CN118832160A - Core/shell type silver coated copper powder synthesized based on atomization drying and heat treatment process and preparation method thereof - Google Patents
Core/shell type silver coated copper powder synthesized based on atomization drying and heat treatment process and preparation method thereof Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 196
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 93
- 239000004332 silver Substances 0.000 title claims abstract description 93
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 238000001035 drying Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000010438 heat treatment Methods 0.000 title claims abstract description 35
- 238000000889 atomisation Methods 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 230000008569 process Effects 0.000 title claims abstract description 21
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 239000000243 solution Substances 0.000 claims description 86
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 52
- 239000008367 deionised water Substances 0.000 claims description 45
- 229910021641 deionized water Inorganic materials 0.000 claims description 45
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 27
- 238000009210 therapy by ultrasound Methods 0.000 claims description 20
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 17
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 14
- 239000012298 atmosphere Substances 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 11
- 239000000047 product Substances 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 8
- 239000008139 complexing agent Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 239000012265 solid product Substances 0.000 claims description 6
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 5
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 5
- 229940071536 silver acetate Drugs 0.000 claims description 5
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 5
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 claims description 5
- 229910000367 silver sulfate Inorganic materials 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 4
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 4
- 230000002194 synthesizing effect Effects 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000012527 feed solution Substances 0.000 claims description 3
- 229960002449 glycine Drugs 0.000 claims description 3
- 235000013905 glycine and its sodium salt Nutrition 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 230000000536 complexating effect Effects 0.000 claims description 2
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims 2
- 238000009690 centrifugal atomisation Methods 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 8
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000003786 synthesis reaction Methods 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 15
- 239000003570 air Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 13
- 239000003638 chemical reducing agent Substances 0.000 description 10
- -1 silver ions Chemical class 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- 238000002525 ultrasonication Methods 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 238000000498 ball milling Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000053 physical method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229940100890 silver compound Drugs 0.000 description 2
- 150000003379 silver compounds Chemical class 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000001595 flow curve Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/145—Chemical treatment, e.g. passivation or decarburisation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Powder Metallurgy (AREA)
Abstract
本发明提供一种基于雾化干燥及热处理工艺合成核/壳型银包覆铜粉及其制备方法,属于粉体材料制备技术领域,采用含银化合物加热分解的原理,首先对铜粉原料进行预处理,然后配置银盐络合溶液,并与铜粉原料混合获得均匀的料液,再对料液进行雾化干燥处理,使得银盐络合物在铜粉表面均匀包覆;最后,对雾化干燥后的包覆产物进行热处理,使银从铜粉表面分解析出,获得核/壳型银包覆铜复合粉体材料。本发明制备方法简单,得到的复合粉体具有良好的分散性、尺寸分布均匀,且铜粉表面所包覆的银层完整、致密、厚度均匀,其导电性能好、高温抗氧化能力强,可用于各种电子浆料的粉体原料,在空气中进行烧结处理。
The present invention provides a synthesis of core/shell type silver-coated copper powder based on atomization drying and heat treatment process and a preparation method thereof, which belongs to the technical field of powder material preparation. The copper powder raw material is first pretreated by adopting the principle of heating and decomposing a silver-containing compound, and then a silver salt complex solution is prepared and mixed with the copper powder raw material to obtain a uniform liquid, and then the liquid is atomized and dried to make the silver salt complex uniformly coat the surface of the copper powder; finally, the coated product after atomization and drying is heat-treated to decompose and separate silver from the surface of the copper powder to obtain a core/shell type silver-coated copper composite powder material. The preparation method of the present invention is simple, and the obtained composite powder has good dispersibility and uniform size distribution, and the silver layer coated on the surface of the copper powder is complete, dense, and uniform in thickness, and has good electrical conductivity and strong high-temperature oxidation resistance. It can be used as a powder raw material for various electronic pastes and is sintered in air.
Description
技术领域Technical Field
本发明属于粉体材料制备技术领域,涉及一种具有包覆效果好、抗氧化性强的银包覆铜粉及其制备方法。The invention belongs to the technical field of powder material preparation, and relates to silver-coated copper powder with good coating effect and strong oxidation resistance and a preparation method thereof.
背景技术Background Art
随着电子信息工业的发展,带动了以超细金属粉体为主要功能相的电子浆料的发展,且随着电子元件向小型化、精密化、多功能化等方面发展,对电子浆料的质量要求也越来越高。电子浆料作为器件的导电涂层材料,目前已经在太阳能电池、印刷电路板、厚膜集成电路、导电油墨等领域被广泛应用,也在航空航天、计算机及通信领域中起到了重要的作用。常见的用于制备电子浆料的超细金属粉体中,银粉因其良好的导电性能和抗氧化性能等优点成为最受欢迎的元器件制备材料之一。但银作为贵重金属材料,其价格昂贵,增加了浆料的制造成本;此外,银容易迁移的问题同样制约着其应用。铜粉的导电性能与银相近且价格便宜,但是铜粉的导电性能会因为其在制备和使用时易于氧化而降低。因此,银包铜粉的制备工艺应运而生,这种生产工艺所制备出来的核/壳型复合粉体材料既解决了银的迁移问题,还改善了铜粉的抗氧化能力。With the development of the electronic information industry, the development of electronic paste with ultrafine metal powder as the main functional phase has been driven. As electronic components develop towards miniaturization, precision, and multifunctionality, the quality requirements for electronic paste are becoming higher and higher. As a conductive coating material for devices, electronic paste has been widely used in solar cells, printed circuit boards, thick film integrated circuits, conductive inks, and other fields, and has also played an important role in aerospace, computer and communication fields. Among the common ultrafine metal powders used to prepare electronic pastes, silver powder has become one of the most popular materials for component preparation due to its good conductivity and antioxidant properties. However, as a precious metal material, silver is expensive, which increases the manufacturing cost of the paste; in addition, the problem of easy migration of silver also restricts its application. The conductivity of copper powder is similar to that of silver and is cheap, but the conductivity of copper powder will be reduced because it is easily oxidized during preparation and use. Therefore, the preparation process of silver-coated copper powder came into being. The core/shell composite powder material prepared by this production process not only solves the migration problem of silver, but also improves the antioxidant ability of copper powder.
银包覆铜粉的制备方法一般分为化学法和物理法,具体的:The preparation methods of silver-coated copper powder are generally divided into chemical method and physical method, specifically:
化学法包括化学还原法、置换法等。化学还原法,主要是利用外加还原剂将溶液中的银离子还原出来并均匀沉积在铜粉的表面,根据镀银的自催化机理生成的单质银可以连续沉积在铜粉表面,形成均匀的银层。但其所需的银镀液需要添加多种成分且稳定性较差,易产生游离态的银颗粒,需要更加精确的控制反应条件才能制备出均匀致密的银镀层。置换法则是将铜粉本身作为还原银离子的还原剂,通过在铜颗粒表面进行的置换反应将银沉积在铜粉表面。由于置换反应是在铜基体上进行的,因此能制备出铜-银结合良好的颗粒,但同时溶液中更容易发生电化学反应,使得银继续沉积在已形成的点状银粒上,导致银镀层的连续性较差。Chemical methods include chemical reduction method, replacement method, etc. The chemical reduction method mainly uses an external reducing agent to reduce the silver ions in the solution and evenly deposit them on the surface of the copper powder. The elemental silver generated according to the self-catalytic mechanism of silver plating can be continuously deposited on the surface of the copper powder to form a uniform silver layer. However, the silver plating solution required needs to add multiple components and has poor stability. It is easy to produce free silver particles. More precise control of reaction conditions is required to prepare a uniform and dense silver coating. The replacement method uses the copper powder itself as a reducing agent to reduce the silver ions, and deposits silver on the surface of the copper powder through a replacement reaction on the surface of the copper particles. Since the replacement reaction is carried out on a copper matrix, particles with good copper-silver bonding can be prepared, but at the same time, electrochemical reactions are more likely to occur in the solution, causing silver to continue to be deposited on the already formed point-like silver particles, resulting in poor continuity of the silver coating.
物理法制备银包铜粉,主要涉及机械球磨法、蒸发冷凝法、磁控溅射法等。机械球磨法使用铜、银作为磨料,在磨粒挤压的作用下使银粉在铜粉表面展开而形成包覆层。尽管能制备出完整包覆的银包覆铜颗粒,但在球磨过程中会产生较多的微纳米级的银颗粒,无法有效降低银的消耗量。蒸发冷凝法是目前获取具有清洁界面纳米颗粒的主要手段之一,该方法在充满惰性气体的环境下制备,通常会利用蒸发源将物料加热至熔融温度以上进行气化或等离子化处理,待其与惰性原子碰撞而能量损失后,急剧降低环境温度使之凝结成具有一定粒径的颗粒。通过蒸发冷凝法制备的银铜粉具有导电性强、粒径可控等优点,但制造成本较高、产率较低,并且难以形成银包覆铜的核/壳型结构。磁控溅射法利用电子在电场作用下加速飞向基片的过程中与氩原子发生碰撞,电离出大量的氩离子和电子。氩离子在电场的作用下加速轰击靶材,溅射出大量的靶材原子,呈中性的靶原子(或分子)沉积在基片上成膜。在制备银包覆铜材料时,银作为靶材材料,通过溅射沉积在铜粉表面。由于溅射对象不是块体或板状材料,因此在制备时需要通过额外的手段处理铜粉才能使得银原子均匀沉积在铜粉表面,导致设备复杂,生产效率不高。The physical method for preparing silver-coated copper powder mainly involves mechanical ball milling, evaporation condensation, magnetron sputtering, etc. The mechanical ball milling method uses copper and silver as abrasives. Under the action of abrasive extrusion, the silver powder is spread on the surface of the copper powder to form a coating layer. Although completely coated silver-coated copper particles can be prepared, a large number of micro-nanoscale silver particles will be produced during the ball milling process, and the consumption of silver cannot be effectively reduced. The evaporation condensation method is currently one of the main means to obtain nanoparticles with clean interfaces. This method is prepared in an environment full of inert gas. Usually, the evaporation source is used to heat the material to above the melting temperature for gasification or plasma treatment. After it collides with inert atoms and loses energy, the ambient temperature is sharply reduced to condense it into particles with a certain particle size. The silver-copper powder prepared by the evaporation condensation method has the advantages of strong conductivity and controllable particle size, but the manufacturing cost is high, the yield is low, and it is difficult to form a core/shell structure of silver-coated copper. The magnetron sputtering method uses the process in which electrons are accelerated to fly toward the substrate under the action of an electric field and collide with argon atoms, ionizing a large number of argon ions and electrons. Under the action of the electric field, the argon ions are accelerated to bombard the target material, sputtering a large number of target atoms, and the neutral target atoms (or molecules) are deposited on the substrate to form a film. When preparing silver-coated copper materials, silver is used as the target material and is deposited on the surface of copper powder by sputtering. Since the sputtering object is not a bulk or plate-like material, additional means are required to process the copper powder during preparation in order to allow the silver atoms to be evenly deposited on the surface of the copper powder, resulting in complex equipment and low production efficiency.
发明内容Summary of the invention
本发明解决的技术问题:本发明的目的是提供一种成本低廉、操作简单、重复性好的银包覆铜复合粉体的制备方法,该复合粉体具有良好的分散性、尺寸分布均匀,且铜粉表面所包覆的银层完整且致密,其导电性能好、高温抗氧化能力强。Technical problem solved by the invention: The purpose of the invention is to provide a method for preparing a silver-coated copper composite powder with low cost, simple operation and good repeatability. The composite powder has good dispersibility and uniform size distribution, and the silver layer coated on the surface of the copper powder is complete and dense, and has good electrical conductivity and strong high-temperature oxidation resistance.
为达到上述目的,本发明的技术方案为:To achieve the above object, the technical solution of the present invention is:
一种基于雾化干燥及热处理工艺合成核/壳型银包覆铜粉的制备方法,所述的制备方法基于含银化合物加热分解的原理,首先,对铜粉原料进行预处理以除去其表面氧化物与有机物杂质;然后,配置银盐络合溶液,并与铜粉原料混合获得均匀的料液,再对料液进行雾化干燥处理,使得银盐络合物在铜粉表面均匀包覆;最后,对雾化干燥后的包覆产物进行热处理,使银从铜粉表面分解析出,获得核/壳型银包覆铜复合粉体材料。具体包括以下步骤:A preparation method for synthesizing core/shell type silver-coated copper powder based on atomization drying and heat treatment process, the preparation method is based on the principle of heating and decomposing silver-containing compounds, firstly, pre-treating the copper powder raw material to remove its surface oxides and organic impurities; then, preparing a silver salt complex solution, mixing it with the copper powder raw material to obtain a uniform liquid, and then atomizing and drying the liquid, so that the silver salt complex is uniformly coated on the surface of the copper powder; finally, heat-treating the coated product after atomization and drying, so that silver is decomposed and precipitated from the surface of the copper powder, and obtaining a core/shell type silver-coated copper composite powder material. Specifically comprising the following steps:
一、对铜粉原料进行预处理1. Pretreatment of copper powder raw materials
步骤(1)将铜粉加入到稀碳酸钠溶液中,对其进行超声清洗得到含铜粉的碱性溶液;室温下使用去离子水对超声后的含铜粉的碱性溶液清洗,得到去离子水清洗后的铜粉;Step (1) adding copper powder to a dilute sodium carbonate solution and ultrasonically cleaning the solution to obtain an alkaline solution containing copper powder; washing the alkaline solution containing copper powder after ultrasonication with deionized water at room temperature to obtain copper powder washed with deionized water;
步骤(2)将去离子水清洗过的铜粉加入到稀盐酸溶液中,而后对其超声清洗,得到酸洗后的铜粉;室温下使用去离子水对超声后的含铜粉的稀盐酸溶液清洗,得到去离子水清洗后的铜粉;Step (2) adding the copper powder washed with deionized water into a dilute hydrochloric acid solution, and then ultrasonically washing it to obtain acid-washed copper powder; washing the dilute hydrochloric acid solution containing the copper powder after ultrasonication with deionized water at room temperature to obtain deionized water-washed copper powder;
步骤(3)将去离子水清洗后的铜粉加入到无水乙醇中进行超声处理,得到超声后的含铜粉的乙醇溶液;在50℃干燥箱中将超声后的含铜粉的乙醇溶液中的乙醇烘干,得到干燥的待包覆铜粉;Step (3) adding the copper powder washed with deionized water into anhydrous ethanol for ultrasonic treatment to obtain an ethanol solution containing copper powder after ultrasonic treatment; drying the ethanol in the ethanol solution containing copper powder after ultrasonic treatment in a drying oven at 50° C. to obtain dry copper powder to be coated;
二、配置料液2. Prepare the liquid
步骤(4)依次将络合剂、银盐、添加剂加入到去离子水中混合搅拌,得到银盐络合液;Step (4) sequentially adding the complexing agent, the silver salt and the additive into deionized water and mixing and stirring to obtain a silver salt complexing solution;
步骤(5)将步骤(3)中得到的待包覆铜粉加入步骤(4)的银盐络合液中搅拌均匀,得到混合均匀的料液;Step (5) adding the copper powder to be coated obtained in step (3) into the silver salt complex solution of step (4) and stirring evenly to obtain a uniformly mixed feed solution;
三、包覆粉末制备3. Preparation of coated powder
步骤(6)使用雾化干燥机对步骤(5)中的料液在合适的干燥温度、进料速率以及干燥气氛等工艺参数下进行雾化干燥,得到银盐包覆铜粉;Step (6) using an atomizing dryer to atomize and dry the liquid in step (5) under suitable process parameters such as drying temperature, feed rate and drying atmosphere to obtain silver salt-coated copper powder;
步骤(7)使用热处理炉对步骤(6)中的固体产物在惰性气氛中进行热分解处理得到银包覆铜粉,并对产物进行收集。Step (7) uses a heat treatment furnace to perform thermal decomposition treatment on the solid product in step (6) in an inert atmosphere to obtain silver-coated copper powder, and collects the product.
其中,in,
步骤(1)所述铜粉的制备方法可以为熔融雾化法、化学还原法、直流电弧等离子体法等中的一种;所述铜粉的平均粒径为0.1μm~1μm;每1g铜粉对应加入10ml~20ml稀碳酸钠溶液;The preparation method of the copper powder in step (1) can be one of a melt atomization method, a chemical reduction method, a DC arc plasma method, etc.; the average particle size of the copper powder is 0.1 μm to 1 μm; 10 ml to 20 ml of dilute sodium carbonate solution is added for every 1 g of copper powder;
步骤(2)所述的每1g铜粉对应加入10ml~20ml稀盐酸溶液;In step (2), 10 ml to 20 ml of dilute hydrochloric acid solution is added for every 1 g of copper powder;
步骤(3)所述每1g铜粉对应加入5ml~8ml无水乙醇;In step (3), 5 ml to 8 ml of anhydrous ethanol is added for every 1 g of copper powder;
步骤(4)所述络合剂为聚乙烯吡咯烷酮、二氰二胺、乙二胺四乙酸、氨基乙酸等有机物中的至少一种;所述添加剂为乙醇、聚乙二醇2000、聚乙烯醇等有机物中的至少一种;所述银盐为硫酸银、硝酸银、乙酸银、氯化银中的至少一种;所述络合剂、银盐、添加剂的质量比为2:1:(0.02~10);所述银盐中银含量与铜粉的质量比为(0.2~1):1。In step (4), the complexing agent is at least one of organic substances such as polyvinyl pyrrolidone, dicyandiamide, ethylenediaminetetraacetic acid, and aminoacetic acid; the additive is at least one of organic substances such as ethanol, polyethylene glycol 2000, and polyvinyl alcohol; the silver salt is at least one of silver sulfate, silver nitrate, silver acetate, and silver chloride; the mass ratio of the complexing agent, the silver salt, and the additive is 2:1:(0.02-10); the mass ratio of the silver content in the silver salt to the copper powder is (0.2-1):1.
步骤(5)所述的每500mL银盐络合液中对应加入1g的待包覆铜粉。In step (5), 1 g of the copper powder to be coated is added to every 500 mL of the silver salt complex solution.
步骤(6)所述雾化干燥机为气流式雾化干燥机、超声式雾化干燥机、离心式雾化干燥机中的一种;所述干燥温度为110℃~160℃;所述进料速率为5ml/min~10ml/min;所述干燥气氛为空气、氮气中的一种;The atomizing dryer in step (6) is one of an air flow atomizing dryer, an ultrasonic atomizing dryer, and a centrifugal atomizing dryer; the drying temperature is 110° C. to 160° C.; the feed rate is 5 ml/min to 10 ml/min; the drying atmosphere is one of air and nitrogen;
步骤(7)所述的热处理温度为200℃~600℃;热处理时间为30min~120min;热处理气氛为真空、氮气中的一种。The heat treatment temperature in step (7) is 200°C to 600°C; the heat treatment time is 30min to 120min; and the heat treatment atmosphere is one of vacuum and nitrogen.
本发明的工作原理及创新点为:The working principle and innovation of the present invention are:
现有银包覆铜粉制备技术主要是采用还原机制,即通过外加还原剂或利用铜粉本身来还原银盐。而本发明基于银化合物加热易分解析出银的原理,采用先雾化干燥造粒,而后加热分解制备银包覆铜粉,其中并未利用还原银离子来制备银。雾化干燥法制备机理是:将配置好的料液通过雾化系统中的雾化器(超声雾化器、气流雾化器等)雾化成微小雾滴,雾滴混合在载气中经过干燥器与干燥的热空气接触而将其中的水分蒸发出去,留下溶液中的溶质。干燥过程中雾滴的湿分蒸发大体分为恒速干燥阶段和降速干燥阶段。恒速干燥阶段的蒸发过程是在颗粒的表面发生,蒸发速率是由蒸汽通过周围气膜的扩散速度所控制,主要推动力是周围空气与颗粒之间的温差决定,颗粒温度不高于进口空气的绝热饱和温度。在这个阶段中水分通过颗粒的扩散速率大于或等于蒸发速率。当水分通过颗粒的扩散速率不能维持颗粒表面饱和时,扩散速率就会成为控制因素,从而进入降速阶段。在这个阶段中,蒸发过程时发生在表面内的某个平面上,同时,颗粒温度开始升高到进气口空气的绝热饱和温度以上,并接近周围的空气温度。在很短时间内完成这两个过程后,雾滴中的水分已大部分干燥完,并将原本溶于水的不挥发的溶质析出。当液滴中存在固体颗粒时,溶质便容易在固体表面析出。最后在高于分解温度下加热雾化干燥后的产物,便可在固体颗粒表面得到需要的包覆层。The existing silver-coated copper powder preparation technology mainly adopts the reduction mechanism, that is, the silver salt is reduced by adding a reducing agent or using the copper powder itself. The present invention is based on the principle that silver compounds are easily decomposed by heating to precipitate silver, and adopts atomization drying granulation first, and then heating decomposition to prepare silver-coated copper powder, wherein silver is not prepared by reducing silver ions. The preparation mechanism of the atomization drying method is: the prepared feed liquid is atomized into tiny droplets by an atomizer (ultrasonic atomizer, air flow atomizer, etc.) in the atomization system, and the droplets are mixed in the carrier gas and contacted with dry hot air through a dryer to evaporate the water therein, leaving the solute in the solution. The moisture evaporation of the droplets during the drying process is roughly divided into a constant speed drying stage and a decreasing speed drying stage. The evaporation process in the constant speed drying stage occurs on the surface of the particles, and the evaporation rate is controlled by the diffusion rate of the steam through the surrounding air film. The main driving force is determined by the temperature difference between the surrounding air and the particles, and the particle temperature is not higher than the adiabatic saturation temperature of the inlet air. In this stage, the diffusion rate of water through the particles is greater than or equal to the evaporation rate. When the diffusion rate of water through the particles cannot maintain the saturation of the particle surface, the diffusion rate becomes the controlling factor, and the process enters the deceleration stage. In this stage, the evaporation process occurs on a certain plane within the surface, and at the same time, the particle temperature begins to rise above the adiabatic saturation temperature of the air at the inlet and approaches the ambient air temperature. After completing these two processes in a very short time, most of the water in the droplets has been dried, and the non-volatile solutes originally dissolved in water have been precipitated. When there are solid particles in the droplets, the solutes are easily precipitated on the solid surface. Finally, the atomized and dried product is heated above the decomposition temperature to obtain the required coating on the surface of the solid particles.
本发明中,银盐与络合剂络合后与铜粉都均匀分散于水分中,由于未添加还原剂且银离子被络合,因此银离子与铜的还原反应与置换反应很大程度上被抑制,使得料液可以稳定存在。料液经雾化器雾化成细小雾滴后流经干燥器,在经历两个干燥过程后溶液中的银盐络合物等溶质随着水分的蒸发逐渐在铜粉表面析出形成包覆膜,后续通过热处理将银从络合物中分解出,从而得到银包覆铜粉。本发明率先尝试使用雾化干燥与热处理相结合的方式,利用雾化干燥均匀的将含银层包覆在铜粉表面,而后分解得到具有银包覆层的铜基复合粉末。本发明未在溶液中添加额外的还原剂,简化了溶液的成分,减弱了银在溶液中自发形核生长的趋势,同时包覆复合粉末具有良好的分散性、较窄的粒径分布。为后续包覆其他易发生化学反应的包覆物提供一种新的路径。In the present invention, the silver salt and the complexing agent are complexed and then evenly dispersed in water with the copper powder. Since no reducing agent is added and the silver ions are complexed, the reduction reaction and replacement reaction of the silver ions and copper are largely suppressed, so that the feed liquid can exist stably. The feed liquid is atomized into fine droplets by an atomizer and then flows through a dryer. After undergoing two drying processes, the solutes such as the silver salt complex in the solution gradually precipitate on the surface of the copper powder as the water evaporates to form a coating film, and then the silver is decomposed from the complex by heat treatment to obtain a silver-coated copper powder. The present invention is the first to try to use a combination of atomization drying and heat treatment, and atomization drying is used to evenly coat the silver-containing layer on the surface of the copper powder, and then decompose to obtain a copper-based composite powder with a silver coating layer. The present invention does not add an additional reducing agent to the solution, simplifies the composition of the solution, weakens the tendency of silver to spontaneously nucleate and grow in the solution, and at the same time, the coated composite powder has good dispersibility and a narrow particle size distribution. Provides a new path for subsequent coating of other coatings that are prone to chemical reactions.
本发明的有益效果为:The beneficial effects of the present invention are:
(1)本发明基于银化合物易分解析出银的原理,提供了一种通过雾化干燥与热处理分解相结合以合成银包覆铜粉的制备方法。所需设备可规模化、原料经济环保、生产成本低,所合成的银包覆铜粉的银包覆层的含量可以通过调节银盐用量调控,且团聚程度低。(1) Based on the principle that silver compounds can be easily decomposed to separate silver, the present invention provides a preparation method for synthesizing silver-coated copper powder by combining atomization drying with heat treatment decomposition. The required equipment can be scaled up, the raw materials are economical and environmentally friendly, and the production cost is low. The content of the silver coating layer of the synthesized silver-coated copper powder can be controlled by adjusting the amount of silver salt used, and the degree of agglomeration is low.
(2)由于雾化干燥本身的特性,溶液中的含银物质均会被干燥出来,使得银元素利用率很高,节约成本。干燥后的包覆层完整且包覆面光滑,且干燥后的产物具有良好的分散性与流动性。(2) Due to the characteristics of atomization drying, all silver-containing substances in the solution will be dried out, making the utilization rate of silver element very high and saving costs. The coating layer after drying is complete and the coating surface is smooth, and the dried product has good dispersibility and fluidity.
(3)本发明未添加额外的还原剂,减少了原料使用,简化了溶液成分,使得生产过程中溶液更易于使用和保存。(3) The present invention does not add additional reducing agents, reduces the use of raw materials, simplifies the solution composition, and makes the solution easier to use and preserve during the production process.
(4)本发明可以拓展于包覆能与基体发生反应的或本身性质不够稳定的包覆物,减小基体颗粒与包覆物的损耗,保证包覆的完整性。(4) The present invention can be extended to coatings that can react with the substrate or that are not stable enough in nature, thereby reducing the loss of substrate particles and the coating and ensuring the integrity of the coating.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明制备流程图;Fig. 1 is a preparation flow chart of the present invention;
图2为实施例1制备过程中雾化干燥后得到的银盐包覆铜粉及热处理后得到的银包覆铜粉的XRD谱图;FIG2 is an XRD spectrum of the silver salt-coated copper powder obtained after atomization drying and the silver-coated copper powder obtained after heat treatment in the preparation process of Example 1;
图3为实施例1制备过程中的雾化干燥后得到的氮气气氛下银盐包覆铜粉的热重及热流曲线;FIG3 is a thermogravimetric and heat flow curve of the silver salt-coated copper powder obtained after atomization drying in the preparation process of Example 1 under a nitrogen atmosphere;
图4为实施例1制备得到的银包覆铜粉在空气气氛下的热重曲线;FIG4 is a thermogravimetric curve of the silver-coated copper powder prepared in Example 1 under air atmosphere;
图5为实施例1制备得到的银包覆铜粉的SEM照片及其EDS元素分布图;FIG5 is a SEM photo of the silver-coated copper powder prepared in Example 1 and its EDS element distribution diagram;
图6为实施例2制备得到的银包覆铜粉的SEM照片及其EDS元素分布图;FIG6 is a SEM image of the silver-coated copper powder prepared in Example 2 and its EDS element distribution diagram;
图7为实施例3制备得到的银包覆铜粉的SEM照片及其EDS元素分布图;FIG7 is a SEM image of the silver-coated copper powder prepared in Example 3 and its EDS element distribution diagram;
图8为对比例1制备得到的铜银复合粉的SEM照片。FIG8 is a SEM photograph of the copper-silver composite powder prepared in Comparative Example 1.
具体实施方式DETAILED DESCRIPTION
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显而易见的,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
实施例1:Embodiment 1:
(1)将1g平均粒径为1μm的铜粉加入到10ml质量浓度5%的碳酸钠溶液中,对其进行5min的超声清洗得到含铜粉的碳酸钠溶液;室温下使用去离子水对超声后的含铜粉的碱性溶液清洗2遍,得到去离子水清洗后的铜粉;(1) adding 1 g of copper powder with an average particle size of 1 μm to 10 ml of a sodium carbonate solution with a mass concentration of 5%, and ultrasonically cleaning the solution for 5 minutes to obtain a sodium carbonate solution containing copper powder; washing the alkaline solution containing the copper powder after ultrasonication with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(2)将去离子水清洗过的铜粉加入到10ml质量浓度为5%的稀盐酸溶液中,而后对其超声清洗6min,得到酸洗后的铜粉;室温下使用去离子水对超声后的含铜粉的溶液清洗2遍,得到去离子水清洗后的铜粉;(2) adding the copper powder washed with deionized water into 10 ml of a 5% diluted hydrochloric acid solution, and then ultrasonically cleaning it for 6 minutes to obtain acid-washed copper powder; washing the solution containing the copper powder after ultrasonic cleaning twice with deionized water at room temperature to obtain deionized water-washed copper powder;
(3)将去离子水清洗后的铜粉加入到5ml无水乙醇中进行超声处理5min,得到超声后的含铜粉的乙醇溶液;在50℃干燥箱中将超声后的含铜粉的乙醇溶液中的乙醇烘干,得到干燥的待包覆铜粉;(3) adding the copper powder washed with deionized water to 5 ml of anhydrous ethanol and subjecting it to ultrasonic treatment for 5 minutes to obtain an ethanol solution containing copper powder after ultrasonic treatment; drying the ethanol in the ethanol solution containing copper powder after ultrasonic treatment in a drying oven at 50° C. to obtain dry copper powder to be coated;
(4)依次将1g聚乙烯吡咯烷酮、0.6g硝酸银、10g乙醇加入到500ml去离子水中混合搅拌,得到硝酸银络合溶液;(4) adding 1 g of polyvinyl pyrrolidone, 0.6 g of silver nitrate, and 10 g of ethanol to 500 ml of deionized water, mixing and stirring to obtain a silver nitrate complex solution;
(5)将步骤(3)中得到的铜粉加入步骤(4)的硝酸银络合溶液中搅拌均匀,得到混合均匀的料液;(5) adding the copper powder obtained in step (3) to the silver nitrate complex solution in step (4) and stirring evenly to obtain a uniformly mixed liquid;
(6)使用气流式雾化干燥机对步骤(5)中的料液以5ml/min的进料速度在110℃干燥温度进行雾化干燥,得到银盐包覆铜粉;(6) using an air flow atomizing dryer to atomize and dry the liquid in step (5) at a feed rate of 5 ml/min and a drying temperature of 110° C. to obtain a silver salt-coated copper powder;
(7)使用管式炉对步骤(6)中的固体产物在氮气气氛下600℃保温30min得到银包覆铜粉,并对产物进行收集。(7) Using a tubular furnace, the solid product in step (6) was heated at 600° C. for 30 min under a nitrogen atmosphere to obtain silver-coated copper powder, and the product was collected.
实施例2Example 2
(1)将1g平均粒径为1μm的铜粉加入到15ml质量浓度5%的碳酸钠溶液中,对其进行5min的超声清洗得到含铜粉的碳酸钠溶液;室温下使用去离子水对超声后的含铜粉的碳酸钠溶液清洗2遍,得到去离子水清洗后的铜粉;(1) adding 1 g of copper powder with an average particle size of 1 μm to 15 ml of a sodium carbonate solution with a mass concentration of 5%, and ultrasonically cleaning the solution for 5 minutes to obtain a sodium carbonate solution containing copper powder; washing the sodium carbonate solution containing copper powder after ultrasonication with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(2)将去离子水清洗过的铜粉加入到15ml质量浓度为5%的稀盐酸溶液中,而后对其超声清洗6min,得到酸洗后的铜粉;室温下使用去离子水对超声后的含铜粉的溶液清洗2遍,得到去离子水清洗后的铜粉;(2) adding the copper powder washed with deionized water into 15 ml of a 5% diluted hydrochloric acid solution, and then ultrasonically cleaning it for 6 minutes to obtain acid-washed copper powder; washing the solution containing the copper powder after ultrasonication with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(3)将去离子水清洗后的铜粉加入到6ml无水乙醇中进行超声处理5min,得到超声后的含铜粉的乙醇溶液;在50℃干燥箱中将超声后的含铜粉的乙醇溶液中的乙醇烘干,得到干燥的待包覆铜粉;(3) adding the copper powder washed with deionized water to 6 ml of anhydrous ethanol and subjecting it to ultrasonic treatment for 5 minutes to obtain an ethanol solution containing copper powder after ultrasonic treatment; drying the ethanol in the ethanol solution containing copper powder after ultrasonic treatment in a drying oven at 50° C. to obtain dry copper powder to be coated;
(4)依次将0.8g乙二胺四乙酸、0.4g乙酸银、0.2g聚乙二醇2000加入到500ml去离子水中混合搅拌,得到乙酸银络合溶液;(4) adding 0.8 g of ethylenediaminetetraacetic acid, 0.4 g of silver acetate, and 0.2 g of polyethylene glycol 2000 to 500 ml of deionized water in sequence, mixing and stirring to obtain a silver acetate complex solution;
(5)将步骤(3)中得到的铜粉加入步骤(4)的乙酸银络合溶液中搅拌均匀,得到混合均匀的料液;(5) adding the copper powder obtained in step (3) to the silver acetate complex solution in step (4) and stirring evenly to obtain a uniformly mixed liquid;
(6)使用超声式雾化干燥机对步骤(5)中的料液以7.5ml/min的进料速度在140℃干燥温度及空气气氛下进行雾化干燥,得到银盐包覆铜粉;(6) using an ultrasonic atomizing dryer to atomize and dry the liquid in step (5) at a feed rate of 7.5 ml/min at a drying temperature of 140° C. in an air atmosphere to obtain a silver salt-coated copper powder;
(7)使用管式炉对步骤(6)中的固体产物在氮气气氛下400℃保温60min得到银包覆铜粉,并对产物进行收集。(7) Using a tubular furnace, the solid product in step (6) was heated at 400° C. for 60 min under a nitrogen atmosphere to obtain silver-coated copper powder, and the product was collected.
实施例3Example 3
(1)将1g平均粒径为0.5μm铜粉加入到20ml质量浓度5%的碳酸钠溶液中,对其进行5min的超声清洗得到含铜粉的碳酸钠溶液;室温下使用去离子水对超声后的含铜粉的碳酸钠溶液清洗2遍,得到去离子水清洗后的铜粉;(1) adding 1 g of copper powder having an average particle size of 0.5 μm to 20 ml of a sodium carbonate solution having a mass concentration of 5%, and ultrasonically cleaning the solution for 5 minutes to obtain a sodium carbonate solution containing copper powder; washing the sodium carbonate solution containing copper powder after ultrasonication with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(2)将去离子水清洗过的铜粉加入到20ml质量浓度为5%的稀盐酸溶液中,而后对其超声清洗6min,得到酸洗后的铜粉;室温下使用去离子水对超声后的含铜粉的溶液清洗2遍,得到去离子水清洗后的铜粉;(2) adding the copper powder washed with deionized water into 20 ml of a 5% diluted hydrochloric acid solution, and then ultrasonically cleaning it for 6 minutes to obtain acid-washed copper powder; washing the solution containing the copper powder after ultrasonication with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(3)将去离子水清洗后的铜粉加入到8ml无水乙醇中进行超声处理5min,得到超声后的含铜粉的乙醇溶液;在50℃干燥箱中将超声后的含铜粉的乙醇溶液中的乙醇烘干,得到干燥的待包覆铜粉;(3) adding the copper powder washed with deionized water into 8 ml of anhydrous ethanol and subjecting it to ultrasonic treatment for 5 minutes to obtain an ethanol solution containing copper powder after ultrasonic treatment; drying the ethanol in the ethanol solution containing copper powder after ultrasonic treatment in a drying oven at 50° C. to obtain dry copper powder to be coated;
(4)依次将0.6g氨基乙酸、0.2g硫酸银、0.02g聚乙烯醇加入到500ml去离子水中混合搅拌,得到硫酸银络合溶液;(4) adding 0.6 g of aminoacetic acid, 0.2 g of silver sulfate, and 0.02 g of polyvinyl alcohol to 500 ml of deionized water in sequence, mixing and stirring to obtain a silver sulfate complex solution;
(5)将步骤(3)中得到的铜粉加入步骤(4)的硫酸银络合溶液中搅拌均匀,得到混合均匀的料液;(5) adding the copper powder obtained in step (3) to the silver sulfate complex solution in step (4) and stirring evenly to obtain a uniformly mixed liquid;
(6)使用离心式雾化干燥机对步骤(5)中的料液以10ml/min的进料速度在160℃干燥温度及氮气气氛下进行雾化干燥,得到银盐包覆铜粉;(6) using a centrifugal atomizing dryer to atomize and dry the liquid in step (5) at a feed rate of 10 ml/min at a drying temperature of 160° C. in a nitrogen atmosphere to obtain a silver salt-coated copper powder;
(7)使用管式炉对步骤(6)中的固体产物在真空气氛200℃保温120min得到银包覆铜粉,并对产物进行收集。(7) Using a tube furnace, the solid product in step (6) is kept warm at 200° C. in a vacuum atmosphere for 120 min to obtain silver-coated copper powder, and the product is collected.
实施例4Example 4
(1)将1g平均粒径为0.1μm铜粉加入到10ml质量浓度5%的碳酸钠溶液中,对其进行5min的超声清洗得到含铜粉的碳酸钠溶液;室温下使用去离子水对超声后的含铜粉的碳酸钠溶液清洗2遍,得到去离子水清洗后的铜粉;(1) adding 1 g of copper powder having an average particle size of 0.1 μm to 10 ml of a sodium carbonate solution having a mass concentration of 5%, and ultrasonically cleaning the solution for 5 minutes to obtain a sodium carbonate solution containing copper powder; washing the sodium carbonate solution containing copper powder after ultrasonic cleaning with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(2)将去离子水清洗过的铜粉加入到10ml质量浓度为5%的稀盐酸溶液中,而后对其超声清洗6min,得到酸洗后的铜粉;室温下使用去离子水对超声后的含铜粉的溶液清洗2遍,得到去离子水清洗后的铜粉;(2) adding the copper powder washed with deionized water into 10 ml of a 5% diluted hydrochloric acid solution, and then ultrasonically cleaning it for 6 minutes to obtain acid-washed copper powder; washing the solution containing the copper powder after ultrasonic cleaning twice with deionized water at room temperature to obtain deionized water-washed copper powder;
(3)将去离子水清洗后的铜粉加入到8ml无水乙醇中进行超声处理5min,得到超声后的含铜粉的乙醇溶液;在50℃干燥箱中将超声后的含铜粉的乙醇溶液中的乙醇烘干,得到干燥的待包覆铜粉;(3) adding the copper powder washed with deionized water into 8 ml of anhydrous ethanol and subjecting it to ultrasonic treatment for 5 minutes to obtain an ethanol solution containing copper powder after ultrasonic treatment; drying the ethanol in the ethanol solution containing copper powder after ultrasonic treatment in a drying oven at 50° C. to obtain dry copper powder to be coated;
(4)依次将0.6g二氰二胺、0.4g氯化银、0.02g聚乙烯醇加入到500ml去离子水中混合搅拌,得到氯化银络合溶液;(4) adding 0.6 g of dicyandiamide, 0.4 g of silver chloride, and 0.02 g of polyvinyl alcohol to 500 ml of deionized water in sequence, mixing and stirring to obtain a silver chloride complex solution;
(5)将步骤(3)中得到的铜粉加入步骤(4)的氯化银络合溶液中搅拌均匀,得到混合均匀的料液;(5) adding the copper powder obtained in step (3) to the silver chloride complex solution in step (4) and stirring evenly to obtain a uniformly mixed feed solution;
(6)使用气流式雾化干燥机对步骤(5)中的料液以10ml/min的进料速度在160℃干燥温度及氮气气氛下进行雾化干燥,得到银盐包覆铜粉;(6) using an air flow atomizing dryer to atomize and dry the liquid in step (5) at a feed rate of 10 ml/min at a drying temperature of 160° C. in a nitrogen atmosphere to obtain a silver salt-coated copper powder;
(7)使用管式炉对步骤(6)中的固体产物在真空气氛200℃保温120min得到银包覆铜粉,并对产物进行收集。(7) Using a tube furnace, the solid product in step (6) is kept warm at 200° C. in a vacuum atmosphere for 120 min to obtain silver-coated copper powder, and the product is collected.
对比例1Comparative Example 1
(1)将1g平均粒径为1μm的铜粉加入到10ml质量浓度5%的碳酸钠溶液中,对其进行5min的超声清洗得到含铜粉的碳酸钠溶液;室温下使用去离子水对超声后的含铜粉的碱性溶液清洗2遍,得到去离子水清洗后的铜粉;(1) adding 1 g of copper powder with an average particle size of 1 μm to 10 ml of a sodium carbonate solution with a mass concentration of 5%, and ultrasonically cleaning the solution for 5 minutes to obtain a sodium carbonate solution containing copper powder; washing the alkaline solution containing the copper powder after ultrasonication with deionized water twice at room temperature to obtain copper powder washed with deionized water;
(2)将去离子水清洗过的铜粉加入到10ml质量浓度为5%的稀盐酸溶液中,而后对其超声清洗6min,得到酸洗后的铜粉;室温下使用去离子水对超声后的含铜粉的溶液清洗2遍,得到去离子水清洗后的铜粉;(2) adding the copper powder washed with deionized water into 10 ml of a 5% diluted hydrochloric acid solution, and then ultrasonically cleaning it for 6 minutes to obtain acid-washed copper powder; washing the solution containing the copper powder after ultrasonic cleaning twice with deionized water at room temperature to obtain deionized water-washed copper powder;
(3)将去离子水清洗后的铜粉加入到5ml无水乙醇中进行超声处理5min,得到超声后的含铜粉的乙醇溶液;在50℃干燥箱中将超声后的含铜粉的乙醇溶液中的乙醇烘干,得到干燥的待包覆铜粉;(3) adding the copper powder washed with deionized water to 5 ml of anhydrous ethanol and subjecting it to ultrasonic treatment for 5 minutes to obtain an ethanol solution containing copper powder after ultrasonic treatment; drying the ethanol in the ethanol solution containing copper powder after ultrasonic treatment in a drying oven at 50° C. to obtain dry copper powder to be coated;
(4)依次将1g聚乙烯吡咯烷酮、0.6g硝酸银、10g乙醇加入到500ml去离子水中混合搅拌,得到硝酸银络合溶液;(4) adding 1 g of polyvinyl pyrrolidone, 0.6 g of silver nitrate, and 10 g of ethanol to 500 ml of deionized water, mixing and stirring to obtain a silver nitrate complex solution;
(5)将步骤(3)中得到的铜粉加入步骤(4)的硝酸银络合溶液中搅拌并反应2h,得到混合均匀的料液;(5) adding the copper powder obtained in step (3) to the silver nitrate complex solution in step (4), stirring and reacting for 2 hours to obtain a uniformly mixed liquid;
(6)将步骤(5)中的料液进行过滤,对产物进行洗涤干燥,得到铜银复合粉。(6) filtering the liquid in step (5), washing and drying the product to obtain a copper-silver composite powder.
图1通过对实施例1热处理前银盐包覆铜粉的X射线衍射图谱与热处理后的银包铜粉末的X射线衍射图谱分析可知,在雾化干燥处理后,银盐络合包覆层并未表现出明显的衍射峰,也未出现其他杂质峰,表明雾化干燥工艺完全不同于其他制备方法。而银的主要衍射峰在热处理后均出现,且其强度相对于热处理前有了很大的增强,意味着在热处理阶段银络合物发生了分解而析出了银;图4给出了实施例1所制备的银包覆铜粉的热重曲线,在空气气氛下加热至800℃后,氧化增重仅13.04%,氧化起始点约318℃,表明其抗氧化性能良好。对实施例1-3、对比例1的银包覆铜粉末使用扫描电镜对其形貌及包覆效果进行了观察,同时还给出了相对应的EDS元素分布图,如图5-图8所示。Figure 1 shows the X-ray diffraction pattern of the silver salt-coated copper powder before heat treatment in Example 1 and the X-ray diffraction pattern of the silver-coated copper powder after heat treatment. After atomization and drying, the silver salt complex coating layer does not show obvious diffraction peaks, nor does it show other impurity peaks, indicating that the atomization and drying process is completely different from other preparation methods. The main diffraction peaks of silver all appear after heat treatment, and their intensity is greatly enhanced compared with that before heat treatment, which means that the silver complex decomposes and precipitates silver during the heat treatment stage; Figure 4 shows the thermogravimetric curve of the silver-coated copper powder prepared in Example 1. After heating to 800°C in an air atmosphere, the oxidation weight gain is only 13.04%, and the oxidation starting point is about 318°C, indicating that it has good antioxidant properties. The morphology and coating effect of the silver-coated copper powders of Examples 1-3 and Comparative Example 1 were observed using a scanning electron microscope, and the corresponding EDS element distribution diagrams were also given, as shown in Figures 5-8.
从各实施例中粉末的表面形貌与能谱元素分布图可知,银元素均匀分布在铜粉表面,具有良好的包覆效果。在对比例1中,由于未添加还原剂,银离子不能在铜粉表面被还原而形成包覆层;而大多数银离子随溶液滤除,少部分溶液残留于铜粉表面使得银离子自发形核生长,因此最终形成游离态的银或附着于在铜粉表面,造成包覆效果差。From the surface morphology and energy spectrum element distribution diagram of the powder in each embodiment, it can be seen that the silver element is evenly distributed on the surface of the copper powder, and has a good coating effect. In Comparative Example 1, since no reducing agent is added, the silver ions cannot be reduced on the surface of the copper powder to form a coating layer; most of the silver ions are filtered out with the solution, and a small part of the solution remains on the surface of the copper powder, causing the silver ions to spontaneously nucleate and grow, thus eventually forming free silver or adhering to the surface of the copper powder, resulting in poor coating effect.
以上所述实施例仅表达本发明的实施方式,但并不能因此而理解为对本发明专利的范围的限制,应当指出,对于本领域的技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些均属于本发明的保护范围。The above-described embodiments merely express the implementation methods of the present invention, but they cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.
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