CN119017150B - A surface grinding positioning method based on six-dimensional force sensor - Google Patents
A surface grinding positioning method based on six-dimensional force sensor Download PDFInfo
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- CN119017150B CN119017150B CN202411495421.6A CN202411495421A CN119017150B CN 119017150 B CN119017150 B CN 119017150B CN 202411495421 A CN202411495421 A CN 202411495421A CN 119017150 B CN119017150 B CN 119017150B
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- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000005498 polishing Methods 0.000 claims abstract description 118
- 230000008569 process Effects 0.000 claims abstract description 15
- 230000004044 response Effects 0.000 claims description 20
- 238000007517 polishing process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Automatic Control Of Machine Tools (AREA)
Abstract
The invention discloses a six-dimensional force sensor-based curved surface polishing positioning method which comprises the steps of responding to a polishing head of a polishing device to contact a device to be polished to obtain first stress data of a six-dimensional force sensor, controlling the polishing head to move towards a preset direction, controlling the polishing head to move in a vertical direction according to the first stress data so that pressure data in the first stress data are kept constant in a moving process, collecting a positioning movement track of the polishing head, obtaining a surface demand shape of the device to be polished, and obtaining an actual relative position between the polishing head and the device to be polished according to the positioning track of the polishing head and the surface demand shape of the device to be polished. The six-dimensional force sensor based positioning device is used for positioning the polishing head and the device to be polished, and can effectively improve the positioning precision and further improve the polishing quality.
Description
Technical Field
The invention relates to the application field of six-dimensional force sensors, in particular to a six-dimensional force sensor-based curved surface polishing and positioning method.
Background
The polishing and grinding machine tool has wide application in various industries, such as automobile manufacturing industry, bathroom products, kitchen products, hardware furniture, 3C industry and the like. At present, the polishing and grinding robot is mainly used for work such as surface grinding, edge deburring, welding line grinding, inner hole deburring and the like of a workpiece. The intelligent manufacturing solution of suitable polishing not only can improve polishing quality and efficiency, but also can reduce production cost. Six-dimensional force sensors are often used in polishing devices, and the six-dimensional force sensors can sense external force changes in an omnibearing and multi-angle manner, including three force components and three moment components in a three-dimensional space. The omnibearing force sensing capability enables force control in the polishing process to be more accurate, so that polishing accuracy is improved. On the other hand, in the polishing process, the six-dimensional force sensor can rapidly sense the magnitude and the direction of the contact force and transmit the information to a control system of the robot.
In order to ensure that the polishing and grinding can realize full-automatic and accurate grinding, the device to be ground is generally required to be identified and positioned through image identification, so that a subsequent grinding head can be accurately moved to the device to be ground to start grinding. However, in the polishing process, the image identification is easy to cause a small deviation in positioning because the tiny micro-difference of the device to be polished cannot be accurately identified, so that the polishing quality is reduced.
Disclosure of Invention
In view of the above-mentioned part of defects in the prior art, the technical problem to be solved by the invention is to provide a six-dimensional force sensor-based curved surface polishing positioning method, which aims to realize precise polishing positioning and improve polishing quality.
In order to achieve the above purpose, the invention discloses a six-dimensional force sensor based curved surface polishing and positioning method, which comprises the following steps:
The method comprises the steps of S1, responding to a polishing head of a polishing device to contact a device to be polished to obtain first stress data of a six-dimensional force sensor, controlling the polishing head to move towards a preset direction, controlling the polishing head to move in a vertical direction according to the first stress data so as to keep pressure data in the first stress data constant in a moving process, responding to zero pressure data in the first stress data to obtain a first positioning movement track of the polishing head, wherein the polishing head is connected with the six-dimensional force sensor;
S2, obtaining a surface demand shape of the device to be polished, and matching a first area position where the surface demand shape of the device to be polished is consistent with the appearance of the first positioning movement track;
Step S3, controlling the polishing head to move to obtain a second positioning movement track in response to a plurality of first area positions, matching the second area positions where the shapes of the second positioning movement track are consistent with the shapes of the second positioning movement track on the surface demand shape of the device to be polished, and determining the corresponding actual area positions of the second positioning movement track on the device to be polished according to the second area positions in response to one or only one of the second area positions;
step S4, a first relative position between the first positioning motion track and the second positioning motion track is obtained in response to the fact that the second area positions are multiple, a first area group matched with the first relative position is determined from the multiple first area positions and the multiple second area positions according to the first relative position, and corresponding actual area positions of the two positioning motion tracks on the device to be polished are determined according to the first area group in response to the fact that the first area group is only one and the first area group is only one;
Step S5, responding to the fact that a plurality of groups of first area groups exist, repeating the step S3 and the step S4 until the corresponding actual area positions of the positioning motion tracks on the device to be polished are determined, wherein each time of repeating, the latest area group comprises one more new area position corresponding to the positioning motion track;
And S6, obtaining the current position relation between the polishing head and each positioning motion track according to the whole motion track of the polishing head, and obtaining the actual relative position between the polishing head and the device to be polished according to the corresponding actual region position of any positioning motion track on the device to be polished and the current position relation.
Optionally, after the step S2, the method further includes:
The method comprises the steps of responding to a plurality of first area positions, controlling a polishing head to obtain a third positioning movement track, matching the third area position where the shape of the third positioning movement track is consistent with the shape of the surface of a device to be polished, responding to one or only one of the third area positions, determining the corresponding actual area position of the third positioning movement track on the device to be polished according to the third area position, responding to a plurality of third area positions, and repeating the steps until the third area position is the same as the third positioning movement track, wherein the third positioning movement track is different in the repeated steps.
Optionally, before the step S1, the method further includes:
And controlling the polishing head to move up and down according to a preset amplitude until the six-dimensional force sensor collects stress data, and judging that the polishing head contacts the device to be polished.
Optionally, before the step S6, the method further includes:
And collecting the whole-course motion track of the polishing head, wherein the whole-course motion track at least comprises all the positioning motion tracks.
Optionally, the step S1 of obtaining the first positioning motion track of the polishing head includes:
And recording the moving direction and the moving distance of the polishing head at each moment, and obtaining the first positioning motion track of the polishing head according to the moving direction and the moving distance at each moment.
Optionally, after the step S6, the method further includes:
Determining a polishing track according to the actual relative position between the polishing head and the device to be polished and the surface demand shape of the device to be polished, and controlling the polishing head to polish the device to be polished according to the polishing track.
Optionally, the method further comprises:
And determining the rotation speed of the polishing head in the polishing process according to the difference between each positioning motion track and the required surface shape of the device to be polished.
Optionally, in the step S2, a first area position corresponding to the first positioning motion track is matched from the surface requirement shape of the device to be polished, and the method includes:
and determining the position of a region, which is different from the first positioning motion track by a first threshold value or less, on the surface demand shape of the device to be polished, and determining the position of the region, which is different from the first threshold value or less, as the position of the first region, which is consistent with the first positioning motion track.
The invention has the beneficial effects that 1, the shape track of the surface of the device to be polished is directionally moved and collected through the polishing head, the collected stress data is monitored through the six-dimensional force sensor to adjust the polishing head to ensure that the track collected by the polishing head is always positioned on the surface of the device to be polished, so that the finally obtained positioning motion track is the same as the track of a certain area on the surface of the device to be polished, then the accurate position of the positioning track on the surface of the device to be polished is obtained through matching the surface required shape with the positioning track, and finally the positioning between the polishing head and the device to be polished is realized. Compared with image recognition, the six-dimensional force sensor-based positioning motion track acquisition device can acquire positioning motion tracks based on the six-dimensional force sensor, sense fine changes and enable positioning to be more accurate, meanwhile, the image recognition system is not needed to be added into the polishing device, and the structure of the polishing device is simplified. 2. According to the invention, when one positioning motion track cannot be positioned accurately, a new positioning motion track can be added, and then the positioning is performed again according to the relative positions of the positioning motion tracks, so that the positioning of the invention is more accurate and reliable. 3. Compared with full scanning positioning, the positioning method and the positioning device greatly improve the positioning efficiency.
In summary, the six-dimensional force sensor based positioning device is used for positioning the polishing head and the device to be polished, so that the positioning precision can be effectively improved, and the polishing quality is further improved.
Drawings
FIG. 1 is a schematic flow chart of a six-dimensional force sensor based curved surface polishing and positioning method according to an embodiment of the present invention;
FIG. 2 is a schematic view of an overall process cycle of a six-dimensional force sensor based curved surface grinding and positioning method according to an embodiment of the present invention;
Fig. 3 is a schematic overall flow cycle diagram of a six-dimensional force sensor based curved surface polishing and positioning method according to another embodiment of the present invention.
Detailed Description
The invention discloses a six-dimensional force sensor based curved surface polishing and positioning method, and a person skilled in the art can refer to the content of the text and properly improve the technical details. It is expressly noted that all such similar substitutions and modifications will be apparent to those skilled in the art, and are deemed to be included in the present invention. While the methods and applications of this invention have been described in terms of preferred embodiments, it will be apparent to those skilled in the relevant art that variations and modifications can be made in the methods and applications described herein, and in the practice and application of the techniques of this invention, without departing from the spirit or scope of the invention.
The applicant researches show that the six-dimensional force sensor stress data can be monitored to enable the polishing head to pass through all surfaces of the device to be polished, so that the actual surface shape of the device to be polished is obtained, and then the polishing head can be positioned in polishing coordinates through comparison with the required surface shape, so that accurate positioning is realized. However, this positioning method through the entire surface can improve the accuracy as compared with image recognition, but the efficiency is greatly reduced. Therefore, a solution is needed that can ensure both positioning efficiency and positioning accuracy.
Therefore, an embodiment of the present invention provides a six-dimensional force sensor based curved surface polishing and positioning method, as shown in fig. 1, including:
step S1, responding to a polishing head of a polishing device to contact a device to be polished to obtain first stress data of a six-dimensional force sensor, controlling the polishing head to move towards a preset direction, controlling the polishing head to move in a vertical direction according to the first stress data so as to keep pressure data in the first stress data constant in a moving process, and responding to zero pressure data in the first stress data to obtain a first positioning movement track of the polishing head.
Wherein, the polishing head is connected with the six-dimensional force sensor.
In the process of polishing the curved surface, a plurality of identical surface tracks are rarely existed, and even if the plurality of tracks are identical, the plurality of tracks can be matched and positioned by adding new tracks with known relative positions until the unique and accurate positioning is determined. Based on the scheme, the embodiment of the invention can avoid the proposal that the polishing head passes through the whole surface of the device to be polished, can realize accurate positioning, greatly reduces the positioning time and improves the positioning efficiency. On the other hand, the embodiment of the invention collects stress data based on the six-dimensional force sensor, and adjusts the height of the polishing head in the collecting and positioning motion track according to the stress data so as to ensure that the collected and positioning motion track accords with the surface of the device to be polished, thereby ensuring that the embodiment of the invention is positioned more accurately.
It is worth mentioning that the polishing head does not rotate in the process of collecting the positioning motion trail, so that the positioning motion trail is prevented from being changed through polishing.
In this particular embodiment, prior to step S1, the method further comprises:
and controlling the polishing head to move up and down according to a preset amplitude until the six-dimensional force sensor collects stress data, and judging that the polishing head contacts the device to be polished.
It should be noted that, the polishing head is controlled to move to the position above the device to be polished without precisely moving to a certain position, and only needs to move to the position above the device to be polished.
In this embodiment, the basis for the pressure data in the first stress data to be zero is that the polishing head is moved up and down by a preset amplitude, and in this process, the pressure data are all zero, and the pressure data in the first stress data are determined to be zero.
In this specific embodiment, obtaining the first positioning motion trajectory of the polishing head in step S1 includes:
And recording the moving direction and the moving distance of the polishing head at each moment, and obtaining a first positioning movement track of the polishing head according to the moving direction and the moving distance of the polishing head at each moment.
Since the movement of the sanding head is controlled by the control module, the control module can also record these movement data.
And S2, obtaining a surface demand shape of the device to be polished, matching a first area position where the shape is consistent with the first positioning movement track from the surface demand shape of the device to be polished, and determining the corresponding area position of the first positioning movement track on the device to be polished according to the first area position in response to the fact that the first area position is one and only one.
The required surface shape is the required surface shape after polishing the device to be polished. Since sanding merely removes roughness and burrs, the actual shape of the surface of the device to be sanded and the desired shape of the surface generally differ little. Therefore, the position of the corresponding area of the positioning motion track on the device to be polished can be determined by matching the surface required shape with the positioning motion track.
In this specific embodiment, in step S2, matching the position of the first area where the topography corresponding to the first positioning motion track is located from the surface requirement shape of the device to be polished, includes:
And determining the position of a region, which is different from the first positioning motion track by a first threshold value, on the surface demand shape of the device to be polished, and determining the position of the region, which is different from the first threshold value, as the position of the first region, which is consistent with the first positioning motion track.
It should be noted that, although the surface demand shape and the surface actual shape are not quite different, there is always a partial gap, so that the positioning motion track will not completely coincide with the position of the corresponding region on the surface demand shape, and therefore, a threshold value needs to be set to ensure that the positioning motion track is approximately the same as the position of the corresponding region on the surface demand shape.
And step S3, controlling the grinding head to move to obtain a second positioning movement track in response to the fact that a plurality of first area positions exist, matching the second area position where the appearance consistent with the second positioning movement track exists in the surface demand shape of the device to be ground, and determining the corresponding actual area position of the second positioning movement track on the device to be ground according to the second area position in response to the fact that one or only one of the second area positions exists.
It should be noted that, a positioning motion track may correspond to a plurality of area positions, and a new positioning motion track needs to be added for determination.
And S4, obtaining a first relative position between the first positioning motion track and the second positioning motion track in response to the fact that the second area positions are multiple, determining a first area group matched with the first relative position from the multiple first area positions and the multiple second area positions according to the first relative position, and determining the corresponding actual area positions of the two positioning motion tracks on the device to be polished according to the first area group in response to the fact that the first area group is multiple and only one group.
The first region group comprises a pair of corresponding first region positions and second region positions.
It should be noted that, when the other positioning motion track corresponds to a plurality of area positions, the accurate area of the device table to be polished cannot be determined. The relative positions of different positioning tracks can be used for determining whether a unique area group meets the requirement or not, and positioning can be performed.
And step S5, responding to the fact that the first area group is provided with a plurality of groups, repeating the step S3 and the step S4 until the corresponding actual area position of each positioning movement track on the device to be polished is determined, wherein each time of repeating, the latest area group comprises one more area position corresponding to the new positioning movement track.
It should be noted that when the region group is also not unique, a new positioning motion track may be added until the region position corresponding to the new positioning motion track is unique, or the new region group is unique. Each time the process is repeated, the latest region group includes a region position corresponding to a new positioning motion track, for example, the region group corresponding to three positioning motion tracks includes region positions corresponding to the three positioning motion tracks.
And S6, obtaining the current position relation between the polishing head and each positioning motion track according to the whole-course motion track of the polishing head, and obtaining the actual relative position between the polishing head and the device to be polished according to the corresponding actual region position and the current position relation of any positioning motion track on the device to be polished.
It should be noted that when the position of the positioning motion trajectory on the device to be polished is known, and the relative position of the positioning motion trajectory and the polishing head is also known (the motion trajectory is recorded at the time of the polishing head), the relative position between the polishing head and the device to be polished can be obtained, that is, if a spatial coordinate axis is established with a definite device to be polished, the coordinates of the polishing head can be obtained.
In this particular embodiment, prior to step S6, the method further comprises:
and collecting the whole-course motion track of the polishing head, wherein the whole-course motion track at least comprises all positioning motion tracks.
It should be noted that, since there may be a stroke between different positioning motion trajectories to move the polishing head again above the device to be polished, the full motion trajectory may include this portion of the trajectory.
In this particular embodiment, after step S6, the method further comprises:
Determining a polishing track according to the actual relative position between the polishing head and the device to be polished and the surface demand shape of the device to be polished, and controlling the polishing head to polish the device to be polished according to the polishing track.
In this particular embodiment, the rotational speed of the sanding head during sanding is determined from the differences between the respective positioning motion trajectories and the desired shape of the surface of the device to be sanded.
It should be noted that, the polishing thickness may be determined according to the difference between each positioning motion track and the required shape of the surface of the device to be polished, and the polishing thickness may determine the rotation speed.
In this particular embodiment, the polishing head positioning process may be as shown in fig. 2, including:
step S201, obtaining a first positioning motion trail;
step S202, matching a first area position where the morphology is consistent with the first positioning movement track from the surface demand shape of the device to be polished;
step S203, judging whether the position of the first area is unique, if yes, entering step S208, otherwise, entering step S204;
step S204, controlling the polishing head to move to obtain a second positioning movement track, and matching the position of a second area where the shape of the second positioning movement track is consistent with the shape of the surface of the device to be polished;
Step S205, judging whether the position of the second area is unique, if yes, proceeding to step S208, otherwise proceeding to step S206;
Step S206, a first relative position between the first positioning motion track and the second positioning motion track is obtained, and a first area group matched with the first relative position is determined from a plurality of first area positions and a plurality of second area positions according to the first relative position;
Step S207, judging whether the first area is unique, if yes, entering step S208, otherwise, returning to step S204;
And step S208, determining the actual area position of the positioning motion trail on the device to be polished.
In another specific embodiment, after step S2, the method further comprises:
The method comprises the steps of responding to a plurality of first area positions, controlling a polishing head to obtain a third positioning motion track, matching the third area position where the shape is consistent with the third positioning motion track from the surface requirement shape of a device to be polished, responding to the third area position and only one of the third area positions, determining the corresponding actual area position of the third positioning motion track on the device to be polished according to the third area position, responding to the plurality of third area positions, and repeating the steps until the third area position and only one of the third area position are obtained, wherein the third positioning motion track is different in positioning motion track when the steps are repeated.
The specific polishing head positioning process may be as shown in fig. 3, and includes:
Step S301, obtaining a first positioning motion trail;
Step S302, matching a first area position where the morphology is consistent with the first positioning movement track from the surface demand shape of the device to be polished;
Step S303, judging whether the position of the first area is unique, if yes, entering step S304, otherwise, returning to step S301, wherein the re-obtained first positioning movement track is different from the previous one;
And step S304, determining the actual area position of the positioning motion trail on the device to be polished.
According to the embodiment of the invention, the shape track of the surface of the device to be polished is directionally moved and collected through the polishing head, the collected stress data is monitored through the six-dimensional force sensor, the polishing head is adjusted to ensure that the track collected by the polishing head is always positioned on the surface of the device to be polished, so that the finally obtained positioning motion track is identical with the track of a certain area of the surface of the device to be polished, then the accurate position of the positioning track, in particular to the surface of the device to be polished, is obtained through matching of the surface required shape and the positioning track, and finally the positioning between the polishing head and the device to be polished is realized. Compared with image recognition, the six-dimensional force sensor-based positioning motion track acquisition device can sense fine changes and enable positioning to be more accurate, meanwhile, the image recognition system is not needed to be added into the polishing device, and the structure of the polishing device is simplified.
According to the embodiment of the invention, when one positioning motion track cannot be positioned accurately, a new positioning motion track can be added, and then the positioning is performed again according to the relative positions of the new positioning motion track and the new positioning motion track, so that the positioning of the embodiment of the invention is more accurate and reliable.
The embodiment of the invention performs positioning through the track, in contrast to the full-scale scanning positioning, the embodiment of the invention greatly improves the positioning efficiency.
In summary, the embodiment of the invention realizes the positioning between the polishing head and the device to be polished based on the six-dimensional force sensor, and can effectively improve the positioning precision and further improve the polishing quality.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing is merely illustrative of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (8)
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| CN108161991A (en) * | 2018-01-26 | 2018-06-15 | 北京邮电大学 | A kind of robotic asssembly automatic seeking hole method based on force feedback |
| CN112541376A (en) * | 2019-09-20 | 2021-03-23 | 北京万维智能技术有限公司 | Motion trail generation method based on pressure information |
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| CN114161402B (en) * | 2021-12-17 | 2023-11-10 | 深圳市优必选科技股份有限公司 | Robot stability control method, model construction method, device and robot |
| CN116572118B (en) * | 2023-05-29 | 2024-09-17 | 中国科学院长春光学精密机械与物理研究所 | Positioning method for grinding head center based on six-dimensional force sensor |
| CN118752318B (en) * | 2024-09-09 | 2024-11-15 | 锐马（福建）电气制造有限公司 | A grinding method based on six-dimensional force sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108161991A (en) * | 2018-01-26 | 2018-06-15 | 北京邮电大学 | A kind of robotic asssembly automatic seeking hole method based on force feedback |
| CN112541376A (en) * | 2019-09-20 | 2021-03-23 | 北京万维智能技术有限公司 | Motion trail generation method based on pressure information |
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