrated circuit connector is connected with the temperature sensor through an internal wiring. The temperature sensor collects temperature data of the back plate and sends the temperature data of the back plate to a baseboard management controller (Baseboard Management Controller, BMC) chip of the main board 303 through an inter-integrated circuit signal link.
Specifically, the temperature sensor of the control board 301 is connected to the inter-integrated circuit connector through the internal wiring, so that an inter-integrated circuit signal link composed of the inter-integrated circuit interface of the main board 303 and the temperature sensor of the inter-integrated circuit connector-control board of the control board 301 can be formed, and the temperature data of the back board collected by the temperature sensor can be transmitted to the baseboard management controller chip of the main board 303 through the inter-integrated circuit signal link.
In this embodiment, an inter-integrated circuit signal link composed of the inter-integrated circuit interface of the motherboard and the temperature sensor of the inter-integrated circuit connector of the control board may be formed, and the temperature data of the back plane acquired by the temperature sensor may be transmitted to the baseboard management controller chip of the motherboard through the inter-integrated circuit signal link.
In one embodiment, the memory board further includes a high speed signal connector. The high-speed signal connector is connected with the main board end through a cable, and is connected with the hard disk connector to form a high-speed signal link between the main board and the storage board so as to perform read-write operation on the hard disk through the high-speed signal link.
That is, the high-speed signal connector of the control board is transferred to the memory board, and the control board has only sideband signals (for example, a lighting signal and an internal integrated circuit signal) and power supply, and no high-speed signal wiring is involved. Therefore, the back plate has higher modularization degree, the functional attributes of different modules are stronger, the high-speed wiring distance can be effectively shortened, the high-speed signal wiring distance is reduced, the high-speed signal quality is improved, and the requirement of the SAS5.0 rate can be met.
In this embodiment, the high-speed signal connector is disposed in the storage board, and the high-speed signal connector is connected to the motherboard end through a cable, and the high-speed signal connector is connected to the hard disk connector, so that a high-speed signal link formed by the motherboard end, the high-speed signal connector of the storage board, and the hard disk connector of the storage board can be formed, and the hard disk can be read and written through the high-speed signal link. Therefore, the control board does not relate to high-speed signal wiring any more, the high-speed signal wiring distance is reduced, the high-speed signal quality is improved, and the requirement of the SAS5.0 rate can be met. And the back plate has higher modularization degree, and the functional attributes of different modules are stronger.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a server according to an embodiment of the invention. As shown in fig. 4, the server includes a motherboard 303 and a server modular backplane 401 as described in any of the embodiments above.
In one embodiment, motherboard 303 includes a baseboard management controller chip, an internal integrated circuit interface, at least one power interface including a 12V power interface, or at least one power interface including a 12V power interface, a 5V power interface, and a 3.3V power interface, and a disk array card or high-speed signal interface.
It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiments of the present invention.
Claims (10)
1. The modularized backboard of the server is characterized by comprising a control board and a plurality of storage boards, wherein the storage boards comprise hard disk connectors, the storage boards are connected with a hard disk through the hard disk connectors, and the control board is connected with a power supply of a main board to supply power for the storage boards and realize transmission of at least one of high-speed signals, lighting signals and internal integrated circuit signals.
2. The modular back plate of the server according to claim 1, wherein the control board comprises a high-speed signal connector and male heads of a plurality of golden fingers, the storage board further comprises female heads of the golden fingers, the high-speed signal connector is connected with a disk array card of the main board through a cable, the high-speed signal connector is connected with the male heads of the golden fingers through internal wires, the male heads of the golden fingers are respectively connected with the female heads of the golden fingers, and a high-speed signal link between the main board and the storage board is formed so as to perform read-write operation on the hard disk through the high-speed signal link;
The control board further comprises a complex programmable logic device, the high-speed signal connector is connected with the complex programmable logic device through an internal wiring, the complex programmable logic device is connected with the male heads of the plurality of golden fingers through an internal wiring to form a serial general input/output signal link between the main board and the storage board, the complex programmable logic device receives serial general input/output signals sent by the disk array card of the main board through the serial general input/output signal link and analyzes the serial general input/output signals to obtain lighting signals, and the lighting signals reach a plurality of hard disks respectively connected with the plurality of storage boards through the plurality of golden fingers.
3. The modular back plate of the server according to claim 1, wherein the control board comprises male heads of a plurality of golden fingers, the storage board further comprises female heads of the golden fingers, the male heads of the golden fingers are connected with a high-speed signal interface of the main board, the male heads of the golden fingers are respectively connected with the female heads of the golden fingers to form a high-speed signal link between the main board and the storage board, and the hard disk is subjected to read-write operation through the high-speed signal link;
The control board further comprises a complex programmable logic device, the complex programmable logic device is connected with the high-speed signal interface of the main board, the complex programmable logic device is connected with the male heads of the golden fingers through internal wiring to form a serial general purpose input/output signal link between the main board and the storage board, the complex programmable logic device receives serial general purpose input/output signals sent by the high-speed signal interface of the main board through the serial general purpose input/output signal link and analyzes the serial general purpose input/output signals to obtain lighting signals, and the lighting signals reach a plurality of hard disks respectively connected with the storage boards through the golden fingers.
4. The modular back panel of claim 2 or 3, wherein the control board further comprises an inter-integrated circuit connector and a field replaceable unit, the inter-integrated circuit connector is connected with the inter-integrated circuit interface of the main board through a cable, and the inter-integrated circuit connector is connected with the complex programmable logic device and the field replaceable unit through internal wires respectively to form an inter-integrated circuit signal link so as to transmit the inter-integrated circuit signals output by the inter-integrated circuit interface of the main board to the complex programmable logic device and the field replaceable unit through the inter-integrated circuit signal link.
5. The modular back panel of claim 4, wherein the control board further comprises a 12V power connector, a first power management chip and a second power management chip, wherein the 12V power connector is connected with a 12V power interface of the main board and is connected with the 12V power of the main board, the first power management chip converts the 12V power into a 5V power, the second power management chip converts the 12V power into a 3.3V power, and the 12V power connector, the first power management chip and the second power management chip are respectively connected with a male head of the plurality of golden fingers through internal wires so that the 12V power, the 5V power and the 3.3V power reach the plurality of storage boards through the plurality of golden fingers.
6. The modular back panel of claim 4, wherein the control board further comprises a 12V power connector, a 5V power connector and a 3.3V power connector, wherein the 12V power connector is connected with a 12V power interface of the main board and connected with the 12V power of the main board, the 5V power connector is connected with a 5V power interface of the main board and connected with a 5V power of the main board, the 3.3V power connector is connected with a 3.3V power interface of the main board and connected with a 3.3V power of the main board, and the 12V power connector, the 5V power connector and the 3.3V power connector are respectively connected with a male head of the plurality of golden fingers through internal wirings so that the 12V power, the 5V power and the 3.3V power reach the plurality of storage boards through the plurality of golden fingers.
7. The modular backplane of claim 5 or 6, wherein the control board further comprises a metal-oxide-semiconductor field effect transistor disposed on the inter-integrated circuit signal link for isolating 3.3V power from the motherboard end.
8. The modular back panel of claim 5 or 6, wherein the control board further comprises a temperature sensor, wherein the internal integrated circuit connector is connected to the temperature sensor through an internal trace, wherein the temperature sensor collects temperature data of the back panel and sends the temperature data of the back panel to a baseboard management controller chip of the motherboard through the internal integrated circuit signal link.
9. A server comprising a motherboard and the modular backplane of a server of any one of claims 1 to 8.
10. The server of claim 9, wherein the motherboard comprises a baseboard management controller chip, an internal integrated circuit interface, at least one power interface, and a disk array card or a high-speed signal interface, wherein the at least one power interface comprises a 12V power interface, or wherein the at least one power interface comprises a 12V power interface, a 5V power interface, and a 3.3V power interface.
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| CN202410993081.3A CN119148818A (en) | 2024-07-23 | 2024-07-23 | Server modular backplane and server |
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| CN202410993081.3A CN119148818A (en) | 2024-07-23 | 2024-07-23 | Server modular backplane and server |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN120335566A (en) * | 2025-06-20 | 2025-07-18 | 苏州元脑智能科技有限公司 | Server device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN120335566A (en) * | 2025-06-20 | 2025-07-18 | 苏州元脑智能科技有限公司 | Server device |
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