CN119008166A - Integrated coupling inductance of circuit board - Google Patents
Integrated coupling inductance of circuit board Download PDFInfo
- Publication number
- CN119008166A CN119008166A CN202411194666.5A CN202411194666A CN119008166A CN 119008166 A CN119008166 A CN 119008166A CN 202411194666 A CN202411194666 A CN 202411194666A CN 119008166 A CN119008166 A CN 119008166A
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- coil
- substrate
- circuit board
- inductor
- conductor
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- 230000008878 coupling Effects 0.000 title abstract description 29
- 238000010168 coupling process Methods 0.000 title abstract description 29
- 238000005859 coupling reaction Methods 0.000 title abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims description 54
- 238000004804 winding Methods 0.000 claims description 18
- 238000010586 diagram Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
本发明提供一种电路板集成耦合电感。在电感器中，第一线圈导体和第二线圈导体集成在电路板上下两面，当经由各端子部施加电压时，电流流过第一线圈导体和第二线圈导体，此时，在第一线圈导体和第二线圈导体之间产生耦合。所述线路绕成多匝线圈，所述片上电感还包括所述线圈至少部分嵌设于所述电路板内，连接第一、第二线圈导体。本申请的电路板集成耦合电感具有更高的耦合系数，且通过设计，可以提高电感的感值和品质因数。
The present invention provides a circuit board integrated coupled inductor. In the inductor, a first coil conductor and a second coil conductor are integrated on the upper and lower surfaces of the circuit board. When a voltage is applied through each terminal portion, current flows through the first coil conductor and the second coil conductor. At this time, coupling is generated between the first coil conductor and the second coil conductor. The circuit is wound into a multi-turn coil, and the on-chip inductor also includes the coil at least partially embedded in the circuit board, connecting the first and second coil conductors. The circuit board integrated coupled inductor of the present application has a higher coupling coefficient, and through design, the inductance value and quality factor of the inductor can be improved.
Description
Technical Field
The present invention relates to a coupling inductor, and more particularly, to a coupling inductor with a high coupling coefficient.
Background
In modern electronic devices, coupled inductors are widely used in various circuits to perform functions such as signal transmission, filtering, and energy conversion. Conventional coupled inductors generally have problems of low coupling coefficient, large volume, high manufacturing cost and the like, and limit the application of the conventional coupled inductors in high-performance and miniaturized electronic equipment. The technical advantage of the coupled inductor is that it is capable of effectively canceling current ripple through magnetic coupling, thereby improving power conversion efficiency, reducing the size of the magnetic element, and obtaining a faster transient response. Compared with the traditional discrete inductor, the coupled inductor has more excellent performance in multiphase power supply topology, can obviously reduce current ripple and reduce conduction loss and switching loss of circuit elements.
In addition, the coupled inductor can be designed to improve the performance by optimizing the coil structure and adopting novel magnetic materials. For example, the inductance can be increased under the condition of high current by adopting a negative coupling design, and the phenomenon of magnetic saturation is avoided. This design allows the coupled inductor to exhibit higher reliability and stability in high current applications. Although various improvements exist, in practical applications, it is still difficult for conventional coupled inductors to meet the requirements of high coupling coefficient, miniaturization and low cost at the same time.
Therefore, a better solution is needed to solve the above problems.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a circuit board integrated coupling inductor.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
a circuit board integrated coupled inductor generated on an FR-4 substrate, comprising:
the device comprises a substrate, a first inductor and a second inductor;
The first inductor comprises a first coil and a second coil, wherein the first coil is a spiral coil conductor positioned on the upper surface of the substrate, and the second coil is a spiral coil conductor positioned on the lower surface of the substrate; the two are connected through a conductor embedded in the substrate;
The second inductor comprises a third coil and a fourth coil, the third coil is a spiral coil conductor positioned on the upper surface of the substrate, and the fourth coil is a spiral coil conductor positioned on the lower surface of the substrate; the two are connected through a conductor embedded in the substrate;
The first coil and the second coil are vertically symmetrical with respect to the substrate, the third coil conductor and the fourth coil are vertically symmetrical with respect to the substrate,
The first coil is shifted by a line spacing g on the upper surface of the substrate to obtain a third coil, and the value range of g is 100-300 mu m;
the second coil is translated by a line spacing g on the lower surface of the substrate to obtain a fourth coil;
the first inductor and the second inductor are the same in size, the number of turns is the same, and the first inductor and the second inductor are mutually coupled;
the second coil and the fourth coil are connected to the grounding end of the upper surface of the substrate through conductors inside the substrate;
the first coil and the third coil are respectively connected to the signal ends of the upper surface of the substrate.
Preferably, the first coil includes a first coil having at least one turn winding and a second coil having at least one turn winding.
Preferably, the second coil conductor includes a third coil having at least one turn of winding and a fourth coil having at least one turn of winding.
Preferably, the first coil is connected to the signal terminal through a first coil connecting wire, the third coil is connected to the signal terminal through a third coil connecting wire, and the first coil connecting wire and the third coil connecting wire are arranged on the upper surface of the substrate.
Preferably, the second coil is connected to the ground through a second coil ground wire, the fourth coil is connected to the ground through a fourth coil ground wire, and the second coil ground wire and the fourth coil ground wire are disposed on the upper surface of the substrate.
Preferably, the conductors of the first coil, the second coil, the third coil and the fourth coil are respectively flat wires.
Preferably, the first coil, the second coil, the third coil, and the fourth coil have the same conductor thickness.
Preferably, the first coil, the second coil, the third coil, and the fourth coil have the same conductor width.
Preferably, the integrated coupling inductor of the circuit board is integrally formed in an axisymmetric pattern along a central symmetry axis, and the signal end and the grounding end are symmetrically arranged on two sides of the symmetry axis respectively.
The beneficial effects of the invention are as follows: the invention provides a circuit board integrated coupling inductor which is generated on an FR-4 substrate and is prepared by a micro-machining process, and the design is simple and convenient; the first coil and the second coil are coupled to each other with a coupling coefficient of about 0.91; the single-phase inductance value is about 1.58 mu H, the peak quality factor can reach 33.3, and the coupling coefficient and the quality factor are higher; the whole is an axisymmetric graph along a central symmetry axis, and the signal end and the grounding end are symmetrically arranged on two sides respectively.
The circuit board integrated coupling inductor provided by the invention is suitable for various circuits in modern electronic equipment, is used for realizing the functions of signal transmission, filtering, energy conversion and the like, and is suitable for high-performance and miniaturized electronic equipment.
Drawings
Fig. 1 is a perspective view of a coupled inductor according to an embodiment of the present invention.
Fig. 2 is a top view of a coupled inductor according to an embodiment of the present invention.
Fig. 3 is a side view of a coupled inductor according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a winding structure of a coupled inductor according to an embodiment of the present invention.
Fig. 5 is a simulation diagram of inductance and quality factor in the coupled inductor according to the embodiment.
Fig. 6 is a simulation diagram of coupling coefficients in a coupled inductor according to an embodiment.
Reference numerals illustrate:
100 is a circuit board integrated coupled inductor;
101-a first coil; 102-a second coil; 103-a third coil; 104-a fourth coil;
101a is a first coil signal terminal, 101b is a first coil ground terminal, 102a is a second coil signal terminal, 102b is a second coil ground terminal,
105 Is a substrate;
B1-upper surface; b2-lower surface;
106 is a first coil connection line, 107 is a third coil connection line, 108 is a second coil ground line, and 109 is a fourth coil ground line.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As shown in fig. 1, the present embodiment provides a circuit board integrated coupling inductor, which is formed on an FR-4 substrate, comprising:
A substrate 105, a first inductor, a second inductor;
The first inductor comprises a first coil 101 and a second coil 102, wherein the first coil 101 is a spiral coil conductor positioned on the upper surface B1 of the substrate, and the second coil 102 is a spiral coil conductor positioned on the lower surface B2 of the substrate; the two are connected through a conductor embedded in the substrate;
The second inductor includes a third coil 103 and a fourth coil 104, wherein the third coil 103 is a spiral coil conductor positioned on the upper surface of the substrate 100, and the fourth coil 104 is a spiral coil conductor positioned on the lower surface of the substrate 105; the two are connected through a conductor embedded in the substrate;
The first coil 101 and the second coil 102 are vertically symmetrical with respect to the substrate, the third coil 103 and the fourth coil 104 are vertically symmetrical with respect to the substrate,
The first coil 101 is shifted by a line spacing g on the upper surface of the substrate to obtain a third coil 103;
the second coil 102 is shifted by a line spacing g on the lower surface of the substrate to obtain a fourth coil 104;
the first inductor and the second inductor are the same in size, the number of turns is the same, and the first inductor and the second inductor are mutually coupled;
The second coil 102 and the fourth coil 104 are connected to the ground terminal of the upper surface of the substrate through conductors inside the substrate; 101b is the first coil ground, 102b is the second coil ground,
The first coil 101 and the third coil 103 are connected to signal terminals on the upper surface of the substrate, respectively. 101a is the first coil signal terminal and 102a is the second coil signal terminal.
The first coil includes a first coil having at least one turn of winding and a second coil having at least one turn of winding.
The second coil conductor includes a third coil having at least one turn of winding and a fourth coil having at least one turn of winding.
The first coil is connected to the signal terminal through a first coil connecting wire 106, the third coil is connected to the signal terminal through a third coil connecting wire 107, and the first coil connecting wire 106 and the third coil connecting wire 107 are arranged on the upper surface of the substrate.
The second coil is connected to the ground through a second coil ground wire 108, the fourth coil is connected to the ground through a fourth coil ground wire 109, and the second coil ground wire 108 and the fourth coil ground wire 109 are disposed on the upper surface of the substrate.
The conductors of the first coil, the second coil, the third coil and the fourth coil are respectively flat wires.
The thicknesses of conductors of the first coil, the second coil, the third coil and the fourth coil are the same.
The conductor widths of the first coil, the second coil, the third coil and the fourth coil are the same.
The integrated coupling inductor of the circuit board is integrally formed by axisymmetric patterns along a central symmetry axis, and the signal end and the grounding end are symmetrically arranged on two sides of the symmetry axis respectively.
Fig. 1 illustrates a perspective view of a coupled inductor according to one embodiment of the present invention.
Fig. 2 is a top view of a circuit board integrated coupling inductor according to the present invention; the integrated coupling inductor of the circuit board is prepared on an FR-4 substrate through a micro-machining process. The winding is made of metallic copper material, the thickness th is 17.5-70 μm, the width w is 100-300 μm, and the coil gap g is 100-300 μm. The length of the magnetic circuit can be adjusted by adjusting the width of the coil under the condition of the same number of turns, the smaller the width is, the smaller the length of the magnetic circuit is, the higher the coupling coefficient is, but the saturation current of the inductor is reduced. Thicker copper wire thickness may provide lower dc resistance for the inductor. The length Lm of the rectangle wound by the first coil conductor and the second coil conductor at the center of the circuit board integrated coupling inductance is 1-5 mm, and the width Wm is lm+w+g, which changes along with the change of the coil width.
The embodiment provides a circuit board integrated coupling inductance, the winding thickness th is 50 μm, the width w is 100 μm, the coil gap g is 300 μm, and the Lm is 2mm. The inductor has lower direct current resistance of about 6Ω, and can still have lower direct current loss under larger direct current bias.
Fig. 3 is a side view of a coupled inductor according to an embodiment of the present invention, showing a side view of a plane along which the line A-A shown in fig. 2 is located.
Fig. 4 is a schematic diagram of a winding structure of a coupled inductor according to an embodiment of the present invention.
Simulation diagrams of inductance value, quality factor and coupling coefficient of the integrated coupling inductor of the circuit board are shown in fig. 5 and 6; because of the symmetry of the two phases, the inductance is the same, only the simulation result related to the primary coil Lp is given, and the simulation software adopts HFSS15.0. Fig. 5 shows the Lp-response and quality factor curves with frequency, with a single-phase response of about 1.58 muh and a peak quality factor of 33. Fig. 5 shows the coupling coefficients of the primary winding Lp and the secondary winding Ls, and as can be seen from fig. 5, K12 is about 0.91, and a high coupling coefficient is achieved between the two phases.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims of this invention, which are within the skill of those skilled in the art, can be made without departing from the spirit and scope of the invention disclosed herein.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411194666.5A CN119008166A (en) | 2024-08-29 | 2024-08-29 | Integrated coupling inductance of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411194666.5A CN119008166A (en) | 2024-08-29 | 2024-08-29 | Integrated coupling inductance of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119008166A true CN119008166A (en) | 2024-11-22 |
Family
ID=93471997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411194666.5A Pending CN119008166A (en) | 2024-08-29 | 2024-08-29 | Integrated coupling inductance of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119008166A (en) |
-
2024
- 2024-08-29 CN CN202411194666.5A patent/CN119008166A/en active Pending
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