CN118837800B - A high-density layout three-axis wide-band magnetic field sensor and its preparation method - Google Patents
A high-density layout three-axis wide-band magnetic field sensor and its preparation method Download PDFInfo
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- CN118837800B CN118837800B CN202411322810.9A CN202411322810A CN118837800B CN 118837800 B CN118837800 B CN 118837800B CN 202411322810 A CN202411322810 A CN 202411322810A CN 118837800 B CN118837800 B CN 118837800B
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- 238000005259 measurement Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 4
- 238000012544 monitoring process Methods 0.000 description 5
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- 238000003475 lamination Methods 0.000 description 4
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/0206—Three-component magnetometers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0052—Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips
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Abstract
The invention discloses a triaxial broadband magnetic field sensor with high-density layout and a preparation method thereof, which belong to the technical field of magnetic field sensors, the triaxial broadband magnetic field sensor with high-density layout comprises three layers of substrates, bridge circuits are arranged on the three layers of substrates, the three layers of substrates are a Z-axis substrate, a Y-axis substrate and an X-axis substrate in sequence from top to bottom, mutually perpendicular magnetic sensitive elements are respectively arranged on the horizontal planes of the Y-axis substrate and the X-axis substrate, and the magnetic sensitive elements connected with the Z-axis substrate are vertically arranged on the vertical side edges of the Y-axis substrate. The three-axis broadband magnetic field sensor with the high-density layout is characterized in that the volume of the sensor is reduced by adopting the modes of multi-layer stacking, extremely small package welding and high-density layout, the measurement of a single-point high-precision vector magnetic field in a space is realized, the preparation process is simple, the implementation is easy, and the perpendicularity of a magnetic sensitive element for detecting a magnetic field in the Z-axis direction is ensured.
Description
Technical Field
The invention relates to the technical field of magnetic field sensors, in particular to a triaxial broadband magnetic field sensor with high-density layout and a preparation method thereof.
Background
The magnetic field sensor is a device capable of converting magnetic field changes caused by various changes into electric signals. With the rapid development of information industry, industrial automation, transportation, power electronics technology, office automation, household appliances, medical instruments, etc., and the popularization of electronic computer applications, a large number of sensors are required to convert non-electrical parameters to be measured and controlled into electrical parameter signals that are easy to process.
The magnetic field sensor is widely applied to various magnetic field measurement fields, such as the fields of industry, traffic, consumer electronics, medical treatment, nondestructive detection and the like. In the industrial field, the magnetic sensor can be used for accurate measurement of displacement of various metal parts, current measurement of large machinery and instruments, automatic control of an industrial system, monitoring of current such as a power supply and a frequency converter, energy management of a distributed power grid and the like. In the traffic field, magnetic sensors are widely used in systems such as subways, automobiles, ships, airplanes, high-speed rails, and the like. Such as real-time monitoring and control of train position and running speed in a subway system, automatic control and flexible operation of an escalator and an elevator in the subway system, a safety access control system of a subway station, and the like. In automotive systems, magnetic sensors are used to sense the earth's magnetic field to determine the direction and position of the vehicle, providing accurate navigation information to the driver. The system is also applied to the monitoring of a navigation magnetic compass, a magnetic heading instrument on an airplane, speed, vibration, position information and the like in a high-speed rail. In the consumer electronics field, the magnetic sensor can be used on various intelligent wearing equipment such as a game handle, an intelligent watch, a smart phone, a computer and the like, and is used for motion detection, direction positioning and the like. In medical treatment, the magnetic sensor can be used for current and magnetic field monitoring of large-scale equipment such as MRI (Magnetic Resonance Imaging ) and CT (computed tomography), and biological signal monitoring such as cerebral magnetism and myomagnetism. In the field of nondestructive testing, magnetic sensors are used for consistency analysis of various conductive materials, such as aircraft skin testing, carbon fiber breakage testing, metal pipe testing, metal energy storage device testing, and the like.
In principle, a magnetic field sensor only detects a magnetic field from a specific direction, and therefore the relation between the magnetic field source and the position of the sensor and how the object moves directly greatly influences the application performance. However, the layout of the sensor and the magnetic element is difficult to achieve in an ideal state due to the need to make the product more compact and tightly integrated. This results in a situation where the target specification is not reached.
Disclosure of Invention
The invention aims to provide a triaxial broadband magnetic field sensor with high-density layout and a preparation method thereof, and solves the technical problems.
In order to achieve the above purpose, the invention provides a high-density layout three-axis broadband magnetic field sensor, which comprises three layers of substrates arranged in a vertically stacked manner, wherein the three layers of substrates are respectively provided with a bridge circuit, the three layers of substrates are electrically connected, the three layers of substrates are sequentially a Z-axis substrate, a Y-axis substrate and an X-axis substrate from top to bottom, mutually perpendicular magnetic sensitive elements are respectively arranged on horizontal planes of the Y-axis substrate and the X-axis substrate and are respectively used for detecting magnetic fields in the Y-axis direction and the X-axis direction, the Z-axis substrate is connected with the magnetic sensitive elements used for detecting the magnetic fields in the Z-axis direction, and the magnetic sensitive elements used for detecting the magnetic fields in the Z-axis direction are vertically arranged on vertical sides of the Y-axis substrate.
Preferably, the magnetically sensitive element is a magneto-resistive or a coil or a combination thereof.
Preferably, the magnetic sensitive elements are arranged on bridge arms of the bridge circuit, the sensitive directions of the two magnetic sensitive elements at the same network connection point are opposite, and the output end of the bridge circuit is connected with an operation discharger.
Preferably, the vertical spacing between the magnetic sensitive element for detecting the Y-axis direction and the magnetic sensitive element for detecting the Z-axis direction magnetic field is 0.1-0.2mm;
the vertical distance between the magnetic sensitive element for detecting the Y-axis direction and the magnetic sensitive element for detecting the X-axis direction is 0.1-0.2mm.
Preferably, an impedance matching network is further provided, and the impedance matching network is electrically connected to the outermost substrate.
A preparation method of the triaxial broadband magnetic field sensor based on the high-density layout comprises the following specific steps:
step S1, preparing a three-layer substrate;
Step S2, stacking three layers of substrates, electrically connecting the three layers of substrates by adopting an FPC (flexible circuit board) flat cable, and arranging an output end on the outermost substrate;
And S3, packaging the triaxial broadband magnetic field sensor.
Preferably, in step S1, when preparing the substrate for detecting the magnetic field in the Z-axis direction, the substrate and the magneto-sensitive element are separately disposed using a heterofacial wire bonding process.
Preferably, in step S2, the horizontal direction includes an X-axis direction and a Y-axis direction,
One of the substrates for detecting the horizontal direction is arranged at the outermost side, the other substrate for detecting the horizontal direction is horizontally rotated by 90 degrees and then vertically turned over by 180 degrees to be placed on the outermost substrate, the two substrates respectively detect magnetic fields in the X-axis direction and the Y-axis direction, the substrate for detecting the magnetic field in the Z-axis direction is arranged above the two substrates, and the magnetic sensitive element for detecting the magnetic field in the Z-axis direction is arranged at the vertical side edge of one of the substrates for detecting the horizontal direction.
Preferably, the packaged triaxial broadband magnetic field sensor is connected with an impedance matching network and used for adjusting the amplitude-frequency characteristic of output.
Therefore, the triaxial broadband magnetic field sensor with the high-density layout and the preparation method thereof have the following beneficial effects:
(1) The sensor and the peripheral resistance-capacitance are concentrated in one area by adopting the modes of multi-layer stacking, minimum package welding and high-density layout, the volume of the sensor is reduced, and the sensitive area of the sensor can be concentrated in the area of 3mm x 3mm by adopting lamination stacking, so that the single-point magnetic field measuring capability of the sensor is enhanced.
(2) The other substrate is only provided with a bridge circuit, and is connected with a magnetic sensitive element for detecting a magnetic field in the Z axis direction by adopting a separated structure, and the magnetic sensitive element for detecting the magnetic field in the Z axis direction is arranged on the vertical side edge of the substrate for detecting the magnetic field in the Y axis direction.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
FIG. 1 is a schematic diagram of a high-density layout three-axis broadband magnetic field sensor;
FIG. 2 is a schematic diagram of a substrate structure for detecting a horizontal magnetic field according to the present invention;
FIG. 3 is a schematic view of a substrate structure for detecting a Z-axis magnetic field according to the present invention;
FIG. 4 is a schematic diagram of a bridge circuit according to the present invention;
Fig. 5 is a graph of the frequency response in the passband of the present invention.
Reference numerals
1. The magnetic sensor comprises a substrate, an X-axis substrate, a Y-axis substrate, a Z-axis substrate, a magnetic sensor and a magnetic sensor.
Detailed Description
Examples
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or in communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example 1
As shown in FIG. 1, the three-axis broadband magnetic field sensor with high-density layout comprises three layers of substrates 1 which are stacked up and down, wherein the three layers of substrates 1 are respectively provided with bridge circuits, as shown in FIG. 4, the bridge circuits in the embodiment adopt Wheatstone full bridge circuits, the three layers of substrates 1 are electrically connected by FPC flat cables, wherein X1-X4 are magnetically sensitive elements, vs+ and Vs-are voltage positive electrodes and voltage negative electrodes of the circuits respectively in FIG. 4, GND is a grounding end, vs represents a voltage end, ox/Ox+ and-/Ox-are output positive electrodes and output negative electrodes in the X-axis direction respectively, oy/Oy+ and-/Oy-are output positive electrodes and output negative electrodes in the Y-axis direction respectively, and Oz/oz+ and-/Oz-are output positive electrodes and output negative electrodes in the Z-axis direction respectively. The sensor and the peripheral resistance-capacitance are concentrated in one area by adopting the modes of multi-layer stacking, tiny package welding and high-density layout, the occupied area of the element is very likely to be reduced, and the total area depends on the size of a used chip and the occupied area of the pin package. Compared with the traditional triaxial sensor, under the condition that the channels are ensured to be mutually different in crosstalk and consistent in sensitivity, the triaxial sensor is usually selected to be placed separately, so that the space utilization rate is low. In the embodiment, lamination stacking is adopted, so that the sensitive area of the sensor can be concentrated in an area of 3mm x 3mm, and the single-point magnetic field measurement capability of the sensor is enhanced.
The three-layer substrate 1 is a Z-axis substrate 13, a Y-axis substrate 12 and an X-axis substrate 11 sequentially from top to bottom, as shown in fig. 2, mutually perpendicular magnetic sensitive elements are respectively arranged on horizontal planes of the Y-axis substrate 12 and the X-axis substrate 11 and are respectively used for detecting magnetic fields in the Y-axis direction and the X-axis direction, and the Z-axis substrate 13 is connected with the magnetic sensitive elements used for detecting the magnetic fields in the Z-axis direction and the magnetic sensitive elements used for detecting the magnetic fields in the Z-axis direction are vertically arranged on vertical sides of the Y-axis substrate 12. The two Y-axis substrates 12 and the X-axis substrate 11 have the same structure and only need to horizontally rotate by 90 degrees. As shown in fig. 3, the Z-axis substrate 13 is provided with only a bridge circuit, and the magnetic sensor 2 for detecting the Z-axis magnetic field is connected in a split structure, and the magnetic sensor 2 for detecting the Z-axis magnetic field is provided on the vertical side of the Y-axis substrate 12 for detecting the Y-axis magnetic field. The vertical distance between the magnetic sensitive element for detecting the Y-axis direction and the magnetic sensitive element for detecting the Z-axis direction magnetic field is 0.1-0.2mm. The vertical distance between the magnetic sensitive element for detecting the Y-axis direction and the magnetic sensitive element for detecting the X-axis direction is 0.1-0.2mm.
The magneto-sensitive element 2 is a magnetic resistance or a coil or a combination thereof, the coil and the magnetic resistance are positioned on the bridge arms of the Wheatstone full bridge, the positions of the coil and the magnetic resistance can be changed, for example, the coil and the magnetic resistance are respectively positioned on two bridge arms, or the coil and the magnetic resistance are mixed and positioned on one bridge arm, the output of the Wheatstone full bridge is balanced through impedance matching, and when a magnetic field in one direction is introduced, the sensitive directions of the two sensitive elements at the same network connection point are opposite. The bridge arm output can be changed into single-ended output or differential output by configuring an operational amplifier so as to improve the output bandwidth of the sensor. The sensor bandwidth is extended by combining magnetic resistance with coils, so that the sensor operating bandwidth covers DC to hundred MHz (frequency units, megahertz). Wherein in the differential mode the sensor bandwidth is mainly dependent on the operating frequency band of the magneto-sensitive element. In the single-ended output mode, the bandwidth of the sensor is mainly determined by the operational amplifier used, such as an operational amplifier model INA826 with a bandwidth of 1MHz, an operational amplifier model AD8421 with a bandwidth of 12MHz, and an operational amplifier model OPA891 with a bandwidth of 180MHz.
The three layers of substrates 1 are used for lamination, as the flatness of the substrates 1 and the magnetic sensitive elements 2 is very high, when lamination is carried out, the substrates 1 are easy to be placed in parallel, the magnetic sensitive elements 2 for detecting the magnetic field in the Z-axis direction are placed on the vertical side edge of the Y-axis substrate 12, the sensitive direction of the magnetic sensitive elements 2 is easy to be vertical to the circuit board, the triaxial sensitive elements are further arranged, and in the prior art, the perpendicular arrangement of the two circuit boards is adopted to realize the perpendicular sensitive direction of the magnetic sensitive elements 2. However, the perpendicularity depends on the angle and the welding process when the two circuit boards are embedded, and the process is complex, low in precision and not easy to operate.
Example 2
The difference between the embodiment and the embodiment 1 is that an impedance matching network is further provided, the impedance matching network is electrically connected with the outermost substrate 1 (X-axis substrate), and the impedance matching network is suitable for the situation that the amplitude-frequency characteristic is required to be flat in application, and the amplitude-frequency characteristic of the sensor can be effectively adjusted by adjusting the gains under different frequencies.
A preparation method of the triaxial broadband magnetic field sensor based on the high-density layout comprises the following specific steps:
step S1, preparing a three-layer substrate 1.
When the Z-axis substrate 13 is prepared, the magnetic sensitive element 2 and the Z-axis substrate 13 are separated by adopting a different-surface wire bonding process.
Step S2, stacking the three-layer substrates 1, electrically connecting the three-layer substrates 1 by using FPC (flexible printed Circuit) flat cables, and arranging output ends on the outermost substrate 1. The horizontal direction includes an X-axis direction and a Y-axis direction, wherein the X-axis substrate 11 is disposed at the outermost side, the other Y-axis substrate 12 for detecting the horizontal direction is horizontally rotated by 90 ° and then vertically turned over by 180 ° to be placed on the X-axis substrate 11, the X-axis substrate 11 and the Y-axis substrate 12 detect magnetic fields in the X-axis direction and the Y-axis direction, respectively, the Z-axis substrate 13 is disposed above the Y-axis substrate 12, and the magneto-sensitive element 2 for detecting the magnetic field in the Z-axis direction is disposed at the vertical side of the Y-axis substrate 12.
And S3, packaging the triaxial broadband magnetic field sensor.
The packaged triaxial broadband magnetic field sensor is connected with an impedance matching network and used for adjusting the amplitude-frequency characteristic of output.
With the sensor, power is supplied by +/-5V- +/-12V, single-ended output is formed inside the sensor through configuration, and the cut-off bandwidth of the operational amplifier is 1MHz. A Helmholtz coil was used to generate a DC-1MHz wide frequency domain magnetic field of about 40 uT. The sensor was used to conduct a frequency response test, the frequency response of which is shown in fig. 5. Finally, the sensor sensitivity is not lower than 20mV/V/uT in DC-1MHz, and the signal to noise ratio in the passband is not lower than 20dB.
It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted by the same, and the modified or substituted technical solution may not deviate from the spirit and scope of the technical solution of the present invention.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102385043A (en) * | 2011-08-30 | 2012-03-21 | 江苏多维科技有限公司 | Magnetic tunnel junction (MTJ) triaxial magnetic field sensor and packaging method thereof |
| CN102426344A (en) * | 2011-08-30 | 2012-04-25 | 江苏多维科技有限公司 | Triaxial magnetic field sensor |
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| CN103076577B (en) * | 2012-08-03 | 2016-12-21 | 陈磊 | A kind of magnetoresistive sensor chip detecting magnetic field and acceleration |
| CN109142785B (en) * | 2018-09-10 | 2021-03-23 | 东南大学 | Horizontal axis sensitive tunnel magnetic resistance accelerometer device based on 3D prints |
| CN114114102B (en) * | 2021-11-18 | 2024-01-23 | 中国人民解放军国防科技大学 | Integrated planar three-axis magnetic sensor and its application method |
| CN115015815B (en) * | 2022-05-07 | 2025-01-03 | 中国人民解放军国防科技大学 | Integrated three-axis magnetic sensor and method based on superconducting/magnetoresistance composite structure |
| CN115078806B (en) * | 2022-06-16 | 2025-10-21 | 河北工业大学 | A broadband integrated measurement method for power module switching current |
| CN116299082A (en) * | 2023-03-02 | 2023-06-23 | 北京芯可鉴科技有限公司 | Three-dimensional magnetic field sensor with 3D mixed structure and its preparation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102385043A (en) * | 2011-08-30 | 2012-03-21 | 江苏多维科技有限公司 | Magnetic tunnel junction (MTJ) triaxial magnetic field sensor and packaging method thereof |
| CN102426344A (en) * | 2011-08-30 | 2012-04-25 | 江苏多维科技有限公司 | Triaxial magnetic field sensor |
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