CN119049816A - An improved plastic-encapsulated chip thermal varistor - Google Patents
An improved plastic-encapsulated chip thermal varistor Download PDFInfo
- Publication number
- CN119049816A CN119049816A CN202411101628.0A CN202411101628A CN119049816A CN 119049816 A CN119049816 A CN 119049816A CN 202411101628 A CN202411101628 A CN 202411101628A CN 119049816 A CN119049816 A CN 119049816A
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- China
- Prior art keywords
- pin
- piezoresistor
- chip
- paste storage
- tweezers
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention provides an improved plastic package patch thermal piezoresistor which comprises a thermistor chip, wherein a piezoresistor chip is arranged on one side of the thermistor chip, a connecting sheet is electrically connected to the lower portion between the piezoresistor chip and the thermistor chip, a first pin is integrally connected to the middle portion of the right portion of the connecting sheet, a second pin is electrically connected to the upper portion of the thermistor chip, a third pin is electrically connected to the upper portion of the piezoresistor chip, and a plastic package layer is arranged on the outer sides of the thermistor chip and the piezoresistor chip. According to the invention, the solder paste can be injected into the conductive paste storage box through the tin injection port, so that the solder paste can be isolated independently through the conductive paste storage box, the problem of bridging phenomenon of the solder paste can be avoided, the problem of short circuit phenomenon after welding of the thermal piezoresistors can be avoided, and the effect of paste storage welding is realized.
Description
Technical Field
The invention belongs to the technical field of thermal piezoresistors, and particularly relates to an improved plastic package patch thermal piezoresistor.
Background
The thermal piezoresistor is an electronic element which is installed on an electric energy meter for use, such as a plastic package patch thermal piezoresistor with the bulletin number of CN207993596U, and comprises a thermistor chip and a piezoresistor chip, wherein the thermistor chip and the piezoresistor chip are arranged in parallel at the same position, the bottoms of the thermistor chip and the piezoresistor chip are respectively connected with the left end of the lower connector through the right end of the lower connector, and the thermal piezoresistor has some problems in the actual use process, such as the fact that an operator needs to smear soldering tin paste on a circuit board when manually welding the thermal piezoresistor, the soldering tin paste bridging problem possibly occurs in the soldering tin paste smearing process due to the small size of the thermal piezoresistor and the small welding position on the circuit board, and the phenomenon of short circuit possibly occurs after the thermal piezoresistor is welded.
Disclosure of Invention
In order to solve the technical problems, the invention provides an improved plastic package patch thermal piezoresistor which can realize the effect of paste storage welding, can effectively avoid the problem of solder paste bridging, and further can avoid the problem of short circuit phenomenon after the thermal piezoresistor is welded.
The technical scheme is that the improved plastic package patch thermal piezoresistor comprises a thermistor chip, wherein a piezoresistor chip is arranged on one side of the thermistor chip, a connecting sheet is electrically connected to the lower portion between the piezoresistor chip and the thermistor chip, a first pin is integrally connected to the middle portion of the right portion of the connecting sheet, a second pin is electrically connected to the upper portion of the thermistor chip, a third pin is electrically connected to the upper portion of the piezoresistor chip, a plastic sealing layer is arranged on the outer sides of the thermistor chip and the piezoresistor chip, and lower side horizontal sections of the first pin, the second pin and the third pin are exposed from the inside of the plastic sealing layer.
Preferably, the paste storage connecting assembly comprises paste storage conductive boxes, wherein tin discharge ports are sequentially formed in the lower sides of the inner parts of the paste storage conductive boxes from left to right, and tin injection ports are formed in the middle of one side of each paste storage conductive box.
Preferably, the four corners of the lower part of the paste storage conductive box are respectively and integrally connected with an L-shaped supporting block.
The limiting forceps taking assembly comprises a first forceps taking plate, a second forceps taking plate is arranged in the middle of the first forceps taking plate in a crossing mode, second limiting grooves are formed in the left side and the right side of the upper side of the front portion and the rear portion of the first forceps taking plate respectively, first limiting grooves are formed in the front side and the rear side of the upper side of the left portion and the right portion of the second forceps taking plate respectively, and the first forceps taking plate and the second forceps taking plate are arranged in a cross mode.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the solder paste can be injected into the conductive paste storage box through the tin injection port, so that the solder paste can be isolated independently through the conductive paste storage box, the problem of bridging phenomenon of the solder paste can be avoided, the problem of short circuit phenomenon after welding of the thermal piezoresistors can be avoided, and the effect of paste storage welding is realized.
2. According to the invention, the L-shaped supporting blocks can enable the welding positions of the paste storage conductive box and the circuit board to be separated by a certain distance, so that the melted soldering paste can be fully combined with the welding positions of the circuit board, and the problem of the phenomenon of cold joint is avoided.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic view of the internal structure of the present invention.
Fig. 3 is a schematic view of the internal structure of another view of the present invention.
Fig. 4 is a partial structural schematic diagram of the present invention.
Fig. 5 is a schematic structural view of the paste storage connecting assembly of the present invention.
Fig. 6 is a schematic structural view of the limiting forceps assembly of the invention.
In the figure:
1. A thermistor chip; 2, a piezoresistor chip, 3, a connecting sheet, 4, a first pin, 5, a second pin, 6, a third pin, 7, a plastic sealing layer, 8, a paste storage connecting component, 81, a paste storage conductive box, 82, a tin discharging port, 83, an L-shaped supporting block, 84, a tin filling port, 9, a limiting forceps picking component, 91, a first forceps picking plate, 92, a second forceps picking plate, 93, a first limiting groove, 94 and a second limiting groove.
Detailed Description
The invention is specifically described below with reference to the accompanying drawings, as shown in the accompanying drawings from 1 to 4, an improved plastic-packaged patch thermal resistor comprises a thermistor chip 1, wherein one side of the thermistor chip 1 is provided with a varistor chip 2, a connecting sheet 3 is electrically connected to the lower part between the varistor chip 2 and the thermistor chip 1, a first pin 4 is integrally connected to the middle part of the right part of the connecting sheet 3, a second pin 5 is electrically connected to the upper part of the thermistor chip 1, a third pin 6 is electrically connected to the upper part of the varistor chip 2, plastic sealing layers 7 are arranged on the outer sides of the thermistor chip 1 and the varistor chip 2, the lower horizontal sections of the first pin 4, the second pin 5 and the third pin 6 are exposed from the inner parts of the plastic sealing layers 7, the connecting sheet 3 adopts copper sheets, and the first pin 4, the second pin 5 and the third pin 6 respectively adopt Z-shaped copper pins.
The improved plastic package patch thermal piezoresistor further comprises a paste storage connecting component 8, the paste storage connecting components 8 are integrally connected to the lower portions of the lower side horizontal sections of the first pins 4, the second pins 5 and the third pins 6 respectively, and the top of the plastic package layer 7 is integrally connected with a limiting forceps component 9, so that the effect of paste storage welding is achieved, the problem of solder paste bridging can be effectively avoided, and the problem of short circuit phenomenon after welding of the thermal piezoresistor can be further avoided.
Referring to fig. 5, the paste storage connecting assembly 8 comprises paste storage conductive boxes 81, wherein tin discharge ports 82 are sequentially formed in the lower side of the inside of each paste storage conductive box 81 from left to right, tin injection ports 84 are formed in the middle of one side of each paste storage conductive box 81, the upper parts of the paste storage conductive boxes 81 are integrally connected with the lower parts of the lower horizontal sections of the first pins 4, the second pins 5 and the third pins 6 respectively, and the paste storage conductive boxes 81 are copper boxes;
In order to make the lower part of the paste storage conductive box 81 and the welding position separated by a certain distance, the four corners of the lower part of the paste storage conductive box 81 are respectively and integrally connected with an L-shaped supporting block 83, and the L-shaped supporting block 83 can make the welding position of the paste storage conductive box 81 and the circuit board separated by a certain distance, so that the welding position of the melted solder paste and the circuit board can be fully combined, and the problem of the phenomenon of cold joint is avoided;
when the thermal piezoresistor is needed to be welded manually, firstly, the solder paste is injected into the solder paste storage conductive box 81 through the tin injection port 84, and the solder paste cannot flow out in a large quantity through the tin discharge port 82 due to poor fluidity of the solder paste, after the injection of the solder paste is completed, the soldering flux can be injected into the solder paste storage conductive box 81 through the tin injection port 84, then the thermal piezoresistor is placed at a designated position of a circuit board, and is heated by a hot air gun, at the moment, the solder paste in the solder paste storage conductive box 81 is heated and melted, then the solder paste flows to a welding position of the circuit board through the tin discharge port 82, and the other part of the solder paste is left in the solder paste storage conductive box 81, and then the hot air gun is removed, so that the melted solder paste is solidified, and the welding of the thermal piezoresistor is completed.
In this embodiment, as shown in fig. 6, the limiting forceps pickup assembly 9 includes a first forceps pickup plate 91, a second forceps pickup plate 92 is disposed in the middle of the first forceps pickup plate 91 in a crossing manner, and second limiting grooves 94 are respectively formed on the left and right sides of the upper sides of the front and rear parts of the first forceps pickup plate 91, first limiting grooves 93 are respectively formed on the front and rear sides of the upper sides of the left and right parts of the second forceps pickup plate 92, the first forceps pickup plate 91 and the second forceps pickup plate 92 are disposed in a cross manner, the first limiting grooves 93 and the second limiting grooves 94 are respectively triangular grooves, the lower parts of the first forceps pickup plate 91 and the second forceps pickup plate 92 are respectively integrally connected with the upper part of the plastic layer 7, and the first forceps pickup plate 91 and the second forceps pickup plate 92 are respectively made of an organic silicon plastic plate;
When the thermal piezoresistor needs to be moved, an operator can take the first tweezers from the first tweezers taking plate 91 or the second tweezers taking plate 92 through the tweezers, and the tweezers can be positioned in the first limiting groove 93 or the second limiting groove 94, and the tweezers can only move in a small range in the first limiting groove 93 or the second limiting groove 94 due to the fact that the tweezers are positioned in the first limiting groove 93 or the second limiting groove 94, so that the problem that large-range relative movement occurs between the thermal piezoresistor and the tweezers in the process of taking the thermal piezoresistor through the tweezers can be avoided.
When the soldering flux soldering gun is used, firstly, the soldering flux is injected into the soldering flux storage conductive box 81 through the tin injection port 84, and the soldering flux can not flow out in a large amount through the tin discharge port 82 because the fluidity of the soldering flux is poor, after the soldering flux is injected, the soldering flux can be injected into the soldering flux storage conductive box 81 through the tin injection port 84, then the thermal piezoresistor is placed at a designated position of a circuit board, and is heated by a hot air gun, at the moment, the soldering flux in the soldering flux storage conductive box 81 is heated and melted, then the soldering flux can be partially flowed to a soldering position of the circuit board through the tin discharge port 82, and the other part of the soldering flux can be left in the soldering flux storage conductive box 81, and then the hot air gun is removed, so that the melted soldering flux can be solidified, and the soldering flux storage conductive box 81 is welded, and compared with the prior art, the soldering flux storage conductive box 81 can be isolated singly, and the soldering flux storage conductive box 81 can avoid the problem of bridging phenomenon, and then the soldering flux storage effect of the thermal piezoresistor can be realized; when the thermal piezoresistor needs to be moved, an operator can take the first tweezers from the first tweezers taking plate 91 or the second tweezers taking plate 92 through the tweezers and can make the tweezers located in the first limiting groove 93 or the second limiting groove 94, and as the tweezers are located in the first limiting groove 93 or the second limiting groove 94, the tweezers can only move in a small range in the first limiting groove 93 or the second limiting groove 94, so that the tweezers can be prevented from taking the thermal piezoresistor in the process of taking the thermal piezoresistor through the tweezers, the problem of large-range relative movement between the thermal piezoresistor and tweezers occurs.
By using the technical scheme of the invention or under the inspired by the technical scheme of the invention, a similar technical scheme is designed by a person skilled in the art, so that the technical effects are achieved, and the technical effects fall into the protection scope of the invention.
Claims (9)
1. The improved plastic package patch thermal piezoresistor comprises a thermistor chip (1), wherein a piezoresistor chip (2) is arranged on one side of the thermistor chip (1), a connecting sheet (3) is electrically connected to the lower portion between the piezoresistor chip (2) and the thermistor chip (1), a first pin (4) is integrally connected to the middle portion of the right portion of the connecting sheet (3), a second pin (5) is electrically connected to the upper portion of the thermistor chip (1), a third pin (6) is electrically connected to the upper portion of the piezoresistor chip (2), a plastic sealing layer (7) is arranged on the outer sides of the thermistor chip (1) and the piezoresistor chip (2), and lower side horizontal sections of the first pin (4), the second pin (5) and the third pin (6) are exposed out of the plastic sealing layer (7), and the plastic package patch thermal piezoresistor is characterized in that a paste storage connecting assembly (8) is integrally connected to the lower portion of the lower side horizontal sections of the first pin (5) and the third pin (6), and a limiting taking assembly (9) is integrally connected to the top of the plastic sealing layer (7).
2. The improved plastic package patch thermal piezoresistor as claimed in claim 1, wherein the paste storage connecting components (8) respectively comprise paste storage conductive boxes (81), tin discharge ports (82) are sequentially formed in the lower sides of the inside of the paste storage conductive boxes (81) from left to right, and tin injection ports (84) are formed in the middle of one side of the paste storage conductive boxes (81).
3. The improved plastic package patch thermal varistor according to claim 2, wherein the lower four corners of the paste storage conductive case (81) are integrally connected with L-shaped supporting blocks (83), respectively.
4. The improved plastic package patch thermal varistor of claim 3, wherein the upper portion of the paste storage conductive case (81) is integrally connected to the lower portions of the lower horizontal sections of the first pin (4), the second pin (5) and the third pin (6), respectively.
5. The improved plastic package patch thermal piezoresistor according to claim 4, wherein the limiting tweezers picking assembly (9) comprises a first tweezers picking plate (91), a second tweezers picking plate (92) is arranged in the middle of the first tweezers picking plate (91) in a crossing mode, second limiting grooves (94) are respectively formed in the left side and the right side of the upper side of the front portion and the rear portion of the first tweezers picking plate (91), first limiting grooves (93) are respectively formed in the front side and the rear side of the upper side of the left portion and the rear portion of the second tweezers picking plate (92), and the first tweezers picking plate (91) and the second tweezers picking plate (92) are arranged in a cross mode.
6. The improved plastic packaged patch thermal varistor of claim 5, wherein the first and second limiting grooves (93, 94) each comprise triangular grooves.
7. The improved plastic package patch thermal varistor of claim 6, wherein the lower portions of the first and second tweezers plates (91, 92) are integrally connected to the upper portion of the plastic package layer (7), respectively.
8. The improved plastic packaged patch thermal varistor of claim 7, wherein said paste storage conductive case (81) is a copper case.
9. The improved plastic packaged patch thermal varistor of claim 8, wherein said L-shaped support block (83) is an L-shaped copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411101628.0A CN119049816B (en) | 2024-08-12 | 2024-08-12 | An improved plastic-encapsulated chip thermal varistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411101628.0A CN119049816B (en) | 2024-08-12 | 2024-08-12 | An improved plastic-encapsulated chip thermal varistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119049816A true CN119049816A (en) | 2024-11-29 |
| CN119049816B CN119049816B (en) | 2025-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411101628.0A Active CN119049816B (en) | 2024-08-12 | 2024-08-12 | An improved plastic-encapsulated chip thermal varistor |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4604966A (en) * | 1985-10-10 | 1986-08-12 | International Business Machine Corp. | Continuous solder paste dispenser |
| US20030193093A1 (en) * | 1999-01-19 | 2003-10-16 | International Business Machines Corporation | Dielectric interposer for chip to substrate soldering |
| JP2010225851A (en) * | 2009-03-24 | 2010-10-07 | Tamura Seisakusho Co Ltd | Substrate for controlling solder deposition |
| CN101945530A (en) * | 2009-07-09 | 2011-01-12 | 佛山市顺德区顺达电脑厂有限公司 | Printed circuit board with pad provided with exhaust through holes |
| KR101464588B1 (en) * | 2013-11-11 | 2014-12-04 | 주식회사이에스이 | Auto solder spreading unit |
| CN108257750A (en) * | 2018-03-07 | 2018-07-06 | 朱同江 | The production method and product of plastic packaging patch hot pressing sensitive resistor |
| CN209199781U (en) * | 2019-01-11 | 2019-08-02 | 东莞市容奥电子有限公司 | A Multilayer Capacitor with High Safety |
| CN209515358U (en) * | 2019-04-26 | 2019-10-18 | 肇庆市捷鸿电子有限公司 | A kind of patch-type varistor |
| CN220933851U (en) * | 2023-08-23 | 2024-05-10 | 深圳市纬盛电子有限公司 | Short-circuit-preventing chip resistor |
-
2024
- 2024-08-12 CN CN202411101628.0A patent/CN119049816B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4604966A (en) * | 1985-10-10 | 1986-08-12 | International Business Machine Corp. | Continuous solder paste dispenser |
| US20030193093A1 (en) * | 1999-01-19 | 2003-10-16 | International Business Machines Corporation | Dielectric interposer for chip to substrate soldering |
| JP2010225851A (en) * | 2009-03-24 | 2010-10-07 | Tamura Seisakusho Co Ltd | Substrate for controlling solder deposition |
| CN101945530A (en) * | 2009-07-09 | 2011-01-12 | 佛山市顺德区顺达电脑厂有限公司 | Printed circuit board with pad provided with exhaust through holes |
| KR101464588B1 (en) * | 2013-11-11 | 2014-12-04 | 주식회사이에스이 | Auto solder spreading unit |
| CN108257750A (en) * | 2018-03-07 | 2018-07-06 | 朱同江 | The production method and product of plastic packaging patch hot pressing sensitive resistor |
| CN209199781U (en) * | 2019-01-11 | 2019-08-02 | 东莞市容奥电子有限公司 | A Multilayer Capacitor with High Safety |
| CN209515358U (en) * | 2019-04-26 | 2019-10-18 | 肇庆市捷鸿电子有限公司 | A kind of patch-type varistor |
| CN220933851U (en) * | 2023-08-23 | 2024-05-10 | 深圳市纬盛电子有限公司 | Short-circuit-preventing chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119049816B (en) | 2025-05-27 |
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